Patent application number | Description | Published |
20090062846 | CLOSURE MEDICAL DEVICE - A closure device for closing a puncture wound has a distal section that can be placed against the interior wall of a vessel and a proximal section that bunches in the tissue tract to close the wound. | 03-05-2009 |
20090062847 | CLOSURE MEDICAL DEVICE - A closure device for closing a puncture wound has a distal section that can be placed against the interior wall of a vessel and a proximal section that bunches in the tissue tract to close the wound. | 03-05-2009 |
20090062848 | CLOSURE MEDICAL DEVICE - A closure device for closing a puncture wound has a distal section that can be placed against the interior wall of a vessel and a proximal section that bunches in the tissue tract to close the wound. One variation of the device provides for removing the distal section from the vessel so that it resides also in the tissue tract after the proximal section has been securely bunched and lodged within the tissue tract in order to provide unobstructed fluid flow in the vessel. | 03-05-2009 |
20090062850 | CLOSURE MEDICAL DEVICE - A closure device for closing a puncture wound has a distal section that can be placed against the interior wall of a vessel and a proximal section that bunches in the tissue tract to close the wound. | 03-05-2009 |
20120253385 | CLOSURE MEDICAL DEVICE AND DELIVERY MECHANISM - A delivery mechanism for deploying a closure device includes several slidable members, a plunger, and attachments to tension members of the closure device. Deployment of the closure device includes controlling placement and expansion of the device within tissue using the tension members, the plunger, and the slidable members. | 10-04-2012 |
20120316636 | LOCK/FLOATING MARKER BAND ON PUSHER WIRE FOR SELF-EXPANDING STENTS OR MEDICAL DEVICES - An apparatus for deploying and retrieving a self-expanding intravascular stent includes an intravascular delivery wire and floating marker band movably retained over the intravascular stent delivery wire and releasably mounting the self-expanding intravascular stent. The floating marker band is movably retained to a fixed marker band, and a distance between the fixed marker band and the floating marker band is variable and self-adjusting. One or more struts of the self-expanding intravascular stent are releasably constrained between a catheter wall and one or more sides of the floating marker band. | 12-13-2012 |
20140236276 | LOCK/FLOATING MARKER BAND ON PUSHER WIRE FOR SELF-EXPANDING STENTS OR MEDICAL DEVICES - An apparatus for deploying and retrieving a self-expanding intravascular stent includes an intravascular delivery wire and floating marker band movably retained over the intravascular stent delivery wire and releasably mounting the self-expanding intravascular stent. The floating marker band is movably retained to a fixed marker band, and a distance between the fixed marker band and the floating marker band is variable and self-adjusting. One or more struts of the self-expanding intravascular stent are releasably constrained between a catheter wall and one or more sides of the floating marker band. | 08-21-2014 |
20150297238 | GEOMETRIC COIL - The invention is an embolic coil having a complex secondary shape based on extensions of the coil into planes orthogonal to the length of the coil. A spring coil is wound on a secondary shaping mandrel having branched extensions positioned sequentially along the length of the linear base mandrel. The spring coil is wound around the base mandrel and the branches that extend or protrude from the base in successive increments creating coil extensions. The secondary wind is stress-relieved. The resulting occupation of space by the secondary shape of the embolic coil is space-filling with extensions into two or more planes, the extensions alternating along the length of the somewhat compressed coil. The invention allows a spring coil to act like a compression coil in its secondary shape. | 10-22-2015 |
Patent application number | Description | Published |
20120086183 | GREEN BIKE - A green bike comprises a frame, two wheels, a first internal-gear module and a second internal-gear module and a transmission element. The frame has a pedal, a front supporting unit, a rear supporting unit, and a seat unit. The two wheels are attached to the front supporting unit and the rear supporting unit, respectively. The transmission element is disposed in the frame or a tube shield linking to the frame. The first internal-gear module and the second internal-gear module are coupled with the pedal and at least one of the wheels. The transmission element links the first and the second internal-gear modules for delivering power to the at least one of the wheels. | 04-12-2012 |
20120088329 | SEMICONDUCTOR MULTI-PROJECT OR MULTI-PRODUCT WAFER PROCESS - The embodiment provides a semiconductor MP wafer process including processing a plurality of MP wafers in a lot or batch with a first process step. The plurality of the MP wafers is split into an MP wafer group- | 04-12-2012 |
20130091312 | RECONFIGURABLE HIGH SPEED MEMORY CHIP MODULE AND ELECTRONICS SYSTEM DEVICE - A reconfigurable high speed memory chip module includes a type of memory cell array group, a first transmission bus, and a logic unit. The type memory cell array group includes multiple memory cell array integrated circuits (ICs). The first transmission bus coupled to the type memory cell array group has a first programmable transmitting or receiving data rate, a first programmable transmitting or receiving signal swing, a first programmable bus width, and a combination thereof. The logic unit is coupled to the first transmission bus for accessing the type memory cell array group through the first transmission bus. | 04-11-2013 |
20130091315 | HIGH SPEED MEMORY CHIP MODULE AND ELECTRONICS SYSTEM DEVICE WITH A HIGH SPEED MEMORY CHIP MODULE - A high speed memory chip module includes a type of memory cell array group and a logic unit. The type memory cell array group includes multiple memory cell array integrated circuits (ICs), and each of the memory cell array ICs has a data bus and at least one memory cell array, and corresponds to first metal-oxide-semiconductor field-effect transistor (MOSFET) gate length corresponding to a first MOSFET process. The logic unit accesses the type of memory cell array group through a first transmission bus, where bus width of the first transmission bus is wider than bus width of the data bus of each of the memory cell array ICs. Corresponding to a second MOSFET process, the logic unit has a second MOSFET gate length which is shorter than the first MOSFET gate length. | 04-11-2013 |
20150113356 | SYSTEM-IN-PACKAGE MODULE WITH MEMORY - A system-in-package module with memory includes a non-memory chip, a substrate, and a memory chip. The non-memory chip has a first portion and a second portion. The substrate has a window and the substrate is electrically connected to the second portion of the non-memory chip. The memory chip is placed into the window of the substrate to electrically connect the first portion of the non-memory chip, and there is no direct metal connection between the memory chip and the substrate. | 04-23-2015 |
20150206849 | SYSTEM-IN-PACKAGE MODULE AND MANUFACTURE METHOD FOR A SYSTEM-IN-PACKAGE MODULE - A system-in-package module includes a non-memory chip, a bundled memory, and an encapsulation package material. The non-memory chip has a plurality of pads. The bundled memory includes a first memory die and a second memory die side-by-side formed over a substrate, wherein the first memory die includes a first group of pads and the second memory die includes a second group of pads. The encapsulation package material encloses the non-memory chip and the bundled memory, and the non-memory chip is electronically coupling with the bundled memory through the plurality of pads, the first and the second group of pads. The first group of pads corresponds to the second group of pads by rotating a predetermined degree or by mirror mapping. | 07-23-2015 |
20150317276 | RECONFIGURABLE HIGH SPEED MEMORY CHIP MODULE AND ELECTRONIC DEVICE WITH A RECONFIGURABLE HIGH SPEED MEMORY CHIP MODULE - A reconfigurable high speed memory chip module includes a type of memory cell array group, a first transmission bus, and a logic unit. The type memory cell array group includes multiple memory cell array integrated circuits (ICs). The first transmission bus coupled to the type memory cell array group has a first programmable transmitting or receiving data rate, a first programmable transmitting or receiving signal swing, a first programmable bus width, and a combination thereof. The logic unit is coupled to the first transmission bus for accessing the type memory cell array group through the first transmission bus. | 11-05-2015 |
20160043065 | SEMICONDUCTOR MULTI-PROJECT OR MULTI-PRODUCT WAFER PROCESS - The embodiment provides a semiconductor MP wafer process including processing a plurality of MP wafers in a lot or batch with a first process step. The plurality of the MP wafers is split into an MP wafer group- | 02-11-2016 |