Koichi Nakamura
Koichi Nakamura, Sakai-Shi JP
Patent application number | Description | Published |
---|---|---|
20110206884 | Sheet adhesive method, sheet adhesive apparatus, laminated products and transcription process products - A sheet bonding method includes a closely attaching step and a steam supply step. In the closely attaching step, a thermal adhesive sheet is closely attached to the surface of a workpiece to closely attach an adhesive layer of the sheet to the surface of the workpiece. In the steam supply step, steam is supplied to the space around the workpiece so as to heat the adhesive layer by heat conduction from the steam to bond the thermal adhesive sheet to the workpiece. | 08-25-2011 |
Koichi Nakamura, Minato-Ku JP
Patent application number | Description | Published |
---|---|---|
20120273115 | SEALANT APPLICATOR, AND METHOD FOR APPLYING SEALANT AND METHOD FOR ASSEMBLING AIRCRAFT USING THE SEALANT APPLICATOR - Provided is a sealant applicator which enables an operator to uniformly apply a given amount of sealant to a fastener in a short time regardless of the skill of the operator. The sealant applicator according to the present invention includes: an inner space defined by a substantially cylindrical inner surface that receives a fastener in an axial direction from one end; and a concave-convex portion formed in the inner surface and composed of a convex portion to be located adjacent to the fastener and a concave portion to be located apart from the fastener. | 11-01-2012 |
Koichi Nakamura, Yamagata-Shi JP
Patent application number | Description | Published |
---|---|---|
20120306118 | JOINT AND METHOD FOR MANUFACTURING JOINT - An inner tubular portion ( | 12-06-2012 |
20140291978 | JOINT AND METHOD FOR MANUFACTURING JOINT - An inner tubular portion and an outer tubular portion 16 for forming an insertion space for a plastic pipe are formed integrally with a joint body. Two fitting grooves are formed in the outer peripheral surface of the inner tubular portion | 10-02-2014 |
Koichi Nakamura, Osaka JP
Patent application number | Description | Published |
---|---|---|
20130213578 | SHEET BONDING APPARATUS - A sheet bonding apparatus for bonding a thermal adhesive sheet having an adhesive layer on one side thereof to a workpiece, has a close attachment apparatus for closely attaching the adhesive layer of the thermal adhesive sheet to a surface of the workpiece, and a steam supply apparatus for supplying steam to a space around the workpiece to heat the adhesive layer through a heat conduction from the steam, thereby to bond the thermal adhesive sheet to the workpiece. | 08-22-2013 |
20140037924 | FLAME-RETARDANT THERMALLY-CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE SHEET - A flame-retardant thermally-conductive pressure-sensitive adhesive sheet includes a substrate and a flame-retardant thermally-conductive pressure-sensitive adhesive layer provided on at least one surface of the substrate. The substrate includes a polyester film and the thickness of the polyester film is 10 to 40 μm, and the thermal resistance of the flame-retardant thermally-conductive pressure-sensitive adhesive sheet is 10 cm | 02-06-2014 |
Koichi Nakamura, Fuchu JP
Patent application number | Description | Published |
---|---|---|
20130299845 | SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MODULE AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE - Disclosed is a semiconductor device including first and second semiconductor elements, first and second external connection terminals and a sealing member. The first external connection terminal is provided at a first surface of the first semiconductor element. The second semiconductor element is provided at a second surface side, that is at a side opposite to the first surface, of the first semiconductor element. The second external connection terminal is connected to the second semiconductor element, and the second external connection terminal is configured to be, together with the first external connection terminal, connected to a wiring board. The sealing member seals the first and second semiconductor elements and exposes a portion, that is configured to be connected to the wiring board, of the first external connection terminal and a portion, that is configured to be connected to the wiring board, of the second external connection terminal. | 11-14-2013 |
20140203291 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME - A semiconductor device includes: an FET chip; pads provided on an upper surface of the FET chip; bumps provided on at least one of the pads; leads having first portions that are connected to the FET chip by the bumps and extend along the upper surface of the FET chip, and second portions that contact surfaces of the first portions along the upper surface of the FET chip and extend along a side surface of the FET chip, the first and second portions being formed by press or cutting; and a seal layer that seals the FET chip and the leads and a surface from which the second portions of the leads are exposed, the surface of the seal layer being on a lower surface side of the FET chip. | 07-24-2014 |
20140217567 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME - A semiconductor package includes a semiconductor chip, a protruding pillar electrode provided on the semiconductor chip, and resin covering the semiconductor chip and the pillar electrode. The resin has a concave part and exposes a front edge portion of the pillar electrode from the resin at the bottom face of the concave part. The front edge portion of the pillar electrode is exposed from the concave part of the resin, which makes it possible to suppress increase in the height of the pillar electrode and to form the pillar electrodes having fine patterns or a narrow pitch. | 08-07-2014 |
Koichi Nakamura, Funabashi-Shi JP
Patent application number | Description | Published |
---|---|---|
20130149540 | ELECTROPHOTOGRAPHIC MEMBER, INTERMEDIATE TRANSFER MEMBER, IMAGE FORMING APPARATUS, AND METHOD FOR MANUFACTURING ELECTROPHOTOGRAPHIC MEMBER - An object of the present invention is to provide: an electrophotographic member which enhances image quality, prevents the lowering of a grade of an image even when images have been repeatedly output, and can remarkably enhance the stability of the grade of the image; an intermediate transfer member; and an image forming apparatus. The electrophotographic member includes a base layer and a surface layer, wherein the surface layer has a binder resin, perfluoropolymer fine particles, a fluorocarbon resin dispersing agent and a particular fluorine compound, wherein the perfluoropolymer fine particle has a fluorine compound carried on its surface. | 06-13-2013 |
Koichi Nakamura, Kakegawa-Shi JP
Patent application number | Description | Published |
---|---|---|
20140248793 | WATERPROOF STRUCTURE FOR CONNECTOR - A waterproof structure for a connector includes a housing, a shield wire, a shield terminal, a first packing, and a second packing. The housing has a tubular housing part. The shield wire passes through the inside of the tubular housing part and extends from the housing. The shield terminal has a first section, a second section and a third section. The first section and the second section get into the tubular housing part such that the shield wire passes through the inside of the shield terminal, the first section joints with a braided shield wire of the shield wire, and the third section protrudes from the tubular housing part. The first packing seals a gap between the second section of the shield terminal and the tubular housing part. The second packing seals a gap between the shield wire and the third section of the shield terminal. | 09-04-2014 |
Koichi Nakamura, Miyoshi-Shi JP
Patent application number | Description | Published |
---|---|---|
20150148174 | ELECTRIC VEHICLE TRANSAXLE - Providing an electric vehicle transaxle suppressing occurrence of wear, seizure, etc. of a one-way clutch as compared to a conventional one. When an electric motor MG is driven and a one-way clutch | 05-28-2015 |