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Kim, Gyunggi-Do

Allen C. Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20080242329Methods and arrangements for link rate adaptation in multi-radio co-existence platforms - Methods and arrangements for link rate adaptation in multi-radio co-existence platforms (MRPs) are contemplated. Embodiments include transformations, code, state machines or other logic to determine an overlap between receiving by a wireless device of the MRP and transmitting by other of the wireless devices of the MRP and to select a link rate of the wireless device of the MRP based upon the determining an overlap. The embodiments may also include communicating the determined link rate to a wireless device transmitting to the wireless device of the MRP. Embodiments may also include selecting a previously used link rate if the receiving overlaps the transmitting. Embodiments may also include basing the link rate upon an overlapping or non-overlapping Signal-to-Interference-Plus-Noise-Ratio depending on the relative amounts of overlapping and non-overlapping.10-02-2008

Byung Moon Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20110048786PRINTED CIRCUIT BOARD HAVING A BUMP AND A METHOD OF MANUFACTURING THE SAME - Disclosed herein is a printed circuit board having a bump and a method of manufacturing the same. The printed circuit board having a bump includes an insulating layer into which an inner circuit layer is impregnated; a protective layer that is formed under the insulating layer and has an opening exposing a pad unit of the inner circuit layer; and a bump that is integrally formed with the pad unit and is protruded from the inner side of the protective layer to the outside of the protective layer through the opening. The bump is integrally formed with the pad unit, thereby improving bonding strength between the bump and the printed circuit board, and the surface area of the bump is formed to be wide, thereby improving bonding strength between a solder ball and the printed circuit board.03-03-2011
20110159282CARRIER FOR MANUFACTURING SUBSTRATE AND METHOD OF MANUFACTURING SUBSTRATE USING THE SAME - Disclosed herein is a carrier for manufacturing a substrate, including: a base plate; adhesive layers formed on one side or both sides of the base plate; auxiliary adhesive layers, each of which is buried in one side of each of the adhesive layers, has a smaller area than each of the adhesive layers and has lower adhesivity than each of the adhesive layers; and metal layers, each of which is formed on one side of each of the auxiliary adhesive layers, whose edges are attached to the adhesive layers, and whose other portions excluding the edges are attached to the auxiliary adhesive layers. The carrier is advantageous in that a metal layer and an auxiliary adhesive layer are attached to each other by the adhesivity of the auxiliary adhesive layer, so that it is not required to use vacuum adsorption, with the result that a process of manufacturing a substrate can be performed more stably.06-30-2011
20120324723METHOD OF MANUFACTURING CORELESS SUBSTRATE - The present invention has been made in an effort to provide a method of manufacturing a coreless substrate that forms an opening by patterning a dry film for forming the opening onto one surface of a carrier, separating the carrier from the substrate, and removing only the dry film for forming the opening. In the present invention, since the pad can be exposed by removing only the dry film for forming the opening, a process time for forming the opening can be reduced and since a process is simple, a cost is saved.12-27-2012

Patent applications by Byung Moon Kim, Gyunggi-Do KR

Chang Sam Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20110014539SOLID OXIDE FUEL CELL - Disclosed herein is a solid oxide fuel cell comprising a support including hollow porous bodies.01-20-2011

Changsung Sean Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20090260569CHEMICAL VAPOR DEPOSITION APPARATUS - There is provided a chemical vapor deposition apparatus improved in structure such that a reaction gas introduced into a reactor where deposition is performed flows at a substantially uniform rate to ensure a thin film is grown substantially uniformly on the deposition object. The chemical vapor deposition apparatus includes: a chamber; a reactor provided in the chamber to have a deposition object deposited therein; and a reservoir storing a reaction gas fed from the outside to introduce the reaction gas to the reactor, the reservoir having a cross-sectional area changing according to a flow path of the introduced reaction gas.10-22-2009
20120306296SWITCHED RELUCTANCE MOTOR - Disclosed herein is a switched reluctance motor in which an outer rotor provided with a plurality of salient poles protruded at equidistance along an inner peripheral surface thereof; and a stator provided in the outer rotor, provided with a plurality of stator cores including main salient poles protruded toward the salient poles of the outer rotor and including coils wound therearound and auxiliary salient poles positioned at both sides of the main salient poles, and having phase windings in which the coils are wound around the main salient poles are provided, a magnetic flux is bisected in the main salient pole and flows into the auxiliary salient poles of adjacent phase windings, such that a short magnetic flux route is implemented, thereby making it possible to reduce core loss, and a magnet is also provided, thereby making it possible to improve torque characteristics.12-06-2012
20120306297SWITCHED RELUCTANCE MOTOR - Disclosed herein is a switched reluctance motor, including: a rotor provided with a plurality of salient poles protruded along an outer peripheral surface thereof; and a stator including a plurality of stator cores in a pi (π) shape that have the rotor rotatably accommodated therein, are opposite to the plurality of salient poles, and have coils wound therearound, wherein a magnetic flux path is formed along the stator cores in the pi shape and the salient pole opposite thereto.12-06-2012
20120306298SWITCHED RELUCTANCE MOTOR - Disclosed herein is a switched reluctance motor comprising: an outer rotor provided with a plurality of salient poles protruded at equidistance along an inner peripheral surface thereof; and a stator provided in the outer rotor, including a plurality of stator cores including a pair of stator salient poles protruded toward the salient pole of the outer rotor and a stator yoke connecting and supporting stator salient poles to each other, and having phase windings in which coils are wound around the stator salient poles, wherein a magnetic flux generated by applying a current to the phase winding flows through the pair of stator salient poles and the salient pole of the outer rotor.12-06-2012
20130015741TRANSVERSE SWITCHED RELUCTANCE MOTORAANM KIM; Changsung SeanAACI Gyunggi-doAACO KRAAGP KIM; Changsung Sean Gyunggi-do KRAANM CHOI; Chang HwanAACI Gyunggi-doAACO KRAAGP CHOI; Chang Hwan Gyunggi-do KRAANM BAE; Han KyungAACI Gyunggi-doAACO KRAAGP BAE; Han Kyung Gyunggi-do KRAANM LEE; Guen HongAACI SeoulAACO KRAAGP LEE; Guen Hong Seoul KR - Disclosed herein is a transverse switched reluctance motor including: a rotor including a plurality of rotor disks each having a shaft fixedly coupled to an inner portion thereof, having a plurality of rotor poles fixedly coupled thereto along an outer peripheral surface thereof, and arranged in a direction of a shaft; and a stator assembly including a plurality of stators each facing the plurality of rotor poles, having coils wound therearound, and arranged in a circumferential direction of the plurality of rotor disks so that the plurality of rotor disks are rotatably received therein, wherein magnetic flux paths are formed so that magnetic fluxes move in the direction of the shaft by the plurality of stators and the plurality of rotor poles facing the plurality of stators to circulate the stators.01-17-2013
20130026859LINEAR MOTOR - Disclosed herein is a linear motor including: a first stator part including a plurality of stator cores having coils wound therearound multiple times and arranged to be spaced apart from each other by predetermined intervals in a longitudinal direction; a second stator part arranged to be spaced apart from the first stator part by a predetermined interval in a transversal direction so as to face the first stator part and including a plurality of stator cores having coils wound therearound multiple times and arranged to be spaced apart from each other by predetermined intervals in the longitudinal direction so that the second stator part is in parallel with the first stator part; and a mover arranged in an interval formed by the first and second stator parts and moving linearly.01-31-2013
20130026864TRAVERSAL SWITCHED RELUCTANCE MOTOR - Disclosed herein is a transversal switched reluctance motor including: a rotor assembly formed by arranging a plurality of rotors including a rotor pole mounting part having a shaft coupled to an inner portion thereof and a plurality of rotor poles coupled to the rotor pole mounting part along an outer peripheral surface thereof in a direction of the shaft; and a stator assembly including a plurality of stators each including a coil enclosing an outer peripheral surface of the rotor assembly so that the rotor assembly is rotatably received in an inner portion thereof and a plurality of stator cores fitted with the coil from one side direction thereof along an outer peripheral surface thereof to thereby face the plurality of rotor poles, wherein the stator core has a C shaped cross section with respect to the direction of the shaft around which the rotor assembly rotates.01-31-2013
20130057091SWITCHED RELUCTANCE MOTOR - Disclosed herein is a switched reluctance motor having a double rotor structure. An out stator salient pole corresponding to an out rotor salient pole is formed to have an “E” shape by sequentially disposing a main salient pole, a first auxiliary salient pole, and a second auxiliary salient pole and an in stator salient pole corresponding to an in rotor salient pole is formed to have a pi (π) shape by sequentially disposing a first salient pole and a second salient pole, such that a magnetic flux path is reduced, thereby making it possible to prevent the loss of magnetic force.03-07-2013
20130076193LAMINATED CORE AND FABRICATION METHOD THEREOF - Disclosed herein is a laminated core used for a motor including an electric motor, wherein the core is formed of a soft magnetic composite and has a structure in which one or more unit laminates are laminated. Since the core is fabricated by laminating soft magnetic composites, the mechanical strength of the core formed of the soft magnetic composites can be improved.03-28-2013
20130106337APPARATUS OF DRIVING WHEELS FOR IN-WHEEL SYSTEM05-02-2013
20130158942APPARATUS AND METHOD FOR DIAGNOSING FAULT OF MULTI-SENSOR OF MOTOR - Disclosed herein are an apparatus and a method for diagnosing a fault of a multi-sensor of a motor. The apparatus includes: a plurality of tachometers attached to the motor to measure rotation speeds; and a plurality of processors each connected directly to the plurality of tachometers to receive the measured rotation speeds, thereby securing a plurality of directly obtained rotation speeds, sharing the obtained rotation speeds with each other, thereby obtaining a plurality of indirectly obtained rotation speeds, and performing a fault diagnosis on the plurality of tachometers using the plurality of directly obtained rotation speeds and the plurality of indirectly obtained rotation speeds.06-20-2013
20130162064LAMINATED CORE AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein is a laminated core used for a motor such as an electric motor, including: a unit laminate laminated in at least one layer and formed of a soft magnetic composite, wherein each powder particle forming the soft magnetic composite is insulation-coated. The preferred embodiments of the present invention can improve the mechanical strength of the core of the soft magnetic composite by manufacturing the core using the laminating method of the soft magnetic composite and reduce core loss by performing insulation coating on powder particles forming the soft magnetic composite.06-27-2013
20130278106ROTOR ASSEMBLY - According to a preferred embodiment of the present invention, in a structure in which a permanent magnet is embedded radially outwardly from a rotor portion, a pair of permanent magnets is embedded in a V-letter shape and a slit in a longitudinal direction is radially formed between the pair of permanent magnets. According to the preferred embodiment of the present invention, it is possible to implement relatively higher torque performance while minimizing the number of permanent magnets embedded in an interior permanent synchronous machine (IPMSM).10-24-2013
20130285584MOTOR DRIVING APPARATUS AND METHOD - Disclosed herein are a motor driving apparatus and method. The motor driving apparatus includes: an inverter including a main driver sequentially activating N phases and a spare driver activating a spare phase substituting for a faulted phase among the activated N phases; a detecting unit detecting the respective output signals of the N phases; a switching unit performing switching so that the spare phase is connected to the faulted phase of the exited N phases; and a controlling unit driving the inverter to determine whether or not a fault is generated and control the switching unit so that the faulted phase is connected to the spare phase. Therefore, since the motor may be driven without replacing the inverter, a cost may be reduced, and since the motor may be driven without a change in the number of phases, the motor may be efficiently and stably driven.10-31-2013

Patent applications by Changsung Sean Kim, Gyunggi-Do KR

Dong Il Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20100207652METHOD FOR WAFER TEST AND PROBE CARD FOR THE SAME - A method of testing a wafer capable of minimizing the asymmetrical thermal deformation of a probe card when a wafer is tested using a probe card and of minimizing the number of times of tests to effectively test a large area wafer and a probe card for the same is presented. For the wafer test method for testing semiconductor chips on a wafer using a probe card, the method includes creating virtual repeating units corresponding to N semiconductor chips, wherein the N is natural number larger than or equal to 2, arranging the plurality of repeating units on the wafer and moving the probe card or the wafer N times and testing the semiconductor chips on a wafer, wherein the semiconductor chips in the repeating units are sequentially tested one by one per each touchdown. Also, the probe cards to realize above mentioned method have been described.08-19-2010

Dong Sun Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20110099807Method of manufacturing printed circuit board - A fabrication method which can improve electrical properties, shorten processing time, and reduce the thickness of a chip package by achieving an ultra-thin fine circuit pattern. The method for fabricating a printed circuit board includes: providing an insulating material; forming in the insulating material at least one via-hole for interlayer electrical connection; ion beam treating the surface of the insulating material having the via-hole formed therein; forming a copper seed layer on the surface-treated insulating material using a vacuum deposition process; and plating a copper pattern on the copper seed layer to form a circuit pattern.05-05-2011
20110114369HEAT DISSIPATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a heat dissipating substrate, including: a heat dissipating circuit layer formed of an electrolytic invar layer including an invar layer and electrolytic copper plating layers formed on both sides of the invar layer; insulation layers formed on both sides of the heat dissipating circuit layer such that the heat dissipating circuit layer is interposed between the insulation layers; first and second circuit layers formed on the insulation layers; and a first bump connecting the heat dissipating circuit layer with the first circuit layer and a second bump connecting the heat dissipating circuit layer with the second circuit layer. The heat dissipating substrate exhibits excellent heat dissipation efficiency and can be made thin.05-19-2011
20140165346HEAT DISSIPATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Embodiments of the invention provide a heat dissipating substrate, including: a heat dissipating circuit layer formed of an electrolytic invar layer including an invar layer and electrolytic copper plating layers formed on both sides of the invar layer; insulation layers formed on both sides of the heat dissipating circuit layer such that the heat dissipating circuit layer is interposed between the insulation layers; first and second circuit layers formed on the insulation layers; and a first bump connecting the heat dissipating circuit layer with the first circuit layer and a second bump connecting the heat dissipating circuit layer with the second circuit layer. The heat dissipating substrate exhibits excellent heat dissipation efficiency and can be made thin.06-19-2014

Patent applications by Dong Sun Kim, Gyunggi-Do KR

Duck Young Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20100148606Spindle motor - The present invention provides a spindle motor which has superior operating characteristics. The spindle motor includes a stationary support shaft which is fastened to a base plate, a thrust plate which is fitted over the stationary support shaft, a sleeve which is rotatably provided around the stationary support shaft and is coupled to a rotor casing, and an annular stopper which is fastened to the sleeve or the rotor casing to support the lower surface of the thrust plate and prevent the sleeve from being removed. A first fluid sealing part is formed between the stopper and the thrust plate. The spindle motor further includes an annular sealing cap which is coupled to the sleeve or the rotor casing to store fluid between the sealing cap and an upper surface of the sleeve. A second fluid sealing part is formed between the sealing cap and the stationary support shaft.06-17-2010
20130082555SPINDLE MOTOR - Disclosed herein is a spindle motor in which oil sealing parts are surface-treated stepwise with respect to oil used as a fluid dynamic bearing, such that sealing of the oil sealing part is enhanced, thereby preventing scattering, or the like, of the oil. According to preferred embodiments of the present invention, oil contact surfaces are surface-treated stepwise in the direction from the inner side of the oil interface formed in the oil sealing part of a fluid dynamic bearing part toward the outer side thereof, thereby making it possible to enhance maintenance of the oil interface.04-04-2013
20130082562SPINDLE MOTOR - Disclosed herein is a spindle motor including: a base; a sleeve fixedly coupled to an inner side of the base; a core coupled to an upper portion of the base and having a coil wound therearound; a shaft inserted into an inner diameter of the sleeve and rotatably mounted; a hub having the shaft coupled to a central portion thereof and having a magnet attached thereto, the magnet being formed to face the core; and a gas adsorbing part formed under the core so as to be spaced apart from the core. According to a preferred embodiment of the present invention, the gas adsorbing part is formed at an inner portion of the spindle motor to remove outgas that may be generated at the inner portion of the spindle motor, thereby making it possible to improve the performance and the operational reliability of the spindle motor.04-04-2013

Patent applications by Duck Young Kim, Gyunggi-Do KR

Eung Ju Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20110080051WIRELESS POWER TRANSMISSION/RECEPTION APPARATUS AND METHOD - Disclosed herein is a wireless power transmission/reception apparatus. The wireless power transmission/reception apparatus includes a wireless power transmission unit and a wireless power reception unit. The wireless power transmission unit receives power, generates a wireless power signal to be wirelessly transmitted, wirelessly transmits the generated wireless power signal in a magnetic resonance manner, receives a returned wireless power signal and detects the number of power consumption devices, and wirelessly transmits a wireless power signal using resonance frequency appropriate for the number of power consumption devices.04-07-2011
20110081857WIRELESS POWER TRANSMISSION/RECEPTION APPARATUS AND METHOD HAVING COMMUNICATION FUNCTION - Disclosed herein is a wireless power transmission/reception apparatus and method having a communication function.04-07-2011
20110241609WIRELESS ENERGY TRANSMISSION STRUCTURE - Disclosed herein is a wireless energy transmission structure, which includes a printed circuit board, a disk section, and a wire section. The printed circuit board is formed in a ring type, the disk section is constituted by a first conductive plate and a second conductive plate formed on portions of the printed circuit board corresponding to each other to be spaced by a predetermined gap and a dielectric material inserted between the first conductive plate and the second conductive plate, and the wire section is constituted by a plurality of meta cells having a meta material structure, which are repetitively formed to surround the exterior and interior of the printed circuit board and a transmission line connected to each of the first conductive plate and the second conductive plate and surround the plurality of meta cells.10-06-2011
20110266879APPARATUS FOR TRANSMITTING AND RECEIVING WIRELESS ENERGY USING META-MATERIAL STRUCTURES HAVING ZERO REFRACTIVE INDEX - Disclosed herein is an apparatus for transmitting and receiving wireless energy using meta-material structures having a zero refractive index. The apparatus includes a wireless energy transmission unit and a wireless energy reception unit. When external power is applied thereto, the wireless energy transmission unit generates wireless energy to be wirelessly transmitted, and then wirelessly transmits wireless energy, which is normally propagated radially when the generated wireless energy is transmitted, using a magnetic resonance method while concentrating the wireless energy in one direction.11-03-2011
20110267247APPARATUS FOR TRANSMITTING AND RECEIVING WIRELESS ENERGY USING META-MATERIAL STRUCTURES HAVING NEGATIVE REFRACTIVE INDEX - Disclosed herein is there is provided an apparatus for transmitting and receiving wireless energy using meta-material structures having a negative refractive index. The apparatus includes a wireless energy transmission unit and a wireless energy reception unit. The wireless energy transmission unit generates wireless energy to be wirelessly transmitted, and then wirelessly transmits wireless energy, which is normally propagated radially, using a magnetic resonance method while concentrating the wireless energy at a single point. The wireless energy reception unit wirelessly receives the wireless energy using the magnetic resonance method while concentrating the wireless energy at a single point.11-03-2011
20110285830Stereoscopic Image Display Apparatus Capable Of Wirelessly Transmitting and Receiving Power - Disclosed herein is a stereoscopic image display apparatus capable of wirelessly transmitting and receiving power. The stereoscopic image display apparatus includes a stereoscopic image display unit and shutter glasses. The stereoscopic image display unit divides stereoscopic images into images for the left eye and images for the right eye and displays the resulting stereoscopic images, generates a signal of opening/closing a right eye shutter and a left eye shutter, and generates a power signal and then wirelessly transmits power in a magnetic resonance coupling manner. The shutter glasses wirelessly receives the power signal from the stereoscopic image display unit in the magnetic resonance coupling manner, and provides the images for the left eye and the images for the right eye by alternatively opening and closing the left eye shutter and the right eye shutter in response to the signal of opening/closing the right eye shutter and the left eye shutter.11-24-2011
20120038220WIRELESS POWER TRANSMISSION APPARATUS AND TRANSMISSION METHOD THEREOF - Disclosed herein are a wireless power transmission apparatus and a transmission method thereof. The wireless power transmission apparatus is configured to include a wireless power transmitter generating a wireless power signal to be wireless transmitted, wirelessly transmitting the generated wireless power signal by a magnetic resonance manner, receiving a reflection wireless power signal to determine whether or not a load apparatus is presented, and supplying power to the load apparatus; and a wireless power receiver connected to the load apparatus and receiving the transmitted wireless power signal by the magnetic resonance manner and supplying it to the connected load apparatus and reflecting the remaining wireless power signal to the wireless power transmitter, whereby a transmission apparatus can recognize a receiving environment and resonance characteristics are improved, without a separate communication device or a system.02-16-2012
20120146425WIRELESS POWER TRANSMISSION/RECEPTION APPARATUS AND METHOD - Disclosed herein is a wireless power transmission/reception apparatus. The wireless power transmission/reception apparatus includes a wireless power transmission unit configured to generate a wireless power signal to be transmitted, transmit the wireless power signal using magnetic resonance, receive a reflected wireless power signal from a wireless power reception unit, determine whether a load device is present, and transmit a wireless power signal if it is determined that the load device is present in such a way that impedance and output power depending on variation in a distance to the load device are automatically tracked, and wireless power is supplied to the load device in an optimized state. A wireless to power reception unit is connected to the load device, and configured to receive the wireless power signal, provide the wireless power signal to the load device, and reflect a reflected wireless power signal towards the wireless power transmission unit.06-14-2012
20120217926WIRELESS POWER TRANSFER - Disclosed herein is a wireless power transfer system. The wireless power transfer system includes a wireless power transmitter receiving power input from the outside to generate a wireless power signal to be transmitted in wireless and transmitting the generated wireless power signal in wireless by a magnetic resonance manner using an LC serial-parallel resonance circuit; a wireless power receiver installed in a charging device to receive the wireless power signal transmitted from the wireless power transmitter by the magnetic resonance manner using the LC serial-parallel resonance circuit and output the received wireless power signal; and a charging circuit installed in the charging device to allow the power output from the wireless power receiver to charge an embedded battery, thereby making it possible to efficiently provide power in wireless.08-30-2012
20130057202CHARGING APPARATUS USING PAD TYPE ELECTRODE CONTACT POINT - Disclosed herein is a charging apparatus using a pad type electrode contact point, the charging apparatus including: a charging plate having a plate shape; and an attaching plate installed on a portable terminal to provide the power to a charging circuit of the portable terminal.03-07-2013
20130074321METHOD OF MANUFACTURING STACKED RESONATED COIL - Disclosed herein is a method of manufacturing a stacked resonant coil, the method including: (A) forming circuit layers on a plurality of double-sided FCCLs, respectively, and then stacking the double-sided FCCLs respectively having the circuit layers formed thereon; (B) forming first and second conductive via holes in the stacked plurality of double-sided FCCLs, the first conductive via hole being for interlayer connection of the first ends respectively formed in the circuit layers and the second conductive via hole being for interlayer connection of the first electrode patterns respectively formed in the circuit layers; and (C) forming a wiring layer on an external layer of an uppermost double-sided FCCL in the staked plurality of double-sided FCCLs, the wiring layer electrically connecting the first ends and the first electrode patterns, thereby improving mass-productivity of products having uniform performances and excellent quality.03-28-2013
20130099729COIL STRUCTURE FOR WIRELESS CHARGING AND WIRELESS CHARGING APPARATUS HAVING THE SAME - The wireless charging apparatus according to the preferred embodiment of the present invention includes a control unit performing a general control of a wireless charging process; a driving unit connected to the control unit to generate a wireless power signal to be transmitted according to the control of the control unit; a transmission coil unit connected to the driving unit as a coil structure in a dumbbel form and transmitting wireless power according to the wireless power signal, the turn loop having a major-axis side of which one side is longer than the other side and at least one area is formed in a form depressed inwardly; and a sensing unit connected between the transmission coil unit and the control unit to detect whether the wireless charging receiver is positioned corresponding to the transmission coil unit and transfer the detected state to the control unit.04-25-2013
20140111156WIRELESS POWER TRANSMISSION/RECEPTION APPARATUS AND METHOD - Disclosed herein is a wireless power transmission/reception apparatus. The wireless power transmission/reception apparatus includes a wireless power transmission unit and a wireless power reception unit. The wireless power transmission unit receives power, generates a wireless power signal to be wirelessly transmitted, wirelessly transmits the generated wireless power signal in a magnetic resonance manner, receives a returned wireless power signal and detects the number of power consumption devices, and wirelessly transmits a wireless power signal using resonance frequency appropriate for the number of power consumption devices.04-24-2014

Patent applications by Eung Ju Kim, Gyunggi-Do KR

Eung-Suen Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20090167329METHODS AND APPARATUS FOR OPEN LAMP DETECTION IN ELECTRONIC CIRCUITS - Methods and apparatus for open lamp detection in electronic circuits are disclosed. An example apparatus to perform open circuit detection associated with an electrical component included in a device disclosed herein comprises a sampling circuit to attempt to pull a sampling current through the electrical component during initialization of the device, a comparator to compare a result produced by the sampling circuit to a reference value, and a timing circuit to cause the sampling circuit to attempt to pull the sampling current through the electrical component and to cause an output of the comparator to be stored after the comparator has compared the result produced by the sampling circuit to the reference value.07-02-2009

Gab Yong Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20100086292Device and method for automatically controlling continuous auto focus - Disclosed herein is a device and method for automatically controlling continuous auto focus. The device includes a lens unit installed in a camera module, and configured to receive images of an external subject; a lens actuation unit for moving the lens unit along an optical axis so as to focus on a subject; an image sensor for receiving the external images, converting the external images into image signals, and outputting the image signals; a computation unit for detecting focus values and feature parameters; a mode determination unit for automatically performing switching between general mode, specific mode and tracking mode, setting the mode, and automatically setting a fixed or variable window according to the set mode using the detected feature parameters; and a lens control unit for generating a control signal for controlling the lens actuation unit so as to perform continuous auto focus according to the detected focus values.04-08-2010

Gyu Won Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20110190632ULTRASONIC DIAGNOSTIC APPRATUS AND ULTRASONIC IMAGE PROCESSING METHOD - Disclosed herein is an ultrasonic diagnostic apparatus and ultrasonic image processing method. The ultrasonic diagnostic apparatus includes an ultrasonic transmission unit; An ultrasonic probe emits; An ultrasonic reception unit; An image processing unit; A sound velocity determination unit; and A control unit. Accordingly, there is an advantage in that the actual sound velocity of a reflected wave is estimated, so that high-quality ultrasonic images can be provided, and the time required for the estimation of a sound velocity can be reduced.08-04-2011
20120035482METHOD FOR ESTIMATING ACOUSTIC VELOCITY OF ULTRASONIC IMAGE AND ULTRASONIC DIAGNOSIS APPARATUS USING THE SAME - Disclosed herein are a method for estimating acoustic velocity of an ultrasonic image and an ultrasonic diagnosis apparatus using the same. The method for estimating acoustic velocity of an ultrasonic image includes: (A) dividing each of the ultrasonic images into a plurality of blocks; (B) extracting contours of ultrasonic images for each block of one frame among the ultrasonic images; (C) calculating and analyzing average luminance values of each block; (D) determining the optimal block number using the average luminance values and selecting the optimal blocks; and (E) estimating and applying the real acoustic velocity, whereby the acoustic velocity is estimated in real time and is applied to the ultrasonic diagnosis apparatus.02-09-2012
20130162679APPARATUS AND METHOD FOR EMBODYING OVERLAY IMAGES USING MRLC - Disclosed herein are an apparatus and a method for embodying overlay images using MRLC. The apparatus includes: a data encoder receiving static overlay images, warning overlay images, and continuous dynamic overlay images to perform RLC on each image and padding dummy data to perform MRLC on the padded dummy data and encode the padded dummy data; an address generator generating address indices; a memory the encoded MRLC data; a data decoder accessing the MRLC data of each overlay image; and a microcontroller calculating each RLC data size to obtain the maximum RLC data size and transmit the maximum RLC data size to the data encoder and reading the stored MRLC data and display each overlay image decoded. By this configuration, the low-price microcontroller can maximize the storage efficiency of the memory and implement the fast and easy access, thereby implementing the effective overlay and saving costs.06-27-2013

Patent applications by Gyu Won Kim, Gyunggi-Do KR

Hak Hwan Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20100090231LED PACKAGE MODULE - An LED package module according to an aspect of the invention may include: a substrate having predetermined electrodes thereon; a plurality of LED chips mounted onto the substrate, separated from each other at predetermined intervals, and electrically connected to the electrodes; a first color resin portion molded around at least one of the plurality of LED chips; a second color resin portion molded around all of the LED chips except for the LED chip around which the first color resin portion is molded, and having a different color from the first color resin portion; and a third color resin portion encompassing both the first color resin portion and the second color resin portion and having a different color from the first color resin portion and the second color resin portion. Accordingly, a reduction in luminous efficiency of an LED caused by yellowing is prevented to thereby increase luminous efficiency and achieve a reduction in size.04-15-2010
20100171143LIGHT EMITTING DIODE PACKAGE - There is provided an LED package having high heat dissipation efficiency. An LED package according to an aspect of the invention may include: a package body including a first groove portion being recessed into the package body and provided as a mounting area on the top of the package body; first and second lead frames arranged on a lower surface of the first groove portion while parts of the first and second lead frames are exposed; an LED chip mounted onto the lower surface of the first groove portion and electrically connected to the first and second lead frames; and a plurality of heat dissipation patterns provided on the bottom of the package body and formed of carbon nanotubes.07-08-2010

Han Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20080196927Working panel for multilayer printed circuit board - Disclosed is a working panel for a multilayer printed circuit board. The working panel for a multilayer printed circuit board is constructed in a manner such that first and second strips, having circuit layers and insulating layers which are layered on the upper and lower sides of a core in the opposite order with respect to each other, are appropriately disposed, by which the working panel can resist warpage due to thermal stress applied during the substrate fabrication process, thus imparting industrially useful effects that promise improvements in the standardization, productivity and yield of products.08-21-2008
20090288872Printed circuit board including outmost fine circuit pattern and method of manufacturing the same - Disclosed herein is a printed circuit board including an outmost fine circuit pattern. In the board, an end of a via, which has the minimum diameter, is connected to the outmost circuit layer of a substrate. The end surface, having the minimum diameter, is positioned at the outmost layer, so that the outmost circuit layer of the substrate, which needs to have a relatively high density in order to mount chips, compared to other circuit layers, can be more finely formed.11-26-2009
20090294164Printed circuit board including landless via and method of manufacturing the same - Disclosed herein is a printed circuit board including a landless via and a method of manufacturing the printed circuit board. The printed circuit board includes a landless via having no upper land. The via includes a circuit pattern having a line width smaller than the minimum diameter of the via. The via does not have an upper land on an end surface thereof having the minimum diameter, and thus a circuit pattern connected to the via is finely formed, resulting in the high-density circuit pattern. Thus, a compact printed circuit board having a reduced number of layers is realized.12-03-2009
20120011716Method of manufacturing printed circuit board including outmost fine circuit pattern - A method of manufacturing a printed circuit board including: preparing a first double-sided substrate including a first insulating layer, a first lower copper layer, a second circuit layer including a first lower land, and a first via; preparing a second double-sided substrate including a second insulating layer, a third lower copper layer, a fourth circuit layer including a second lower land, and a second via; disposing a third insulating layer between the second circuit layer and the fourth circuit layer such that the first lower land and the second lower land are electrically connected to each other though a conductive bump; and forming a first circuit layer including a first circuit pattern connected to the first via on the first lower copper layer and forming a third circuit layer including a third circuit pattern connected to the second via on the third lower copper layer.01-19-2012
20120066902METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD INCLUDING LANDLESS VIA - A method of manufacturing a printed circuit board, including: preparing a double-sided substrate which comprises an insulating layer, a first copper layer formed on one side of the insulating layer and a second copper layer formed on the other side of the insulating layer; forming a via-hole through the second copper layer and the insulating layer; forming a plating layer on an inner wall of the via-hole; and forming, on the double-sided substrate, a via, a first circuit layer including a circuit pattern that is formed on a surface of the via having a minimum diameter and has a line width smaller than the minimum diameter of the via, and a second circuit layer including a lower land.03-22-2012

Patent applications by Han Kim, Gyunggi-Do KR

Ho Kyoum Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20100086292Device and method for automatically controlling continuous auto focus - Disclosed herein is a device and method for automatically controlling continuous auto focus. The device includes a lens unit installed in a camera module, and configured to receive images of an external subject; a lens actuation unit for moving the lens unit along an optical axis so as to focus on a subject; an image sensor for receiving the external images, converting the external images into image signals, and outputting the image signals; a computation unit for detecting focus values and feature parameters; a mode determination unit for automatically performing switching between general mode, specific mode and tracking mode, setting the mode, and automatically setting a fixed or variable window according to the set mode using the detected feature parameters; and a lens control unit for generating a control signal for controlling the lens actuation unit so as to perform continuous auto focus according to the detected focus values.04-08-2010
20130114952CAMERA MODULE - Disclosed herein is a camera module including: a lens part including a lens; a housing having the lens part coupled thereto; a bracket coupled to the housing; and a shaft mounted in the bracket and driving the lens part and the housing.05-09-2013

Hong Ki Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20100118371THREE-DIMENSIONAL SPACE SCANNER - A three-dimensional space scanner can obtain spatial data by scanning a space around a mobile object not only in the horizontal direction but also in the vertical direction to measure a distance to a surrounding obstacle using a mirror that is driven to rotate as well as to tilt.05-13-2010

Hong Min Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20110049552LIGHT EMITTING DIODE PACKAGE - There is provided a light emitting diode (LED) package. The LED package includes A light emitting diode (LED) package includes a pair of lead frames connected with at least one LED chip through a metal wire, a package body integrally fixed with the lead frames and having a cavity having an open top, a lead frame bent downwardly to a lower part of an external mounting surface of the package body, a light-transmissive, transparent resin covering the LED chip and filling the cavity, a recess formed in a bottom surface of the cavity, in which the LED chip is mounted, and a transparent resin including a fluorescent material formed in the recess and the cavity. Accordingly, the amount of light-transmissive, transparent resin filling the cavity is reduced to save on manufacturing costs, and the height of the resin is lowered to improve the luminance of light. Also, the height of the package body is lowered, contributing to manufacturing a small product.03-03-2011

Hong Won Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20100320624DIE PACKAGE INCLUDING ENCAPSULATED DIE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a die package including an encapsulated die, including: a die including pads on one side thereof; an encapsulation layer covering lateral sides of the die; a support layer covering the encapsulation layer and one side of the die; a passivation layer formed on the other side of the die such that the pads are exposed therethrough; and a redistribution layer formed on the passivation layer such that one part thereof is connected with the pad. Here, since one side of the die is supported by the support layer and the encapsulation layer is formed on only the lateral side of the die, the warpage of the die package due to the difference in thermal expansion coefficient can be minimized.12-23-2010
20110097856METHOD OF MANUFACTURING WAFER LEVEL PACKAGE - Disclosed is a method of manufacturing a wafer level package, which includes arranging semiconductor dies on a carrier, forming a protective layer between the semiconductor dies of the carrier through screen printing, primarily heat hardening the protective layer, simultaneously pressing and secondarily heat hardening the protective layer, and removing the carrier, so that a thickness difference between the semiconductor dies and the protective layer is not formed and the warping of the wafer level package is reduced.04-28-2011
20110127076ELECTRONIC COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is an electronic component-embedded printed circuit board, including: a base plate having a cavity formed therein in a thickness direction thereof; an electronic component which is disposed in the cavity such that an active surface of the electronic component is flush with one side of the base plate; an insulating material layer which is formed on the other side of the base plate to bury the electronic component; and a first circuit layer which is formed on one side of the base plate and includes connection patterns coming into contact with connecting terminals of the electronic component, and a method of manufacturing the same. The electronic component-embedded printed circuit board is advantageous in that the active surface of an electronic component is disposed such that it is flush with one side of a base plate, so that additional viaholes do not need to be formed, with the result that a laser process requiring high cost can be omitted, thereby simplifying the manufacturing process of a printed circuit board and reducing the manufacturing cost thereof.06-02-2011

Patent applications by Hong Won Kim, Gyunggi-Do KR

Hyun Ho Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20110037481Method Of Testing Substrate - Disclosed herein is a method of testing a substrate. In the method, a first test terminal is connected to a first external circuit layer coupled to a first connection pad of a first active element included in a substrate, and a second test terminal is connected to a second external circuit layer coupled to a second connection pad of the first active element. Static electricity is applied through the first test terminal and a voltage drop of an electrostatic discharge protection circuit of the first active element is measured at the second test terminal, thus testing a status of a connection between the first active element and the external circuit layers. In the method, status of a connection of a connection circuit layer, a connection of an external circuit layer, a connection of a surface mount element, and a normal operation of the substrate is further tested.02-17-2011

Jae Yeon Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20100116458Integrated hybrid heat exchanger using water head difference - An integrated hybrid heat exchanger may include a first radiator and a second radiator disposed up and down in parallel, a first radiator tank connected to both first end portions of the first and second radiators in common, a first baffle installed in the first radiator tank and separating an inner space of the first radiator tank into an upper space and a lower space, wherein the upper and lower spaces of the first radiator tank include a coolant inlet respectively and a first air bypass member having a passage therein, the first air bypass member installed on the first baffle and extending upwards with a predetermined length and configured to remove bubbles collected in the lower space of the first radiator tank through the passage of the first air bypass member by pressure difference between the upper and lower spaces of the first radiator tank.05-13-2010

Jae Yoon Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20110127860BRUSHLESS DC MOTOR - A brushless DC motor. The motor includes a rotating shaft, a bearing rotatably supporting the rotating shaft in radial directions, a support holder made of a plastic material and supporting both the lower end of the rotating shaft and the outer circumferential surface of the bearing, a rotor casing having a rotor magnet therein and rotated along with the rotating shaft, a stator mounted to the outer circumferential surface of the support holder so as to face the rotor magnet and rotating the rotor casing by mutual cooperation with the rotor magnet in response to electricity applied from an external power source, and a plate, to which the support holder is locked using a locking screw. The brushless DC motor has a simple structure and reduces the material cost and assembly cost.06-02-2011
20110169359ASSEMBLY STRUCTURE OF BEARING AND HOLDER OF BRUSHLESS DC MOTOR - Disclosed herein is an assembly structure of a bearing and a holder of a brushless DC motor. The bearing is forcibly fitted into a hollow space formed through the holder. A beveled mouth edge is formed on the upper end of the circumferential inner surface of the holder through which the bearing enters the holder. Therefore, the assembly structure can enhance the workability of the process of assembling the bearing with the holder.07-14-2011
20110169380ASSEMBLY STRUCTURE OF BEARING AND HOLDER OF BRUSHLESS DC MOTOR - Disclosed herein is an assembly structure of a bearing and a holder of a brushless DC motor. The bearing is forcibly fitted into a hollow space formed through the holder. A beveled mouth edge is formed on the upper end of the circumferential inner surface of the holder through which the bearing enters the holder. Therefore, the assembly structure can enhance the workability of the process of assembling the bearing with the holder.07-14-2011

Jin Gu Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20110042799DIE PACKAGE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a die package and a method of manufacturing the die package. A solder layer is formed on a lower surface of a die. The die is self-aligned and attached to a support plate using surface tension between the solder layer and a metal layer of the support plate, thus reducing attachment lead time of the die.02-24-2011
20110156241PACKAGE SUBSTRATE AND METHOD OF FABRICATING THE SAME - Disclosed herein are a package substrate and a method of fabricating the same. The package substrate includes a base part that includes a chip, a mold part surrounding the chip, and a connection unit formed inside the mold part to connect the chip to a terminal part formed on the outer surface of the mold part, and a buildup layer that is formed on one surface of the base part on which the terminal part is formed, including the side surfaces of the base part, but includes a circuit layer connected to the terminal part, thereby making it possible to minimize stress applied to chips during a buildup process and easily replace malfunctioning chips.06-30-2011
20120067636INTERPOSER-EMBEDDED PRINTED CIRCUIT BOARD - Disclosed herein is an interposer-embedded printed circuit board, including: a substrate including a cavity formed in one side thereof and having a predetermined height in a thickness direction of the substrate; an interposer disposed in the cavity and including a wiring region and an insulating region; and a circuit layer formed in the substrate and including a connection pattern connected with one side of the wiring region. The interposer-embedded printed circuit board is advantageous in that an interposer is embedded in a substrate, so that the thickness of a semiconductor package can be reduced, thereby keeping up with the trend of slimming the semiconductor package.03-22-2012
20130149437METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD - Disclosed herein is a method for manufacturing a printed circuit board.06-13-2013
20130153275PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a printed circuit board and a method for manufacturing the same. According to a preferred embodiment of the present invention, the printed circuit board includes: a base substrate; circuit patterns formed in a circuit region on the base substrate; dummy patterns formed in a dummy region on the base substrate; and an insulating layer formed above the circuit patterns and the dummy patterns by a slit die coating method.06-20-2013
20130169382COMMON MODE FILTER AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a common mode filter and a method for manufacturing the same. The common mode filter includes a first insulator sheet; a first circuit layer having a first-layered first coil and a first-layered second coil alternately and separately arranged; a second insulator sheet laminated on the first circuit layer; and a second circuit layer having a second-layered first coil and a second-layered second coil alternately and separately arranged, the second-layered first coil being connected to the first-layered first coil and the second-layered second coil being connected to the first-layered second coil through the plurality of penetration holes.07-04-2013

Patent applications by Jin Gu Kim, Gyunggi-Do KR

Jin San Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20100005662Method of manufacturing hydrodynamic bearing - Disclosed herein is a method of manufacturing a hydrodynamic bearing in which a metal bearing made of sintered metal powder is internally subjected to chemical etching, to form hydrodynamic pressure grooves thereon, thus assuring a high-precision and reliable hydrodynamic bearing. The method includes: compressing metal powder that is a raw material of the bearing in a press unit, and sintering the compressed metal powder at a predetermined temperature, thus preparing a sintered bearing; removing foreign substances adhering to the sintered bearing through a deburring process, and pressing the sintered bearing into a desired shape; forming a hydrodynamic groove, configured to generate hydrodynamic pressure, on an internal surface of the shaped bearing using chemical etching; and conducting a post treatment of cleaning the bearing including the hydrodynamic grooves thereon and drying the bearing.01-14-2010
20130058603SPINDLE MOTOR - There is provided a spindle motor including: a hub moving together with a shaft; a sleeve supporting the shaft with oil; a stopper provided in the hub to thereby prevent excessive floating of the shaft; and oil storage parts formed on the stopper so as to be in communication with the outside, providing a storage space for the oil, and allowing an oil interface to be formed therein.03-07-2013
20130099625SPINDLE MOTOR - Disclosed herein is a spindle motor including: a shaft forming a rotation center of the motor; a sleeve receiving the shaft therein and rotatably supporting the shaft; a thrust plate protruding in a direction vertical to an axial direction of the shaft and coupled to an upper end portion of the sleeve in the axial direction; and a stopper including a first plate covering an upper end surface of the thrust plate in the axial direction and a second plate bent from one side end of the first plate in a downward axial direction. According to a preferred embodiment of the present invention, a bent stopper is coupled to one side end of a thrust plate of the spindle motor using a fluid dynamic pressure bearing, thereby making it possible to secure a double or more storage space of oil which is an operating fluid.04-25-2013

Jin Su Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20100084765Semiconductor package having bump ball - Disclosed is a semiconductor package having a bump ball as an external connection terminal, the bump ball including a core layer containing copper, a copper alloy, aluminum, an aluminum alloy or a combination thereof and a shell layer surrounding the core layer and containing tin, a tin alloy or a combination thereof.04-08-2010

Jin Waun Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20100252305CIRCUIT BOARD MODULE AND METHOD OF MANUFACTURING THE SAME - There is provided a circuit board module and a method of manufacturing the same. The circuit board module may include: a circuit board; a resistor arranged on the circuit board; pads covering both edges of the resistor; adhesive portions provided at least on the pads and formed of an electrically insulating material; and a heat dissipation member provided on the resistor and bonded to the pads using the adhesive portions.10-07-2010

Jin Yi Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20100059562Roof Side Bar for Prevention of Noise for Automobile - A roof side bar is configured for prevention of noise for an automobile. The roof side bar includes a cross bar mounting hole to which a cross bar may be mounted, and/or an interior space having a specific volume located behind the cross bar mounting hole, wherein a partitioning wall may be provided to divide the interior space into a plurality of subspaces so as to vary a resonant frequency in the interior space.03-11-2010

Jong Duck Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20110101884MULTI-STAGE POWER SUPPLY - There is provided a multi-stage power supply. A multi-stage power supply according to an aspect of the invention may include: a voltage converter circuit section including a plurality of first to n-th DC/DC converters connected in series between an input terminal and an output terminal, in order to supply a DC driving voltage to an LED array having a plurality of LEDs therein; a voltage detection section detecting an output voltage from the voltage converter circuit section; and a PWM control section generating a PWM control signal on the basis of a first detection voltage from the voltage detection section, a second detection voltage obtained by detecting current flowing through the LED array, and a third detection voltage obtained by detecting a current waveform flowing through an internal switch of the n-th DC/DC converter, and supplying the PWM control signal to each of the first through n-th DC/DC converters.05-05-2011

Jong Man Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20110042042RADIATING PACKAGE MODULE FOR EXOTHERMIC ELEMENT - Disclosed herein is a radiating package module for an exothermic element. The radiating package module includes a heat conducting plate which has a groove of an internal thread shape, with the exothermic element being mounted on a surface of the heat conducting plate. A heat pipe is inserted into the groove in a screw-type coupling manner and has a coupling part of an external thread shape. An adhesive is applied between the groove and the coupling part. A cooling unit is coupled to an end of the heat pipe. The radiating package module maintains the reliability with which the radiating package radiates heat and improves structural reliability.02-24-2011
20120105186TRANSFORMER HAVING THE HEAT RADIATION FUNCTION - Disclosed herein is a transformer having a heat radiation function. The transformer includes a pair of cores having an E-shape and facing and contacting each other to form central pillars and outer peripheral parts, a transforming coil part wound on the central pillars of the pair of cores and dropping voltage, and a heat radiation pipe formed to have a cylindrical shape and positioned inward from the transforming coil part to radiate heat generated from the transforming coil part, thereby well discharging heat generated from the coil.05-03-2012
20130020111SUBSTRATE FOR POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a substrate for a power module package and a method for manufacturing the same, including: a base substrate made of a metal material; an anodized layer formed on the base substrate; and a circuit layer formed on the anodized layer, wherein the anodized layer is formed to correspond to circuit patterns on the circuit layer or is formed to be divided into a plurality of areas.01-24-2013
20130037967SEMICONDUCTOR PACKAGE SUBSTRATE - Disclosed herein is a semiconductor package substrate including a base substrate, a mounting member mounted on an upper portion of the base substrate, and an adhesive layer formed between the base substrate and the mounting member, wherein the adhesive layer includes a thermally conductive adhesive and a ductile adhesive formed at the outer circumference of the thermally conductive adhesive.02-14-2013
20130069213POWER MODULE PACKAGE - Disclosed herein is a power module package including: a first substrate having one surface and the other surface; a second substrate contacting one surface of the first substrate; a third substrate contacting one side of the other surface of the first substrate; a first lead frame contacting the other side of the other surface of the first substrate; and a second lead frame electrically connected to the third substrate.03-21-2013
20130314874HEAT RADIATION SYSTEM FOR POWER MODULE - Disclosed herein is a heat radiation system for a power module, including: a heat radiation member having an internal space and a cooling medium circulated in the internal space; a heat generation module formed on the heat radiation member; and a pair of electrodes formed at regions facing each other in the internal space of the heat radiation member and having different volumes.11-28-2013
20130343001HEAT DISSIPATION SYSTEM FOR POWER MODULE - Disclosed herein is a heat dissipation system for a power module, the heat dissipation system including: first and second heat dissipation plates spaced apart from each other while facing each other, to form a cooling medium flow passage; first and second inflow lines extended to the cooling medium flow passage of the first and second heat dissipation plates, to transfer cooling media flowing therein at different flow rates or different fluxes to the cooling medium flow passage; and first and second inlets respectively connected with the first and second inflow lines to allow the cooling media to flow therein.12-26-2013

Patent applications by Jong Man Kim, Gyunggi-Do KR

Jong Rak Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20080231404INTEGRATED TYPE TRANSFORMER - There is provided an integrated type transformer that reduces the volume by integrating a plurality of transformers transmitting power for driving a plurality of lamps in an inverter circuit for an LCD into one transformer structure. An integrated type transformer according to an aspect of the invention includes a bobbin unit including a bobbin body having a predetermined length and a through hole therein in a longitudinal direction of the bobbin unit, and a core unit including an inner core inserted into the through hole of the bobbin unit, and an outer core formed along one surface in the longitudinal direction among outer circumferential surfaces of the bobbin unit and electromagnetically coupled to the inner core to form one magnetic path.09-25-2008

Jong Yun Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20090314653Electrode tool for electrochemical machining and method of manufacturing the same - Disclosed herein is a highly-durable electrode tool for electrochemical machining, which can prevent the corrosion and abrasion of a conductive pattern at the time of electrochemical machining for forming dynamic pressure-generating grooves of a fluid dynamic bearing, and a method of manufacturing the same. The electrode tool for electrochemical machining includes: an electrode substrate on which a conductive pattern is formed to have protrusions corresponding to the fine grooves and to which negative current is applied; a nonconductive insulating layer, covering an entire top surface of the electrode substrate excluding the conductive pattern; and a conductive layer, which is formed on the conductive pattern to protect the conductive pattern, and a top surface of which is the same height as a top surface of the nonconductive insulating layer.12-24-2009

Joong El Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20090260569CHEMICAL VAPOR DEPOSITION APPARATUS - There is provided a chemical vapor deposition apparatus improved in structure such that a reaction gas introduced into a reactor where deposition is performed flows at a substantially uniform rate to ensure a thin film is grown substantially uniformly on the deposition object. The chemical vapor deposition apparatus includes: a chamber; a reactor provided in the chamber to have a deposition object deposited therein; and a reservoir storing a reaction gas fed from the outside to introduce the reaction gas to the reactor, the reservoir having a cross-sectional area changing according to a flow path of the introduced reaction gas.10-22-2009

Joon Sung Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20090232467Printed circuit board for optical waveguide and method of manufacturing the same - Disclosed herein is a printed circuit board for an optical waveguide, including a base board, and an optical waveguide formed on the base board. The optical waveguide includes a lower clad layer formed on the base board, an insulation layer formed on the lower clad layer and having a core-forming through-hole, a core part formed on a region of the lower clad layer, which is exposed through the through-hole, and an upper clad layer formed in the through-hole and on the insulation layer.09-17-2009
20090290832Printed circuit board including optical waveguide and method of manufacturing the same - Disclosed herein is a printed circuit board including an optical waveguide and a method of manufacturing the board. In the board, the optical waveguide includes a metal layer extending portion integrally connected to a metal layer constituting a mirror formed in the optical waveguide. Since the method of the present invention creates the mirror using electroless plating, which is typically used in a process of manufacturing general printed circuit boards, it is suitable for the manufacture of printed circuit boards having a large area, and the mirror has high reflectivity and is efficient in terms of material consumption.11-26-2009
20100018052Method of manufacturing printed circuit board for optical waveguide - Disclosed herein is a method of manufacturing a printed circuit board for an optical waveguide which includes electrical and optical layers for transmitting electrical and optical signals to the printed circuit board. The method includes forming a lower clad layer on a base substrate, layering or applying a core material on the lower clad layer, machining a trench in the core material to form a core layer having a core pattern, and forming an upper clad layer on the lower clad layer and the core layer. The method enables an optical waveguide to be manufactured using a simple apparatus and process without the use of an additional photo mask.01-28-2010
20100142883Printed circuit board for optical waveguide and method of manufacturing the same - Disclosed herein is a printed circuit board for an optical waveguide, including: a substrate; an insulation layer having a through hole and formed on the substrate; a lower clad layer formed on a bottom of the through hole; core part formed on the lower clad layer; and an upper clad layer formed on the lower clad layer and the core part and thus covering an exposed surface of the core part.06-10-2010
20100316329OPTICAL ELEMENT PACKAGE AND SUBSTRATE COMPRISING THE SAME - Disclosed herein is an optical element package substrate configured such that electric wiring substrates having a cavity are layered on both sides of an optical waveguide, an optical element package is mounted in the electric wiring substrates, and an optical element mounted on the surface of the optical element package is housed in the cavity, so that the distance between the optical element and the optical waveguide is decreased, thereby increasing optical connection efficiency.12-16-2010
20100316330PRINTED CIRCUIT BOARD FOR OPTICAL WAVEGUIDES AND METHOD OF MANUFACTURING SAME - Disclosed herein is a printed circuit board for an optical waveguide, including: a lower substrate; an insulation layer which has a through-hole and is formed on the lower substrate; an optical waveguide which is formed in the through-hole such that a clearance is present between the optical wave guide and an inner wall of the through-hole; and an adhesive material which is charged in the clearance. The printed circuit board for an optical waveguide is advantageous in that a lower clad material, a core material and an upper clad material are sequentially applied on the lower substrate partially, not entirely, based on the region in which a core is formed, and is then patterned to form an optical waveguide, so that the amounts of the lower and upper clad materials and the core material, which are used to form the optical waveguide, can be greatly decreased.12-16-2010
20120171624PRINTED CIRCUIT BOARD FOR OPTICAL WAVEGUIDE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a printed circuit board for an optical waveguide, including a base board, and an optical waveguide formed on the base board. The optical waveguide includes a lower clad layer formed on the base board, an insulation layer formed on the lower clad layer and having a core-forming through-hole, a core part formed on a region of the lower clad layer, which is exposed through the through-hole, and an upper clad layer formed in the through-hole and on the insulation layer.07-05-2012
20130126224PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes: a base substrate; an outer circuit layer formed on an upper portion of the base substrate and including a connection pad; a first solder resist formed on the upper portion of the base substrate so that the connection pad of the outer circuit layer is exposed; and a second solder resist formed on an upper portion of an outer circuit layer and formed so that the connection pad is exposed.05-23-2013
20140048320PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a printed circuit board and a method for manufacturing the same, the printed circuit board including an adhesion promoter (AP) film for enhancing adhesive strength, interposed between a circuit pattern and an insulating layer above a substrate, the AP film containing any one of a first polymer, a second polymer, and an organic compound. According to the method for manufacturing the printed circuit board, there can be provided a printed circuit board having a fine circuit pattern by using the AP film having a low roughness value and having improved adhesive strength with respect to the circuit pattern.02-20-2014

Patent applications by Joon Sung Kim, Gyunggi-Do KR

Ju Eung Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20110193415WIRELESS ENERGY TRANSMISSION STRUCTURE - Disclosed is a wireless energy transmission structure which includes a disc part including a first conductor plate and a second conductor plate which are spaced to face each other and a dielectric material inserted between the first conductor plate and the second conductor plate, and generating an electric field between the first conductor plate and the second conductor plate; and a ring-shaped wire part one end of which is connected to the first conductor plate and the other end of which is connected to the second conductor plate, and having a meta structure in which a plurality of meta cells is repetitively arranged so as to induce a magnetic field using the electric field, so that the wireless energy transmission structure is reduced in size and is improved in transmission distance and transmission efficiency.08-11-2011

Jung Soo Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20100319980PRINTED CIRCUIT BOARD - Disclosed herein is a printed circuit board. When power layers for supplying different voltages are sequentially stacked, a first EBG cell formed between a first power layer and a ground layer is arranged within a second EBG cell formed between a second power layer and the ground layer to allow the first EBG cell and the second EBG cell to have a double EBG structure. Accordingly, the present invention can prevent a DC open state while preventing noise and realizing band-stop characteristics.12-23-2010
20100319982ELECTROMAGNETIC WAVE SHIELDING SUBSTRATE - Disclosed herein is an electromagnetic wave shielding substrate including an electromagnetic bandgap structure which is formed along the edge thereof in order to prevent electromagnetic waves from being emitted therefrom. The electromagnetic wave shielding substrate can effectively prevent the emission of electromagnetic waves.12-23-2010
20100328178PRINTED CIRCUIT BOARD INCLUDING ELECTROMAGNETIC BANDGAP STRUCTURE - Disclosed is a printed circuit board, which includes an electromagnetic bandgap structure disposed around an antenna so as to prevent noise from being transmitted to the antenna. The printed circuit board includes an antenna, a circuit chip, a plurality of metal layers and a plurality of dielectric layers, a pair of transmission lines for transmitting a signal to the antenna, and an electromagnetic bandgap structure disposed between the antenna and the circuit chip and for preventing an electromagnetic wave from being transmitted from the circuit chip to the antenna.12-30-2010
20140191907PRINTED CIRCUIT BOARD INCLUDING ELECTROMAGNETIC BANDGAP STRUCTURE - Embodiments of the present invention provide a printed circuit board, which includes an electromagnetic bandgap structure disposed around an antenna, so as to prevent noise from being transmitted to the antenna. The printed circuit board includes an antenna, a circuit chip, a plurality of metal layers and a plurality of dielectric layers, a pair of transmission lines for transmitting a signal to the antenna, and an electromagnetic bandgap structure disposed between the antenna and the circuit chip and for preventing an electromagnetic wave from being transmitted from the circuit chip to the antenna.07-10-2014

Ki Joong Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20110102084MULTI-STAGE CMOS POWER AMPLIFIER - There is provided a multi-stage CMOS power amplifier including: a driver amplifier having differential output terminals, inverting differential signals input through first and second input terminals and outputting the respective inverted signals through the differential output terminals; a transformer for power matching having a primary coil connected between the differential output terminals of the driver amplifier and a secondary coil coupled with the primary coil using electromagnetic induction, having a predetermined turns ratio to the primary coil, and connected to a direct current (DC) tuning voltage terminal; and a power amplifier power-amplifying differential signals passing through one end and the other end of the secondary coil of the transformer and outputting the respective power-amplified differential signals through first and second output terminals.05-05-2011
20110121903POWER AMPLIFIER - There is provided a power amplifier that can increase power efficiency by preventing power consumption caused by DC components from an RF input signal. A power amplifier according to an aspect of the invention may include: an inverter amplification section amplifying an input signal according to an inverter method to thereby remove DC components from the input signal; an impedance matching section matching an impedance of a transmission path of the input signal amplified by the inverter amplification section; and an amplification section amplifying an impedance-matched signal from the impedance matching section according to a gain set beforehand.05-26-2011
20110140781IMPEDANCE MATCHING CIRCUIT ELIMINATING INTERFERENCE BETWEEN SIGNAL LINES AND POWER AMPLIFIER HAVING THE SAME - Disclosed are an impedance matching circuit preventing the occurrence of inter-line interference by making currents at adjacent lines flow in the same direction, and a power amplifier having the same. The impedance matching circuit eliminating interference between signal lines includes: a first transformer including a first input line which forms a first loop by a conductor receiving a signal and a first output line which forms a second loop by a conductor outputting a signal at the inner side of the first loop of the first input line to match the impedance of a path of an input signal; and a second transformer including a second input line which forms a third loop by a conductor receiving a signal and a second output line which forms a fourth loop by a conductor outputting a signal at the inner side of the third loop of the second input line to match impedance, wherein the direction of current in the first input line of the first transformer and the direction of current in the second input line of the second transformer are the opposite so that a portion of the first input line of the first transformer and a portion of the second input line of the second transformer adjacent to the portion of the first input line of the first transformer have the same current direction.06-16-2011
20110215865POWER AMPLIFIER - Disclosed herein is a power amplifier. The power amplifier includes N power amplification means, a transformer, and a harmonic elimination unit. Each of the N power amplification means amplifies an input signal into a predetermined level. The transformer includes N/2 primary windings respectively connected to the output terminals of the power amplification means and a secondary winding configured such that coil elements are connected in series between an output terminal and a ground, and sums power transmitted from the primary windings. The harmonic elimination unit is disposed across both ends of the secondary winding of the transformer, and eliminates the output of the harmonic frequencies of a preset frequency.09-08-2011
20140139291POWER AMPLIFIER - There is provided a power amplifier including a bias circuit unit generating a bias voltage of an amplifying unit, a voltage drop unit disposed between the bias circuit unit and the amplifying unit to drop the bias voltage to a base voltage, and a bypass circuit unit including an impedance element connected to the voltage drop unit in parallel and performing a switching operation according to a magnitude of an input signal.05-22-2014
20140162579FRONT END MODULE - There is provided a front end module, including an amplification circuit unit amplifying signal, a multistage matching circuit unit connected to an output terminal of the amplification circuit unit, and a switch circuit unit connected to the multistage matching circuit unit, wherein the switch circuit unit includes a series switch circuit and a parallel switch circuit, the parallel switch circuit being connected to a node between a plurality of matching circuits included in the multistage matching circuit unit.06-12-2014

Kiy Eo Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20110057278X-RAY DETECTOR USING LIQUID CRYSTAL DEVICE - An X-ray detector includes a first substrate having a bottom surface on which a first electrode is formed. A second substrate has a top surface on which a second electrode and a polyimide layer are sequentially formed. A photoconductive layer is formed on a bottom surface of the first electrode and generates electron-hole pairs. A reflective layer is formed on a bottom surface of the photoconductive layer. A liquid crystal polymer layer is formed on a bottom surface of the reflective layer, and peaks and valleys are alternately formed on a bottom surface of the liquid crystal polymer layer. A liquid crystal layer is formed between the liquid crystal polymer layer and the polyimide layer, and liquid crystal molecules are aligned in a direction in which the peaks and valleys on the bottom surface are arranged.03-10-2011

Kyung Ha Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20090062052Power transmission device for hybrid vehicle - The present invention provides a layout of a power transmission device for a hybrid vehicle which provides a high damping force a high damping force against engine fluctuation at low RPM operation by an engine03-05-2009

Mi Yang Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20110195010Method of forming InP quantum dot and InP quantum dot formed by the same - Disclosed herein is a method of forming a spherical InP quantum dot, including: providing a compound containing indium (In); dissolving the compound in alcohol to form a solution; and introducing a compound containing phosphorus (P) into the solution. The method is advantageous because a spherical InP quantum dot can be formed, the method is environment-friendly because alcohol is used as a solvent, because InP quantum dots can be produced in large quantities because the InP quantum dots can be formed while putting all reactants into a reactor and slowly heating the reactants, and because the desired InP quantum dots can be easily recovered by decreasing the temperature of a reactor or by performing centrifugal separation at low speed.08-11-2011
20140138611IN NANOWIRE, DEVICE USING THE SAME AND METHOD OF MANUFACTURING In NANOWIRE - There is provided an In nanowire including a substrate, an indium thin film formed on the substrate, an insulating film formed on the indium thin film and having at least one through hole through formation of a pattern, and an In nanowire vertically protruded from the indium thin film through the at least one through hole.05-22-2014

Moonil Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20110133991DIELECTRIC RESONATOR ANTENNA EMBEDDED IN MULTILAYER SUBSTRATE - Disclosed is a dielectric resonator antenna embedded in a multilayer substrate, which includes a multilayer substrate, a first conductor plate having an opening, a second conductor plate formed on the bottom of a lowermost insulating layer resulting from stacking at least two insulating layers downward from the first conductor plate, a plurality of metal via holes passing through around the opening at a predetermined interval, and a feeder for transmitting a frequency signal to the dielectric resonator embedded by the metal boundaries defined by the first conductor plate, the second conductor plate and the plurality of metal via holes, thus exhibiting low sensitivity to fabrication error and the external environment.06-09-2011
20110248890DIELECTRIC RESONATOR ANTENNA EMBEDDED IN MULTILAYER SUBSTRATE FOR ENHANCING BANDWIDTH - Disclosed herein is a dielectric resonator antenna embedded in a multilayer substrate for enhancing bandwidth. The dielectric resonator antenna includes a multilayer substrate, a first conductive plate, a second conductive plate, a plurality of first metal via holes, a feeding part configured to feed a dielectric resonator, and a conductive pattern part inserted into the dielectric resonator so that a vertical metal interface is formed in the dielectric resonator. Accordingly, the dielectric resonator antenna has low sensitivity to fabrication errors and an external environment, and can enhance the radiation characteristics of the antenna when multiple resonances occur.10-13-2011
20110248891DIELECTRIC RESONANT ANTENNA USING A MATCHING SUBSTRATE - Disclosed herein is a dielectric resonator antenna using a matching substrate in order to improve a bandwidth. The dielectric resonator antenna includes: a dielectric resonator body part that is embedded in a multi-layer substrate and has an opening part on the upper portion thereof; and at least one matching substrate that is stacked on the opening part and includes an an insulating layer having a dielectric constant smaller than that of the multi-layer substrate but larger than that of air, thereby making it possible to improve the bandwidth without adjusting the size of the dielectric resonator body part and to prevent loss and change in the radiation pattern due to the substrate mode.10-13-2011
20120206311DIELECTRIC WAVEGUIDE ANTENNA - Disclosed herein is a dielectric waveguide antenna including: a dielectric waveguide transmitting a signal applied from a power feeder; a dielectric waveguide radiator radiating the signal transmitted from the dielectric waveguide to the air through a first aperture; and a matching unit formed in a portion of the dielectric waveguide and controlling a serial reactance and a parallel reactance to thereby perform impedance matching between the dielectric waveguide radiator and the air, in order to reduce reflection generated in the first aperture during the radiation of the signal through the first aperture. Reflection in the aperture is reduced through the matching unit having various structures, thereby making it possible to improve characteristics of the dielectric waveguide antenna.08-16-2012
20140168024DIELECTRIC WAVEGUIDE ANTENNA - Embodiments of the invention provide a dielectric waveguide antenna including a dielectric waveguide transmitting a signal applied from a power feeder, a dielectric waveguide radiator radiating the signal transmitted from the dielectric waveguide to the air through a first aperture, and a matching unit formed in a portion of the dielectric waveguide and controlling a serial reactance and a parallel reactance to thereby perform impedance matching between the dielectric waveguide radiator and the air, in order to reduce reflection generated in the first aperture during the radiation of the signal through the first aperture. Reflection in the aperture is reduced through the matching unit having various structures, thereby making it possible to improve characteristics of the dielectric waveguide antenna.06-19-2014

Patent applications by Moonil Kim, Gyunggi-Do KR

Moon Sun Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20110133834POWER AMPLIFIER - There is provided a power amplifier with a variable supply of bias power according to a look-up table having a voltage value determined based on a level of an RF signal being input to the power amplifier to thereby increase power efficiency. A power amplifier according to an aspect of the invention may include an amplification section amplifying an input signal according to a bias voltage being supplied; and a bias supply section comparing a level of the input signal with a look-up table set in advance and supplying a bias voltage to the amplification section according to a result of the comparison.06-09-2011

Nam Seok Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20090271975Jig for assembling rotor - The jig includes an upper jig part, a lower jig part, a support plate, a guide jig part, and a spring. The upper jig part has a pressure protrusion for press-fitting a rotating shaft, and applies pressing force to the rotating shaft. The lower jig part supports a rotor casing in a direction which is opposite the acting direction of the pressing force. The support plate is mounted to the lower jig part, and supports the rotor casing in a direction which is opposite that of the force for press-fitting the rotating shaft. The guide jig part supports the rotor casing in a direction which is opposite that of reaction force generated in the rotor casing by the support plate. The spring elastically biases the guide jig part towards the rotor casing.11-05-2009
20100102661Rotating shaft for ultra slim spindle motor - Disclosed herein is a rotating shaft for an ultra slim spindle motor which reduces a frictional area between the rotating shaft and a bearing, thus being capable of reducing consumption current consumed during the rotation of the rotating shaft. The ultra slim spindle motor includes a rotating shaft for axially supporting a rotor casing and a bearing for rotatably supporting the rotating shaft. The rotating shaft includes a coupling part which is press-fitted into the rotor casing, upper and lower contact parts which are supported, respectively, by an upper portion and a lower portion of the bearing, and a non-contact part which is provided between the upper and lower contact parts in such a way that the non-contact part is not in contact with the bearing.04-29-2010
20100146525Clamping device for disk - Disclosed herein is a disk clamping device capable of preventing the slipping or eccentricity of an optical disk when it rotates at high speeds. The disk clamping device includes a turntable having a hub which is integrally provided in a central portion thereof and inserted into a central hole of an optical disk. A guide unit is accommodated in the turntable in such a way as to move linearly, and at least portion of the guide unit protrudes outwards from the hub and is supported 06-10-2010
20100148608SPINDLE MOTOR - The spindle motor includes a rotating shaft, a rotor cover which is secured to the rotating shaft and rotates the rotating shaft, a bearing for rotatably supporting the rotating shaft, a holder for holding the bearing, and a holding magnet which is directly mounted to an inner wall of the rotor cover. In this case, the holding magnet is positioned above the bearing to prevent oil from being discharged from the bearing to the outside.06-17-2010
20110072447DISK DRIVE MOTOR - Disclosed herein is a disk drive motor which can prevent a disk from wobbling despite having a simple structure. The disk drive motor includes a turntable which is rotated by a drive unit and supports a disk thereon, and a disk support which is attached onto the turntable to support the disk thereon. Grooves are formed in the disk support. Each groove is inclined based on the radial direction of the turntable in the direction opposite to the direction in which the disk rotates. In the present invention, when a disk rotates, air which has been in a space between the turntable and the disk is discharged outside through the grooves, so that adsorption force is generated by a difference in pressure between the air and the space between the turntable and the disk. Therefore, the disk can be prevented from wobbling when rotating.03-24-2011
20110131592DISK CHUCKING APPARATUS - Disclosed herein is a disk chucking apparatus. The apparatus includes a central boss which is coupled to a rotating shaft of a motor, a guide which extends from the central boss outwards and is inserted into a center hole of a disk, and a chucking unit which extends from the central boss outwards. The chucking unit is elastically deformable inwards when pushed by the disk that is fitted over the guide. The chucking unit includes a lower horizontal part, a vertical part and an upper horizontal part. The lower horizontal part extends from the lower portion of the central boss outwards in the horizontal direction. The vertical part is bent from the outer end of the lower horizontal part upwards. The vertical part extends in a direction inclined outwards. The upper horizontal part extends from the upper end of the vertical part inwards in a horizontal direction.06-02-2011

Patent applications by Nam Seok Kim, Gyunggi-Do KR

Ok Tae Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20100132985Printed circuit board having metal bump and method of manufacring the same - The invention relates to a printed circuit board having metal bumps which are of even heights and are directly connected to a circuit pattern without using additional bump pads thus allowing an arrangement thereof at fine pitches.06-03-2010
20100193232PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a printed circuit board and a process of manufacturing the printed circuit board. The printed circuit board includes an insulating layer, and circuit layers disposed at both sides of the insulating layer, each of the circuit layers including a land part and a pattern part. The land parts formed on both sides of the insulating layer are coupled to each other using electrical resistance welding. There is no need for a separate interlayer connection structure such as vias or bumps and a process of forming the interlayer connection structure, thus simplifying the printed circuit board and the process.08-05-2010
20100314755PRINTED CIRCUIT BOARD, SEMICONDUCTOR DEVICE COMPRISING THE SAME, AND METHOD OF MANUFACTURING THE SAME - Disclosed is a printed circuit board, which includes a first circuit layer embedded in one surface an insulating layer and including a bump pad and a wire bonding pad, thus realizing a high-density wire bonding pad. A semiconductor device including the printed circuit board and a method of manufacturing the printed circuit board are also provided.12-16-2010
20110061231METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD - Disclosed herein is a method of manufacturing a printed circuit board, comprising: preparing a first carrier including a first pattern formed on one side thereof; preparing a second carrier including a first solder resist layer and a second pattern sequentially formed on one side thereof; pressing the first carrier and the second carrier such that the first pattern is embedded in one side of an insulation layer and the second pattern is embedded in the other side of the insulation layer and then removing the first carrier and the second carrier to fabricate two substrates; attaching the two substrates to each other using an adhesion layer such that the first solder resist layers face each other; and forming a via for connecting the first pattern with the second pattern in the insulation layer, forming a second solder resist on the insulation layer provided with the first pattern, and then removing the adhesion layer.03-17-2011
20120060365Method of manufacturing a printed circuit board having metal bumps - A method of manufacturing a printed circuit board having a metal bump, including: forming a recess for creation of the metal bump on a first carrier, forming a first barrier layer on the first carrier, and forming an upper circuit layer on the first barrier layer, the upper circuit layer including a metal bump charged in the recess and a circuit pattern; forming a second barrier layer on a second carrier, and forming a lower circuit layer on the second barrier layer; preparing an insulating layer, and transferring the upper and lower circuit layers to the insulating layer; removing the first and second carriers; and removing the first and second barrier layers.03-15-2012
20120061132Printed circuit board having metal bumps - A printed circuit board having a metal bump, including: an upper circuit layer including a circuit pattern embedded in an upper part of an insulating layer, the circuit pattern being made of electroconductive metal; wherein the metal bump is integrally formed with the circuit pattern and protruding from the circuit pattern and above the insulating layer.03-15-2012
20140090245METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD - In accordance with various embodiments, there is provided a method of manufacturing a printed circuit board, the method including the steps of preparing a first carrier including a first pattern formed on one side thereof, preparing a second carrier including a first solder resist layer and a second pattern sequentially formed on one side thereof, pressing the first carrier and the second carrier such that the first pattern is embedded in one side of an insulation layer and the second pattern is embedded in the other side of the insulation layer and then removing the first carrier and the second carrier to fabricate two substrates, attaching the two substrates to each other using an adhesion layer such that the first solder resist layers face each other, and forming a via for connecting the first pattern with the second pattern in the insulation layer, forming a second solder resist on the insulation layer provided with the first pattern, and then removing the adhesion layer.04-03-2014

Patent applications by Ok Tae Kim, Gyunggi-Do KR

Pyo Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20090271975Jig for assembling rotor - The jig includes an upper jig part, a lower jig part, a support plate, a guide jig part, and a spring. The upper jig part has a pressure protrusion for press-fitting a rotating shaft, and applies pressing force to the rotating shaft. The lower jig part supports a rotor casing in a direction which is opposite the acting direction of the pressing force. The support plate is mounted to the lower jig part, and supports the rotor casing in a direction which is opposite that of the force for press-fitting the rotating shaft. The guide jig part supports the rotor casing in a direction which is opposite that of reaction force generated in the rotor casing by the support plate. The spring elastically biases the guide jig part towards the rotor casing.11-05-2009
20100146525Clamping device for disk - Disclosed herein is a disk clamping device capable of preventing the slipping or eccentricity of an optical disk when it rotates at high speeds. The disk clamping device includes a turntable having a hub which is integrally provided in a central portion thereof and inserted into a central hole of an optical disk. A guide unit is accommodated in the turntable in such a way as to move linearly, and at least portion of the guide unit protrudes outwards from the hub and is supported 06-10-2010
20100148608SPINDLE MOTOR - The spindle motor includes a rotating shaft, a rotor cover which is secured to the rotating shaft and rotates the rotating shaft, a bearing for rotatably supporting the rotating shaft, a holder for holding the bearing, and a holding magnet which is directly mounted to an inner wall of the rotor cover. In this case, the holding magnet is positioned above the bearing to prevent oil from being discharged from the bearing to the outside.06-17-2010
20130140962SPINDLE MOTOR - Disclosed herein is a spindle motor including: a shaft; a rotor case coupled to the shaft to rotate integrally with the shaft and including a rotor magnet coupled to an inner portion thereof; a base plate to which the shaft is rotatably coupled; a bearing coupled to an outer peripheral surface of the shaft to rotatably support the shaft; a bearing holder coupled to an outer peripheral surface of the bearing to support the bearing and fixedly coupled to an upper portion of the base plate; and a stator core part coupled to an outer peripheral surface of the bearing holder so as to face the rotor magnet, wherein the bearing has a length of an inner peripheral surface contacting the shaft longer than a length of an outer peripheral surface contacting the bearing holder.06-06-2013

Patent applications by Pyo Kim, Gyunggi-Do KR

Sang Hee Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20110121903POWER AMPLIFIER - There is provided a power amplifier that can increase power efficiency by preventing power consumption caused by DC components from an RF input signal. A power amplifier according to an aspect of the invention may include: an inverter amplification section amplifying an input signal according to an inverter method to thereby remove DC components from the input signal; an impedance matching section matching an impedance of a transmission path of the input signal amplified by the inverter amplification section; and an amplification section amplifying an impedance-matched signal from the impedance matching section according to a gain set beforehand.05-26-2011
20110215865POWER AMPLIFIER - Disclosed herein is a power amplifier. The power amplifier includes N power amplification means, a transformer, and a harmonic elimination unit. Each of the N power amplification means amplifies an input signal into a predetermined level. The transformer includes N/2 primary windings respectively connected to the output terminals of the power amplification means and a secondary winding configured such that coil elements are connected in series between an output terminal and a ground, and sums power transmitted from the primary windings. The harmonic elimination unit is disposed across both ends of the secondary winding of the transformer, and eliminates the output of the harmonic frequencies of a preset frequency.09-08-2011

Sang Hwa Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20110057278X-RAY DETECTOR USING LIQUID CRYSTAL DEVICE - An X-ray detector includes a first substrate having a bottom surface on which a first electrode is formed. A second substrate has a top surface on which a second electrode and a polyimide layer are sequentially formed. A photoconductive layer is formed on a bottom surface of the first electrode and generates electron-hole pairs. A reflective layer is formed on a bottom surface of the photoconductive layer. A liquid crystal polymer layer is formed on a bottom surface of the reflective layer, and peaks and valleys are alternately formed on a bottom surface of the liquid crystal polymer layer. A liquid crystal layer is formed between the liquid crystal polymer layer and the polyimide layer, and liquid crystal molecules are aligned in a direction in which the peaks and valleys on the bottom surface are arranged.03-10-2011
20110109564TOUCH SCREEN INPUT DEVICE AND METHOD OF MANUFACTURING THE SAME - Disclosed is a touch screen input device, which includes a window plate through which a signal is input, a conductive film applied on one surface of the window plate using a conductive polymer, a first adhesive layer applied on one surface of the conductive film, and an anti-noise film applied on one surface of the first adhesive layer using a conductive polymer and thus grounded, so that the conductive film is directly applied on the window plate, thus omitting bonding of an additional film coated with a conductive film to the window plate, thereby preventing the generation of foam and simplifying the manufacturing process. A method of manufacturing the touch screen input device is also provided.05-12-2011
20110147668CONDUCTIVE POLYMER COMPOSITION AND CONDUCTIVE FILM PREPARED USING THE SAME - Disclosed herein is a conductive polymer composition, including: a conductive polymer; a liquid crystal polymer; and a polar solvent. The conductive polymer composition according to the present invention, differently from a general conductive polymer, can prevent the deterioration of conductive properties by using a minimum of binder or without using any binder at all. Therefore, the conductive polymer film prepared using the conductive polymer composition can be used in electrodes for various display devices, such as liquid crystal displays (LCDs), transparent touch panels, e-papers, organic light emitting diodes (OLEDs) and the like, because it has a low surface resistance of 10˜1000 Ω/□.06-23-2011
20110151201TRANSPARENT ELECTRODE FILM AND METHOD OF MANUFACTURING THE SAME - Disclosed is a transparent electrode film for a touch screen, which includes a transparent substrate, an assistant adhesive layer formed on each of both surfaces of the transparent substrate, and a transparent conductive polymer layer formed on the assistant adhesive layer, thus obviating a need for an optically clear adhesive film and resulting in increased transmittance and superior price competitiveness. A method of manufacturing the transparent electrode film is also provided.06-23-2011
20110169751TOUCH SCREEN INPUT DEVICE - Disclosed herein is a touch screen input device, including: a first transparent electrode applied on one side of a transparent film using a conductive polymer composition including a conductive polymer and a solvent; a second transparent electrode applied on one side of a transparent substrate using the conductive polymer composition or indium-tin oxide (ITO); and a first adhesive layer disposed between one side of the transparent film and one side of the transparent substrate which face each other, so as to attach the one side of the first transparent electrode and the one side of the second transparent electrode to each other. The conductive polymer composition can be used to form transparent electrodes of the touch screen input device because it has a surface resistance of 10˜1000Ω/□.07-14-2011
20110199317Touch Screen - Disclosed herein is a touch screen, including: a liquid crystal layer including a localized polymer layer formed on a surface thereof; and transparent electrodes disposed on both sides of the liquid crystal layer. The touch screen can be used as an integral touch screen without optical and physical losses because a localized polymer layer is formed on the surface of a liquid crystal layer, can improve durability and obtain high-speed response characteristics in liquid crystal behavior because a uniform polymer layer formed in a liquid crystal layer, and can improve durability without increasing thickness or additionally forming a protective film and does not deteriorate intrinsic display properties such as light and darkness ratio (LD ratio), response characteristics and the like, because a localized polymer layer is formed on the surface of a liquid crystal layer.08-18-2011
20110212661METHOD AND APPARATUS FOR MANUFACTURING TOUCH SCREEN - Disclosed herein is a method of manufacturing a touch screen, including: supplying a PET film; supplying and printing transparent conductive polymer electrodes on both sides of the PET film; printing conductive patterns on the transparent conductive polymer electrodes; supplying an adhesive to the transparent conductive polymer electrodes to form an adhesive layer; supplying a protective film to the adhesive layer; and cutting a laminate composed of the PET film, the printed transparent conductive polymer electrodes, the conductive patterns, the adhesive layer and the protective film. The method is advantageous in that a touch screen can be manufactured by an automated process using a roll-type feed or a sol-type feeder.09-01-2011
20110216020LARGE-SIZE TOUCH SCREEN - Disclosed herein is a touch screen, including: a transparent film having a thickness of 188˜2000 μm; and a transparent electrode layer formed on one side or both sides of the transparent film, wherein one side or both sides of the transparent film is ultraviolet-treated, high-frequency-treated or primer-treated. The touch screen is advantageous in that a hard coating layer included in conventional touch screens was removed thereby improving its transmittance, and in that the number of total structural layers was decreased to strengthen its price competitiveness. Further, the touch screen is advantageous in that a hard coating layer was removed which reduces the manufacturing process, and in that the thickness of a base film was increased allowing touch screens having a size of 22 inches or more to be manufactured.09-08-2011
20110227860RESISTIVE TOUCH SCREEN - Disclosed herein is a resistive touch screen, including: a large-area touch screen formed by connecting two or more single touch screens, each including a first substrate and a second substrate which are respectively coated with transparent electrodes on one side thereof and face each other, on the same level; a plurality of first dot spacers formed on first connection parts at which the first substrates are connected with each other and supporting second connection parts at which the second substrates are connected with each other; and a plurality of second dot spacers formed on respective one sides of the first substrates excluding the first connection parts and having a lower height than the plurality of first dot spacers. The resistive touch screen is advantageous in that a large-area touch panel can be realized by connecting single touch panels on the same level.09-22-2011
20110240927CONDUCTIVE POLYMER COMPOSITION AND CONDUCTIVE FILM FORMED USING THE SAME - Disclosed herein is a conductive polymer composition, including: a conductive polymer; a liquid crystal polymer; and a solvent. The conductive polymer has excellent conductivity properties because it including a liquid crystal polymer which serves as a binder and has high molecular regularity.10-06-2011
20110248936TOUCH SCREEN-INTEGRATED LIQUID CRYSTAL DISPLAY - Disclosed herein is a touch screen-integrated liquid crystal display, including: a backlight unit emitting light; a first polarizing plate disposed on the backlight unit; a liquid crystal panel disposed on the first polarizing plate and creating an image using the light emitted from the backlight unit; a touch screen disposed on the liquid crystal panel; a cholesteric liquid crystal plate disposed on the touch screen; a phase difference plate disposed on the cholesteric liquid crystal plate; and a second polarizing plate disposed on the phase difference plate.10-13-2011
20110256307METHOD FOR MANUFACTURING CAPACITIVE TOUCH SCREEN - Disclosed herein is a method for manufacturing a capacitive touch screen. The method for manufacturing the capacitive touch screen includes forming a plurality of first electrode patterns made of conductive polymer on the upper surface of a first substrate by an inkjet method, thereby making it possible to finely and precisely form the electrode patterns having a complex shape.10-20-2011
20110310053CONDUCTIVE POLYMER COMPOSITION FOR TRANSPARENT ELECTRODE AND TOUCH PANEL USING THE SAME - This invention relates to a conductive polymer composition for a transparent electrode and a touch panel using the same. The conductive polymer composition for a transparent electrode includes a polythiophene derivative, at least one dopant, at least one binder, and the remainder solvent. When the transparent electrode formed of the conductive polymer composition is used, the touch panel having high conductivity, superior transmittance, adhesion and flexibility, and a low sheet resistance of 100˜300 Ω/□ can be provided.12-22-2011
20120017828APPARATUS FOR MANUFACTURING TRANSPARENT CONDUCTIVE LAYER - Disclosed herein is an apparatus for manufacturing a transparent conductive layer. The apparatus includes a transparent substrate, a longitudinal direction of which is arranged in an X axis direction. Jetting means jets a conductive polymer solution, containing ions, onto a first surface of the transparent substrate in a Y axis direction. A wire is spaced apart from a second surface of the transparent substrate by a predetermined distance and arranged in a Z axis direction. Voltage application means generates electric attractive force between the wire and the conductive polymer solution by applying a potential having polarity opposite to that of the ions to the wire. The apparatus adds ions to the conductive polymer solution, and employs a wire to which a potential having polarity opposite to that of the ions is applied, thus obtaining the advantage that the target substrate can be uniformly coated with the conductive polymer solution.01-26-2012
20120018200TRANSPARENT CONDUCTIVE FILM FOR TOUCH PANEL AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a transparent conductive film for a touch panel and a method for manufacturing the same. A transparent conductive film 01-26-2012
20120019486TOUCH PANEL AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a touch panel, including: a transparent substrate; a transparent protrusion unit including a patterned partition wall and formed on the transparent substrate; and a transparent electrode formed in the transparent protrusion unit such that it is surrounded by the partition wall. The touch panel is advantageous in that a transparent protrusion unit is employed, and a transparent electrode is formed in the partition wall of the transparent protrusion unit, so that it is possible to prevent the transparent electrode from being scratched and separated during a manufacturing process, thereby improving the durability of the touch panel.01-26-2012
20120032904TOUCH PANEL - Disclosed herein is a touch panel. The touch panel includes a transparent substrate and a plurality of transparent electrodes. The transparent electrodes are formed on one surface of the transparent substrate. Each of the transparent electrodes includes a touch part formed to have an identical width and a connection part configured in a stepped form along with the touch part and configured to connect the touch part with the transparent substrate.02-09-2012
20120062504TOUCH SCREEN AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a touch screen and a method of manufacturing the same. The touch screen includes a transparent substrate, a transparent electrode formed on the transparent substrate and adopted for sensing a change in capacitance when a touch input is performed, an adhesive layer formed on the transparent substrate in which the transparent electrode is formed, a window plate bonded with the transparent substrate by the adhesive layer, and a circular polarization-coating layer coated on the window plate and adopted for transmitting light in one direction, whereby a circular polarization coating layer may block reflected light from an inside of the touch screen, thereby improving visibility of the touch screen.03-15-2012
20120161080CONDUCTIVE POLYMER COMPOSITION AND CONDUCTIVE FILM USING THE SAME - Disclosed herein are a conductive polymer composition and a conductive film using the same. The conductive polymer composition includes: a conductive polymer; a solvent; and an ionic binder. A transparent parent is formed by adding the ionic binder to the conductive polymer, thereby making it possible to have excellent flexibility and a low sheet resistance of 110Ω/□ to 500Ω/□ and simplify a coating process of the transparent electrode. Accordingly, the transparent electrode of the present invention is suitable for being used as a display device.06-28-2012
20120162097MICROCAPSULE HAVING HEAT-RESISTANCE, TOUCH PANEL CONTAINING THE SAME AND METHOD FOR MANUFACTURING TOUCH PANEL - Disclosed herein is a microcapsule having heat-resistance in a core-shell structure, including: a conductive polymer core; and a shell made of polyimide and partially enclosing the conductive polymer core. The core-shell structure in which a partial polyimide shell is formed on the conductive polymer core is formed, thereby making it possible to improve the heat-resistance of the conductive polymer. In addition, a transparent electrode having improved heat-resistance is used to minimize a change rate in sheet resistance due to a high temperature, such that electrical reliability of a touch panel is improved, thereby making it possible to improve accuracy of an operation.06-28-2012
20120168682PEDOT/PSS COMPOSITION AND PEDOT/PSS FILM USING THE SAME - Disclosed herein is a PEDOT/PSS composition, including PEDOT/PSS, a solvent, a compatibilizer and a water-soluble conductive polymer, and a transparent electrode. Since a transparent electrode is formed by adding a compatibilizer and a water-soluble conductive polymer to PEDOT/PSS, the transparent electrode has excellent flexibility, can be easily coated and has a low surface resistance of 240˜300 Ω/□, so that this transparent electrode can be used as a transparent electrode for displays.07-05-2012
20120171358METHOD OF PREPARING CONDUCTIVE POLYMER COMPOSITION AND METHOD OF MANUFACTURING CONDUCTIVE FILM USING THE SAME - Disclosed is a method of preparing a conductive polymer composition, in which FTS (Ferric p-toluene sulfonate) is used as a dopant and mixed with a conductive polymer monomer before polymerizing the conductive polymer monomer, thereby facilitating the control of the concentration of the conductive polymer composition and increasing the electrical conductivity of the conductive polymer composition. A method of manufacturing a conductive film is also provided.07-05-2012
20120175564CONDUCTIVE POLYMER COMPOSITION AND CONDUCTIVE FILM PREPARED FROM THE COMPOSITION - Disclosed is a conductive polymer composition including a conductive polymer, a dopant, a solvent, and a thixotropic agent. The conductive polymer composition includes the thixotropic agent in lieu of a binder, so that the viscosity of the conductive polymer composition is high and the electrical conductivity thereof is superior. The thixotropic agent can reversibly change the viscosity by expansion and shrinkage, thus adjusting the viscosity of the conductive polymer composition depending on the end uses.07-12-2012
20130068506PLATING SYSTEM AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a plating pattern and a method of manufacturing the same. The plating pattern includes: a base substrate; a conductive polymer formed on the base substrate and patterned to be selectively deactivated by having a deactivator added thereto; and a plating layer formed on portions of the conductive polymer except for the deactivated portions.03-21-2013

Patent applications by Sang Hwa Kim, Gyunggi-Do KR

Seong Geun Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20110127636INTEGRATED PASSIVE DEVICE ASSEMBLY - There is provided an integrated passive device assembly including: a substrate having a wiring pattern disposed therein; a mounting part disposed on an upper surface of the substrate, formed of an insulating material, and having an integrated passive device mounted on an upper surface thereof; a conductive pattern disposed inside the mounting part; and a connecting part disposed on the substrate and electrically connected to the integrated passive device. The connecting part and the conductive pattern are electrically connected to the wiring pattern.06-02-2011
20110156203INTEGRATED PASSIVE DEVICE ASSEMBLY - There is provided an integrated passive device assembly. An integrated passive device assembly according to an aspect of the invention may include: a board having a wiring pattern provided thereon; an integrated passive device mounted on an upper surface of the board and having conductive patterns provided on upper and lower surfaces thereof; a first connection portion electrically connecting the conductive pattern, provided on the upper surface of the integrated passive device, and the wiring pattern to each other; and a second connection portion electrically connecting the conductive pattern, provided on the lower surface of the integrated passive device, and the wiring pattern to each other.06-30-2011

Sun Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20110072447DISK DRIVE MOTOR - Disclosed herein is a disk drive motor which can prevent a disk from wobbling despite having a simple structure. The disk drive motor includes a turntable which is rotated by a drive unit and supports a disk thereon, and a disk support which is attached onto the turntable to support the disk thereon. Grooves are formed in the disk support. Each groove is inclined based on the radial direction of the turntable in the direction opposite to the direction in which the disk rotates. In the present invention, when a disk rotates, air which has been in a space between the turntable and the disk is discharged outside through the grooves, so that adsorption force is generated by a difference in pressure between the air and the space between the turntable and the disk. Therefore, the disk can be prevented from wobbling when rotating.03-24-2011
20130024878SPINDLE MOTOR - Disclosed herein is a spindle motor including: a turn table made of a deformable iron based material; a turn table inner diameter part provided at the center of the turn table, having a hollow part, and including a coupling part formed in an inner peripheral surface thereof; and a shaft inserted into the hollow part of the turn table inner diameter part to thereby contact the coupling part and rotate in an axial direction.01-24-2013
20130251160PURE TONE TEST APPARATUS AND METHOD FOR CONTROLLING THE SAME - Disclosed herein is a pure tone test apparatus including: a stage including a support supporting a pure tone test target; a support plate mounted on one side of the stage and having a guide mounted on a front surface thereof; an acoustic detection unit movably mounted on the guide and being engaged with the support to detect noise generated from the target; a control unit connected with the guide, the acoustic detection unit, and the support to control a pure tone test; and a display unit displaying a pure tone test result detected by the control of the control unit.09-26-2013

Sung Yong Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20080307641Method of fabricating paste bump for printed circuit board - This invention relates to a method of fabricating a paste bump for a printed circuit board, which can decrease the number of printings to thus reduce the fabrication cost and process time in the formation of the paste bump on the printed circuit board.12-18-2008
20080308315Multilayer printed circuit board and method of fabricating the same - This invention relates to a multilayer printed circuit board and a method of fabricating the same, which can increase the reliability of the multilayer printed circuit board and can decrease the process time to thus improve productivity.12-18-2008
20120080401METHOD OF FABRICATING MULTILAYER PRINTED CIRCUIT BOARD - A method of fabricating a multilayer printed circuit board includes preparing a first substrate, and preparing a second substrate, in parallel to the formation of the first substrate, that is, at the same time of the formation of the first substrate, by forming a third inner circuit pattern on one surface of a third insulating layer and forming a window on the other surface of the third insulating layer.04-05-2012

Tak Gyum Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20110116084METHOD OF INSPECTING DEFECTS IN CIRCUIT PATTERN OF SUBSTRATE - Disclosed herein is a method of inspecting defects in a circuit pattern of a substrate. At least one laser beam radiation unit for radiating a laser beam onto an inspection target circuit pattern of a substrate in a non-contact manner is prepared. A probe beam radiation unit for radiating a probe beam onto a connection circuit pattern to be electrically connected to the inspection target circuit pattern in a non-contact manner is prepared. The laser beam is radiated onto the inspection target circuit pattern using the laser beam radiation unit. The probe beam is radiated onto the connection circuit pattern using the probe beam radiation unit, thus measuring information about whether the probe beam is diffracted, and a diffraction angle. Accordingly, the method can solve problems such as erroneous measurements caused by contact pressure and can reduce the time required for measurements.05-19-2011
20110247186METHOD OF MANUFACTURING MULTILAYER CERAMIC CAPACITOR - A method of manufacturing a multilayer ceramic capacitor includes forming a base dielectric layer, forming a unit ceramic capacitor by alternately depositing internal dielectric layers and internal electrode layers on a top surface of the base dielectric layer, and stacking another unit ceramic capacitor on the unit ceramic capacitor, wherein the number of unit ceramic capacitors being stacked is two or more.10-13-2011

Woon Chun Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20110212661METHOD AND APPARATUS FOR MANUFACTURING TOUCH SCREEN - Disclosed herein is a method of manufacturing a touch screen, including: supplying a PET film; supplying and printing transparent conductive polymer electrodes on both sides of the PET film; printing conductive patterns on the transparent conductive polymer electrodes; supplying an adhesive to the transparent conductive polymer electrodes to form an adhesive layer; supplying a protective film to the adhesive layer; and cutting a laminate composed of the PET film, the printed transparent conductive polymer electrodes, the conductive patterns, the adhesive layer and the protective film. The method is advantageous in that a touch screen can be manufactured by an automated process using a roll-type feed or a sol-type feeder.09-01-2011
20110227861RESISTIVE TOUCH SCREEN - Disclosed herein is a resistive touch screen, including: a transparent film 09-22-2011
20110232975TOUCH PANEL - Disclosed is a touch panel 09-29-2011
20110234505TOUCH PANEL - Disclosed herein is a touch panel 09-29-2011
20110234506FPCB CONNECTION STRUCTURE OF TOUCH SCREEN PANEL - Disclosed herein is an FPCB connection structure of a touch screen panel. The FPCB connection structure includes a touch screen panel and an FPCB. The touch screen panel has a connection part in which a plurality of connection holes is formed. The connection holes extend to ends of a plurality of electrode wires. The FPCB includes a substrate having a plurality of lead wires formed thereon, and a plurality of metal pins inserted into the plurality of connection holes to be connected to the ends of the electrode wires via conductive paste. A first through hole passes through the substrate and each of the lead wires, and a second through hole extends from the first through hole and is formed in each of the metal pins in a longitudinal direction thereof.09-29-2011
20110234530MUTUAL CAPACITIVE TOUCH PANEL - Disclosed herein is a mutual capacitive touch panel, including: a first transparent substrate; a first bar-shaped transparent electrode formed on the first transparent substrate and divided in a length direction; first wiring whose one set of ends are connected to the first bar-shaped transparent electrode and whose the other set of ends are arranged on one side of the first transparent substrate; a second transparent substrate; a second bar-shaped transparent electrode formed on the second transparent substrate and divided in a length direction; second wiring whose one set of ends are connected to the second bar-shaped transparent electrode and whose the other set of ends are arranged on one side of the second transparent substrate; and an adhesive layer disposed between the first bar-shaped transparent electrode and the second bar-shaped transparent electrode such that the first bar-shaped transparent electrode and the second bar-shaped transparent electrode face each other. The mutual capacitive touch panel is advantageous in that, since transparent electrodes are divided, low resistance can be realized even when the transparent electrodes are made of a conductive polymer, thus keeping up with the trend of manufacturing large touch panels.09-29-2011
20110254780DISPLAY APPARATUS HAVING TOUCH SCREEN PANEL - Disclosed herein is a display apparatus having a touch screen panel including: a housing of which first surface is open; a main circuit substrate that is built-in the housing; a display unit that is connected to the main circuit substrate and is disposed to face the opened first surface of the housing; and a touch screen panel that is connected to the main circuit substrate and is positioned on the upper portion of the display unit and includes an active region disposed on the first surface and inactive regions that are extended from the active region and are disposed at side surfaces of the housing or on a second surface opposite to the first surface.10-20-2011
20110267307DISPLAY DEVICE HAVING TOUCH SCREEN - Disclosed herein is a display device having a touch screen, including: a display unit, a touch screen that is positioned on the upper side of the display unit, a double-sided adhesive sheet that is positioned between the display unit and the touch screen and is disposed in the edge region of the touch screen to bond the display unit to the touch screen, and an optical transparent sheet that is positioned inside the double-sided adhesive sheet and is bonded to the touch screen and is contacted to the display unit.11-03-2011
20110298728TOUCH PANEL - Disclosed herein is a touch panel 100 including: a transparent electrode 120 formed on one surface of a transparent substrate 110, a protective layer 130 formed at the side surface of the transparent electrode 120 so that its upper end 133 surrounds the edge of one surface of the transparent electrode 120 and its lower end 137 protrudes in the edge direction of the transparent substrate 110, and an electrode wiring 140 that is formed at the side surface of the protective layer 130 so as to surround the lower end 137 of the protective layer 130 protruding in the edge direction of the transparent substrate 110. The protective layer 130 is interposed between the transparent electrode 120 and the electrode wiring 140 to prevent the electromigration (EM).12-08-2011
20110298729TOUCH PANEL AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a touch panel including: a transparent substrate 12-08-2011
20110298747CAPACITIVE TOUCH PANEL - Disclosed herein is a capacitive touch panel 12-08-2011
20110308929TOUCH PANEL AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a touch panel 12-22-2011
20120001863TOUCH PANEL - Disclosed herein is a touch panel, including: a transparent substrate including an active region and a bezel region partitioned thereon; a plurality of first transparent electrodes formed in the active region in parallel to each other along a Y-axis direction and including a plurality of first sensing units and a plurality of first connecting units connected with the plurality of first sensing units in an X-axis direction; a plurality of second transparent electrodes alternately formed with the plurality of first sensing units in the active region in parallel to each other along the Y-axis direction and including a plurality of second sensing units and a plurality of second connecting units connected with the plurality of first sensing units in the X-axis direction; and electrode wirings formed in the bezel region and connected to terminals of the first transparent electrodes and terminals of the second transparent electrodes, respectively.01-05-2012
20120007825OPERATING MODULE OF HYBRID TOUCH PANEL AND METHOD OF OPERATING THE SAME - Disclosed herein is an operating module of a hybrid touch panel, including: an input unit 01-12-2012
20120013549TOUCH SCREEN - Disclosed herein is a touch screen, including: a pair of base members that are spaced apart from each other by a spacer having an opening formed inside thereof and have resistive films formed on the opposite surfaces thereof; grooves that are each formed in outer regions of the resistive films formed on the pair of base members to intersect with each other and are extended from the upper surfaces of the resistive films to the base members in a thickness direction; and sensing electrodes that are formed in the outer regions of the resistive films to cover the grooves and are filled in the grooves.01-19-2012
20120019476CAPACITIVE TOUCH PANEL - Disclosed herein is a capacitive touch panel including: a transparent substrate, a transparent electrode formed on the transparent substrate, the transparent electrode being made of a conductive polymer, a transparent protective layer formed on the transparent electrode, the transparent protective layer having transparent characteristics, and a transparent adhesive formed on the transparent protective layer. According to the present invention, the transparent protective layer is further formed between the transparent electrode and the transparent adhesive to prevent reactivity between the transparent electrode and the transparent adhesive, thereby making it possible to improve operation reliability of the touch panel.01-26-2012
20120032910TOUCH PANEL AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a touch panel, including: a transparent substrate; a transparent electrode made of a conductive polymer and formed on one surface of the transparent substrate; an anisotropic conductive adhesion layer formed on an edge of the transparent electrode; and an electrode formed on the anisotropic conductive adhesion layer and electrically connected with the transparent electrode by the anisotropic conductive adhesion layer. The touch panel is advantageous in that the anisotropic conductive adhesion layer is disposed between the transparent electrode and the electrode, so that the chemical reaction between the transparent electrode and the electrode can be prevented, with the result that the resistance between the transparent electrode and the electrode can be maintained constant and the change in physical properties of the transparent electrode can be prevented.02-09-2012
20120032927TOUCH PANEL - Disclosed herein is a touch panel. The touch panel 02-09-2012
20120038594TOUCH SCREEN DEVICE - Disclosed herein is a touch screen device, including: a first transparent electrode formed on one surface of a first transparent substrate to sense a touched input; a second transparent electrode formed on one surface of a second transparent substrate formed to be opposite to the first transparent electrode to sense a touched input; a display formed on the other surface of the second transparent substrate; a first adhesive layer bonding the first transparent substrate to the second transparent substrate; and a second adhesive layer bonding a first connection part formed on an outer side of first transparent substrate to a second connection part formed on an outer side of the display. The touch screen device directly bonds the first transparent substrate to the display, thereby making it possible to provide a high definition image to a user and to reduce infiltration of moisture or the like.02-16-2012
20120056843RESISTIVE TOUCH PANEL - Disclosed herein is a resistive touch panel, including: a transparent substrate; a transparent electrode formed on the transparent substrate and including a conductive polymer; and a curing agent applied to the transparent electrode, the curing agent undergoing a hydrolysis reaction with the conductive polymer to cure the transparent electrode. The resistive touch panel is advantageous in that, even when a transparent electrode is formed using a conductive polymer having low hardness, the hardness of the transparent electrode is improved by the application of the curing agent, so that it is possible to prevent the contact resistance between the transparent electrodes facing each other from changing in relation to the pressure intensity of input means, thereby improving the touch sensitivity and performance of the resistive touch panel.03-08-2012
20120056844CAPACITIVE TOUCH SCREEN - Disclosed herein is a capacitive touch screen. The capacitive touch screen includes: a base member including an active region through which an image generated in a display passes and an inactive region which extends from the active region and is formed to be stepwise; a plurality of electrode patterns which intersects with the top and the bottom of the base member and are disposed in the active region; electrode wirings which are connected to the electrode patterns disposed in the active region and extend to the inactive region; and a window formed on the top of the base member.03-08-2012
20120056845TOUCH SCREEN - Disclosed herein is a touch screen including a touch panel and a window disposed at a top side of the touch panel. In particular, a groove part is formed in the window or the lower substrate and the touch panel is configured in the groove part to reduce an interface of the touch panel, exposed to the outside, thereby making it possible to prevent infiltration of moisture and oil.03-08-2012
20120062478TOUCH PANEL - Disclosed herein is a touch panel. The touch panel according to the present invention includes a first adhesive layer bonding an edge of an image display device to an edge of a window so that a predetermined space is partitioned between the image display device and the window; a first transparent substrate provided in the predetermined space and having a first transparent electrode formed on one surface thereof, a second transparent substrate provided in the predetermined space and having a second transparent electrode formed on one surface thereof, and a second adhesive layer bonding an edge of the first transparent electrode to an edge of the second transparent electrode so that the first transparent electrode faces the second transparent electrode and an air gap is provided between the first transparent electrode and the second transparent electrode.03-15-2012
20120062505CAPACITIVE TOUCH PANEL AND METHOD OF MANUFACTURING THE SAME - Disclosed is a capacitive touch panel, which includes a transparent substrate, transparent electrodes formed on one surface of the transparent substrate, and electrode wires formed on the other surface of the transparent substrate, wherein the transparent substrate includes through holes which are formed therethrough and are filled with a filler so that the transparent electrodes are electrically connected with the electrode wires, and in which the patterned transparent electrodes are connected with the electrode wires by the through holes formed on the transparent electrodes, thus increasing the force of adhesion between the electrode wires and the transparent electrodes, and also, the through holes are filled with a filler and thus the transparent electrodes and the electrode wires are electrically connected with each other, thus reducing contact resistance.03-15-2012
20120062507CAPACITIVE TOUCH SCREEN AND MANUFACTURING METHOD THEREOF - Disclosed herein are a capacitive touch screen and a manufacturing method thereof. The capacitive touch screen includes a base member on which a plurality of electrode patterns are formed; a conductive adhesive member formed on ends of the electrode patterns; and a window disposed on an upper side of the base member and having a plurality of electrode wirings formed in the outer side thereof to be conducted with the electrode patterns by the conductive adhesive member and to be opposite to the electrode patterns.03-15-2012
20120068959RESISTIVE TOUCH SCREEN - Disclosed herein is a resistive touch screen. The resistive touch screen includes a resistive touch panel configured to include a lower substrate formed with a lower electrode pattern in an active region through which images pass, an upper substrate formed with an upper electrode pattern to be opposite to the lower electrode pattern, and a spacer spacing the upper substrate from the lower substrate in order to contact the upper electrode pattern to the lower electrode pattern by external pressure; and a window bonded to the upper portion of the resistive touch panel by an optical clear adhesive, and including a covering film formed in the outer side region on the lower surface thereof and an elastic suppressing layer formed in the inner side region of the covering film.03-22-2012
20120068960TOUCH SCREEN AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a touch screen and a method of manufacturing the same. The touch screen includes: a transparent substrate; a transparent electrode formed on the transparent substrate and including a sensing part sensing a touch input and an extension part extending from the sensing part to an edge of the transparent substrate; a wiring electrode formed at the edge of the transparent substrate and spaced apart from the extension part of the transparent electrode; and a conductive paste formed at the edge of the transparent substrate and covering both the extension part and the wiring electrode so as to electrically connect the transparent electrode to the wiring electrode, whereby the transparent electrode is formed after the wiring electrode is formed and the wiring electrode is connected to the transparent electrode through the conductive paste, thereby preventing the transparent electrode from being damaged.03-22-2012
20120075236TERMINAL WITH TOUCH SCREEN - Disclosed herein is a terminal with a touch screen, including: a main body part including a display and a first touch screen positioned on the display; a folder part including a second touch screen, and transparent dots protruding from the second touch screen; a hinge part connecting one side of the folder part to the main body part so that the folder part is in a closed state or an open state with respect to the main body part; and a controller selectively operating the first touch screen and the second touch screen, whereby the transparent dots are provided on the second touch screen, thereby making it possible to improve operating feeling to at the time of touching the terminal and accomplishing accurate touch.03-29-2012
20120081329DIGITAL RESISTIVE TYPE TOUCH PANEL - Disclosed is a digital resistive type touch panel, including a transparent substrate, a plurality of bar-shaped transparent electrodes mutually formed in parallel in an X-axis direction on the transparent substrate, and electrode wires extending from either or both ends of the bar-shaped transparent electrodes and bundled to one side in a Y-axis direction of the transparent substrate, wherein the bar-shaped transparent electrodes become wider as becoming more distant from one side in the Y-axis direction of the transparent substrate. Thus because the bar-shaped transparent electrodes become wider as the electrode wires get longer, errors can be prevented from occurring when touch coordinates are determined, making it possible for information to be precisely input using the digital resistive type touch panel.04-05-2012
20120092274TOUCH SCREEN - Disclosed herein is a touch screen, including: a first transparent electrode formed on one surface of a first transparent substrate; a second transparent electrode formed on one surface of a second transparent substrate; a first adhesive layer configured to adhere the first transparent substrate and the second transparent substrate to each other; a window plate adhered to the first transparent substrate; and hardness dots formed on one surface of the window plate or the other surface of the first transparent substrate. The present invention has been made in an effort to provide a touch screen which can lower the operational load of a transparent electrode.04-19-2012
20120098781CAPACITIVE TOUCH SCREEN AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a capacitive touch screen and a method for manufacturing the same. The capacitive touch screen includes: a base member on which a plurality of electrode patterns are formed; conductive adhesive members formed at ends of the electrode patterns; a window disposed over the base member and having a plurality of electrode wirings formed in an outer region thereof, the plurality of electrode wirings being opposite to the electrode patterns; and auxiliary electrodes formed at one of the ends of the electrode wirings to conduct the electrode patterns with the electrode wirings by the conductive adhesive members.04-26-2012
20120118606CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF - Disclosed herein are conductive film including: a base member; N transparent electrodes formed on one surface of the base member, the N transparent electrodes being arranged in a second direction of the base member, while being extended in a first direction of the base member; and electrode wirings each correspondingly connected to one end or both ends of the N transparent electrodes and including wiring portions configured of a plurality of wirings extended in a third direction of the base member and bent and extended in the second direction of the base member and insulating portions having the wiring portions impregnated therein and formed on an upper surface of one side or both sides of the transparent electrode and a manufacturing method thereof. Accordingly, the plurality of wirings are formed in a three-dimensional shape vertically in the insulating portion rather than a plane of the base member, making it possible to reduce the area of a non-display region due to the electrode wirings.05-17-2012
20120133609RESISTIVE TYPE TOUCH PANEL AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a resistive type touch panel according to a preferred embodiment of the present invention. The resistive type touch panel includes a transparent substrate; a transparent electrode formed on one surface of the transparent substrate and made of a conductive polymer; and a plurality of conductive balls formed on the transparent electrode and having conductivity. According to the present invention, the conductive balls are included in the transparent electrode made of the conductive polymer to improve the conductivity of the transparent electrode and the conductive balls are formed on the transparent electrode at a predetermined interval, thereby making it possible to constantly maintain the thickness of the transparent electrode. Further, the conductive balls are formed on the transparent electrode to reduce the contact resistance value generated when the resistive type touch panel is touched, thereby making it possible to improve the reliability of the operation of the touch panel.05-31-2012
20120194453TOUCH PANEL - Disclosed herein is a touch panel. A touch panel according to a first preferred embodiment of the present invention includes: a base member; a transparent electrode formed in an active area of the base member; an insulator formed in a bezel area of the base member, and convexly protruded from the base member; and an electrode wiring formed on an exposed surface of the insulator. In addition, a touch panel according to a second preferred embodiment of the present invention includes: a base member having a groove portion formed such that an exposed surface thereof has a concave curved surface; a transparent electrode formed in an active area; and an electrode wire connected to one end or both ends of the transparent electrode and formed on the exposed surface of the groove portion.08-02-2012
20130130020ELECTRODE PASTE COMPOSITION, ELECTRODE FOR ELECTRONIC DEVICE USING THE SAME, AND METHOD OF MANUFACTURING THE SAME - There is provided an electrode paste composition, an electrode for an electronic device using the same, and a method of manufacturing the same. The electrode for an electronic device includes: a substrate; a thin film layer formed on the substrate, the thin film layer including reduced graphene oxide (rGO); and an oxide layer formed between the substrate and the thin film layer. The electrode for an electronic device may have excellent uniform resistivity and electrical conductivity since the electrode is formed by coating the substrate with a solution containing graphene oxide having superior dispersibility and reducing the graphene oxide.05-23-2013
20130133925GRAPHENE TRANSPARENT ELECTRODE AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a method for manufacturing a graphene transparent electrode and a graphene transparent electrode manufactured by the method. The method includes: providing a graphene oxide solution: forming a metal thin film on a glass substrate; coating the graphene oxide solution on the metal thin film, followed by drying; primarily reducing the thus obtained graphene oxide by using a reducing agent, to obtain reduced graphene oxide; secondarily reducing the reduced graphene oxide by heat treatment under the inert atmosphere, to form a reduced layer; compressing a transparent film on the reduced layer; and etching the metal film by an etching solution. The method enables a graphene transparent electrode having economical feasibility and excellent electric conductivity to be manufactured.05-30-2013

Patent applications by Woon Chun Kim, Gyunggi-Do KR

Yong Chun Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20100123159SIDE-VIEW TYPE LIGHT EMITTING DEVICE AND LINE LIGHT SOURCE TYPE LIGHT EMITTING DEVICE - A side-view type light emitting device includes a package body, a lead frame, and a light emitting diode (LED). The package body has a first surface provided as a mount surface, a second surface disposed on a side opposite to the first surface, and lateral surfaces disposed between the first surface and the second surface. The package body includes a recessed portion disposed on a lateral surface corresponding to a light emitting surface of the lateral surfaces. The lead frame is disposed in the package body. The LED chip is mounted on a bottom surface of the recessed portion. Protrusion parts protruding toward the LED chip are disposed in regions adjacent to the LED chip of facing inner sidewalls of the recessed portion, respectively.05-20-2010

Yong Sik Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20090095975LIGHT EMITTING DIODE PACKAGE - A light emitting diode package for preventing an electric short circuit among semiconductor layers and with excellent bonding strength. The light emitting diode package includes a package substrate, a light emitting diode chip bonded to an upper surface of the package substrate, and a bonding material for bonding the light emitting diode chip to the package substrate. The package substrate has a recess formed in a bonding surface thereof to accommodate the bonding material.04-16-2009

Yoo Hwan Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20110133834POWER AMPLIFIER - There is provided a power amplifier with a variable supply of bias power according to a look-up table having a voltage value determined based on a level of an RF signal being input to the power amplifier to thereby increase power efficiency. A power amplifier according to an aspect of the invention may include an amplification section amplifying an input signal according to a bias voltage being supplied; and a bias supply section comparing a level of the input signal with a look-up table set in advance and supplying a bias voltage to the amplification section according to a result of the comparison.06-09-2011
20140002204DIGITALLY CONTROLLED OSCILLATOR HAVING IMPROVED LINEARITY01-02-2014

Youn Suk Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20110102084MULTI-STAGE CMOS POWER AMPLIFIER - There is provided a multi-stage CMOS power amplifier including: a driver amplifier having differential output terminals, inverting differential signals input through first and second input terminals and outputting the respective inverted signals through the differential output terminals; a transformer for power matching having a primary coil connected between the differential output terminals of the driver amplifier and a secondary coil coupled with the primary coil using electromagnetic induction, having a predetermined turns ratio to the primary coil, and connected to a direct current (DC) tuning voltage terminal; and a power amplifier power-amplifying differential signals passing through one end and the other end of the secondary coil of the transformer and outputting the respective power-amplified differential signals through first and second output terminals.05-05-2011
20110121903POWER AMPLIFIER - There is provided a power amplifier that can increase power efficiency by preventing power consumption caused by DC components from an RF input signal. A power amplifier according to an aspect of the invention may include: an inverter amplification section amplifying an input signal according to an inverter method to thereby remove DC components from the input signal; an impedance matching section matching an impedance of a transmission path of the input signal amplified by the inverter amplification section; and an amplification section amplifying an impedance-matched signal from the impedance matching section according to a gain set beforehand.05-26-2011
20110121912ASYMMETRIC POWER DIVIDER - Disclosed herein is an asymmetric power divider. The asymmetric power divider includes a power dividing unit, a first matching network, and a second matching network. The power dividing unit supplies different amounts of power to a carrier amplifier and a peaking amplifier, which are connected in parallel. The first matching network is connected between the power dividing unit and the carrier amplifier so as to perform impedance matching between the power dividing unit and the carrier amplifier. The second matching network is connected between the power dividing unit and the peaking amplifier so as to perform impedance matching between the power dividing unit and the peaking amplifier.05-26-2011
20110127636INTEGRATED PASSIVE DEVICE ASSEMBLY - There is provided an integrated passive device assembly including: a substrate having a wiring pattern disposed therein; a mounting part disposed on an upper surface of the substrate, formed of an insulating material, and having an integrated passive device mounted on an upper surface thereof; a conductive pattern disposed inside the mounting part; and a connecting part disposed on the substrate and electrically connected to the integrated passive device. The connecting part and the conductive pattern are electrically connected to the wiring pattern.06-02-2011
20110140781IMPEDANCE MATCHING CIRCUIT ELIMINATING INTERFERENCE BETWEEN SIGNAL LINES AND POWER AMPLIFIER HAVING THE SAME - Disclosed are an impedance matching circuit preventing the occurrence of inter-line interference by making currents at adjacent lines flow in the same direction, and a power amplifier having the same. The impedance matching circuit eliminating interference between signal lines includes: a first transformer including a first input line which forms a first loop by a conductor receiving a signal and a first output line which forms a second loop by a conductor outputting a signal at the inner side of the first loop of the first input line to match the impedance of a path of an input signal; and a second transformer including a second input line which forms a third loop by a conductor receiving a signal and a second output line which forms a fourth loop by a conductor outputting a signal at the inner side of the third loop of the second input line to match impedance, wherein the direction of current in the first input line of the first transformer and the direction of current in the second input line of the second transformer are the opposite so that a portion of the first input line of the first transformer and a portion of the second input line of the second transformer adjacent to the portion of the first input line of the first transformer have the same current direction.06-16-2011
20110156203INTEGRATED PASSIVE DEVICE ASSEMBLY - There is provided an integrated passive device assembly. An integrated passive device assembly according to an aspect of the invention may include: a board having a wiring pattern provided thereon; an integrated passive device mounted on an upper surface of the board and having conductive patterns provided on upper and lower surfaces thereof; a first connection portion electrically connecting the conductive pattern, provided on the upper surface of the integrated passive device, and the wiring pattern to each other; and a second connection portion electrically connecting the conductive pattern, provided on the lower surface of the integrated passive device, and the wiring pattern to each other.06-30-2011
20110215865POWER AMPLIFIER - Disclosed herein is a power amplifier. The power amplifier includes N power amplification means, a transformer, and a harmonic elimination unit. Each of the N power amplification means amplifies an input signal into a predetermined level. The transformer includes N/2 primary windings respectively connected to the output terminals of the power amplification means and a secondary winding configured such that coil elements are connected in series between an output terminal and a ground, and sums power transmitted from the primary windings. The harmonic elimination unit is disposed across both ends of the secondary winding of the transformer, and eliminates the output of the harmonic frequencies of a preset frequency.09-08-2011
20140139291POWER AMPLIFIER - There is provided a power amplifier including a bias circuit unit generating a bias voltage of an amplifying unit, a voltage drop unit disposed between the bias circuit unit and the amplifying unit to drop the bias voltage to a base voltage, and a bypass circuit unit including an impedance element connected to the voltage drop unit in parallel and performing a switching operation according to a magnitude of an input signal.05-22-2014
20140162579FRONT END MODULE - There is provided a front end module, including an amplification circuit unit amplifying signal, a multistage matching circuit unit connected to an output terminal of the amplification circuit unit, and a switch circuit unit connected to the multistage matching circuit unit, wherein the switch circuit unit includes a series switch circuit and a parallel switch circuit, the parallel switch circuit being connected to a node between a plurality of matching circuits included in the multistage matching circuit unit.06-12-2014

Yun Hee Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20090278041Method and apparatus for qualitatively analyzing high-molecular additives in metal plating solution - Disclosed herein is a method of qualitatively analyzing high-molecular additives in a metal plating solution, including: removing sulfate ions and metal ions from a metal plating solution; and qualitatively analyzing the metal plating solution, from which sulfate ions and metal ions are removed, using Matrix-Assisted Laser Desorption/Ionization Time-Of-Flight Mass Spectroscopy (MALDI-TOF MS). The method is advantageous in that the structure and molecular weight of high-molecular additives present in very small amounts in a plating solution can be accurately measured while maintaining the specific structure and molecular weight thereof without degrading the high-molecular additives.11-12-2009

Yu Sin Kim, Gyunggi-Do KR

Patent application numberDescriptionPublished
20110121912ASYMMETRIC POWER DIVIDER - Disclosed herein is an asymmetric power divider. The asymmetric power divider includes a power dividing unit, a first matching network, and a second matching network. The power dividing unit supplies different amounts of power to a carrier amplifier and a peaking amplifier, which are connected in parallel. The first matching network is connected between the power dividing unit and the carrier amplifier so as to perform impedance matching between the power dividing unit and the carrier amplifier. The second matching network is connected between the power dividing unit and the peaking amplifier so as to perform impedance matching between the power dividing unit and the peaking amplifier.05-26-2011
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