Patent application number | Description | Published |
20130037833 | Optical Device and Method for Manufacturing Same - The present invention relates to an optical device and a method for manufacturing the same. The technical object of the invention is to realize a surface emitting body which allows heat generated from a light-emitting chip to be easily dissipated, eliminates the need for an additional wiring layer, and allows a singular light emitting chips or a plurality of light emitting chips to be arranged in series, in parallel, or in series-parallel. The present invention discloses an optical device comprising: a substrate; a plurality of light emitting chips disposed on the substrate; a plurality of conductive wires which electrically connect the substrate with the light emitting chips such that the plurality of light emitting chips are connected to each other in series, in parallel or in series-parallel; and a protective layer which covers the plurality of light emitting chips and the plurality of conductive wires on the substrate. | 02-14-2013 |
20140027796 | Optical Device and Method for Manufacturing Same - The present invention relates to an optical device and a method for manufacturing the same. The technical object of the invention is to realize a surface emitting body which allows heat generated from a light-emitting chip to be easily dissipated, eliminates the need for an additional wiring layer, and allows a singular light emitting chips or a plurality of light emitting chips to be arranged in series, in parallel, or in series-parallel. The present invention discloses an optical device comprising: a substrate; a plurality of light emitting chips disposed on the substrate; a plurality of conductive wires which electrically connect the substrate with the light emitting chips such that the plurality of light emitting chips are connected to each other in series, in parallel or in series-parallel; and a protective layer which covers the plurality of light emitting chips and the plurality of conductive wires on the substrate. | 01-30-2014 |
20140177242 | Substrate for Optical Device - The present invention relates to a substrate for an optical device, which is configured to connect an optical element substrate and an electrode substrate in a fitting manner, and simultaneously, to form one or more bridge pads which are insulated from the optical element substrate by a horizontal insulating layer, on the optical element substrate. The substrate for an optical device according to a first aspect of the present invention comprises: an optical element substrate which is made of a metal plate and contains a plurality of optical elements therein; a pair of electrode substrates which are made of an insulating material to form a conductive layer on at least a portion of the upper surface thereof, are connected to both side surfaces of the optical element substrate, respectively, and are wire-bonded to the electrodes of the optical elements; and a fitting means which is formed on the side surfaces of the electrode substrate and the optical element substrate to fit the optical element substrate and the electrode substrate. The substrate for an optical device according to a second aspect of the present invention comprises: an optical element substrate which is made of a metal plate and contains a plurality of optical elements therein; a pair of electrode substrates which are made of a metal material to be connected to both side surfaces of the optical element substrate, respectively, and are wire-bonded to the electrodes of the optical elements; a fitting means which is formed on the side surfaces of the electrode substrate and the optical element substrate to fit the optical element substrate and the electrode substrate; and a fitting-type vertical insulating layer which is interposed between the optical element substrate and the electrode substrate so as to be connected to the fitting means. | 06-26-2014 |
20140374783 | Optical Device Integrated with Driving Circuit and Power Supply Circuit, Method for Manufacturing Optical Device Substrate Used Therein, and Substrate Thereof - The present invention relates to an optical device integrated with a driving circuit and a power supply circuit, a method for manufacturing an optical device substrate used therein, and a substrate thereof, which are capable of reducing the overall size and facilitating the handling and management thereof by mounting a plurality of optical elements, driving circuits thereof, and power supply circuits thereof on a single substrate for an optical device having a vertical insulating layer. The objective of the present invention is to provide the optical device integrated with the driving circuit and the power supply circuit, the method for manufacturing the optical device substrate used therein, and the substrate thereof which are capable of reducing the overall size and facilitating the handling and the management thereof by mounting the plurality of optical elements, the driving circuits thereof, and the power supply circuits thereof on the single substrate for the optical device having the vertical insulating layer. | 12-25-2014 |
20150048408 | Method for Manufacturing a Can Package-Type Optical Device, and Optical Device Manufactured Thereby - The present invention relates to a method for manufacturing an optical device, and to an optical device manufactured thereby, which involve using a substrate itself as a heat-dissipating plate, and adopting a substrate with vertical insulation layers formed thereon, such that electrode terminals do not have to be extruded out from a sealed space, and thus enabling the overall structure and manufacturing process for an optical device to be simplified. | 02-19-2015 |
20150098209 | Method for Manufacturing Optical Element for Backlight Unit and Optical Element and Optical Element Array Manufactured by Method - The present invention relates to a method of manufacturing an optical device for a back light unit, and an optical device and an optical device array manufactured by the method, in which optical device chips constituting the optical device array are each laid the sides thereof on a printed circuit board in such a manner that light can be emitted from the optical device chips in a lateral direction, thus reducing the overall thickness of the back light unit. | 04-09-2015 |
20150102486 | Method for Mounting a Chip and Chip Package - Provided is a method of mounting a chip. The method includes: forming a bump at one surface of a cavity formed concavely in an inner direction of a substrate; performing a coining process to flatten a surface of the bump; coating a solder material on the bump subjected to the coining process; and bonding a chip and the bump by melting the solder material, wherein an electrode portion or a metal portion is formed on a bottom of the chip. For a metal substrate according to the present invention, wherein a vertical insulating layer is included, since the electrode portion of the chip and the electrode portion of the substrate have to be electrically connected, the metal substrate is bonded to the electrode portion of the chip using the bump additionally formed on the metal substrate, so the heat generated in the chip can be rapidly transferred to the substrate, and the junction temperature of the chip can be decreased, thereby enhancing the light efficiency and the. In addition, cracking due to the difference of thermal expansion coefficient between solder materials can be prevented by sealing the bonding portion of the chip using the solder materials. Further, since oxidation of the bonding portion is prevented by blocking the contact with the outside, the chip packaging process can be performed without an additional process of filling an inert gas into the internal space wherein the chip is mounted. | 04-16-2015 |
20150115310 | ARRAY SUBSTRATE FOR MOUNTING CHIP AND METHOD FOR MANUFACTURING THE SAME - Provided is an array substrate for mounting a chip. The array substrate includes a plurality of conductive layers unidirectionally stacked with respect to an original chip substrate; a plurality of insulating layers alternately stacked with the plurality of conductive layers, and electrically separate the plurality of conductive layers; and a cavity having a groove of a predetermined depth with respect to a region including the plurality of insulating layers in an upper surface of the original chip substrate. Accordingly, since the optical device array of a single structure is used as a line source of light, an emission angle emitted from the optical device is great, it is not necessary to form an interval for supplying an amount of light, and a display device can be simply constructed. Further, since it is not necessary to perform soldering a plurality of LED packages on a printed circuit board, a thickness of a back light unit can be reduced. | 04-30-2015 |
20150129905 | Optical Device and Method for Manufacturing Same - The present invention relates to an optical device and a method for manufacturing the same. The technical object of the invention is to realize a surface emitting body which allows heat generated from a light-emitting chip to be easily dissipated, eliminates the need for an additional wiring layer, and allows a singular light emitting chips or a plurality of light emitting chips to be arranged in series, in parallel, or in series-parallel. The present invention discloses an optical device comprising: a substrate; a plurality of light emitting chips disposed on the substrate; a plurality of conductive wires which electrically connect the substrate with the light emitting chips such that the plurality of light emitting chips are connected to each other in series, in parallel or in series-parallel; and a protective layer which covers the plurality of light emitting chips and the plurality of conductive wires on the substrate. | 05-14-2015 |
20150138656 | Chip Substrate Having a Lens Insert - A chip substrate includes: a conductive layer being stacked in one direction and constituting a chip substrate; an insulator being alternately stacked with the conductive layer and electrically separating the conductive layer; and a lens insert having: a depression reaching down to a predetermined depth from a specified area of an upper surface of the chip substrate overlapping with the insulator; and a predetermined number of sides on the upper surface wherein arcs are formed at regions where the sides are met with each other. Since the space for inserting a lens can be formed to have a shape comprising straight lines, and a lens to be inserted can also be manufactured in a shape comprising straight lines, therefore the manufacturing process for a lens to be inserted into the chip substrate can be further simplified. | 05-21-2015 |
20150138659 | Substrate for Preventing Burr Generation - A substrate for an optical device includes an optical device substrate including a plurality of conductive plates elongated along a length direction, wherein side surfaces of the conductive plates are bonded to each other with insulators interposed therebetween, the insulators being respectively formed on the side surfaces. A groove having a predetermined depth for preventing burrs is formed in a lower surface of the optical device substrate at each point where a cutting line is crossed with one of the insulators when the optical device substrate is cut in a length direction and in a vertical direction, the groove being formed in such a way that said one of the insulators is exposed to an inside of the groove. | 05-21-2015 |
20150143678 | Method for Manufacturing Optical Element for Backlight Unit and Optical Element and Optical Element Array Manufactured by Method - The present invention relates to a method of manufacturing an optical device for a back light unit, and an optical device and an optical device array manufactured by the method, in which optical device chips constituting the optical device array are each laid the sides thereof on a printed circuit board in such a manner that light can be emitted from the optical device chips in a lateral direction, thus reducing the overall thickness of the back light unit. | 05-28-2015 |
20150147580 | High Heat-Radiant Optical Device Substrate - An optical device substrate includes metal plates and insulating layers formed between the metal plates. Each insulating layer includes a cured insulating layer formed by curing insulating material and an anodized layer merged with each metal plate, the anodized layer formed by anodizing a first metal and a second metal of each metal plate. The first metal and the second metal include a first anodized layer and a second anodized layer, respectively, and are electrically insulated by interfaces including a first interface formed between the first metal and the first anodized layer, a second interface formed between the first anodized layer and the cured insulating layer, a third interface formed between the cured insulating layer and the second metal and a fourth interface formed between the second anodized layer and the second metal. | 05-28-2015 |
20150243864 | Method for Manufacturing Optical Device and Optical Device Manufactured by Same - The present invention relates to a method for manufacturing an optical device and to an optical device manufactured by the method, in which heat-dissipating performance by a heat sink and thermal insulation performance between a substrate and the heat sink are improved and workability is enhanced. According to a first characteristic of the present invention, the method for manufacturing an optical device comprises: (a) a step of preparing a disk for an optical device having a vertical thermal insulation layer; (b) a step of forming a groove along a cut line formed on the lower surface of the disk for an optical device; (c) a step of applying liquid insulation material to the surface on which the groove is formed and hardening the liquid insulation material to form an electrically insulating layer having a planar surface; and (d) a step of forming a fixing hole penetrating in a vertical direction through both the disk for an optical device and the groove. | 08-27-2015 |