Knollenberg
Clifford Knollenberg, San Bruno, CA US
Clifford F. Knollenberg, Mountain View, CA US
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20110062486 | FABRICATION FOR ELECTROPLATING THICK METAL PADS - A method of electroplating includes forming a seed region to be electroplated on a first portion of a substrate, forming a ground plane on a second portion of a substrate, electrically isolating the ground plane from the seed region, electroplating the region, wherein electroplating includes causing the ground plane and the region to make electrical connection, and then removing the ground plane region on the second portion of the substrate, but not removing the electrical isolation. This creates a structure having a substrate, a passivation layer on the substrate, and at least one electroplated, metal region on the substrate such that there is contiguous contact between the metal region and the passivation layer. And, after an additional flip-chip assembly to a bond pad/heat sinking chip, results in a device having a bond pad chip having bond pads, solder beads formed on the bond pads, and a component connected to the bond pads by the solder beads. Wherein, the component has a substrate, a passivation layer on the substrate, and at least one electroplated, metal region on the substrate such that there is contiguous contact between the metal region and the passivation layer. | 03-17-2011 |
Clifford F. Knollenberg, Fremont, CA US
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20100148188 | LASER-INDUCED FLAW FORMATION IN NITRIDE SEMICONDUCTORS - An embodiment is a method and apparatus to induce flaw formation in nitride semiconductors. Regions of a thin film structure are selectively decomposed within a thin film layer at an interface with a substrate to form flaws in a pre-determined pattern within the thin film structure. The flaws locally concentrate stress in the pre-determined pattern during a stress-inducing operation. The stress-inducing operation is performed. The stress-inducing operation causes the thin film layer to fracture at the pre-determined pattern. | 06-17-2010 |
20100148197 | SELECTIVE DECOMPOSITION OF NITRIDE SEMICONDUCTORS TO ENHANCE LED LIGHT EXTRACTION - A method of texturing a surface within or immediately adjacent to a template layer of a LED is described. The method uses a texturing laser directed through a substrate to decompose and pit a semiconductor material at the surface to be textured. By texturing the surface, light trapping within the template layer is reduced. Furthermore, by patterning the arrangement of pits, metal coating each pit can be arranged to spread current through the template layer and thus through the n-doped region of a LED. | 06-17-2010 |
20100151602 | LASER ROUGHENING TO IMPROVE LED EMISSIONS - An improved method of forming a LED with a roughened surface is described. Traditional methods of roughening a LED surface utilizes strong etchants that require sealing or protecting exposed areas of the LED. The described method uses a focused laser to separate the LED from the substrate, and a second laser to roughen the LED surface thereby avoiding the use of strong etchants. A mild etchant may be used on the laser roughened LED surface to remove unwanted metals. | 06-17-2010 |
20110039360 | Selective Decomposition Of Nitride Semiconductors To Enhance LED Light Extraction - A method of texturing a surface within or immediately adjacent to a template layer of a LED is described. The method uses a texturing laser directed through a substrate to decompose and pit a semiconductor material at the surface to be textured. By texturing the surface, light trapping within the template layer is reduced. Furthermore, by patterning the arrangement of pits, metal coating each pit can be arranged to spread current through the template layer and thus through the n-doped region of a LED. | 02-17-2011 |
20140038334 | LASER-INDUCED FLAW FORMATION IN NITRIDE SEMICONDUCTORS - An embodiment is a method to induce flaw formation in nitride semiconductors. Regions of a thin film structure are selectively decomposed within a thin film layer at an interface with a substrate to form flaws in a pre-determined pattern within the thin film structure. The flaws locally concentrate stress in the pre-determined pattern during a stress-inducing operation. The stress-inducing operation is performed. The stress-inducing operation causes the thin film layer to fracture at the pre-determined pattern. | 02-06-2014 |
Clint Knollenberg, Racine, WI US
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20080273341 | Method and Apparatus for Mounting an LED Module to a Heat Sink Assembly - A heat sink assembly for mounting an LED module to a surrounding main heat sink member is disclosed. The heat sink assembly has a first plate with inner and outer faces and a peripheral edge. The assembly further includes a second plate that is movable with respect to the first plate and has inner and outer faces and an inwardly-tapered peripheral camming surface. Also included in the assembly is an expandable ring sandwiched between the first and second plates. The ring has an inward peripheral edge that engages the camming surface and an outward heat-transfer surface. The ring is expandable beyond the peripheries of the first and second plates. The heat sink assembly also has a sandwiching-device that adjustably interconnects the first and second plates such that sandwiching of the ring facilitates heat-transfer engagement of the heat-transfer surface with the main heat sink member. | 11-06-2008 |
Joerg Knollenberg, Berlin DE
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20100194893 | Process For Monitoring Territories In Order To Recognise Forest And Surface Fires - The monitoring of territories in order to recognize forest and surface fires requires complex automatic and human-assisted processes, which ultimately must include the control of intervention forces. Disclosed are processes for the centralised monitoring of territories. A swiveling and tiltable camera installed at a monitoring site supplies images of overlapping observation sectors. In each observation sector a sequence of images comprising a plurality of images is taken, at an interval which corresponds to fire and smoke dynamics. An on-site image-processing software supplies event warnings with indication of the position of the event site in the analysed image. A total image and an image sequence with image sections of the vent site are then transmitted to a central station and reproduced at the central station as an endless sequence in quick-motion mode. Event warnings with all relevant data can be blended into electronic maps at the central station. Cross-bearing is made possible by blending event warnings from adjacent monitoring sites. False alarms are minimized in that known false alarm sources are marked as exclusion zones in reference images. | 08-05-2010 |