Kolvenbach
Hendrik René Kolvenbach, Koln DE
Patent application number | Description | Published |
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20150251049 | APPARATUS, IN PARTICULAR FOR BALANCE TRAINING, HAVING AT LEAST ONE MOVEABLE PLATFORM - An apparatus, in particular for balance training and/or fine motor training, includes at least one moveable platform, which is in at least two dimensions oscillatingly moveable, and at least one damping unit for a damping of movements of the moveable platform. The damping unit comprises a central connecting element, which extends at least partially along a zero axis of a rest position of the platform, for the connection of the platform and the damping unit and for a transfer of an at least two-dimensional movement of the platform. | 09-10-2015 |
Kevin Kolvenbach, Walden, NY US
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20090167336 | METHOD AND APPARATUS FOR DYNAMIC CHARACTERIZATION OF RELIABILITY WEAROUT MECHANISMS - A method and apparatus for dynamic characterization of reliability wearout mechanisms is disclosed. The system comprises an integrated circuit incorporating a device under test to be measured, structure for inputting a waveform to the device under test for a first predetermined time interval, structure for disabling the inputting of the waveform to the device under test, structure for measuring one or more fundamental parameters of the device under test after a second predetermined time interval, and structure for calculating an aging estimate of the device under test without the influence of recovery effect based on the one or more measured fundamental parameters. The time between stressing and measurement is precisely controlled, providing for repeatable experiments, and serves to minimize measurement error caused by recovery effects. | 07-02-2009 |
20120292763 | ELECTROMIGRATION IMMUNE THROUGH-SUBSTRATE VIAS - A through-substrate via (TSV) structure includes at least two electrically conductive via segments embedded in a substrate and separated from each other by an electrically conductive barrier layer therebetween. The length of each individual conductive via segment is typically equal to, or less than, the Blech length of the conductive material so that the stress-induced back flow force, generated by each conductive barrier layer, cancels the electromigration force in each conductive via segment. Consequently, the TSV structures are immune to electromigration, and provide reliable electrical connections among a chips stacked in 3 dimensions. | 11-22-2012 |
20150198654 | NON-PLANAR FIELD EFFECT TRANSISTOR TEST STRUCTURE AND LATERAL DIELECTRIC BREAKDOWN TESTING METHOD - Disclosed are test structures and methods for non-planar field effect transistors. The test structures comprise test device(s) on an insulator layer. Each device comprises semiconductor fin(s). Each fin has a first portion comprising a pseudo channel region at one end and a second portion comprising a diffusion region positioned laterally adjacent to the first portion. A gate with sidewall spacers can be adjacent to the first portion of the fin(s). A first contact can be on the insulator layer adjacent the end of the fin(s). A second contact can be on the second portion of the fin(s) such that the gate is positioned laterally between the contacts. Measurements taken when the first contact is biased against the gate are compared to measurements taken when the second contact is biased against the gate in order to assess lateral dielectric breakdown between the gate and first contact independent of gate dielectric breakdown. | 07-16-2015 |
Kevin Kolvenbach, Hopewell Junction, NY US
Patent application number | Description | Published |
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20110193199 | ELECTROMIGRATION IMMUNE THROUGH-SUBSTRATE VIAS - A through-substrate via (TSV) structure includes at least two electrically conductive via segments embedded in a substrate and separated from each other by an electrically conductive barrier layer therebetween. The length of each individual conductive via segment is typically equal to, or less than, the Blech length of the conductive material so that the stress-induced back flow force, generated by each conductive barrier layer, cancels the electromigration force in each conductive via segment. Consequently, the TSV structures are immune to electromigration, and provide reliable electrical connections among a chips stacked in 3 dimensions. | 08-11-2011 |
Ralf Kolvenbach, Dusseldorf DE
Patent application number | Description | Published |
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20080243223 | Device for affixing of tubular medical accessory to a body passage - A device for affixing a tubular medical accessory to a wall of a body passage is disclosed. The said device comprises a handle portion, a barrel portion and a working head portion, said barrel portion is fitted with a pushing rod displaceable along the barrel portion upon actuating the handle portion. The working head portion is fitted with a plurality of wings and levers and said wings are preloaded with a plurality of staples. Upon initial displacement of the pushing rod in a distal direction the wings are swiveled towards the medical accessory such that they abut it and stretch it together with the body passage in a radial direction. Upon still further displacement of the pushing rod the levers are swiveled and cause the staples to exit from the wings such that the staples pierce the accessory and the wall of the body passage and affix the accessory to the body passage. | 10-02-2008 |
20090240262 | Device for affixing prosthesis to a vessel - Embodiments of the present invention are directed to devices, systems and methods (both in operation of the devices and systems, and methods of treatment on a mammal) for affixing a prosthesis, e.g. graft to a first end and to a second end of a vessel is described. Such embodiments include a device which may comprise a rear handle portion, a frontal working portion and an intermediate barrel portion. The working portion may be loaded with a first plurality of staples and with a second plurality of staples. The barrel portion is preferable adapted to carry the graft thereon and the device is preferably provided with a pushing rod which may be displaceable along the barrel portion so as to cause protrusion of the first and the second plurality of staples towards the first end and towards the second end of the vessel respectively. | 09-24-2009 |