Patent application number | Description | Published |
20110014569 | RADIATION-SENSITIVE RESIN COMPOSITION AND POLYMER - A radiation-sensitive resin composition includes a solvent and a polymer. The polymer includes a first repeating unit shown by a general formula (1) in which R | 01-20-2011 |
20110212401 | RADIATION-SENSITIVE RESIN COMPOSITION, AND RESIST PATTERN FORMATION METHOD - A radiation-sensitive resin composition includes a resin, a photoacid generator, a fluorine-containing resin, and a lactone compound. The resin does not include a first fluorine-containing repeating unit. The resin includes a first repeating unit that becomes alkali-soluble due to an acid. The fluorine-containing resin includes a second fluorine-containing repeating unit and a second repeating unit that becomes alkali-soluble due to an acid. A content of the lactone compound in the radiation-sensitive resin composition is about 31 to about 200 parts by mass based on 100 parts by mass of the resin. | 09-01-2011 |
20110223537 | RADIATION-SENSITIVE RESIN COMPOSITION AND POLYMER - A radiation-sensitive resin composition includes a polymer, a photoacid generator, and an acid diffusion controller. The polymer includes a first repeating unit shown by a following formula (a-1). The acid diffusion controller includes at least one of a base shown by a following formula (C-1) and a photodegradable base, | 09-15-2011 |
20120045719 | RADIATION-SENSITIVE RESIN COMPOSITION AND COMPOUND - A radiation-sensitive resin composition includes an acid-dissociable group-containing resin, and a compound shown by the following general formula (1). | 02-23-2012 |
20120082935 | RADIATION-SENSITIVE RESIN COMPOSITION AND RESIST FILM FORMED USING THE SAME - [Problem] To provide a resist film that exhibits high surface hydrophobicity during liquid immersion lithography, suppresses occurrence of defects due to development failure, and exhibits excellent lithographic performance | 04-05-2012 |
20120183902 | RADIATION-SENSITIVE RESIN COMPOSITION - A radiation-sensitive resin composition includes an acid-labile group-containing resin, a radiation-sensitive acid generating agent, and an acid diffusion controller including a first compound shown by a following general formula (1-1) and a second compound shown by a following general formula (1-2) or (1-3). In the formula (1-1), each of R | 07-19-2012 |
20120237875 | RADIATION-SENSITIVE RESIN COMPOSITION, METHOD FOR FORMING RESIST PATTERN, POLYMER AND POLYMERIZABLE COMPOUND - A radiation-sensitive resin composition includes a first polymer including an acid-labile group, an acid generator to generate an acid upon exposure to radiation, and a second polymer including a fluorine atom and a functional group shown by a general formula (x). The second polymer has a fluorine atom content higher than a fluorine atom content of the first polymer. R | 09-20-2012 |
20120295198 | RADIATION-SENSITIVE RESIN COMPOSITION - A radiation-sensitive resin composition includes a compound represented by a following formula (1), and a first polymer that serves as a base resin. R | 11-22-2012 |
20130095428 | RADIATION-SENSITIVE RESIN COMPOSITION - A radiation-sensitive resin composition includes a compound represented by a following formula (1) and a base polymer. In the formula (1), R | 04-18-2013 |
20130216948 | RADIATION-SENSITIVE RESIN COMPOSITION AND PATTERN-FORMING METHOD - A radiation-sensitive resin composition for forming a resist film includes a polymer including a first structural unit represented by a formula (1) and a second structural unit represented by a formula (2). The first structural unit and the second structural unit are included in an identical polymer molecule or different polymer molecules. R | 08-22-2013 |
20130280657 | PHOTORESIST COMPOSITION AND RESIST PATTERN-FORMING METHOD - A photoresist composition includes a polymer component that includes a first structural unit represented by the formula (1) and a second structural unit represented by the formula (2), an acid generator, and a compound represented by the formula (3). The first structural unit and the second structural unit are included in an identical polymer, or different polymers. R | 10-24-2013 |
20140023968 | RESIST PATTERN-FORMING METHOD, RESIST PATTERN-FORMING RADIATION-SENSITIVE RESIN COMPOSITION, AND RESIST FILM - A resist pattern-forming method includes providing a resist film having a surface free energy of 30 to 40 mN/m on a substrate using a radiation-sensitive resin composition. The resist film is exposed by applying radiation via a mask. The exposed resist film is developed. It is preferable that the exposing of the resist film includes exposing the resist film via an immersion liquid that is provided over the resist film | 01-23-2014 |
20140212813 | RADIATION-SENSITIVE RESIN COMPOSITION, METHOD FOR FORMING RESIST PATTERN, POLYMER AND POLYMERIZABLE COMPOUND - A radiation-sensitive resin composition includes a first polymer including an acid-labile group, an acid generator to generate an acid upon exposure to radiation, and a second polymer including a fluorine atom and a functional group shown by a general formula (x). The second polymer has a fluorine atom content higher than a fluorine atom content of the first polymer. R | 07-31-2014 |