Patent application number | Description | Published |
20090140426 | FLIP CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME - A flip chip package includes a substrate and a semiconductor chip. The substrate includes a substrate body, a metal wiring having a terminal part some of which is disposed in the substrate body, a solder resist pattern formed on the substrate body with an opening for exposing the terminal part, and an organic anti-oxidation layer for covering the terminal part. The semiconductor chip has a bump formed through (e.g., penetrates) the organic anti-oxidation layer and is electrically connected to the terminal part. The present invention prevents oxidation of the terminal part and allows easy coupling of a bump of a semiconductor chip and the terminal part of the substrate, since an anti-oxidation layer including an organic matter is formed over a surface of a terminal part including copper which is easily oxidized. | 06-04-2009 |
20100326715 | CIRCUIT BOARD HAVING SEMICONDUCTOR CHIP - A circuit board includes a semiconductor chip having an upper surface and side surfaces connected to the upper surface. A bonding pad is disposed on the upper surface of the semiconductor chip. A bump is disposed on the bonding pad and projects from the bonding pad by a predetermined height. A circuit board body has a recess part, and the semiconductor chip is positioned in the recess part so that the circuit board body covers the upper surface and the side surfaces of the semiconductor chip while exposing an end of the bump. A wiring line is disposed on the circuit board body and part of the wiring line is positioned over the bump. An opening is formed in a portion of the part of the wiring line over the bump to expose the bump. A reinforcing member physically and electrically connects the exposed bump and the wiring line. | 12-30-2010 |
20110031604 | SEMICONDUCTOR PACKAGE REQUIRING REDUCED MANUFACTURING PROCESSES - A semiconductor package includes a semiconductor chip having a first surface, a second surface located opposite the first surface, and side surfaces connecting the first and second surfaces. The semiconductor chip includes bonding pads disposed on the first surface and having a molding member formed to cover the first surface of the semiconductor chip. The molding member is formed so as to expose the side surfaces of the semiconductor chip. The semiconductor chip also includes bonding members having first ends electrically connected to the respective bonding pads and second ends that are connected to and opposite the first ends. The second ends are exposed from side surfaces of the molding member after passing through the molding member so as to allow various electrical connections. | 02-10-2011 |
20110156269 | SEMICONDUCTOR PACKAGE AND STACK SEMICONDUCTOR PACKAGE HAVING THE SAME - A semiconductor package includes a semiconductor chip having a first region defined at a center portion of a first surface of the semiconductor chip, and having second and third regions defined on both sides of the first region, respectively. Bonding pads are disposed in the first region and a substrate having a substrate body is disposed in the second region of the semiconductor chip. The substrate includes an extension portion projecting away from the semiconductor chip. The substrate also includes circuit patterns disposed on the substrate body having a first ends placed adjacent to the bonding pads and second ends placed on the extension portion. Connection members electrically connect the first ends of the circuit patterns and the bonding pads. | 06-30-2011 |
20120212140 | APPARATUS AND METHOD FOR CONTROLLING LIGHTING BASED ON DALI COMMUNICATION - A lighting controlling apparatus including: a management server generating control information based on information received from a user; a digital addressable lighting interface (DALI) master that is connected to the management server via wired or wireless communication and generates a control message based on the control information; and a DALI ballast that is connected to the DALI master via DALI communication and drives a lighting apparatus by using the control message. Accordingly, a plurality of DALI masters may be locally or remotely controlled via the management server. Also, not only the DALI ballast may be controlled by using the DALI master via DALI communication but also, it may be selectively controlled in regard to the relationship between a DALI switch. In addition, the DALI ballast may be directly controlled by using a sensor and a remote controller. | 08-23-2012 |
20120268365 | METHOD, SYSTEM, AND APPARATUS FOR CONTROLLING LIGHT - Methods, systems and apparatuses for controlling light. A method of controlling light includes displaying on a display unit at least one light property representing a property of the light of a lighting apparatus; if a user command for selecting a property value of the light property is input, displaying a lighting state corresponding to the selected property value; and if a user command representing that selection is completed is input, determining the displayed lighting state as a lighting state of the lighting apparatus. | 10-25-2012 |
20140176181 | PRE SPACE TRANSFORMER, SPACE TRANSFORMER MANUFACTURED USING THE PRE SPACE TRANSFORMER, AND SEMICONDUCTOR DEVICE INSPECTING APPARATUS INCLUDING THE SPACE TRANSFORMER - Disclosed herein is a pre space transformer including: a substrate having a first surface and a second surface, which is an opposite surface to the first surface; individual electrodes disposed on the first surface; and common electrodes disposed in the substrate, wherein the individual electrodes are repeatedly disposed while configuring a unit pattern. | 06-26-2014 |
20150295417 | MAGNETIC FIELD ADJUSTING THREE-DIMENSIONAL FLEXIBLE RESONATOR FOR WIRELESS POWER TRANSMISSION SYSTEM - A stereoscopic flexible resonator is provided. The stereoscopic flexible stereoscopic resonator includes at least one cell, at least one resonator including a capacitor, and a connection unit configured to connect the cell and the resonator in a stereoscopic structure. | 10-15-2015 |