Patent application number | Description | Published |
20080290498 | Semiconductor Device - A semiconductor device is disclosed that includes a circuit board, a semiconductor element, a heat sink, and a stress relaxation member. The circuit board includes an insulated substrate, a metal circuit joined to one side of the insulated substrate, and a metal plate joined to the other side of the insulated substrate. The semiconductor element is joined to the metal circuit. The heat sink radiates heat generated in the semiconductor element. The stress relaxation member thermally joins the heat sink to the metal plate. The stress relaxation member is formed of a material having a high thermal conductivity. The stress relaxation member includes recesses, which curve inward from the peripheral portion of the stress relaxation member, to form stress relaxation spaces at the peripheral portion of the stress relaxation member. | 11-27-2008 |
20080290500 | Semiconductor device - A semiconductor device has a ceramic substrate having a first surface and a second surface, a metal layer that is coupled to the second surface, a heat sink that is coupled to the metal layer and a stress relaxation member. The stress relaxation member is arranged between the metal layer and the heat sink and has a first surface that is coupled to the metal layer and a second surface that is coupled to the heat sink. A plurality of stress relaxation spaces are provided over the entire surface of at least one of the first and second surfaces of the stress relaxation member. The stress relaxation spaces that are arranged at the outermost portions of the stress relaxation member are deeper than the other stress relaxation spaces. | 11-27-2008 |
20090000963 | HYDROGEN STORAGE TANK AND ITS MANUFACTURING METHOD - A manufacturing method of a hydrogen storage tank stored with a hydrogen gas by including built-in hydrogen-occlusion alloys, has a stacking step of stacking plate members building up heat transfer fins, an arranging step of disposing the hydrogen-occlusion alloys between the neighboring plate members so as to form an area in which to dispose the hydrogen-occlusion alloys and an area in which to dispose none of the hydrogen-occlusion alloys, and a pressurizing step of forming air spaces sectioned by the plate members building up the heat transfer fins and containing the previously built-in hydrogen-occlusion alloys in a way that gets a part of the plate members deformed by pressurizing the plate members in a stacking direction thereof so as to restrict migrations of the hydrogen-occlusion alloys disposed in the arranging step. | 01-01-2009 |
20090174063 | Semiconductor Module - A semiconductor module | 07-09-2009 |
20090200065 | HEAT DISSIPATION DEVICE AND POWER MODULE - A heat radiator | 08-13-2009 |
20090218386 | Soldering Method, Soldering Apparatus and Method for Manufacturing Semiconductor Device - An object-to-be-soldered ( | 09-03-2009 |
20090302458 | Heat Sink For Power Module - A heat sink ( | 12-10-2009 |
20100236767 | HYDROGEN GAS STORING DEVICE - A plurality of MH tank modules ( | 09-23-2010 |
20110297531 | HYDROGEN GENERATION DEVICE AND METHOD OF USING SAME - The present invention provides a hydrogen generation device using a photocatalyst to generate hydrogen from liquid water or water vapor and a method of using the same. The hydrogen generation device of the present invention has a water channel through which liquid water or water vapor flows, and which has an outer circumferential wall made at least in part of a transparent material; a hydrogen channel through which hydrogen flows and which is located at the inner circumference side of the water channel; a hydrogen separating membrane forming at least part of a wall between the water channel and hydrogen channel, separating hydrogen from the liquid water or water vapor in the water channel, and providing the hydrogen to the hydrogen channel; and a photocatalyst layer arranged on least at part of the water channel-side surface of the hydrogen separating membrane. | 12-08-2011 |
20110300065 | APPARATUS FOR PURIFYING HYDROGEN AND METHOD FOR USING THE SAME - An apparatus and method purify hydrogen from a mixed fluid containing gaseous hydrogen, gaseous oxygen, and liquid water. The apparatus has a mixed fluid channel through which the mixed fluid flows; a first gas channel through which a mixed gas containing gaseous hydrogen and gaseous oxygen flows; a second gas channel through which gaseous hydrogen or oxygen flows; a gas-liquid separating membrane forming a wall between the mixed fluid channel and the first gas channel, separating the mixed gas from the mixed fluid of the mixed fluid channel, and providing the separated mixed gas to the first gas channel; and a hydrogen or oxygen separating membrane forming a wall between the first gas channel and the second gas channel, separating gaseous hydrogen or oxygen from the mixed gas of the first gas channel, and providing the separated gaseous hydrogen or oxygen to the second gas channel. | 12-08-2011 |
20120113598 | BASE FOR POWER MODULE - A power module base includes a heat radiation substrate formed of a high-thermal-conduction material, an insulating substrate joined to an upper surface of the heat radiation substrate, a wiring layer provided on an upper surface of the insulating substrate, and a heat radiation fin joined to a lower surface of the heat radiation substrate. A component attachment plate thicker than the heat radiation substrate and including a through hole for accommodating the insulating substrate is joined to the upper surface of the heat radiation substrate such that the insulating substrate is located within the through hole. This power module base can maintain the upper surface of the component attachment plate flat, and various components for a power module, such as a casing, can be attached onto the component attachment plate. | 05-10-2012 |
20140140004 | HEAT SINK FOR POWER MODULE - A power module includes a power device and a heat sink. The heat sink includes a refrigerant passage in which a cooling medium flows and a corrugated fin body arranged in the refrigerant passage. The refrigerant passage is defined by a surface and a backside, and the power device is disposed in proximity to the surface. The corrugated fin body has crests and troughs that extend in the flow direction of the cooling medium and side walls each of which connects the corresponding one of the crests with the adjacent one of the troughs. Each adjacent pair of the side walls and the corresponding one of the crests or the corresponding one of the troughs arranged between the adjacent side walls form a fin. A guide that extends in the flow direction of the cooling medium and operates to stir the cooling medium is arranged in each of the fins. | 05-22-2014 |