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Kirchner

Eric Jacob Jan Kirchner, Leiden NL

Patent application numberDescriptionPublished
20120098845DISPLAY OF EFFECT COATINGS ON ELECTRONIC DISPLAY DEVICES - The invention relates to a method of displaying an image of an effect coating having texture and colour properties on an electronic display device, using measured colour data and measured texture data as input to generate the image, wherein the textured image is displayed with visual colour properties which are maintained on a prescribed level independent of possible variations in texture properties.04-26-2012
20130010009COLOUR CALIBRATION OF ELECTRONIC DISPLAY SCREENS - Process of colour calibrating an electronic display screen comprising the steps of displaying at least one trial colour of at least one physical sample having standardized colour on an electronic display screen, visually comparing the colour of the at least one physical sample and the at least one trial colour displayed on the electronic display screen, selecting the trial colour having the best visual match with the at least one physical sample, and using the selected trial colour on the electronic display screen having the best visual match with the at least one physical sample colour to colour calibrate the electronic display screen.01-10-2013
20150026298COLOUR VARIANT SELECTION METHOD USING A MOBILE DEVICE - The invention relates to a method of selecting the most probable variant of a matching paint candidate colour standard for vehicle repair using a mobile device having a colour display and an input unit and which is capable of data exchange with a central computer via an at least partly wireless communication line, wherein verbal or symbolic characterizations describing visual differences between a selected candidate colour standard and identified variants are displayed on the display of the mobile device.01-22-2015

Patent applications by Eric Jacob Jan Kirchner, Leiden NL

Olaf Nobert Kirchner, Genolier CH

Patent application numberDescriptionPublished
20120108127POLYAMIDE COMPOSITE STRUCTURES AND PROCESSES FOR THEIR PREPARATION - Disclosed herein are composite structures, overmolded composites structures and processes for their preparation. The disclosed composite structures have a surface having at least a portion made of a surface resin composition, and comprise a fibrous material being impregnated with a matrix resin composition, wherein the matrix polyamide resin composition and the surface resin composition are selected from polyamide compositions comprising a blend of semi-aromatic polyamides.05-03-2012

Olaf Norbert Kirchner, Genolier CH

Patent application numberDescriptionPublished
20090127740Use of polyamide compositions for making molded articles having improved adhesion, molded articles thereof and methods for adhering such materials - The present invention relates to the use of polyamide compositions comprising at least one semi-aromatic polyamide and at least one aliphatic semi-aromatic polyamide for making molded articles made of at least two moulded parts adhered to each other having improved adhesion.05-21-2009
20100237293USE OF POLYAMIDE COMPOSITIONS FOR MAKING MOLDED ARTICLES HAVING IMPROVED ADHESION, MOLDED ARTICLES THEREOF AND METHODS FOR ADHERING SUCH MATERIALS - The present invention relates to encapsulated electrical/electronic devices and the use of polyamide compositions comprising at least one semi-aromatic polyamide and at least one aliphatic semi-aromatic polyamide, in particular, for encapsulating electrical/electronic devices.09-23-2010
20100291819OVERMOLDED POLYAMIDE COMPOSITE STRUCTURES AND PROCESSES FOR THEIR PREPARATION - The present invention relates to the field of overmolded polyamide composites structures and processes for their preparation. The disclosed overmolded composite structures comprise a first component having a surface, which surface has at least a portion made of a surface polyamide resin composition, and having a fibrous material impregnated with a matrix resin composition, and comprise a second component comprising an overmolding resin composition. The second component is adhered to the first component over at least a portion of the surface of said first component. One of the overmolding resin composition and the surface polyamide resin composition is made of a polyamide composition comprising a blend of one or more semi-aromatic polyamides (A) and one or more fully aliphatic polyamides (B) and the other of the overmolding resin composition and the surface polyamide resin composition is made of one or more polyamides.11-18-2010
20110027571HEAT RESISTANT POLYAMIDE COMPOSITE STRUCTURES AND PROCESSES FOR THEIR PREPARATION - The invention relates to the field of composite structures comprising a fibrous material, a matrix resin composition and a portion made of a surface resin composition, wherein the compositions are chosen from compositions comprising one or more fully aliphatic polyamides and one or more polyhydric alcohols.02-03-2011
20110028060HEAT RESISTANT SEMI-AROMATIC POLYAMIDE COMPOSITE STRUCTURES AND PROCESSES FOR THEIR PREPARATION - The invention relates to the field of composite structures comprising a fibrous material, a matrix resin composition and a portion made of a surface resin composition, wherein the compositions are chosen from compositions comprising one or more semi-aromatic polyamides and one or more polyhydric alcohols.02-03-2011
20110039470OVERMOLDED HEAT RESISTANT POLYAMIDE COMPOSITE STRUCTURES AND PROCESSES FOR THEIR PREPARATION - The invention relates to heat resistant overmolded composite structures comprising a first component comprising a fibrous material, a matrix resin composition and a surface resin compositions, said compositions comprising one or more polyamide resins and one or more polyhydric alcohols and a second component comprising an overmolding resin composition.02-17-2011
20120108122OVERMOLDED POLYAMIDE COMPOSITE STRUCTURES AND PROCESSES FOR THEIR PREPARATION - Disclosed are overmolded polyamide composites structures and processes for their preparation. The disclosed overmolded composite structures comprise i) a first component having a surface, which surface has at least a portion made of a surface resin composition, and comprising a fibrous material, ii) a second component comprising an overmolding resin composition, adhered to said first component over at least a portion of the surface of said first component. The surface resin composition is selected from polyamide compositions comprising a blend of (A) one or more fully aliphatic polyamides selected from group (I) polyamides having a melting point of less than 230° C., and (B) one or more polyamides selected from group (II) polyamides having a melting point of at least 250° C., and wherein the matrix resin composition is selected from (B) or blends of (A) and (B).05-03-2012
20120108123COMPOSITE STRUCTURES HAVING IMPROVED HEAT AGING AND INTERLAYER BOND STRENGTH - Disclosed are composite structures having improved heat aging, processes for making them, and end use articles. The composite structures comprise a polyamide matrix resin composition comprising copper based heat stabilizer; a fibrous material and a polyamide surface resin composition comprising surface heat stabilizer; wherein the surface heat stabilizer is different than the copper based heat stabilizer.05-03-2012
20120108124OVERMOLDED POLYAMIDE COMPOSITE STRUCTURES AND PROCESSES FOR THEIR PREPARATION - Disclosed are overmolded composites structures and processes for their preparation. The overmolded composite structures comprise i) a first component having a surface, having at least a portion made of a surface resin composition, and comprising a fibrous material impregnated with a matrix resin composition, ii) a second component comprising an overmolding resin composition, and adhered to said first component over at least a portion of the surface of said first component. The matrix resin composition and the surface resin composition are identical or different and are selected from polyamide compositions comprising a blend of (A) one or more fully aliphatic polyamides selected, and (B) one or more semiaromatic polyamides having a melting point of at least 280° C.05-03-2012
20120108125COMPOSITE STRUCTURES HAVING IMPROVED HEAT AGING AND INTERLAYER BOND STRENGTH - Disclosed herein are composite structures having improved heat aging, processes for making them, and end use articles. The composite structures comprise a polyamide matrix resin composition comprising a matrix heat stabilizer ; a fibrous material and a polyamide surface resin composition comprising copper based heat stabilizer; wherein: the matrix heat stabilizer is different than the copper based heat stabilizer; and wherein the fibrous material is impregnated with the polyamide matrix resin composition.05-03-2012
20120108126COMPOSITE STRUCTURES HAVING IMPROVED HEAT AGING AND INTERLAYER BOND STRENGTH - Disclosed herein are composite structures having improved heat aging and interlayer adhesion properties, processes for making them, and end use articles. The composite structures comprise a second component overmolded onto a first component and wherein the surface of the first and optionally of second component comprise a copper based heat stabilizer thereby providing superior bond strength between components compared to polyhydric alcohol based heat stabilizers.05-03-2012
20120108129POLYAMIDE COMPOSITE STRUCTURES AND PROCESSES FOR THEIR PREPARATION - Disclosed herein are composite structures and processes for their preparation. The disclosed composite structures comprise a surface, having at least a portion made of a surface resin composition selected from polyamide compositions comprising a blend of two or more fully aliphatic polyamides having a melting point of at least 250° C. and comprise a fibrous material being impregnated with a matrix resin composition, and wherein the matrix resin composition is selected from polyamide compositions comprising a one or more fully aliphatic polyamides having a melting point of at least 250° C.05-03-2012
20120108130OVERMOLDED POLYAMIDE COMPOSITE STRUCTURES AND PROCESS FOR THEIR PREPARATION - Disclosed herein are overmolded composite structures and processes for their preparation. The disclosed overmolded composite structures comprise i) a first component having a surface, of which at least a portion made of a surface resin composition, and comprising a fibrous material being impregnated with a matrix resin composition, ii) a second component comprising an overmolding resin composition, wherein said second component is adhered to said first component over at least a portion of the surface of said first component, and wherein the matrix resin composition and the surface resin composition are identical or different polyamide compositions.05-03-2012
20120108131POLYAMIDE COMPOSITE STRUCTURES AND PROCESSES FOR THEIR PREPARATION - Disclosed herein are polyamide composite structures and processes for their preparation. The disclosed composite structures comprise a surface, having at least a portion made of a surface resin composition, and comprise a fibrous material being impregnated with a matrix resin composition. The surface resin composition is selected from polyamide compositions comprising a blend of (A) fully aliphatic polyamides having a melting point of less than 230° C., and (B) fully aliphatic polyamides having a melting point of at least 250° C., and wherein the matrix resin composition is independently selected from (B) or blends of (A) and (B).05-03-2012
20120108136OVERMOLDED POLYAMIDE COMPOSITE STRUCTURES AND PROCESSES FOR THEIR PREPARATION - Disclosed herein are overmolded polyamide composites structures and processes for their preparation. The disclosed overmolded composite structures comprise i) a first component having a surface, at least a portion of which is made of a surface resin composition, selected from polyamide compositions comprising a blend of two or more fully aliphatic polyamides having a melting point of at least 250° C., and comprising a fibrous material being impregnated with a matrix resin composition, ii) a second component comprising an overmolding resin composition, adhered to said first component over at least a portion of the surface of said first component, and wherein the matrix resin composition is selected from polyamide compositions comprising a one or more fully aliphatic polyamides having a melting point of at least 250° C.05-03-2012
20120178325POLYAMIDE COMPOSITE STRUCTURES AND PROCESSES FOR THEIR PREPARATION - The invention relates to composite structures having surface, which surface has at least a portion made of a composition comprising one or more polyamides having an excess of amine end groups such that the ratio of the amine end groups to the acid end groups is at least 1.5:1.0.07-12-2012

Patent applications by Olaf Norbert Kirchner, Genolier CH

Olaf Norbert Kirchner, Grenolier CH

Patent application numberDescriptionPublished
20100291821POLYAMIDE COMPOSITE STRUCTURES AND PROCESSES FOR THEIR PREPARATION - The present invention relates to the field of composite structures, overmolded composites structures and processes for their preparation, particularly it relates to the field of polyamide composite structures. The disclosed composite structures have a surface, which surface has at least a portion made of a surface polyamide resin composition, and comprise a fibrous material selected from non-woven structures, textiles, fibrous battings and combinations thereof, said fibrous material being impregnated with a matrix resin composition, wherein the surface polyamide resin composition is selected from polyamide compositions comprising a blend of a) one or more semi-aromatic polyamides (A) containing repeat units derived from aromatic dicarboxylic acids and aliphatic diamines, and b) one or more fully aliphatic polyamides (B) selected from the group consisting of polyamides containing repeat units derived from aliphatic dicarboxylic acids and aliphatic diamines, polyamides containing repeat units derived from aliphatic aminocarboxylic acids, and polyamides derived from lactams.11-18-2010

Ulf Kirchner, Hauset BE

Patent application numberDescriptionPublished
20110309926METHOD AND SYSTEM FOR DETERMINING A ROUTE FOR EFFICIENT ENERGY CONSUMPTION - Various embodiments relate to determining a route for efficient energy consumption. Data defining one or more routes and one or more consumption influencing parameters which influence a consumption of an energy source of the vehicle along the one or more routes may be received at a vehicle computer. Based on the route data and the consumption influencing parameters, at least one route which minimizes the consumption of the energy source for the vehicle may be determined. For the at least one route, one or more braking strategies may be determined for implementation by a vehicle operator in the vehicle in accordance with reducing the consumption of the vehicle energy source. The one or more braking strategies may be output in the vehicle.12-22-2011

Uwe Kirchner, Feldkirchen AT

Patent application numberDescriptionPublished
20090212284ELECTRONIC DEVICE AND MANUFACTURING THEREOF - An electronic device and manufacturing thereof. One embodiment provides a semiconductor chip having a control electrode and a first load electrode on a first surface and a second load electrode on a second surface. A first lead is electrically coupled to the control electrode. A second lead is electrically coupled to the first load electrode. A third lead is electrically coupled to the first load electrode, the third lead being separate from the second lead. A fourth lead is electrically coupled to the second load electrode, the second and third leads being arranged between the first and fourth leads.08-27-2009
20100123511Circuit Arrangement for Actuating a Transistor - One example of the invention relates to a circuit arrangement for actuating a high-side transistor which includes a control terminal and a load terminal. The circuit arrangement includes a driver circuit that is designed to generate, in response to a control signal, a driver signal for the control terminal of the high-side transistor. A supply circuit is capacitively coupled to a radio-frequency signal source and is designed to provide a supply voltage to the driver circuit, the supply voltage being referenced to a floating reference potential.05-20-2010
20100276797SEMICONDUCTOR DEVICE - A semiconductor device includes a substrate having a chip island, a chip attached to the chip island, and encapsulation material deposited on the chip and part of the chip island. The chip island includes a first main face to which the chip is attached opposite a second main face, with the second main face of the chip island defining at least one cavity.11-04-2010
20120061819Semiconductor Module and Method for Production Thereof - This invention relates to a module including a semiconductor chip, at least two contact elements and an insulating material between the two contact elements. Furthermore, the invention relates to a method for production of such a module.03-15-2012
20120319109ELECTRONIC DEVICE AND MANUFACTURING THEREOF - An electronic device and manufacturing thereof. One embodiment provides a semiconductor chip having a control electrode and a first load electrode on a first surface and a second load electrode on a second surface. A first lead is electrically coupled to the control electrode. A second lead is electrically coupled to the first load electrode. A third lead is electrically coupled to the first load electrode, the third lead being separate from the second lead. A fourth lead is electrically coupled to the second load electrode, the second and third leads being arranged between the first and fourth leads.12-20-2012
20130285197Semiconductor Devices and Methods of Manufacturing and Using Thereof - A semiconductor device includes at least one first semiconductor element and two interconnectors for electrically coupling the at least one first semiconductor element to external. A spacing between the two interconnectors corresponds to a size of a second semiconductor element. The second semiconductor element can be affixed between the two interconnectors.10-31-2013

Patent applications by Uwe Kirchner, Feldkirchen AT

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