Patent application number | Description | Published |
20080252212 | Solid state device and light-emitting element - A solid-state device having: a flip-chip mounted solid-state element; a power receiving/feeding portion having a mounting substrate to allow that a mounting surface of the solid-state element forms substantially the same plane as a surface of the mounting substrate; and an inorganic sealing portion made of an inorganic sealing material having a thermal expansion coefficient equal to that of the power receiving/feeding portion for sealing the solid-state element. | 10-16-2008 |
20080283860 | Light emitting device - A light emitting device includes an emission portion, an optical control portion for reflecting or refracting light emitted from the emission portion in a predetermined direction, a light guiding member including a light input surface to which the reflected or refracted light is inputted, a refection region formed on a surface thereof for reflecting the inputted light, and a light output surface for externally outputting the reflected light from the refection region, a reflection portion, on which the emission portion is mounted and which covers externally the refection region, for dissipating heat generated from the emission portion and for reflecting light passing through the refection region in a direction of the light output surface, and a space formed between the light guiding member and the reflection portion. | 11-20-2008 |
20080284315 | Light emitting device and light emitter - A light emitting device includes a light emitting element, a substrate with a flat mounting surface for mounting the light emitting element thereon, a sealing part for the light emitting element on the mounting surface of the substrate. The sealing part is formed of glass including a phosphor to be excited by light emitted from the light emitting element to radiate a wavelength conversion light. The sealing part is shaped like a rectangular solid wherein a lateral length is defined as a distance between a center of a bottom surface of the sealing part bonded to the mounting surface and a side face perpendicular to the mounting surface, a vertical length is defined as a distance between the mounting surface and a top surface of the sealing part, and at least one of the lateral length is longer than the vertical length. The device further includes a transparent member formed on the top surface of the sealing part. The transparent member includes the phosphor at a concentration higher than the sealing part. | 11-20-2008 |
20090086479 | Light source unit - A light source unit includes a light source portion including an LED element, a heat radiation portion that is connected to the light source portion, a case including an outside wall that is disposed apart from the light source portion and the heat radiation portion, and a spring member that is disposed between the outside wall of the case and the heat radiation portion. | 04-02-2009 |
20090122541 | Light source unit - A light source unit includes a linear light source portion including a plurality of glass-sealed LEDs, a heat radiation portion including a heat radiation plate connected to the linear light source portion, and a case including an outside wall that is disposed apart from the linear light source portion and the heat radiation portion, a support portion connecting the outside wall to heat radiation portion, and a vent hole formed in the outside wall. | 05-14-2009 |
20090262517 | Light source unit - A light source unit includes a light source portion including a mounting board, a light emitting element mounted on the mounting board, a rectangular solid sealing material for sealing the light emitting element, the sealing material including a first distance between the light emitting element and a top face thereof and a second distance between the light emitting element and a side face thereof, the first distance being greater than the second distance and a phosphor dispersed in the sealing material for radiating a wavelength conversion light by being excited by light emitted from the light emitting element, wherein a first light emitted through the top face of the sealing material is different in emission color from a second light emitted through the side face of the sealing material. The light source unit further includes an optical connection member including a reflection surface for reflecting light emitted from the side face of the sealing material, and a light guiding member including an end face through which light emitted through the top face of the sealing material and light reflected by the reflection surface of the optical connection member are inputted into the light guiding member. | 10-22-2009 |
20100123164 | LIGHT EMITING DEVICE AND METHOD OF MAKING SAME - A light emitting device includes a light-emitting portion including a metal part including a metal able to be bonded to a solder material, and a heat dissipation member that includes aluminum, aluminum alloy, magnesium or magnesium alloy and a bonding portion processed to be bonded to the solder material. The metal part of the light-emitting portion is bonded via the solder material to the bonding portion of the heat dissipation member. The solder material includes a material unable to be directly bonded to the heat dissipation member, the metal part of the light-emitting portion is formed by metalizing an insulation of ceramic or semiconductor, and the bonding portion includes a thermal expansion coefficient between that of the heat dissipation member and that of the insulation. | 05-20-2010 |
20100214777 | Light-emitting device and method of manufacturing the same - A light-emitting device includes a light emitting portion comprising a substrate having a mounting surface for mounting a LED element and a metal portion formed on a surface of the substrate opposite to the mounting surface, the substrate comprising ceramic or a semiconductor and the metal portion being bondable to a solder material and a heat dissipating member comprising aluminum, aluminum alloy, magnesium or magnesium alloy, and having, on a surface thereof, a junction treated so as to be bondable to the solder material and a heat dissipating film formed in a periphery of the junction, wherein the metal portion of the light emitting portion is bonded to the junction of the heat dissipating member by the solder material. | 08-26-2010 |