Patent application number | Description | Published |
20080200098 | POLISHING SLURRY FOR ALUMINUM AND ALUMINUM ALLOYS - The invention is directed to a method of polishing a surface of an object that includes aluminum. The method includes the step of contacting the surface of the object with a soft polishing pad and a polishing composition. The polishing composition includes abrasive particles, an agent that oxidizes aluminum, and a liquid carrier to polish the surface of the object. The polishing composition includes the abrasive particles suspended in the liquid carrier, and is applied at a pH above about 7. | 08-21-2008 |
20080283502 | Compositions, methods and systems for polishing aluminum oxide and aluminum oxynitride substrates - A method and system is provided for improved polishing or planarizing of aluminum oxide and/or aluminum oxynitride substrates. Specifically, the composition comprises an abrasive, a liquid carrier, and a phosphorus-type mono-acid. Preferably, the phosphorus-type mono-acid is phosphoric acid, phosphonoacetic acid, phosphorous acid, methyl phosphonic acid, or mixtures thereof. The control of the pH of the composition further improves polishing rates. | 11-20-2008 |
20090032006 | Wire saw process - This invention provides a method for increasing the cutting performance of a wire saw, in cutting a substrate, by increasing the association of the abrasive particles in the cutting slurry and the cutting wire, the enhancement being caused by the use of thickening agents in the cutting slurry or by increasing the attraction of the abrasive particles to the cutting wire. | 02-05-2009 |
20100022171 | Glass polishing compositions and methods - The present invention provides glass polishing compositions and methods suitable for polishing a glass substrate at a down force of about 110 g/cm | 01-28-2010 |
20100062601 | METHODS FOR POLISHING ALUMINUM NITRIDE - The present invention provides a method for polishing an aluminum nitride substrate. The method comprises abrading a surface of the aluminum nitride substrate with a basic, aqueous polishing composition, which comprises an abrasive (e.g., colloidal silica), an oxidizing agent (e.g., hydrogen peroxide), and an aqueous carrier. The methods of the invention provide for substantially improved polishing rates relative to conventional methods that do not utilize an oxidizing agent in the polishing slurry. | 03-11-2010 |
20110239836 | COMPOSITION FOR IMPROVING DRYNESS DURING WIRE SAWING - The invention provides a composition for slicing a substrate using a wire saw wherein the composition comprises a liquid carrier and an abrasive. The invention further provides methods of slicing a substrate using a wire saw and a composition. | 10-06-2011 |
20120094489 | CMP COMPOSITIONS AND METHODS FOR SUPPRESSING POLYSILICON REMOVAL RATES - The present invention provides a chemical-mechanical polishing (CMP) composition suitable for polishing a silicon nitride-containing substrate while suppressing polysilicon removal from the substrate. The composition comprises abrasive particles suspended in an acidic aqueous carrier containing a surfactant comprising an alkyne-diol, an alkyne diol ethoxylate, or a combination thereof. Methods of polishing a semiconductor substrate therewith are also disclosed. | 04-19-2012 |