Patent application number | Description | Published |
20090068586 | SILSESQUIOXANE RESIN, POSITIVE RESIST COMPOSITION, RESIST LAMINATE, AND METHOD OF FORMING RESIST PATTERN - A silsesquioxane resin, a positive resist composition, a resist laminate, and a method of forming a resist pattern that are capable of suppressing a degas phenomenon are provided, and a silicon-containing resist composition and a method of forming a resist pattern that are ideally suited to immersion lithography are also provided. The silsesquioxane resin includes structural units represented by the general shown below [wherein, R | 03-12-2009 |
20100159191 | PROCESSED SUBSTRATE AND METHOD FOR MANUFACTURING SAME - The present invention provides (i) a processed substrate having a through-hole whose openings on respective surfaces of the processed substrate are matched to each other in size, and (ii) a method for easily manufacturing the processed substrate with high efficiency. A processed substrate | 06-24-2010 |
20100178498 | Adhesive composition and film adhesive - An adhesive composition of the present invention is an adhesive composition including a polymer obtained by polymerizing a monomer composition containing a (meth)acrylic acid ester having a structure represented by General Formula (1): | 07-15-2010 |
20100178499 | ADHESIVE COMPOSITION AND FILM ADHESIVE - An adhesive composition of the present invention is an adhesive composition including a polymer obtained by copolymerizing a monomer composition containing a (meth)acrylic acid ester and a monomer having a maleimide group, the (meth)acrylic acid ester has a structure represented by General Formula (1): | 07-15-2010 |
20100310817 | SUPPORT PLATE, METHOD FOR PRODUCING THE SAME, AND METHOD FOR PROCESSING SUBSTRATE - This invention provides a support plate which makes it possible to stably perform a step for separating from a support plate a wafer which has been processed while preventing delay in time taken for this step. The support plate of this invention is a support plate for supporting a substrate via an adhesive, including: a plate-shaped part having a surface which is in contact with the adhesive; and at least one spacer provided on the surface which is in contact with the adhesive. | 12-09-2010 |
20100314043 | STICKING METHOD AND STICKING APPARATUS - A sticking method for sticking a support plate onto a substrate in such a way that the support plate can be removed in quickly and easily is provided. The sticking method according to the present invention includes the step of sticking a support plate | 12-16-2010 |
20100331477 | ADHESIVE COMPOSITION AND FILM ADHESIVE - The adhesive composition according to the present invention includes a resin containing a polymer having an alkoxystyrene structure as a repeating unit, and an acid generator. In accordance with the present invention, it is possible to provide a novel adhesive composition which is excellent in heat resistance and which is easily stripped. | 12-30-2010 |
20110240231 | STRIPPING METHOD AND STRIPPING SOLUTION - A method for stripping a wafer from a supporting plate to which the wafer is adhered via an adhesive agent, wherein the supporting plate has a through hole penetrating the supporting plate in a thickness direction thereof, the method including dissolving the adhesive agent with a stripping solution by contacting the stripping solution with the adhesive agent via the through hole. The adhesive agent has a hydrocarbon resin as a viscous component, and the stripping solution is a hydrocarbon-based solvent having a viscosity of 1.3 mPa·s or less and a dissolving rate of 30 nm/sec or greater to dissolve the adhesive agent. | 10-06-2011 |
20110306720 | ADHESIVE COMPOSITION - Disclosed is an adhesive composition in which a solid component is dissolved in a solvent, the solid component being dissolved in the solvent to have a solid component content of not less than 20% by weight with respect to a total amount of the solid component and the solvent, the solid component containing resin obtained by polymerizing a monomer composition that contains a cycloolefin monomer, the solvent having no carbon-carbon double bond, and an alcohol content contained in the solvent being not more than 0.45% by weight with respect to an entire amount of the solvent. | 12-15-2011 |
20120073741 | ADHESIVE COMPOSITION - An adhesive composition for forming an adhesive layer for temporarily fixing a substrate, such as a wafer, to a support when processing the substrate, the adhesive composition including a resin (A) produced by polymerizing a monomer component containing a cycloolefin-based monomer, at least one terpene-based resin, rosin-based resin, or petroleum resin (resin B), and an organic solvent capable of dissolving the resins (A) and (B). The resin (A) has a glass transition point of 60° C. or higher, the resin (B) has a softening point of 80 to 160° C. and a molecular weight of 300 to 3000, and the blending ratio of the resin (A) to the resin (B) is (A):(B)=80:20 to 55:45 (mass ratio). | 03-29-2012 |
20120083561 | ADHESIVE COMPOSITION - An adhesive composition of this invention includes a hydrocarbon resin and a solvent for dissolving the hydrocarbon resin, the solvent containing a condensed polycyclic hydrocarbon. Thus, an adhesive composition having excellent product stability is provided. | 04-05-2012 |
20120118511 | LAMINATE AND METHOD FOR SEPARATING THE SAME - A laminate including a supporter which transmits infrared; a substrate supported by the supporter; an adhesive layer via which the supporter and the substrate are attached to each other; and a separation layer, positioned on a surface of the supporter to which surface the substrate is attached, and made of a compound having an infrared-absorbing structure. | 05-17-2012 |
20120217210 | SUPPORT METHOD, HIGH-TEMPERATURE TREATMENT METHOD USING SAME, AND SUPPORT JIG - A method for supporting a support to which a wafer is attached, by supporting the support against gravitational force by supporting three or more support points of an inner circumference section of a support surface of the support. The support surface of the support is opposite to a side on which the wafer is attached to the support. | 08-30-2012 |
20130081760 | ADHESIVE COMPOSITION, ADHESIVE FILM, AND METHOD FOR TREATING SUBSTRATE - An adhesive composition including a hydrocarbon resin, a modified elastomer that is bonded with at least one functional group-containing atom group, and a solvent. | 04-04-2013 |
20130213582 | LAMINATE AND METHOD FOR SEPARATING THE SAME - A laminate including a supporting member which is light transmissive; a supported substrate supported by the supporting member; an adhesive layer provided on a surface of the supported substrate which surface faces toward the supporting member; and a release layer which is made of an inorganic material and is provided between the supporting member and the supported substrate, the release layer having a property that changes when the release layer absorbs light coming through the supporting layer, and the release layer having a flat surface which faces the adhesive layer. | 08-22-2013 |
20130220554 | LAMINATE AND METHOD FOR SEPARATING THE SAME - A laminate including a supporting member which is light transmissive; a supported substrate supported by the supporting member; an adhesive layer provided on a surface of the supported substrate which surface faces toward the supporting member; and a release layer which is made of a fluorocarbon and is provided between the supporting member and the supported substrate, the release layer having a property that changes when it absorbs light coming through the supporting member. | 08-29-2013 |
20140038111 | PROCESSED SUBSTRATE AND METHOD FOR MANUFACTURING SAME - A processed substrate having a through-hole whose openings in respective surfaces of the processed substrate are matched to each other in size, and a method for easily manufacturing the processed substrate with high efficiency. The processed substrate ( | 02-06-2014 |
20140166209 | LAMINATE AND METHOD FOR SEPARATING THE SAME - A laminate including a supporter which transmits infrared; a substrate supported by the supporter; an adhesive layer via which the supporter and the substrate are attached to each other; and a separation layer positioned on a surface of the supporter to which surface the substrate is attached, and which is made of a compound having an infrared-absorbing structure. A target is tightly attached and supported in the laminate while securing easy separation of a supporter from the target. | 06-19-2014 |
20140311680 | LAMINATED BODY AND METHOD FOR SEPARATING LAMINATED BODY - A laminate including a supporting member which is light transmissive; a supported substrate which is supported by the supporting member; an adhesive layer which is provided on a surface of the supported substrate on which surface the supported substrate is supported by the supporting member; and a release layer, which (i) is provided between the supporting member and the supported substrate and (ii) contains a polymer including, in a repeating unit, a structure having a light absorption property, a property of the polymer being changed when the polymer absorbs light irradiated via the supporting member. | 10-23-2014 |
20150013917 | PROCESSING METHOD AND PROCESSING APPARATUS - A bonding method including an adhesive layer forming process in which a thermoplastic adhesive is applied to a substrate or a support plate and an adhesive layer is formed; a heating process in which the adhesive layer that is formed on the substrate or the support plate is heated; and a bonding process in which the substrate and the support plate are pressed against each other via the heated adhesive layer, thereby bonding the substrate and the support plate. | 01-15-2015 |
20150059976 | ADHESIVE COMPOSITION, ADHESIVE FILM, AND BONDING METHOD - An adhesive composition including a block copolymer. An adhesive layer formed by using the adhesive composition has a Young's modulus of 0.1 GPa or greater at 23° C., a storage modulus (G′) of 1.5×10 | 03-05-2015 |