Patent application number | Description | Published |
20090129085 | OPTICAL DEVICE - An exemplary embodiment of an optical device may include a lead frame with a plurality of leads and a reflector housing formed around the lead frame. The reflector housing includes a first end face and a second end face and a peripheral sidewall extending between the first end face and the second end face. The reflector housing includes a first pocket with a pocket opening in the first end face and a second pocket with a pocket opening in the second end face. At least one LED die is mounted in the first pocket of the reflector housing, and a light transmitting encapsulant is disposed in the first pocket and encapsulating the at least one LED die. | 05-21-2009 |
20100320485 | MULTI-CHIP PACKAGED LED LIGHT SOURCE - A light source having a lead frame, a body, and a plurality of dies, each die having an LED thereon is disclosed. The body includes a top surface, a bottom surface and a plurality of side surfaces. The lead frame includes first, second, and third sections, the first section includes a die mounting area having a first protrusion that passes through the body and terminates in a pad on the bottom surface. The second and third sections each include a protrusion that is bent to form first and second leads that run along one of the side surfaces. Each die is bonded to the die mounting area such that a first contact is electrically connected to the die mounting area, and a second contact is connected to one of the second and third sections. The first protrusion of the first section provides improved heat transfer. | 12-23-2010 |
20120211785 | HIGH POWER PLASTIC LEADED CHIP CARRIER WITH INTEGRATED METAL REFLECTOR CUP AND DIRECT HEAT SINK - A Plastic Leaded Chip Carrier (PLCC) package is disclosed. The PLCC package includes a lead frame with an integrated reflector cup. The reflector cup is directly connected to a heat sink, which improves the ability of the PLCC package to distribute heat away from the light source that is provided in the reflector cup. | 08-23-2012 |
20130062655 | HIGH THERMAL CONDUCTIVITY AND LOW DEGRADATION DIE ATTACH WITH DUAL ADHESIVE - A package for a light source, a semiconductor device, and methods of manufacturing the same are disclosed. In particular, a Light Emitting Diode (LED) dice is attached to a bonding pad of the light source package by two discrete types of different adhesives. One of the adhesives may be curable under exposure to Ultraviolet (UV) light and the other adhesive may be cured under thermal radiation, but is stable when exposed to UV light. | 03-14-2013 |
20130215611 | HYBRID CANOPY LIGHTING FOR OPTIMUM LIGHT BEAM SHAPING - A lighting system and method are disclosed. Specifically, the lighting system includes a hybrid canopy that can provide an optimum light beam shape for a number of different lighting applications. The hybrid canopy is equipped with lighting clusters of different types, thereby enabling a broader beam output without sacrificing beam intensity or brightness. | 08-22-2013 |
20140146531 | ILLUMINATION DEVICE WITH COMBINATION OF DISCRETE LIGHT EMITTING DIODE AND ORGANIC LIGHT EMITTING DIODE COMPONENTS - An illumination device, system, and method are disclosed. The illumination device includes one or more first light sources and one or more second light sources. The one or more first light sources may correspond to discrete light sources whereas the one or more second light sources may correspond to sheet or film-type light sources, such as Organic Light Emitting Diode (OLED) sheets. | 05-29-2014 |
20140153219 | Cooling System Utilizing Potential Energy - A cooling system utilizing a potential energy that provides cooling with low power consumption is disclosed. The cooling system may comprise a heat dissipating member, a support structure, a movable assembly, and a coil. In one embodiment, the movable assembly may be configured to oscillate above the heat dissipating member by utilizing induction from the coil and the potential energy to generate air flow that provide cooling on the heat dissipating member. In other embodiments, the movable assembly may be configured to oscillate substantially within the recess of the heat dissipating member. | 06-05-2014 |
20140160746 | SYSTEM, DEVICE, AND METHOD FOR ADJUSTING COLOR OUTPUT THROUGH ACTIVE COOLING MECHANISM - An illumination device, system, and method are disclosed. The illumination device includes an active cooling mechanism and a controller for the same. When the controller activates or deactivates the active cooling mechanism, one or more optical elements on the illumination device are automatically moved, thereby adjusting at least one characteristic of the light emitted by the illumination device. | 06-12-2014 |
20140168975 | LIGHTING FIXTURE WITH FLEXIBLE LENS SHEET - A lighting system and lighting fixture cover are disclosed. Specifically, the lighting system can provide an optimum light beam shape for a number of different lighting applications. The lighting system includes a PCB and cover with one or more lenses and one or more snap-fit locking mechanisms to secure the cover to the PCB. The cover enables a narrow beam output without sacrificing beam intensity or brightness. The cover simplifies the assembly process of a lighting fixture. | 06-19-2014 |
20140184096 | MINIMIZED COLOR SHIFT LIGHTING ARRANGEMENT DURING DIMMING - An illumination device, system, and method are disclosed. The illumination system includes a first set of light sources and a second set of light sources, driven by a first driver and second driver, respectively. The system further includes a dimming control system that implemented dimming control logic. The dimming control logic coordinates the operation of the first and second drivers such that the first and second sets of light sources are activated and deactivated so as to achieve substantially constant color temperature during dimming operations. | 07-03-2014 |
20140252943 | Lighting Device With Spectral Converter - In one embodiment, a light-emitting device having a body, a reflector, a light source die, and a spectral converter is disclosed. The spectral converter may be formed adjacent to, but distanced away from, the light source die. The spectral converter may be configured to spectrally adjust a portion of the light output having a predetermined spectral content. In another embodiment, a system for illumination having a plurality of lighting assemblies is disclosed. Each of the lighting assemblies comprises a spectral converter configured to spectrally adjust a portion of the light output so that the plurality of lighting assemblies are configured to emit substantially similar spectral output. In yet another embodiment, a lighting apparatus having the spectral converter is disclosed. | 09-11-2014 |
20140254127 | Lighting Device And Apparatus With Spectral Converter Within A Casing - In one embodiment, a light-emitting device having a substrate, a casing, a plurality of light source dies, a plurality of spectral converters and a plurality of optical structures is disclosed. The spectral converters may be configured to spectrally adjust a portion of the light output of the light source die into a first and second converted spectral output that is substantially different from one another. In another embodiment, a system for illumination having a plurality of lighting assemblies has been disclosed. Each of the lighting assemblies comprises a light source die and a spectral converter. The spectral converter is configured to spectrally adjust the light output of the light source die so that the plurality of lighting assemblies are configured to emit substantially different spectral output. In yet another embodiment, a lighting apparatus having a primary spectral converter and a secondary spectral converter is disclosed. | 09-11-2014 |
20140353701 | LIGHT SOURCE PACKAGE AND METHOD OF MANUFACTURING THE SAME - A package for a light source is disclosed. In particular, a Plastic Leaded Chip Carrier (PLCC) is described which provides enhanced heat dissipating properties. Moreover, the PLCC is described as comprising a single-gage leadframe, which provides for enhanced design flexibility and reduced manufacturing costs. Methods of manufacturing light source packages are also disclosed. | 12-04-2014 |