| Patent application number | Description | Published |
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| 20090127740 | Use of polyamide compositions for making molded articles having improved adhesion, molded articles thereof and methods for adhering such materials - The present invention relates to the use of polyamide compositions comprising at least one semi-aromatic polyamide and at least one aliphatic semi-aromatic polyamide for making molded articles made of at least two moulded parts adhered to each other having improved adhesion. | 05-21-2009 |
| 20100237293 | USE OF POLYAMIDE COMPOSITIONS FOR MAKING MOLDED ARTICLES HAVING IMPROVED ADHESION, MOLDED ARTICLES THEREOF AND METHODS FOR ADHERING SUCH MATERIALS - The present invention relates to encapsulated electrical/electronic devices and the use of polyamide compositions comprising at least one semi-aromatic polyamide and at least one aliphatic semi-aromatic polyamide, in particular, for encapsulating electrical/electronic devices. | 09-23-2010 |
| 20100291819 | OVERMOLDED POLYAMIDE COMPOSITE STRUCTURES AND PROCESSES FOR THEIR PREPARATION - The present invention relates to the field of overmolded polyamide composites structures and processes for their preparation. The disclosed overmolded composite structures comprise a first component having a surface, which surface has at least a portion made of a surface polyamide resin composition, and having a fibrous material impregnated with a matrix resin composition, and comprise a second component comprising an overmolding resin composition. The second component is adhered to the first component over at least a portion of the surface of said first component. One of the overmolding resin composition and the surface polyamide resin composition is made of a polyamide composition comprising a blend of one or more semi-aromatic polyamides (A) and one or more fully aliphatic polyamides (B) and the other of the overmolding resin composition and the surface polyamide resin composition is made of one or more polyamides. | 11-18-2010 |
| 20110027571 | HEAT RESISTANT POLYAMIDE COMPOSITE STRUCTURES AND PROCESSES FOR THEIR PREPARATION - The invention relates to the field of composite structures comprising a fibrous material, a matrix resin composition and a portion made of a surface resin composition, wherein the compositions are chosen from compositions comprising one or more fully aliphatic polyamides and one or more polyhydric alcohols. | 02-03-2011 |
| 20110028060 | HEAT RESISTANT SEMI-AROMATIC POLYAMIDE COMPOSITE STRUCTURES AND PROCESSES FOR THEIR PREPARATION - The invention relates to the field of composite structures comprising a fibrous material, a matrix resin composition and a portion made of a surface resin composition, wherein the compositions are chosen from compositions comprising one or more semi-aromatic polyamides and one or more polyhydric alcohols. | 02-03-2011 |
| 20110039470 | OVERMOLDED HEAT RESISTANT POLYAMIDE COMPOSITE STRUCTURES AND PROCESSES FOR THEIR PREPARATION - The invention relates to heat resistant overmolded composite structures comprising a first component comprising a fibrous material, a matrix resin composition and a surface resin compositions, said compositions comprising one or more polyamide resins and one or more polyhydric alcohols and a second component comprising an overmolding resin composition. | 02-17-2011 |
| 20120108122 | OVERMOLDED POLYAMIDE COMPOSITE STRUCTURES AND PROCESSES FOR THEIR PREPARATION - Disclosed are overmolded polyamide composites structures and processes for their preparation. The disclosed overmolded composite structures comprise i) a first component having a surface, which surface has at least a portion made of a surface resin composition, and comprising a fibrous material, ii) a second component comprising an overmolding resin composition, adhered to said first component over at least a portion of the surface of said first component. The surface resin composition is selected from polyamide compositions comprising a blend of (A) one or more fully aliphatic polyamides selected from group (I) polyamides having a melting point of less than 230° C., and (B) one or more polyamides selected from group (II) polyamides having a melting point of at least 250° C., and wherein the matrix resin composition is selected from (B) or blends of (A) and (B). | 05-03-2012 |
| 20120108123 | COMPOSITE STRUCTURES HAVING IMPROVED HEAT AGING AND INTERLAYER BOND STRENGTH - Disclosed are composite structures having improved heat aging, processes for making them, and end use articles. The composite structures comprise a polyamide matrix resin composition comprising copper based heat stabilizer; a fibrous material and a polyamide surface resin composition comprising surface heat stabilizer; wherein the surface heat stabilizer is different than the copper based heat stabilizer. | 05-03-2012 |
| 20120108124 | OVERMOLDED POLYAMIDE COMPOSITE STRUCTURES AND PROCESSES FOR THEIR PREPARATION - Disclosed are overmolded composites structures and processes for their preparation. The overmolded composite structures comprise i) a first component having a surface, having at least a portion made of a surface resin composition, and comprising a fibrous material impregnated with a matrix resin composition, ii) a second component comprising an overmolding resin composition, and adhered to said first component over at least a portion of the surface of said first component. The matrix resin composition and the surface resin composition are identical or different and are selected from polyamide compositions comprising a blend of (A) one or more fully aliphatic polyamides selected, and (B) one or more semiaromatic polyamides having a melting point of at least 280° C. | 05-03-2012 |
| 20120108125 | COMPOSITE STRUCTURES HAVING IMPROVED HEAT AGING AND INTERLAYER BOND STRENGTH - Disclosed herein are composite structures having improved heat aging, processes for making them, and end use articles. The composite structures comprise a polyamide matrix resin composition comprising a matrix heat stabilizer ; a fibrous material and a polyamide surface resin composition comprising copper based heat stabilizer; wherein: the matrix heat stabilizer is different than the copper based heat stabilizer; and wherein the fibrous material is impregnated with the polyamide matrix resin composition. | 05-03-2012 |
| 20120108126 | COMPOSITE STRUCTURES HAVING IMPROVED HEAT AGING AND INTERLAYER BOND STRENGTH - Disclosed herein are composite structures having improved heat aging and interlayer adhesion properties, processes for making them, and end use articles. The composite structures comprise a second component overmolded onto a first component and wherein the surface of the first and optionally of second component comprise a copper based heat stabilizer thereby providing superior bond strength between components compared to polyhydric alcohol based heat stabilizers. | 05-03-2012 |
| 20120108129 | POLYAMIDE COMPOSITE STRUCTURES AND PROCESSES FOR THEIR PREPARATION - Disclosed herein are composite structures and processes for their preparation. The disclosed composite structures comprise a surface, having at least a portion made of a surface resin composition selected from polyamide compositions comprising a blend of two or more fully aliphatic polyamides having a melting point of at least 250° C. and comprise a fibrous material being impregnated with a matrix resin composition, and wherein the matrix resin composition is selected from polyamide compositions comprising a one or more fully aliphatic polyamides having a melting point of at least 250° C. | 05-03-2012 |
| 20120108130 | OVERMOLDED POLYAMIDE COMPOSITE STRUCTURES AND PROCESS FOR THEIR PREPARATION - Disclosed herein are overmolded composite structures and processes for their preparation. The disclosed overmolded composite structures comprise i) a first component having a surface, of which at least a portion made of a surface resin composition, and comprising a fibrous material being impregnated with a matrix resin composition, ii) a second component comprising an overmolding resin composition, wherein said second component is adhered to said first component over at least a portion of the surface of said first component, and wherein the matrix resin composition and the surface resin composition are identical or different polyamide compositions. | 05-03-2012 |
| 20120108131 | POLYAMIDE COMPOSITE STRUCTURES AND PROCESSES FOR THEIR PREPARATION - Disclosed herein are polyamide composite structures and processes for their preparation. The disclosed composite structures comprise a surface, having at least a portion made of a surface resin composition, and comprise a fibrous material being impregnated with a matrix resin composition. The surface resin composition is selected from polyamide compositions comprising a blend of (A) fully aliphatic polyamides having a melting point of less than 230° C., and (B) fully aliphatic polyamides having a melting point of at least 250° C., and wherein the matrix resin composition is independently selected from (B) or blends of (A) and (B). | 05-03-2012 |
| 20120108136 | OVERMOLDED POLYAMIDE COMPOSITE STRUCTURES AND PROCESSES FOR THEIR PREPARATION - Disclosed herein are overmolded polyamide composites structures and processes for their preparation. The disclosed overmolded composite structures comprise i) a first component having a surface, at least a portion of which is made of a surface resin composition, selected from polyamide compositions comprising a blend of two or more fully aliphatic polyamides having a melting point of at least 250° C., and comprising a fibrous material being impregnated with a matrix resin composition, ii) a second component comprising an overmolding resin composition, adhered to said first component over at least a portion of the surface of said first component, and wherein the matrix resin composition is selected from polyamide compositions comprising a one or more fully aliphatic polyamides having a melting point of at least 250° C. | 05-03-2012 |
| 20120178325 | POLYAMIDE COMPOSITE STRUCTURES AND PROCESSES FOR THEIR PREPARATION - The invention relates to composite structures having surface, which surface has at least a portion made of a composition comprising one or more polyamides having an excess of amine end groups such that the ratio of the amine end groups to the acid end groups is at least 1.5:1.0. | 07-12-2012 |
| Patent application number | Description | Published |
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| 20090212284 | ELECTRONIC DEVICE AND MANUFACTURING THEREOF - An electronic device and manufacturing thereof. One embodiment provides a semiconductor chip having a control electrode and a first load electrode on a first surface and a second load electrode on a second surface. A first lead is electrically coupled to the control electrode. A second lead is electrically coupled to the first load electrode. A third lead is electrically coupled to the first load electrode, the third lead being separate from the second lead. A fourth lead is electrically coupled to the second load electrode, the second and third leads being arranged between the first and fourth leads. | 08-27-2009 |
| 20100123511 | Circuit Arrangement for Actuating a Transistor - One example of the invention relates to a circuit arrangement for actuating a high-side transistor which includes a control terminal and a load terminal. The circuit arrangement includes a driver circuit that is designed to generate, in response to a control signal, a driver signal for the control terminal of the high-side transistor. A supply circuit is capacitively coupled to a radio-frequency signal source and is designed to provide a supply voltage to the driver circuit, the supply voltage being referenced to a floating reference potential. | 05-20-2010 |
| 20100276797 | SEMICONDUCTOR DEVICE - A semiconductor device includes a substrate having a chip island, a chip attached to the chip island, and encapsulation material deposited on the chip and part of the chip island. The chip island includes a first main face to which the chip is attached opposite a second main face, with the second main face of the chip island defining at least one cavity. | 11-04-2010 |
| 20120061819 | Semiconductor Module and Method for Production Thereof - This invention relates to a module including a semiconductor chip, at least two contact elements and an insulating material between the two contact elements. Furthermore, the invention relates to a method for production of such a module. | 03-15-2012 |
| 20120319109 | ELECTRONIC DEVICE AND MANUFACTURING THEREOF - An electronic device and manufacturing thereof. One embodiment provides a semiconductor chip having a control electrode and a first load electrode on a first surface and a second load electrode on a second surface. A first lead is electrically coupled to the control electrode. A second lead is electrically coupled to the first load electrode. A third lead is electrically coupled to the first load electrode, the third lead being separate from the second lead. A fourth lead is electrically coupled to the second load electrode, the second and third leads being arranged between the first and fourth leads. | 12-20-2012 |
| 20130285197 | Semiconductor Devices and Methods of Manufacturing and Using Thereof - A semiconductor device includes at least one first semiconductor element and two interconnectors for electrically coupling the at least one first semiconductor element to external. A spacing between the two interconnectors corresponds to a size of a second semiconductor element. The second semiconductor element can be affixed between the two interconnectors. | 10-31-2013 |
