Kazuo Kobayashi
Kazuo Kobayashi, Hyogo JP
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20110074045 | INTERPOSER, SEMICONDUCTOR CHIP MOUNTED SUB-BOARD, AND SEMICONDUCTOR PACKAGE - A semiconductor device can be manufactured with a high non-defect ratio, making it possible to easily guarantee the KGD (Known-Good-Die) of semiconductor chips, when configuring one packaged semiconductor device on which a plurality of semiconductor chips is mounted. Utilizing each semiconductor chip is made possible without limits on terminal position, pitch, signal arrangement, and so on. Protrusions provided to a semiconductor chip mounted sealing sub-board are attached to a package substrate. A plurality of semiconductor bare chips is disposed in a space formed between the semiconductor chip mounted sealing sub-board and the package substrate, making wiring possible. | 03-31-2011 |
Kazuo Kobayashi, Takasaki-Shi JP
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20110014651 | METHOD FOR HIGH-LEVEL SECRETORY PRODUCTION OF PROTEIN - This invention provides a means for high-level secretory production of a protein, and, in particular, a protein having a complicated structure such as an antibody, in a host cell such as a yeast cell. This invention provides a method for high-level secretory production of a foreign protein with the use of a transformed host cell having one or more types of chaperone protein genes and via suppression of O sugar chain inherent to a host cell such as a yeast cell. | 01-20-2011 |
Kazuo Kobayashi, Chiba JP
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20090076224 | Composite Material Comprising Flourine-Containing Rubber, Fuel-Impermeable Sealing Material Comprising Same, and Process for Preparing Composite Material - The present invention provides a novel fluorine-containing rubber composite material having both of excellent fuel impermeability and excellent cold resistance, a fuel impermeable sealing material comprising the composite material and a process for preparing the composite material. The fluorine-containing rubber composite material comprises crosslinked particles of fluorine-containing silicone rubber dispersed in a fluorine-containing rubber. It is preferable that the fluorine-containing rubber comprises a vinylidene fluoride/tetrafluoroethylene/perfluoro vinyl ether copolymer, and the composite material has cold resistance of not more than −35° C. and fuel permeability of not more than 500 g·mm/m | 03-19-2009 |
20100209707 | CROSS-LINKED SILICONE PARTICLES AND METHOD OF MANUFACTURING THEREOF - Cross-linked silicone particles, which have secondary amino groups represented by general formula: R | 08-19-2010 |
20100216952 | Silicone Rubber Powder And Method Of Manufacturing Thereof - A silicone rubber powder obtained by curing a condensation-curable silicone rubber composition in a dispersed state in water, having an epoxy equivalent measured by a titration method equal to or lower than 3,000 and an average particle size in the range of 0.1 to 100 μm; and a method of manufacturing a silicone rubber powder comprising the steps of dispersing in water a silicone rubber composition comprising at least components (A) through (C) listed below; adding component (D); and curing the mixture: (A) a diorganopolysiloxane capped at both molecular terminals with silanol groups and having in one molecule 30 or less silicon atoms; (B) an organopolysiloxane having in one molecule at least two silicon-bonded hydrogen atoms; (C) an epoxy-containing alkoxysilane; and (D) a condensation-reaction catalyst. The silicone rubber powder has low epoxy equivalent and possesses excellent dispersibility in organic resins, and the method is efficient in manufacturing of the aforementioned powder. | 08-26-2010 |
Kazuo Kobayashi, Tokyo JP
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20100172074 | Electronic apparatus having lock unit - A lock unit used for an electronic apparatus that includes a foldable and unfoldable housing that has a first surface that is foldable, and a second surface orthogonal to the first surface includes a lock member that locks the housing in a folded state, an operation member that moves the lock member and releases a lock of the housing by the lock member, and a transmission mechanism that transmits a driving force applied to the operation member to the lock member by changing an operating direction of the operation member to another direction, and moves the lock member in the other direction, wherein the operation member is provided on the second surface, and an operating direction of the operation member is a first direction perpendicular to the second surface, the lock member projecting in a second direction orthogonal to the first surface, and a moving direction of the lock member being a third direction orthogonal to the first and second directions. | 07-08-2010 |
20110207336 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE - A method of manufacturing a semiconductor device according to the present invention includes the steps of: (a) introducing hydrogen and oxygen on a SiC substrate; and (b) subjecting the hydrogen and the oxygen to a combustion reaction on the SiC substrate to form a gate oxide film being a silicon oxide film on a surface of the SiC substrate by the combustion reaction. | 08-25-2011 |
20110223694 | METHOD OF MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE - A wafer WF is mounted in a substrate holder, and the substrate holder is placed in a film forming furnace. The film forming furnace is evacuated by a vacuum pump through a gas discharge part to remove remaining oxygen as completely as possible. Then, a temperature in the film forming furnace is heated to a range of 800° C. to 950° C. under reduced pressure while an inert gas such as Ar or helium (He) is being introduced through a gas introduction part. When the temperature reaches this temperature range, an inflow of the inert gas is stopped. Vaporized ethanol is introduced as a source gas into the film forming furnace through the gas introduction part, thus forming a graphite film on an entire surface of the wafer WF. | 09-15-2011 |
20120252223 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE - A method of manufacturing a semiconductor device according to the present invention includes the steps of: (a) introducing hydrogen and oxygen on a SiC substrate; and (b) subjecting the hydrogen and the oxygen to a combustion reaction on the SiC substrate to form a gate oxide film being a silicon oxide film on a surface of the SiC substrate by the combustion reaction. | 10-04-2012 |
20140242815 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A method of manufacturing a semiconductor device according to the present invention includes the steps of (b) forming, on a back face of a dummy substrate and back faces of a plurality of semiconductor substrates, inorganic films having such thicknesses as to be resistant to a temperature of a thermal oxidizing treatment or a heat treatment and to sufficiently decrease an amount of oxidation or reducing gaseous species to reach the back faces of the dummy substrate and the plurality of semiconductor substrates, (c) disposing the dummy substrate and the plurality of semiconductor substrates in a lamination with surfaces turned in the same direction at an interval from each other, and (d) carrying out a thermal oxidizing treatment or post annealing over the surfaces of the semiconductor substrates in an oxidation gas atmosphere or a reducing gas atmosphere after the steps (b) and (c). | 08-28-2014 |
20150072448 | METHOD FOR MANUFACTURING SiC SEMICONDUCTOR DEVICE - A method for manufacturing an SiC semiconductor device according to the present invention includes the steps of (a) implanting an impurity into a surface layer of an SiC substrate at a concentration of 1×10 | 03-12-2015 |
Kazuo Kobayashi, Annaka-City JP
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20090203299 | SUBSTRATE FLAT GRINDING DEVICE - To provide a high-rigidity flat grinding device, a substrate flat grinding device has three fastening plate lifting-and-lowering mechanisms that have kinematic couplings and a cylinder rod that move the fastening plate upward or downward. Being a high-rigidity grinding device in which the load of the fastening plate | 08-13-2009 |
20110165823 | SEMICONDUCTOR SUBSTRATE PLANARIZATION APPARATUS AND PLANARIZATION METHOD - A planarization apparatus and method that thins and planarizes a substrate by grinding and polishing the rear surface of the substrate with high throughput, and that fabricates a semiconductor substrate with reduced adhered contaminants. A planarization apparatus that houses various mechanism elements in semiconductor substrate loading/unloading stage chamber, a rear-surface polishing stage chamber, and a rear-surface grinding stage chamber. The throughput time of the rear-surface polishing stage that simultaneously polishes two substrates is typically about double the throughput time of the rear-surface grinding stage that grinds one substrate. | 07-07-2011 |
Kazuo Kobayashi, Gunma JP
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20090068702 | METHOD FOR PRODUCING A MUCIN-TYPE GLYCOPROTEIN - The present invention relates to a means for generating a mucin-type glycopeptide or glycoprotein on a large scale in yeast. Specifically, the invention relates to a method which comprises introducing into a yeast at least one selected from the group consisting of a gene encoding UDP-GalNAc synthetase, a gene encoding UDP-GalNAc transporter, and a gene encoding polypeptide:O-GalNAc transferase, and, if desired, a gene encoding a mucin-type glycopeptide; and producing a mucin-type glycoprotein having O-GalNAc by use of the yeast. | 03-12-2009 |
20090191587 | METHOD FOR HIGH-LEVEL SECRETORY PRODUCTION OF PROTEIN - This invention provides a means for enabling high-level secretory production of proteins, in particular proteins having complicated structures such as antibodies, in host cells such as yeast cells. The invention also provides transformed yeast cells having the activated HAC1 gene and the RRBP1 gene and a method for enabling high-level secretory production of foreign proteins using such transformed host cells by inhibiting O-sugar chain formation indigenous to host cells such as yeast cells. | 07-30-2009 |
Kazuo Kobayashi, Oyama-Shi JP
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20090141399 | MAGNETIC RECORDING MEDIUM, METHOD FOR PRODUCING THEREOF, AND MAGNETIC RECORDING AND REPRODUCING APPARATUS - A magnetic-recording medium which is provided on a nonmagnetic substrate with at least an orientation-controlling layer for controlling the orientation of a layer formed directly thereon, a perpendicularly magnetic layer having an easily magnetizing axis oriented mainly perpendicularly relative to the nonmagnetic substrate, and a protective layer. The perpendicularly magnetic layer includes two or more magnetic layers, at least one of the magnetic layers is a layer having Co as a main component and containing Pt as well and containing an oxide, and at least another of the magnetic layers is a layer having Co as a main component and containing Cr as well and containing no oxide. | 06-04-2009 |
Kazuo Kobayashi, Kawasaki JP
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20090128962 | READ-HEAD, MAGNETIC HEAD AND MAGNETIC STORAGE APPARATUS - The read-head is capable of corresponding to high recording density without deteriorating characteristics even if a small size read-element is used. The read-head of the present invention comprises: a read-element including a free layer; and a magnetic domain control layer for domain-controlling the free layer. The magnetic domain control layer is composed of a soft magnetic material including at least one substance selected from the group consisting of Fe, Co and Ni. A ratio (a/b) of a length (a) of the magnetic domain control layer in the core width direction to a length (b) thereof in the height direction is 5 or more, and the length (b) is 100 nm or less. | 05-21-2009 |
Kazuo Kobayashi, Kakamigahara-Shi JP
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20090038152 | Method for producing ink-jet head and ink-jet head - A method for producing an ink-jet head includes forming a buffer layer on an upper surface of a vibration plate, and forming a piezoelectric precursor layer on an entire upper surface of a surface layer, the piezoelectric precursor layer being converted into a piezoelectric sheet. The buffer layer is formed of a material with which mutual diffusion between the piezoelectric precursor layer and the buffer layer is hardly caused as compared with mutual diffusion between the piezoelectric precursor layer and the vibration plate with which no buffer layer is provided. A stack, in which the buffer layer and the piezoelectric precursor layer are formed, is heated at a predetermined temperature, and the piezoelectric precursor layer is calcinated to form the piezoelectric sheet. It is possible to suppress the deterioration of the performance of the piezoelectric member. | 02-12-2009 |
20090113686 | Piezoelectric Actuator, Ink-Jet Head Provided with the Same, Ink-Jet Printer, and Method for Manufacturing Piezoelectric Actuator - A piezoelectric actuator includes a metallic vibration plate, an insulating layer, a plurality of individual electrodes, a piezoelectric layer and a common electrode. The insulating layer is formed on the top surface of the vibration plate. The individual electrodes are formed on the top surface of the insulating layer. The piezoelectric layer is formed on the top surfaces of the individual electrodes. The common electrode is formed on the top surface of the piezoelectric layer over the individual electrodes. A plurality of terminals and a plurality of wirings are formed on the top surface of the insulating layer. Each of the terminals is associated with one of the individual electrodes. Each of the wirings connects one of the individual electrodes and the associated terminal. | 05-07-2009 |
20090115822 | Piezoelectric Actuator, Ink-Jet Head Provided with the Same, Ink-Jet Printer, and Method for Manufacturing Piezoelectric Actuator - A piezoelectric actuator includes a metallic vibration plate, an insulating layer, a plurality of individual electrodes, a piezoelectric layer and a common electrode. The insulating layer is formed on the top surface of the vibration plate. The individual electrodes are formed on the top surface of the insulating layer. The piezoelectric layer is formed on the top surfaces of the individual electrodes. The common electrode is formed on the top surface of the piezoelectric layer over the individual electrodes. A plurality of terminals and a plurality of wirings are formed on the top surface of the insulating layer. Each of the terminals is associated with one of the individual electrodes. Each of the wirings connects one of the individual electrodes and the associated terminal. | 05-07-2009 |
20120081475 | LIQUID DISCHARGING HEAD AND METHOD FOR PRODUCING THE SAME - There is provided a liquid discharging head discharging a liquid, including: a channel unit having a liquid channel including a pressure chamber which has an opening at one surface of the channel unit; a piezoelectric element formed of a piezoelectric material; an intermediate member preventing the liquid in the pressure chamber and the piezoelectric element from making contact with each other; a first adhesive layer composed of a first adhesive and adhering the channel unit and the intermediate member, the first adhesive being a thermo-setting adhesive starting to be cured at a first temperature; and a second adhesive layer composed of a second adhesive and adhering the intermediate member and the piezoelectric element, the second adhesive starting to be cured at a second temperature lower than the first temperature. | 04-05-2012 |
20140333701 | Method for Manufacturing Piezoelectric Actuator - A method for manufacturing a piezoelectric actuator is disclosed that includes forming a vibration plate, forming a plurality of electrodes on the vibration plate, forming a piezoelectric layer on the electrodes, and forming a common electrode on the piezoelectric layer. | 11-13-2014 |
Kazuo Kobayashi, Amagasaki-Shi JP
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20080265433 | INTERPOSER, SEMICONDUCTOR CHIP MOUNTED SUB-BOARD, AND SEMICONDUCTOR PACKAGE - A semiconductor device can be manufactured with a high non-defect ratio, making it possible to easily guarantee the KGD (Known-Good-Die) of semiconductor chips, when configuring one packaged semiconductor device on which a plurality of semiconductor chips is mounted. Utilizing each semiconductor chip is made possible without limits on terminal position, pitch, signal arrangement, and so on. | 10-30-2008 |
20090065922 | SEMICONDUCTOR DEVICE PACKAGE STRUCTURE - A semiconductor chip mounted interposer ( | 03-12-2009 |
Kazuo Kobayashi, Ichihara-Shi JP
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20080300365 | FLUORINE-CONTAINING RESIN COMPOSITION INHIBITING CORROSIVENESS - The present invention relates to a fluorine-containing resin composition for molding comprising a fluorine-containing resin (A) and a hydrofluoric acid scavenger (B), in which the hydrofluoric acid scavenger (B) is organopolysiloxane. According to the present invention, a fluorine-containing resin composition which can reduce an amount of hydrofluoric acid released from a fluorine-containing resin and inhibits corrosiveness can be provided. | 12-04-2008 |
20120121909 | Composite Cured Silicone Powder And Method For Production Thereof - A composite cured silicone powder comprising: (A) a cured silicone powder having an average particle size of 0.1 to 500 μm, (B) an inorganic fine powder coated on the surface of said cured silicone powder and (C) a monohydric or polyhydric alcohol with a boiling point of at least 150° C. coating on the surface of component (A) and/or component (B). The composite cured silicone powder that has an excellent flowability, hydrophilicity, and dispersibility. And, this invention also relates to a production method of the composite, which is characterized by mixing components (A) to (C) under the condition of mechanical shearing. | 05-17-2012 |
20120205580 | Emulsion, Its Manufacturing Method And Silicone Oil Composition - This invention relates to a silicone oil emulsion that contains cross-linked silicone particles in drops of silicone oil which have an average particle diameter of 0.1 to 500 μm and are dispersed in water, wherein the silicone oil contains epoxy groups, acryl groups, methacryl groups, silicon-bonded alkoxy groups, or silicon-bonded hydroxyl groups but is free of silicon-bonded hydrogen atoms and alkenyl groups, said cross-linked silicone particles is formed by a hydrosilation reaction. Furthermore, this invention also relates to a silicone oil composition obtained by removing water from said emulsion. | 08-16-2012 |
20120321679 | Method Of Producing A Silicone Oil Composition - To provide a method that efficiently produces a silicone oil composition in which cross-linked silicone particles uniformly dispersed in amino-modified silicone oil. This invention is a method of producing a silicone oil composition, characterized by removing water after mixing an aqueous suspension of cross-linked silicone particles having an average particle diameter in the range of 0.1 to 500 μm with an aqueous emulsion of an amino-modified silicone oil having an average emulsion particle diameter in the range of 0.05 to 100 μm. | 12-20-2012 |
Kazuo Kobayashi, Annaka JP
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20110306277 | COMPLEX APPARATUS AND METHOD FOR POLISHING AN INGOT BLOCK - A compound chamfering device that manufactures prism-shaped ingot blocks of excellent surface smoothness is disclosed. The four-corner round surfaces and the four sides of a prism-shaped ingot obtained by using a pair of rotary blades of a slicer to perform four-side peeloff of a cylindrical ingot block are chamfered by rough grinding with a pair of cup wheel type rough grinding grindstones. A pair of cup wheel type finishing grinding grindstones are used to chamfering by finishing grinding the four-corner round surfaces and the four sides of the block. | 12-15-2011 |
Kazuo Kobayashi, Aichi-Ken JP
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20120213648 | COMPRESSOR - A compressor compressing a fluid including lubricating oil includes, on the discharge side thereof, a first separation chamber for separating the lubricating oil by generating a swirling flow in the fluid. The first separation chamber includes: a circumferential wall; an inflow port that is formed in the circumferential wall and causes the fluid to flow into the first separation chamber; and a guiding plate extending from the circumferential wall. The guiding plate extends so as to face the inflow port in a direction where the fluid flows from the inflow port into the first separation chamber, and so as to deflect the fluid flow from the inflow port to guide it along an inner circumferential surface of the circumferential wall. | 08-23-2012 |
Kazuo Kobayashi, Kariya-Shi JP
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20130034461 | COMPRESSOR - A compressor has auxiliary and main oil reservoir chambers that retain lubricant oil that is separated from refrigerant in an oil separation chamber. A part of the auxiliary oil reservoir chamber is defined by a peripheral wall of the oil separation chamber. An introducing passage for introducing lubricant oil in the oil separation chamber to the auxiliary oil reservoir chamber is formed in the peripheral wall. The inlet of the introducing passage opens to the oil separation chamber on the inner surface of the peripheral wall. The outlet of the introducing passage opens to the auxiliary oil reservoir chamber. The main oil reservoir chamber is located below the auxiliary oil reservoir chamber in the direction of gravity. A drain port for draining lubricant oil in the auxiliary oil reservoir chamber to the main oil reservoir chamber is formed in a bottom wall of the auxiliary oil reservoir chamber. | 02-07-2013 |
Kazuo Kobayashi, Tochigi JP
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20140170703 | RECOMBINANT MICROORGANISM - A recombinant microorganism obtained by transferring, into a host microorganism capable of producing protein or polypeptide with increased productivity, a gene encoding a protein or polypeptide, and a method for producing a protein or polypeptide by use of the recombinant microorganism. The recombinant microorganism is prepared by transferring, to a mutant strain of microorganism from which any of | 06-19-2014 |