Patent application number | Description | Published |
20100118546 | Method and apparatus for lighting with reflection - An apparatus for lighting. The apparatus includes a first light source. The apparatus includes a first housing in which the first light source is disposed. The apparatus includes a support structure to which the first housing is attached. The apparatus includes a reflection portion having a least two reflectors. The reflection portion attached to the support structure and in spaced relationship with the first housing such that light from the first light source is directed to desired locations. Alternatively, the apparatus includes a first light source. The apparatus includes a first housing in which the first light source is disposed. The apparatus includes a support structure to which the first light source is attached. The apparatus includes a second light source. The apparatus includes a second housing in which the second light source is disposed. The second housing attached to the support structure and in spaced relationship with the first housing. The apparatus includes a first reflector disposed with the second housing and opposing the first light source so light emitted by the first light source is reflected by the first reflector. | 05-13-2010 |
20110085331 | Method and apparatus for lighting involving reflectors - A variety of lighting apparatuses are described that utilize reflection as a basis for lighting a desired area. | 04-14-2011 |
20110273893 | Method and apparatus for lighting with reflection - A mirror module includes a mirror. The module includes a mirror housing. The module includes a mounting box that fits into the housing. The module includes a motorized element disposed in the mounting box. The motorized element having a mirror mounting plate which holds the mirror, and a base plate which is attached to the mounting box through an axis screw at a central axis of the module about which the motorized element rotates. | 11-10-2011 |
20120262926 | Method and Apparatus for Lighting with Reflection - A mirror module includes a mirror. The module includes a mirror housing. The module includes a mounting box that fits into the housing. The module includes a motorized element disposed in the mounting box. The motorized element having a mirror mounting plate which holds the mirror, and a base plate which is attached to the mounting box through an axis screw at a central axis of the module about which the motorized element rotates. | 10-18-2012 |
20130039042 | Method and Apparatus for Lighting Involving Reflectors - A variety of lighting apparatuses are described that utilize reflection as a basis for lighting a desired area. | 02-14-2013 |
20140098543 | Method and Apparatus for Lighting With Reflection - A mirror module includes a mirror. The module includes a mirror housing. The module includes a mounting box that fits into the housing. The module includes a motorized element disposed in the mounting box. The motorized element having a mirror mounting plate which holds the mirror, and a base plate which is attached to the mounting box through an axis screw at a central axis of the module about which the motorized element rotates. | 04-10-2014 |
20140268755 | Method and Apparatus for Lighting Involving Reflectors - A variety of lighting apparatuses are described that utilize reflection as a basis for lighting a desired area. | 09-18-2014 |
Patent application number | Description | Published |
20100139368 | MICRO-OPTICAL-MECHANICAL SYSTEM PHOTOACOUSTIC SPECTROMETER - All-optical photoacoustic spectrometer sensing systems (PASS system) and methods include all the hardware needed to analyze the presence of a large variety of materials (solid, liquid and gas). Some of the all-optical PASS systems require only two optical-fibers to communicate with the opto-electronic power and readout systems that exist outside of the material environment. Methods for improving the signal-to-noise are provided and enable mirco-scale systems and methods for operating such systems. | 06-10-2010 |
20100273090 | Micro-Electro-Mechanical Systems Phosphoric Acid Fuel Cell - A phosphoric acid fuel cell system comprising a porous electrolyte support, a phosphoric acid electrolyte in the porous electrolyte support, a cathode electrode contacting the phosphoric acid electrolyte, and an anode electrode contacting the phosphoric acid electrolyte. | 10-28-2010 |
20110182309 | LASER DIODE PACKAGE WITH ENHANCED COOLING - A laser diode package assembly includes a reservoir filled with a fusible metal in close proximity to a laser diode. The fusible metal absorbs heat from the laser diode and undergoes a phase change from solid to liquid during the operation of the laser. The metal absorbs heat during the phase transition. Once the laser diode is turned off, the liquid metal cools off and resolidifies. The reservoir is designed such that that the liquid metal does not leave the reservoir even when in liquid state. The laser diode assembly further includes a lid with one or more fin structures that extend into the reservoir and are in contact with the metal in the reservoir. | 07-28-2011 |
20110235669 | ENHANCED VBASIS LASER DIODE PACKAGE - A substrate having an upper surface and a lower surface is provided. The substrate includes a plurality of v-grooves formed in the upper surface. Each v-groove includes a first side and a second side perpendicular to the first side. A laser diode bar assembly is disposed within each of the v-grooves and attached to the first side. The laser diode bar assembly includes a first adhesion layer disposed on the first side of the v-groove, a metal plate attached to the first adhesion layer, a second adhesion layer disposed over the metal plate, and a laser diode bar attached to the second adhesion layer. The laser diode bar has a coefficient of thermal expansion (CTE) substantially similar to that of the metal plate. | 09-29-2011 |
20110286481 | LASER DIODE PACKAGE WITH ENHANCED COOLING - A laser diode package assembly includes a reservoir filled with a fusible metal in close proximity to a laser diode. The fusible metal absorbs heat from the laser diode and undergoes a phase change from solid to liquid during the operation of the laser. The metal absorbs heat during the phase transition. Once the laser diode is turned off, the liquid metal cools off and resolidifies. The reservoir is designed such that that the liquid metal does not leave the reservoir even when in liquid state. The laser diode assembly further includes a lid with one or more fin structures that extend into the reservoir and are in contact with the metal in the reservoir. | 11-24-2011 |
20110286482 | LASER DIODE PACKAGE WITH ENHANCED COOLING - A laser diode package assembly includes a reservoir filled with a fusible metal in close proximity to a laser diode. The fusible metal absorbs heat from the laser diode and undergoes a phase change from solid to liquid during the operation of the laser. The metal absorbs heat during the phase transition. Once the laser diode is turned off, the liquid metal cools off and resolidifies. The reservoir is designed such that that the liquid metal does not leave the reservoir even when in liquid state. The laser diode assembly further includes a lid with one or more fin structures that extend into the reservoir and are in contact with the metal in the reservoir. | 11-24-2011 |
20110286483 | LASER DIODE PACKAGE WITH ENHANCED COOLING - A laser diode package assembly includes a reservoir filled with a fusible metal in close proximity to a laser diode. The fusible metal absorbs heat from the laser diode and undergoes a phase change from solid to liquid during the operation of the laser. The metal absorbs heat during the phase transition. Once the laser diode is turned off, the liquid metal cools off and resolidifies. The reservoir is designed such that that the liquid metal does not leave the reservoir even when in liquid state. The laser diode assembly further includes a lid with one or more fin structures that extend into the reservoir and are in contact with the metal in the reservoir. | 11-24-2011 |
20120144924 | Contact Stress Sensor - A method for producing a contact stress sensor that includes one or more MEMS fabricated sensor elements, where each sensor element of includes a thin non-recessed portion, a recessed portion and a pressure sensitive element adjacent to the recessed portion. An electric circuit is connected to the pressure sensitive element. The circuit includes a pressure signal circuit element configured to provide a signal upon movement of the pressure sensitive element. | 06-14-2012 |