Patent application number | Description | Published |
20080230888 | Semiconductor device - A first memory chip ( | 09-25-2008 |
20080231288 | Semiconductor package having projected substrate - A semiconductor package includes a bare chip which has a plurality of external electrodes, a land grid array substrate having an edge, a first surface and a second surface. The first surface includes a first portion apart from the edge and a second portion adjacent to the edge. The first portion of the first surface mounts the bare chip and is covered with a resin to seal the bare chip with the resin. The first portion of the first surface and the second surface includes a non-sealed region which is not covered with the resin. A plurality of first electrodes are arranged on the non-sealed region and connected to the external electrodes and a plurality of second electrodes are arranged on the second surface and connected to the external electrodes. | 09-25-2008 |
20080261386 | SAMPLE WAFER FABRICATION METHOD - A third channel region into which a high concentration N-type impurity is implanted, a fourth channel region into which a low concentration N-type impurity is implanted, a first channel region into which a high concentration P-type impurity is implanted, and a second channel region into which a low concentration P-type impurity is implanted are formed in predetermined regions on a wafer. A first region where the second channel region and the third channel region are formed, a second region where the second channel region and the forth channel region are formed, a third region where the first channel region and the third channel region are formed, and a fourth region where the first channel region and the forth channel region are formed are thereby formed. | 10-23-2008 |
20090057925 | Semiconductor apparatus - A semiconductor apparatus capable of detecting a crack generated in a semiconductor chip while the design freedom, the layout freedom of a wiring, the layout efficiency of LSI, and the layout efficiency of a package substrate are improved. The semiconductor apparatus according to the invention includes a semiconductor chip having a multilayered wiring structure; plural electrode pads being formed on a top surface along the outer periphery of the semiconductor chip; and a wiring being coupled to a first electrode pad and a second electrode pad selected from the plural electrode pads and formed along the entire outer periphery of the semiconductor chip in plan view. The wiring includes a first wiring and a second wiring that are formed on different layers, and the first wiring and the second wiring are connected in series by a connection plug. | 03-05-2009 |
20090057926 | Semiconductor apparatus - A semiconductor apparatus capable of simply detecting a crack generated in plural semiconductor chips while the design freedom is improved, includes a first semiconductor chip and a second semiconductor chip that is laminated on the first semiconductor chip, in which a first wiring that is formed along the outer periphery of the first semiconductor chip and a second wiring that is formed along the outer periphery of the second semiconductor chip are connected in series. | 03-05-2009 |
20100103573 | Semiconductor package having electrostatic protection circuit for semiconductor package including multiple semiconductor chips - A semiconductor package includes: a first semiconductor chip; a first internal circuit which operates, in the first semiconductor chip, at a voltage applied between a first high-potential side power supply terminal and a first low-potential side power supply terminal; a second semiconductor chip; a second internal circuit which operates, in the second semiconductor chip, at a voltage applied between a second high-potential side power supply terminal and a second low-potential side power supply terminal; and a first electrostatic protection circuit which is formed in the first semiconductor chip, and which has one end connected to a node between the first internal circuit and the first low-potential side power supply terminal and has the other end connected to a node between the second internal circuit and the second low-potential side power supply terminal. | 04-29-2010 |
20110108975 | Semiconductor package and system - Even when only one of semiconductor packages mounted by carrying out infrared reflow is defective, it is required to carry out infrared reflow again to dismount this defective semiconductor package from a mounting board. At this time, stress of heat is also applied to the other non-defective semiconductor packages. For this reason, if infrared reflow is carried out beyond a number of times of infrared reflow specified for non-defective semiconductor packages, the operation of each non-defective semiconductor package cannot be assured. In this case, it is inevitable to discard the semiconductor packages together with the mounting board. To solve this problem, a magnetic material is passed through a hole penetrating a protection member and a package board and the relevant semiconductor package is fixed over a mounting board by this magnetic material. To supply power to the semiconductor package, electromagnetic induction by coils provided in the package board and the mounting board is used. | 05-12-2011 |
Patent application number | Description | Published |
20080265554 | Airbag Device - There is provided an airbag device being excellent in performance of protection of an occupant wherein a folded airbag ( | 10-30-2008 |
20090033079 | AIRBAG FOLDING DEVICE AND AIRBAG FOLDING METHOD - There are provided an airbag folding device, and an airbag folding method, for mechanically folding an airbag to form a doughnut-shaped airbag. The airbag folding device is characterized in comprising a support member ( | 02-05-2009 |
20090051147 | AIRBAG DEVICE - In an airbag device, a decorative member is prevented from being scattered with a simple structure at the time of expansion of an airbag. That is, a concave part of the airbag cover ( | 02-26-2009 |
20090079167 | AIRBAG DEVICE - There is provided an airbag device for allowing a holding member to firmly hold an outer circumference part and a peripheral edge part of an airbag during the airbag assembling work and to reduce the assembling work time. The airbag device comprising a holding member ( | 03-26-2009 |
20090091107 | AIRBAG DEVICE - There is provided an airbag device comprising electrical equipment disposed at the central part of a steering wheel, capable of connecting a harness to the electrical equipment while using the steering shaft, the inflator, and so forth, commonly in use, thereby alleviating work for manufacturing intricate components, and achieving reduction in component cost. The airbag device comprises an airbag cover ( | 04-09-2009 |
20090102172 | METHOD OF ASSEMBLING AIRBAG DEVICE AND AIRBAG DEVICE - The invention improves efficiency in a work for assembling an airbag device ( | 04-23-2009 |
20090218799 | AIRBAG DEVICE - There is provided an airbag device being excellent in performance of protection of an occupant wherein a folded airbag ( | 09-03-2009 |