Patent application number | Description | Published |
20080217301 | Laser beam processing machine - A laser beam processing machine comprising a laser beam application means for applying a pulse laser beam to a workpiece held on a chuck table and a controller, wherein the laser beam application means comprises a laser beam oscillation means for oscillating a pulse laser beam, an optical axis changing means for deflecting the optical axis of a pulse laser beam oscillated from the laser beam oscillation means in the processing-feed direction, and a condenser for converging a pulse laser beam whose optical axis has been deflected by the optical axis changing means; and the controller comprises a memory for storing a plurality of processing position coordinates set in the workpiece, controls the optical axis changing means according to the frequency of a pulse laser beam oscillated from the laser beam oscillation means and determines a plurality of predetermined processing position coordinates to be processed to ensure that the time interval between pulses of the pulse laser beam to be applied to the same processing position coordinates becomes a predetermined time or more when one pulse of the pulse laser beam is applied each time to a plurality of predetermined processing position coordinates to be processed sequentially and the pulse laser beam is applied to a plurality of predetermined processing position coordinates to be processed a predetermined number of times sequentially repeatedly. | 09-11-2008 |
20090153868 | Device for detecting the edges of a workpiece, and a laser beam processing machine - A device for detecting the edges of a workpiece held on the chuck table of a processing machine, having a beam oscillation means for oscillating a detection beam, an objective lens for focusing the detection beam oscillated from the beam oscillation means, and a reflected light detection means for detecting the reflected light of the detection beam applied through the objective lens, wherein the beam oscillation means oscillates the detection beam in such a manner that the optical axis of the detection beam becomes parallel to the center axis of the objective lens at a position offset from the center axis; and the reflected light detection means detects the edge of the workpiece based on a positional difference between reflected light obtained when the detection beam applied through the objective lens is reflected on an area where the workpiece is not existent and refracted by the objective lens and reflected light obtained when the detection beam is reflected on the workpiece and refracted by the objective lens. | 06-18-2009 |
20090230103 | LASER BEAM PROCESSING MACHINE - A laser beam processing machine comprising a chuck table for holding a workpiece, a laser beam application means for applying a laser beam to the workpiece held on the chuck table, a processing-feed means for moving the chuck table and the laser beam application means relative to each other in a processing-feed direction (X-axis direction), and an indexing-feed means for moving the chuck table and the laser beam application means relative to each other in an indexing-feed direction (Y-axis direction) perpendicular to the processing-feed direction (X-axis direction), wherein the laser beam application means comprises a laser oscillation means for oscillating a laser beam, a first acousto-optic deflection means for deflecting the optical axis of a laser beam oscillated by the laser beam oscillation means in the processing-feed direction (X-axis direction), and a second acousto-optic deflection means for deflecting the optical axis of a laser beam oscillated by the laser beam oscillation means in the indexing-feed direction (Y-axis direction). | 09-17-2009 |
20090266802 | LASER PROCESSING APPARATUS - A laser processing apparatus including a height detecting device for detecting the height of a workpiece held on a chuck table. The height detecting device includes an annular spot forming unit for forming the spot shape of a detecting laser beam into an annular spot shape, a pinhole mask for passing the reflected light reflected on the upper surface of the workpiece held on the chuck table, but blocking the reflected light reflected on the lower surface of the workpiece, and a reflected light analyzing unit for analyzing the reflected light passed through the pinhole mask and transmitting the result of analyzation to a control unit. The laser processing apparatus further includes a focusing unit having an objective lens for focusing a processing laser beam having a circular spot shape and the detecting laser beam having the annular spot shape and a window lens for focusing the detecting laser beam focused by the objective lens without focusing the processing laser beam. | 10-29-2009 |
20130193122 | LASER PROCESSING APPARATUS - A laser processing apparatus includes a plasma detecting unit for detecting a wavelength of plasma light generated by applying a pulsed laser beam from a laser beam applying unit to a workpiece. The plasma detecting unit includes a bandpass filter for passing only the wavelength of plasma light generated from a first material and a photodetector for detecting the light passed through the bandpass filter. A light intensity signal is output to a controller. The controller controls the laser beam applying unit so that the amplitude of a light intensity is detected according to the light intensity signal output from the photodetector. The pulsed laser beam is stopped after the amplitude of the light intensity is decreased to a predetermined value and a predetermined number of shots of the pulsed laser beam has been applied. | 08-01-2013 |
20130240494 | LASER PROCESSING APPARATUS - A laser processing apparatus including a workpiece holding unit for holding a workpiece and a laser beam applying unit for applying a laser beam to the workpiece held by the workpiece holding unit. The laser beam applying unit includes a laser oscillator for oscillating a laser beam, a focusing unit for focusing the laser beam oscillated by the laser oscillator onto the workpiece held by the workpiece holding unit, and an optical system provided between the laser oscillator and the focusing unit for transmitting the laser beam oscillated by the laser oscillator. The laser beam applying unit further includes a wavelength converting mechanism provided between the optical system and the focusing unit for converting the wavelength of the laser beam oscillated by the laser oscillator into a short wavelength. | 09-19-2013 |
20130319985 | LASER MACHINING APPARATUS - A laser machining apparatus includes a chuck table for holding a workpiece, and an irradiation unit which irradiates a laser beam upon the workpiece held on the chuck table. The laser beam irradiation unit includes a condenser which condenses the laser beam and irradiates the condensed laser beam upon the workpiece held on the chuck table. The condenser includes first and second condenser lenses arrayed in series in an advancing direction of the laser beam, a first moving unit having a first driving source for moving the first condenser lens in a first direction perpendicular to an optical axis of the first condenser lens, and a second moving unit having a second driving source for moving the second condenser lens in a second direction perpendicular to the first direction. | 12-05-2013 |
20130334185 | LASER PROCESSING APPARATUS - A laser processing apparatus including a laser beam branching mechanism provided between a laser oscillator and a focusing unit. The laser beam branching mechanism includes a spread angle adjusting unit for adjusting the spread angle of a laser beam and a branching unit for branching the laser beam into a plurality of laser beams. The branching unit includes a half-wave plate, a first polarization beam splitter for separating the laser beam into P polarized light and S polarized light, a first mirror for reflecting the P polarized light, a second mirror for reflecting the S polarized light, and a second polarization beam splitter for leading the P polarized light reflected by the first mirror and the S polarized light reflected by the second mirror to different optical paths extending in the same direction. | 12-19-2013 |
20130334186 | LASER PROCESSING APPARATUS - A laser processing apparatus includes a laser beam branching mechanism provided between a laser oscillator and a focusing unit. The branching mechanism includes a branching unit for branching a laser beam into a plurality of laser beams. The branching unit includes a half-wave plate for 45° rotating the polarization plane of the laser beam. A first polarization beam splitter separates the laser beam passed through the half-wave plate into P polarized light and S polarized light. A first mirror reflects the P polarized light and a second mirror reflects the S polarized light. A second polarization beam splitter leads the reflected P polarized light and the reflected S polarized light to different optical paths extending in the same direction, and an angle adjusting mechanism adjusts the angle of reflection of at least one of the P polarized light and the S polarized light. | 12-19-2013 |
20130344685 | PROCESSING METHOD AND PROCESSING APPARATUS - A processing method for etching a workpiece is disclosed. While etching gas is supplied into an etching chamber in which a workpiece held on a holding face of a holding table is accommodated, a laser beam of a wavelength having a transparency through the holding table and the workpiece is irradiated upon the workpiece from the opposite side to the holding face of the holding table such that the focal point of the laser beam is positioned in the inside of a processing region of the workpiece to excite the processing region to induce etching. | 12-26-2013 |
20140034624 | LASER PROCESSING APPARATUS - A laser processing apparatus has an optical transmitting unit for guiding a laser beam to a focusing unit. The optical transmitting unit includes a focusing lens for focusing the laser beam, an optical fiber unit for inputting the focused laser beam and guiding it to the focusing unit. The optical fiber unit includes an LMA fiber for inputting the focused laser beam. The LMA fiber has a large-diameter core covered with a cladding, a transmitting fiber provided by an SM fiber or a PM fiber. The transmitting fiber has a small-diameter core covered with a cladding, the small-diameter core having a diameter corresponding to the wavelength of the laser beam oscillated by the laser oscillator. A connector connects the LMA fiber and the transmitting fiber so that these fibers are axially aligned with each other. | 02-06-2014 |
20150072506 | WAFER PROCESSING METHOD - A wafer is divided into a plurality of individual devices along a plurality of crossing division lines formed on the front side of the wafer. The wafer has a substrate, a functional layer formed on the front side of the substrate, and an SiO | 03-12-2015 |