Kosuke Takasaki
Kosuke Takasaki, Saitama-Shi JP
Patent application number | Description | Published |
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20110074941 | IMAGE PICKUP DEVICE AND ENDOSCOPE - An image pickup device includes: an image pickup element; a spacer surrounding a light receiving surface of the image pickup element; a cover glass attached to the spacer, the cover glass being disposed opposing to the light receiving surface; and an insulative resin configured to thermally couple the image pickup element with the cover glass, and to have a thermal conductivity of not less than 8 W/mK. An endoscope includes: the image pickup device; an image pickup optical system; a drive circuit; a light guide configured to radiate light from a illumination light source; a tubular body configured to accommodate the image pickup device, the image pickup optical system, the drive circuit, the light guide, and a forceps opening; and a first insulative resin having a thermal conductivity of not less than 8 W/mK, and adapted to thermally couple the image pickup device with the drive circuit. | 03-31-2011 |
Kosuke Takasaki, Kanagawa JP
Patent application number | Description | Published |
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20080231739 | SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME - A transfer film, on which an adhesive is applied, is glued to plural spacers formed on a glass substrate. The glass substrate is laid on a working table, and one end of the transfer film is fixed to a winding roller. A peeling guide is set at a position over the transfer film. The winding roller is driven to wind the transfer film while the working table moves horizontally. While winding the transfer film, the angle between the glass substrate and the transfer film is kept constant. After the transfer film is peeled off, the adhesive is uniformly transferred to each of the spacers. | 09-25-2008 |
20090046183 | Solid state imaging device and manufacturing method thereof - A plurality of sensor packages ( | 02-19-2009 |
20090053850 | METHOD OF MANUFACTURING SOLID STATE IMAGING DEVICE | 02-26-2009 |
20100108237 | DEVICE AND METHOD FOR JOINING SUBSTRATES - A device for joining substrates ( | 05-06-2010 |
Kosuke Takasaki, Kurokawa-Gun JP
Patent application number | Description | Published |
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20100032784 | SOLID-STATE IMAGE SENSOR - A solid-state image sensor ( | 02-11-2010 |
20100060757 | SOLID-STATE IMAGE PICKUP DEVICE - A solid-state image pickup device ( | 03-11-2010 |
20100073470 | IMAGING APPARATUS AND ENDOSCOPE - An imaging apparatus includes an observation optical system, a solid state imaging element photoelectrically converting an image from the observation optical system, a flexible board electrically connected to the solid state imaging element, a plurality of electronic components and a plurality of signal cables electrically connected to the flexible board, and a first resin sealing the electronic components and a second resin sealing a connection part of the signal cables. A thixotropic ratio of the first resin is set to be lower than a thixotropic ratio of the second resin. Accordingly, apparatus and an endoscope, which can be made compact, and have high physical and electrical reliability without increasing a size of the imaging apparatus, are provided. | 03-25-2010 |
Kosuke Takasaki, Ashigarakami-Gun JP
Patent application number | Description | Published |
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20110237886 | IMAGING UNIT AND ENDOSCOPE - An imaging unit includes an objective optical system, an image sensor, a cover glass, a prism, and a heat conduction portion. The objective optical system imports light of an image of a subject. The image sensor forms an image of the light and outputs an imaging signal. The cover glass is provided on an imaging surface of the image sensor and seals the image sensor air-tightly. The prism is disposed between the objective optical system and the cover glass so as to guide the light from the objective optical system to the imaging surface. The heat conduction portion touches the prism and extends from the prism towards the image sensor so as to transmit heat of the image sensor to the prism. | 09-29-2011 |