Patent application number | Description | Published |
20080222464 | Structure for System for and Method of Performing High Speed Memory Diagnostics Via Built-In-Self-Test - A design structure for a system for and method of performing high speed memory diagnostics via built-in-self-test (BIST) is disclosed. In particular, a test system includes a tester for testing an integrated circuit that includes a BIST circuit and a test control circuit. The BIST circuit further includes a BIST engine and fail logic for testing an imbedded memory array. The test control circuit includes three binary up/down counters, a variable delay, and a comparator circuit. A method of performing high speed memory diagnostics via BIST includes, but is not limited to, presetting the counters of the test control circuit, presetting the variable delay to a value that is equal to the latency of the fail logic, setting the BIST cycle counter to decrement mode, presetting the variable delay to zero, re-executing the test algorithm and performing a second test operation of capturing the fail data, and performing a third test operation of transmitting the fail data to the tester. | 09-11-2008 |
20090153172 | STRUCTURE FOR INDICATING STATUS OF AN ON-CHIP POWER SUPPLY SYSTEM - A design structure embodied in a machine readable medium used in a design process includes a system for indicating status of an on-chip power supply system with multiple power supplies, having a power system status register for receiving digital compliance signals, each compliance signal associated with one of the multiple power supplies, and having an associated compliance level, wherein each digital compliance signal indicates whether its associated power supply is operating at the associated compliance level, and wherein the power system status register generates a power supply status signal based on the digital compliance signals indicating status of the digital compliance signals; and an output for outputting the power supply status signal, wherein if a power supply is operating at its associated compliance level, the power supply status signal indicates that the power supply is passing, otherwise the power supply status signal indicates that the power supply is failing. | 06-18-2009 |
20090158092 | SYSTEM AND METHOD FOR INDICATING STATUS OF AN ON-CHIP POWER SUPPLY SYSTEM - The status of multiple on-chip power supply systems is indicated for use in modifying chip test flow and diagnosing chip failure. Digital compliance signals are received, each compliance signal associated with one of multiple on-chip power supplies. Each power supply has an associated compliance level, and each compliance signal indicates whether its associated power supply is operating at the associated compliance level. The compliance signals are converted into a power supply status signal indicating status of the compliance signals associated with the power supply. The power supply status signal is output. If a power supply is operating at its associated compliance level, the output power supply status signal indicates that the power supply is passing. If the power supply is not operating at its associated compliance level, the output power supply status signal indicates that the power supply is failing. If a power supply is failing, a memory test may be aborted, simplifying chip failure diagnosis. | 06-18-2009 |
20090161722 | AUTOMATIC SHUTDOWN OR THROTTLING OF A BIST STATE MACHINE USING THERMAL FEEDBACK - A Built-In-Self-Test (BIST) state machine providing BIST testing operations associated with a thermal sensor device(s) located in proximity to the circuit(s) to which BIST testing operations are applied, and a design structure including the BIST state machine embodied in a machine readable medium are provided. The thermal sensor device compares the current temperature value sensed to a predetermined temperature threshold and determines whether the predetermined threshold is exceeded. A BIST control element suspends the BIST testing operation in response to meeting or exceeding said predetermined temperature threshold, and initiates resumption of BIST testing operations when the current temperature value normalizes or is reduced. A BIST testing methodology implements steps for mitigating the exceeded temperature threshold condition in response to determining that the predetermined temperature threshold is met or exceeded. These steps include one of: ignoring the BIST results of the suspect circuit(s), or by causing the BIST state machine to enter a wait state and adjusting operating parameters of the suspect circuits while in the wait state. | 06-25-2009 |
20090249146 | AUTOMATICALLY EXTENSIBLE ADDRESSING FOR SHARED ARRAY BUILT-IN SELF-TEST (ABIST) CIRCUITRY - A method for testing integrated circuits (ICs) by automatically extending addressing for shared array built-in self-test (BIST) circuitry, includes polling a plurality of memories to determine which of the plurality of memories are sharing a first comparison tree and mapping a shared array BIST address space to each of the plurality of memories using the first comparison tree. Additionally, the method includes estimating a shared array BIST completion time corresponding to a most significant bits of a maximum total memory address size under test, reconfiguring the shared array BIST circuitry to accommodate the estimated shared array BIST completion time and testing the plurality of memories sharing the first comparison tree. | 10-01-2009 |
20090319818 | METHOD AND APPARATUS FOR A ROBUST EMBEDDED INTERFACE - A method is provided for operating an interface between a first unit and a second unit supplying its data. The method includes switching control between LSSD_B and LSSD_C clocks and system clock (CLK) to provide a test mode of operation and a functional mode of operation to optimize setup and hold times depending on conditions under which the unit is operating. In the test mode, data is launched by the LSSD_C clock. In the functional mode, the data is launched by the system clock (CLK) to RAM. A method is also provided to determine which memory inputs should use a circuit that provides adequate setup and hold margins. | 12-24-2009 |
20090319841 | STRUCTURE AND APPARATUS FOR A ROBUST EMBEDDED INTERFACE - A design structure is embodied in a machine readable medium for designing, manufacturing, or testing an integrated circuit. The design structure includes an input register coupled to a data processing unit input and a test operation mode and functional operation mode. In the test mode operation, the register operates in a clocked mode such that, during the test operation mode, the register propagates data to the data processing unit in response to a clock signal. In the functional operation mode, the register operates in a data flush mode such that the register propagates data to the data processing unit in response to the data. The functional mode is enabled by a flush enable signal and the test mode is enabled by an opposite state of the flush enable signal. | 12-24-2009 |
20110113280 | CIRCUIT AND METHOD FOR EFFICIENT MEMORY REPAIR - A circuit and method of testing a memory and calculating a repair solution for a given address location includes pausing a built in self test (BIST) operation on detection of a failing memory output data of an integrated circuit. During the pause, the circuit and method analyzes “n” number of groups of the failing memory output data during “n” cycles using analysis logic and calculating a repair solution. Normal operations can be resumed. | 05-12-2011 |
20120075919 | Methods and Systems for Adjusting Wordline Up-Level Voltage to Improve Production Yield Relative to SRAM-Cell Stability - Methods of setting wordline up-level voltage in as-fabricated SRAM. In one example, the method includes determining the relative speed, or strength, of 1) the combination of the pass-gate and pull-down devices and 2) the pull-up devices in the bitcells of the SRAM. These relative strengths are then used to adjust the wordline up-level voltage, if needed, to decrease the likelihood of the SRAM experiencing a stability failure. Corresponding systems are provided for determining the relative strengths of the devices of interest, for determining the amount of up-level voltage adjustment needed, and for selecting and setting the up-level voltage. | 03-29-2012 |
20130042166 | FUSEBAY CONTROLLER STRUCTURE, SYSTEM, AND METHOD - Error correction is selectively applied to data, such as repair data to be stored in a fusebay for BIST/BISR on an ASIC or other semiconductor device. Duplicate bit correction and error correction code state machines may be included, and selectors, such as multiplexers, may be used to enable one or both types of correction. Each state machine may include an indicator, such as a “sticky bit,” that may be activated when its type of correction is encountered. The indicator(s) may be used to develop quality and yield control criteria during manufacturing test of parts including embodiments of the invention. | 02-14-2013 |
20130139010 | CIRCUIT AND METHOD FOR EFFICIENT MEMORY REPAIR - A circuit and method of testing a memory and calculating a repair solution for a given address location includes pausing a built in self test (BIST) operation on detection of a failing memory output data of an integrated circuit. During the pause, the circuit and method analyzes “n” number of groups of the failing memory output data during “n” cycles using analysis logic and calculating a repair solution. Normal operations can be resumed. | 05-30-2013 |
20130275821 | READ ONLY MEMORY (ROM) WITH REDUNDANCY - A read only memory (ROM) with redundancy and methods of use are provided. The ROM with redundancy includes a programmable array coupled to a repair circuit having one or more redundant repairs. The one or more redundant repairs include a word address match logic block, a data I/O address, and a tri-state buffer. The word address match logic block is provided to the tri-state buffer as a control input and the data I/O address is provided to the tri-state buffer as an input. An output of the tri-state buffer of each redundant repair is provided as a first input to one or more logic devices. One or more data outputs of a ROM bit cell array is provided as a second input to a respective one of the one or more logic devices. | 10-17-2013 |
20140110710 | STACKED CHIP MODULE WITH INTEGRATED CIRCUIT CHIPS HAVING INTEGRATABLE AND RECONFIGURABLE BUILT-IN SELF-MAINTENANCE BLOCKS - Disclosed is a stacked chip module incorporating a stack of integrated circuit (IC) chips having integratable and automatically reconfigurable built-in self-maintenance blocks (i.e., built-in self-test (BIST) circuits or built-in self-repair (BISR) circuits). Integration of the built-in self-maintenance blocks between the IC chips in the stack allows for servicing (e.g., self-testing or self-repairing) of functional blocks at the module-level. Automatic reconfiguration of the built-in self-maintenance blocks further allows for functional blocks on any of the IC chips in the stack to be serviced at the module-level even when one or more controllers associated with a given built-in self-maintenance block on a given IC chip has been determined to be defective (e.g., during previous wafer-level servicing). Also disclosed is a method of manufacturing and servicing such a stacked chip module. | 04-24-2014 |
20140110711 | STACKED CHIP MODULE WITH INTEGRATED CIRCUIT CHIPS HAVING INTEGRATABLE BUILT-IN SELF-MAINTENANCE BLOCKS - Disclosed is a stacked chip module and associated method with integrated circuit (IC) chips having integratable built-in self-maintenance blocks. The module comprises a stack of chips and each chip comprises a self-maintenance block with first and second controllers. The first controller controls wafer-level and module-level servicing (e.g., self-testing or self-repairing) of an on-chip functional block. The second controller provides an interface between an off-chip tester and the first controller during wafer-level servicing. Each chip further comprises a plurality of interconnect structures (e.g., multiplexers and through-substrate-vias) that integrate the self-maintenance blocks of adjacent chips in the stack so that, during module-level servicing, a single second controller on a single one of the chips in the stack (e.g., the bottom chip) provides the only interface between the off-chip tester and all of the first controllers. | 04-24-2014 |
20140129888 | STAGGERED START OF BIST CONTROLLERS AND BIST ENGINES - Each register in each built-in self-test (BIST) controller contains a BIST controller-specific start count value that is different from at least one other BIST controller-specific start count. A test controller provides a start command simultaneously to all the BIST controllers. This causes each of the BIST controllers to simultaneously begin a countdown of the BIST controller-specific start count values, using a counter. Each of the BIST controllers starts a test procedure in a corresponding BIST domain when the countdown completes (in the corresponding BIST controller). Thus, the test procedure starts at different times in at least two of the BIST domains based on the difference of the BIST controller-specific start count values in the different registers. Further, during the test procedure, each stagger controller can stagger the start of each BIST engine within the corresponding BIST domain to which the stagger controller is connected. | 05-08-2014 |
20140143619 | MEMORY TEST WITH IN-LINE ERROR CORRECTION CODE LOGIC - Systems and methods are provided for reusing existing test structures and techniques used to test memory data to also test error correction code logic surrounding the memories. A method includes testing a memory of a computing system with an error code correction (ECC) logic block bypassed and a first data pattern applied. The method further includes testing the memory with the ECC logic block enabled and a second data pattern applied. The method also includes testing the memory with the ECC logic block enabled and the first data pattern applied. | 05-22-2014 |
20140149810 | SYSTEM AND METHOD OF REDUCING TEST TIME VIA ADDRESS AWARE BIST CIRCUITRY - In a method of executing a BIST operation on IC memory arrays having a common BIST control unit, a first BIST sequence is initiated. Each address for the arrays is incremented. The BIST control unit receives a signal indicating a maximum valid address in the array is reached, receiving a plurality of maximum valid addresses, which are recorded. A single relatively highest maximum valid address is determined. A first mode, which prevents BIST testing, is engaged in each array having reached the maximum valid address. A second BIST sequence is initiated based on having received the signal indicating a maximum valid address is reached from all the arrays connected to the common BIST control unit. An address count is decremented from the single relatively highest maximum valid address. The first mode is disengaged for each array as the address count reaches each of the maximum valid addresses during the decrementing. | 05-29-2014 |
20140258797 | BUILT-IN-SELF-TEST (BIST) TEST TIME REDUCTION - Aspects of the invention provide for reducing BIST test time for a memory of an IC chip. In one embodiment, a BIST architecture for reducing BIST test time of a memory for an integrated circuit (IC) chip, the architecture comprising: a pair of latches for receiving bursts of data from a memory; a first compression stage for receiving a burst of data and compressing the burst of data into a plurality of latches; a second compression stage for comparing the compressed bursts of data with expected data; and a logic gate for determining whether there is a fail in the burst of data. | 09-11-2014 |
20140351662 | READ ONLY MEMORY (ROM) WITH REDUNDANCY - A read only memory (ROM) with redundancy and methods of use are provided. The ROM with redundancy includes a programmable array coupled to a repair circuit having one or more redundant repairs. The one or more redundant repairs include a word address match logic block, a data I/O address, and a tri-state buffer. The word address match logic block is provided to the tri-state buffer as a control input and the data I/O address is provided to the tri-state buffer as an input. An output of the tri-state buffer of each redundant repair is provided as a first input to one or more logic devices. One or more data outputs of a ROM bit cell array is provided as a second input to a respective one of the one or more logic devices. | 11-27-2014 |
20150070048 | VERIFYING PARTIAL GOOD VOLTAGE ISLAND STRUCTURES - Structures, methods, and systems for designing and verifying integrated circuits including redundant logic blocks are provided. An integrated circuit includes selection logic and selectable logic blocks that are individually controllable by the selection logic. The selectable logic blocks include respective instances of a redundant logic block, and respective instances of an interface logic block that selectively disable the redundant logic blocks in the integrated circuit. | 03-12-2015 |