Patent application number | Description | Published |
20090050988 | MEMS APPARATUS AND METHOD OF MANUFACTURING THE SAME - A MEMS apparatus includes a MEMS unit formed on a semiconductor substrate and a cover provided with a pore and serving to seal the MEMS unit. The pore is sealed with a sealing material shaped in a sphere or a hemisphere. | 02-26-2009 |
20090056439 | SENSOR FOR HUMIDITY - The present invention provides a sensor for humidity which is optimized as moisture sensitive material in basic properties such as long term stability and the like at the range of high temperature. The sensor for moisture according to the present invention is provided with a moisture sensitive film formed with polymer in which a hydrophilic group binds through at least one hydrophobic group to other hydrophilic groups. Basic properties of the sensor such as long term stability and the like is optimized by forming a moisture sensitive element provided with a moisture sensitive film formed with polymer in which the glass transition temperature is in the range of 240° C. to 500° C. | 03-05-2009 |
20090079443 | SENSOR DEVICE AND DISPLAY APPARATUS - A sensor device according to an embodiment of the present invention includes an electrode array having plural electrodes arranged in an array manner, a signal generator configured to generate a first signal having a first frequency, and apply the first signal to the plural electrodes, and a detection unit configured to, when the first signal is applied to the plural electrodes, and a second signal having a second frequency is applied to an object to be detected, detect a distance between each electrode included in the electrode array and the surface of the object, using an interference wave between the first signal applied to each electrode and the second signal applied to the object, or detect irregularities on the surface of the object, using a signal generated by using the interference wave outputted from one electrode and the interference wave outputted from another electrode. | 03-26-2009 |
20090086879 | SENSOR DEVICE, AND SENSOR SYSTEM AND ELECTRONIC DEVICE USING THE SENSOR DEVICE - A sensor device which detects a positional relationship between an first member and second member, includes a signal source generating an electrical signal, a first electrode receiving the electrical signal and storing an electrical charge at a first part on the first member, a second electrode inducing an electrical charge at the second part on the second member, a third electrode inducing an electrical charge at the third part on the second member, a fourth electrode inducing an electrical charge at the fourth part on the first member, a reference electrode disposed at a fifth part on the second member to be connected to a reference voltage point, a fifth electrode inducing an electrical charge at the sixth part on the first member, and a differential amplifier amplifying a voltage difference between the fourth electrode and the fifth electrode and outputting a difference signal. | 04-02-2009 |
20090127639 | SEMICONDUCTOR APPARATUS - A semiconductor apparatus includes: a first chip including a MEMS device which has a structure supported in midair therein, and having first pads and a first joining region electrically connected to the MEMS device on a top face thereof; a second chip including a circuit having a semiconductor device electrically connected to the MEMS device therein, and having second pads and a second joining region electrically connected to the semiconductor device on a top face thereof, the second chip being disposed in opposition to the first chip so as to oppose the second pads and the second joining region respectively to the first pads and the first joining region; electrical connection parts which electrically connect the first pads to the second pads, respectively; and joining parts provided between the first joining region and the second joining region opposed to the first joining region to join the first chip and the second chip to each other. | 05-21-2009 |
20090236526 | INFRARED RAY SENSOR ELEMENT - An infrared ray sensor element includes: a first signal wiring part including a first signal wire and provided on a first region of a semiconductor substrate different from a region on which a concave part is provided; a second signal wiring part including a second signal wire and provided on the first region so as to intersect the first signal wiring part; a supporter including a support wiring part disposed over the concave part, and including a first wire electrically connected at a first end thereof to the first signal wire, and a second wire insulated from the first wire, disposed in parallel with the first wire, and electrically connected at a first end thereof to the second signal wire; a thermoelectric transducer electrically connected to second ends of the first and second wires; an infrared ray absorption layer provided over the thermoelectric transducer; and a detection cell provided over the concave part. | 09-24-2009 |
20090237772 | OPTICAL ELEMENT, OPTICAL DEVICE, AND DISPLAY DEVICE - An optical element includes a plurality of first beam bodies arranged in a first direction on a first plane and being parallel to each other, and second beam bodies placed between adjacent ones of the first beam bodies and provided parallel to the first beam bodies. The first beam body has side surfaces which face the second beam bodies adjacent thereto and are sloped so that the width in the first direction gradually decreases to the upward direction perpendicular to the first plane, the second beam body has side surfaces which face the first beam bodies adjacent thereto and are sloped so that the width in the first direction gradually increases to the upward direction perpendicular to the first plane, and as viewed in the first direction, the spacing between the first beam body and the second beam body is variable. | 09-24-2009 |
20100026319 | SENSOR DEVICE, AND PORTABLE COMMUNICATION TERMINAL AND ELECTRONIC DEVICE USING THE SENSOR DEVICE - A sensor device for detecting a positional relationship between a first member and a second member, includes a first electrode provided on a surface of the first member and supplied with an alternating signal of a first frequency, a second electrode provided on a surface of the second member and supplied with an alternating signal of a second frequency, and a beat detector which detects a beat frequency component corresponding to a difference between the first and second frequencies indicative of the positional relationship between the first member and the second member, when the positional relationship between the first and second members changes to cause the first electrode to approach the second electrode. | 02-04-2010 |
20100231246 | SENSOR APPARATUS FOR DETECTING A POSITIONAL RELATIONSHIP BETWEEN TWO MEMBERS AND METHOD USED FOR THE SENSOR APPARATUS - A sensor apparatus for detecting a positional relationship includes a first electrode, an applying unit applying a charging signal with a first cycle period to the first electrode, a second electrode, a selecting unit selecting the first or second cycle period which have overlapped segment periods, an output unit outputting electrical signals supplied from the second electrode with the first cycle period, if the first cycle period is selected, and parts of the electrical signals during the segment periods, if the second cycle period is selected, a comparator comparing an amplitude of the electrical signals with a threshold value and generating a first or second comparison signal and a controller generating a proximity and non-proximity signal in response to the first and second comparison signal, respectively, so that the selecting unit selects the first and second cycle period in response to the proximity and non-proximity signal, respectively. | 09-16-2010 |
20110041557 | MANUFACTURING OF GLASS - Glass is mass-produced with a glass melting furnace comprising a melting tank, at least a wall surface in contact with molten glass thereof being made of refractory material, at least one pair of electrodes placed so as to be in contact with the molten glass held in the melting tank for ohmically heating the molten glass held in the melting tank; and at least one metallic member, at least a surface of which is made of metal and placed so as to be substantially always in contact with the molten glass held in the melting tank. Every metallic member is, when the melting tank is filled with the molten glass, placed so as to be substantially always outside an electric current flowing region which is formed by the electrodes into the molten glass held in the melting tank. | 02-24-2011 |
20110097473 | Method for Refining Natural Oil - Provided is a method for purifying natural oil comprising: supplying a to-be-treated raw natural oil into a reaction tank which is provided with a layer of a particulate photocatalyst, and which is configured to allow the to-be-treated raw natural oil and oxygen and/or hydrogen to pass through the particulate photocatalyst in the layer; and then, while introducing oxygen and/or hydrogen to the inside of the layer of the particulate photocatalyst, causing the raw natural oil to circulate and to come into contact with the particulate photocatalyst, with a temperature inside the reaction tank kept at 40 to 110° C., to thereby purifying the raw natural oil. | 04-28-2011 |
20110156186 | SOLID-STATE IMAGING DEVICE - Certain embodiments provide a solid-state imaging device including: a plurality of pixels provided on a semiconductor substrate, each of the pixels having a semiconductor region that converts incident light from a side of a first face of the semiconductor substrate into signal charges and stores the signal charges; a readout circuit provided on a side of a second face that is the opposite side from the first face, and reading out the signal charges stored in the pixels; and a pixel separation structure provided between adjacent ones of the pixels in the semiconductor substrate, the pixel separation structure including a stack film buried in a trench extending from the first face, the stack film including a first insulating film provided along side faces and a bottom face of the trench, and a fixed charge film provided in the trench to cover the first insulating film and retaining fixed charges that are non-signal charges. | 06-30-2011 |
20110169861 | INFORMATION PROCESSING APPARATUS, INFORMATION PROCESSING SYSTEM, AND INFORMATION PROCESSING METHOD - A first image pickup means picks up an image of a real space, to thereby obtain a first background image. A first positional relationship estimating unit estimates, in a case where the first background image includes a first marker image being an image of a marker previously registered and located in the real space, a first positional relationship being a spatial positional relationship of the first image pickup means to the marker based on the first marker image, and estimates, in a case where the first background image fails to include the first marker image, the first positional relationship based on a displacement of a feature point extracted from the first background image. An image generating unit generates a first additional image based on the first positional relationship, and synthesizes the first additional image and the first background image, to thereby generate a synthetic image. | 07-14-2011 |
20110175187 | SOLID-STATE IMAGING DEVICE - Certain embodiments provide a solid-state imaging device including: a photoelectric converting unit that includes a semiconductor layer of a second conductivity type provided on a semiconductor substrate of a first conductivity type, converts incident light entering a first surface of the semiconductor substrate into signal charges, and stores the signal charges; a readout circuit that reads the signal charges stored by the photoelectric converting unit; an antireflection structure that is provided on the first surface of the semiconductor substrate to cover the semiconductor layer of the photoelectric converting unit, includes a fixed charge film that retains fixed charges being non-signal charges, and prevents reflection of the incident light; and a hole storage region that is provided between the photoelectric converting unit and the antireflection structure, and stores holes being non-signal charges. | 07-21-2011 |
20110216961 | INFORMATION PROCESSING DEVICE, INFORMATION PROCESSING METHOD, AND PROGRAM - There is provided an information processing device includes a virtual space recognition unit for analyzing 3D space structure of a real space to recognize a virtual space, a storage unit for storing an object to be arranged in the virtual space, a display unit for displaying the object arranged in the virtual space, on a display device, a detection unit for detecting device information of the display device, and an execution unit for executing predetermined processing toward the object based on the device information. | 09-08-2011 |
20110227945 | INFORMATION PROCESSING DEVICE, INFORMATION PROCESSING METHOD, AND PROGRAM - There is provided an information processing device includes a virtual space recognition unit for analyzing 3D space structure of a real space to recognize a virtual space, a storage unit for storing an object to be arranged in the virtual space, a display unit for making a display unit display the object arranged in the virtual space, a direction of gravitational force detection unit for detecting a direction of gravitational force of a real space, and a direction of gravitational force reflection unit for reflecting the direction of gravitational force detected by the detection unit in the virtual space. | 09-22-2011 |
20110234791 | INFORMATION PROCESSING APPARATUS, INFORMATION PROCESSING METHOD, PROGRAM, AND INFORMATION PROCESSING SYSTEM - Provided is an information processing apparatus including an image acquisition unit for acquiring a real space image including an image of another apparatus, a coordinate system generation unit for generating a spatial coordinate system of the real space image acquired by the image acquisition unit, and a transmission unit for transmitting spatial information constituting the spatial coordinate system generated by the coordinate system generation unit to the other apparatus sharing the spatial coordinate system. | 09-29-2011 |
20120007205 | INFRARED IMAGING DEVICE AND METHOD OF MANUFACTURING THE SAME - Certain embodiments provide an infrared imaging device including: an SOI structure that is placed at a distance from a substrate, and includes: heat-sensitive diodes that detect infrared rays and convert the infrared rays into heat; and STI regions that separate the heat-sensitive diodes from one another; an interlayer insulating film that is stacked on the SOI structure; and supporting legs that are connected to the heat-sensitive diodes and vertical signal lines provided in outer peripheral regions of the heat-sensitive diodes. Each of the supporting legs includes: an interconnect unit that transmit signals to the vertical signal lines; and interlayer insulating layers that sandwich the interconnect unit, each bottom side of the interlayer insulating layers being located in a higher position than the SOI structure. | 01-12-2012 |
20120056291 | IMAGING DEVICE, IMAGING MODULE AND METHOD FOR MANUFACTURING IMAGING DEVICE - According to one embodiment, an imaging device includes a substrate, a photodetecting portion, a circuit portion and a through interconnect. The substrate has a first major surface, a second major surface on a side opposite to the first major surface, a recess portion provided on the first major surface and retreated in a first direction going from the first major surface to the second major surface, and a through hole communicating with the first major surface and the second major surface and extending in the first direction. The photodetecting portion is provided above the recess portion and away from the substrate. The circuit portion is electrically connected to the photodetecting portion and provided on the first major surface. The through interconnect is electrically connected to the circuit portion and provided inside the through hole. The recess portion has a first inclined surface. The through hole has a second inclined surface. | 03-08-2012 |
20120092371 | INFORMATION PROCESSING APPARATUS, INFORMATION PROCESSING METHOD, PROGRAM, AND INFORMATION PROCESSING SYSTEM - Provided is an information processing apparatus including an image acquisition unit for acquiring a real space image including an image of another apparatus, a coordinate system generation unit for generating a spatial coordinate system of the real space image acquired by the image acquisition unit, and a transmission unit for transmitting spatial information constituting the spatial coordinate system generated by the coordinate system generation unit to the other apparatus sharing the spatial coordinate system. | 04-19-2012 |
20120133011 | SOLID-STATE IMAGING DEVICE AND METHOD OF MANUFACTURING THE SAME - A solid-state imaging device according to an embodiment includes: a plurality of pixels arranged on a first face of a first semiconductor layer, each of the pixels including a photoelectric conversion element converting light entering through a second face of the first semiconductor layer on the opposite side from the first face into a signal charge, the photoelectric conversion element having a pn junction formed with a first semiconductor region formed on the first face and a second semiconductor region formed on a surface of the first semiconductor region; pixel separating regions separating the pixels from one another and formed between the pixels, each of the pixel separating regions including a second semiconductor layer covering faces in contact with the photoelectric conversion elements, and an insulating film with a lower refractive index than a refractive index of the second semiconductor layer to cover the second semiconductor layer. | 05-31-2012 |
20120218454 | OPTICAL DEVICE, SOLID-STATE IMAGE APPARATUS, PORTABLE INFORMATION TERMINAL, AND DISPLAY APPARATUS - An optical element according to an embodiment includes: a lens array including a plurality of convex shaped lenses provided on a first surface thereof and taking a flat shape at a second surface which is opposite from the first surface; a lens holder comprising concave portions formed to correspond to respective lenses in the lens array, at a surface opposed to the lens array, each of the concave portions having a size which makes it possible for one of the convex shaped lenses corresponding to the concave portion to fit therein; and a drive unit configured to drive at least one of the lens array and the lens holder to bring the convex shaped lenses in the lens array and the concave portions in the lens holder into an isolation state or a contact state. | 08-30-2012 |
20120228496 | UNCOOLED INFRARED IMAGING ELEMENT AND MANUFACTURING METHOD THEREOF - An uncooled infrared imaging element includes a pixel region, a device region, and a support substrate. The pixel region includes heat-sensitive pixels. The heat-sensitive pixels are arranged in a matrix and change current-voltage characteristics thereof in accordance with receiving amounts of infrared. The device region includes at least one of a drive circuit and a readout circuit which includes a MOS transistor. The drive circuit drives the heat-sensitive pixels. The readout circuit detects signals of the heat-sensitive pixels. The support substrate is provided with a cavity region to be under pixel region and the MOS transistor. | 09-13-2012 |
20120228497 | INFRARED IMAGING ELEMENT - An infrared imaging element according to an embodiment includes: a semiconductor substrate including a stacked structure of a silicon first substrate, and a first insulation film, first cavities being provided on a surface of the first substrate; an infrared detection unit provided in the semiconductor substrate and including, detection cells provided respectively over the first cavities, each of the detection cells having diodes and a second insulation film, the first insulation film converting incident infrared rays to heat, the diodes converting the heat obtained by the first insulation film to an electric signal, a third insulation film having a top face located at a greater distance from the semiconductor substrate as compared with a top face of the second insulation film; and a second substrate provided over the third insulation film. A second cavity is formed between the second substrate and the infrared detection unit. | 09-13-2012 |
20120230581 | INFORMATION PROCESSING APPARATUS, INFORMATION PROCESSING METHOD, AND PROGRAM - An information processing apparatus includes an image acquisition unit for acquiring a real-world image, a space analysis unit for analyzing a three-dimensional space structure of the real-world image, a scale reference detection unit for detecting a length, in a three-dimensional space, of an object to be a scale reference that is included in the real-world image, and a scale determination unit for determining, from the length of the object detected by the scale reference detection unit, a scale of the three-dimensional space. | 09-13-2012 |
20120241613 | INFRARED IMAGING DEVICE AND INFRARED IMAGING APPARATUS USING IT - One embodiment provides an infrared imaging device, including: a substrate; connection wiring portions arranged in matrix form on the substrate; a first infrared detecting portion configured to convert intensity of absorbed infrared radiation into a first signal; and a second infrared detecting portion configured to convert intensity of absorbed infrared radiation into a second signal, the second infrared detecting portion being larger in thermal conductance than the first infrared detecting portion. | 09-27-2012 |
20120314936 | INFORMATION PROCESSING DEVICE, INFORMATION PROCESSING METHOD, AND PROGRAM - An information processing apparatus that acquires first posture information corresponding to the information processing apparatus and a first distance coordinate corresponding to the information processing apparatus, and second posture information corresponding to another information processing apparatus and a second distance coordinate corresponding to the another information processing apparatus. The information processing apparatus then calculates an object's position in a virtual space based on the first and second posture information and the first and second distance coordinates. | 12-13-2012 |
20130075585 | SOLID IMAGING DEVICE - According to one embodiment, a solid imaging device includes an imaging substrate, an imaging lens, a microlens array substrate and a polarizing plate array substrate. The imaging substrate has a plurality of pixels formed on an upper side thereof. The imaging lens is provided above the imaging substrate. The optical axis in the imaging lens intersects with the upper side of the imaging substrate. The microlens array substrate is provided between the imaging substrate and the imaging lens. A surface in the microlens array substrate has a plurality of microlenses arranged two-dimensionally. The surface of the microlens array intersects with the optical axis. The polarizing plate array substrate is provided between the imaging substrate and the imaging lens. The plurality of kinds of polarizing plates in the polarizing plate array substrate having polarization axes in mutually different directions are arranged two dimensionally. | 03-28-2013 |
20130075586 | SOLID IMAGING DEVICE AND PORTABLE INFORMATION TERMINAL DEVICE - According to one embodiment, a solid imaging device includes an imaging substrate, a light-shielding member and a AD conversion circuits. The imaging substrate is two-dimensionally arranged with a plurality of pixels. The plurality of pixels have a top face formed with an optoelectronic conversion element for converting incident light into an electric charge and storing it and a back face opposite to the top faces. The imaging substrate is formed with a top face by the top face of the plurality of pixels and formed with a back face by the back face of the plurality of pixels. The light-shielding member is provided on the top face side of the imaging substrate. The AD conversion circuits is formed on the back face of the pixels shielded from the light. | 03-28-2013 |
20130075587 | SOLID STATE IMAGING DEVICE, PORTABLE INFORMATION TERMINAL DEVICE AND METHOD FOR MANUFACTURING SOLID STATE IMAGING DEVICE - According to one embodiment, a solid state imaging device includes a sensor substrate having a plurality of pixels formed on an upper face, a microlens array substrate having a plurality of microlenses formed and a connection post with one end bonded to a region between the microlenses on the microlens array substrate and with the other end bonded to the upper face. | 03-28-2013 |
20130075849 | SOLID STATE IMAGING DEVICE, SOLID STATE IMAGING ELEMENT, PORTABLE INFORMATION TERMINAL DEVICE AND METHOD FOR MANUFACTURING THE SOLID STATE IMAGING ELEMENT - According to one embodiment, a solid state imaging device includes a sensor substrate curved such that an upper face having a plurality of pixels formed is recessed and an imaging lens provided on the upper face side. | 03-28-2013 |
20130076923 | CAMERA SHAKE CORRECTION DEVICE AND IMAGING DEVICE - According to one embodiment, a camera shake correction device includes a substrate, a fixed part, a linking part, a movable part, a first spring part, a second spring part, a first damper, and a second damper. The fixed part is provided on the substrate and fixed to the substrate. The linking part is provided around the fixed part on the substrate that can move in a first direction within a plane of the substrate with respect to the fixed part. The movable part is provided on the substrate and arranged around the fixed part and the linking part that can move in a second direction that intersects with the first direction within the plane of the substrate. | 03-28-2013 |
20130093902 | INFRARED SOLID STATE IMAGING DEVICE - An infrared solid state imaging device includes an infrared detection element unit having heat sensitive pixels, an AD conversion unit which conducts analog-to-digital conversion on an infrared image signal obtained by the infrared detection element unit, and a digital signal processing unit which converts the image signal converted to a digital signal. The digital signal processing unit stores an image value produced from the digital signal, and acquired in a frame immediately preceding a current frame, subtracts an image value obtained by multiplying the image value acquired in the frame immediately preceding the current frame by a predetermined constant α in a range of 0 to 1, from an image value acquired in the current frame, and conducts processing of multiplying a resultant image value obtained by the subtraction by 1/(1−α) so that an infrared image with less afterimage is provided. | 04-18-2013 |
20130240709 | SOLID-STATE IMAGING DEVICE AND PORTABLE INFORMATION TERMINAL - A solid-state imaging device according to an embodiment includes: an imaging element including a semiconductor substrate and a plurality of pixel blocks, each of the pixel blocks including at least two of R pixels, G pixels, B pixels, and W pixels; a first optical system configured to form an image of an object on an imaging plane; and a second optical system including a microlens array having a plurality of microlenses provided for the respective pixels blocks, the second optical system being located between the imaging element and the first optical system, the second optical system being configured to reduce and re-image the image formed on the imaging plane onto each of the pixel blocks. A proportion of the W pixels to be provided increases in a direction from a center of each pixel block toward an outer periphery thereof. | 09-19-2013 |
20130242161 | SOLID-STATE IMAGING DEVICE AND PORTABLE INFORMATION TERMINAL - A solid-state imaging device according to an embodiment includes: an imaging element including a plurality of pixel blocks each containing a plurality of pixels; a first optical system forming an image of an object on an imaging plane; and a second optical system including a microlens array, the microlens array including a light transmissive substrate, a plurality of first microlenses formed on the light transmissive substrate, and a plurality of second microlenses formed around the first microlenses, a focal length of the first microlenses being substantially equal to a focal length of the second microlenses, an area of the first microlenses in contact with the light transmissive substrate being larger than an area of the second microlenses in contact with the light transmissive substrate, the second optical system being configured to reduce and reconstruct the image formed on the imaging plane on the pixel blocks via the microlens array. | 09-19-2013 |
20130248714 | UNCOOLED INFRARED IMAGING DEVICE - An uncooled infrared imaging device according to an embodiment includes: reference pixels formed on a semiconductor substrate and arranged in at least one row; and infrared detection pixels arranged in the remaining rows and detecting incident infrared rays. Each of the reference pixels includes a first cell located above a first concave portion. The first cell includes a first thermoelectric conversion unit having a first infrared absorption film; and a first thermoelectric conversion element. Each of the infrared detection pixels includes a second cell located above a second concave portion, and having a larger area than the first cell. The second cell includes: a second thermoelectric converting unit located above the second concave portion; and first and second supporting structure units supporting the second thermoelectric converting unit above the second concave portion. The second thermoelectric converting unit includes: a second infrared absorption film; and a second thermoelectric conversion element. | 09-26-2013 |
20130248724 | RADIATION DETECTION APPARATUS - A radiation detection apparatus according to an embodiment includes: a scintillator including a fluorescent material to convert radiation to visible radiation photon; a photon detection device array having a plurality of cells each of which includes a photon detection device to detect visible radiation photon emitted from a fluorescent material in the scintillator and convert the visible radiation photon to an electric signal; and a plurality of lenses provided on cells respectively in association with the cells to cause the visible radiation photon to be incident on the photon detection device in an associated cell. | 09-26-2013 |
20130293548 | INFORMATION PROCESSING APPARATUS, INFORMATION PROCESSING METHOD, PROGRAM, AND INFORMATION PROCESSING SYSTEM - Provided is an information processing apparatus including an image acquisition unit for acquiring a real space image including an image of another apparatus, a coordinate system generation unit for generating a spatial coordinate system of the real space image acquired by the image acquisition unit, and a transmission unit for transmitting spatial information constituting the spatial coordinate system generated by the coordinate system generation unit to the other apparatus sharing the spatial coordinate system. | 11-07-2013 |
20140018508 | CATIONIC (METH) ACRYLIC SILICONE-BASED GRAFT COPOLYMER AND COSMETIC CONTAINING SAME - The present invention provides a novel (meth)acrylic silicone-based graft copolymer that is preferably used for cosmetics and the like. The (meth)acrylic silicone-based graft copolymer of the present invention is a copolymer obtained by reacting the following radically polymerizable monomers (a) to (d):
| 01-16-2014 |
20140072774 | SUBSTRATE BONDING APPARATUS, SUBSTRATE HOLDING APPARATUS, SUBSTRATE BONDING METHOD, SUBSTRATE HOLDING METHOD, MULTILAYERED SEMICONDUCTOR DEVICE, AND MULTILAYERED SUBSTRATE - Substrates are aligned and then bonded to each other. A substrate bonding apparatus includes a deformer that deforms at least a first one of two substrates that are to be bonded to each other in order to correct misalignment between the two substrates, a holder that holds the deformed first substrate in the deformed state achieved by the deformer, a transporter that transports the holder from a position at which the deformed first substrate is held by the holder while the first substrate remains deformed, and a bonder that bonds the first substrate that has been transported by the transporter to the second substrate. In the above-described substrate bonding apparatus, while the first substrate is not held by the holder, the deformer may deform the holder from a first state to a second state that is more deformed than the first state, and while the first substrate is held by the holder, the deformer may reduce the amount of the deformation of the holder to less than the amount of the deformation of the second state to deform the first substrate. | 03-13-2014 |
20140084392 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - After a TEOS oxide film is formed on the surface of a semiconductor device, a PSG film and an SiN film, which have air permeability, are formed on the surface of the TEOS oxide film. Thereafter, a Poly-Si film is formed thereon. A sacrifice layer is removed by a gaseous HF that passes through the PSG film, the SiN film, and the Poly-Si film, and then, the uppermost layer is covered with a Poly-Si/SiC film. A chip scale package having a thin-film hollow-seal structure can be realized on the semiconductor element. | 03-27-2014 |
20140118516 | SOLID STATE IMAGING MODULE, SOLID STATE IMAGING DEVICE, AND INFORMATION PROCESSING DEVICE - A solid state imaging module according to an embodiment can be attached to and detached from an information processing device, the solid state imaging module including: an imaging element formed on a semiconductor substrate and including a plurality of pixel blocks, each of the plurality of pixel blocks having a plurality of pixels; a first optical system for imaging a subject on an imaging plane; and input and output terminals that are connectable to the information processing device, which processes information from the imaging element. | 05-01-2014 |
20140131553 | SOLID-STATE IMAGING DEVICE - A solid-state imaging device according to an embodiment includes: an imaging element including an imaging area formed with a plurality of pixel blocks each including pixels; a first optical system forming an image of an object on an imaging surface; and a second optical system re-forming the image, which has been formed on the imaging surface, on the pixel blocks corresponding to microlenses, the second optical system including a microlens array formed with the microlenses provided in accordance with the pixel blocks. The microlenses are arranged in such a manner that an angle θ between a straight line connecting center points of adjacent microlenses and one of a row direction and a column direction in which the pixels are aligned is expressed as follows: θ>sin | 05-15-2014 |
20140240559 | SOLID STATE IMAGING DEVICE, PORTABLE INFORMATION TERMINAL, AND SOLID STATE IMAGING SYSTEM - A solid state imaging device according to an embodiment includes: an imaging element formed on a semiconductor substrate, and including pixel blocks each having pixels; a main lens forming an image of a subject on an imaging plane; a microlens array including microlenses corresponding to the pixel blocks, the microlens array reducing an image to be formed on the imaging plane by Nf times or less and forming reduced images on the pixel blocks corresponding to the respective microlenses; and an image processing unit enlarging and synthesizing the reduced images formed by the microlenses, the solid state imaging device meeting conditions of an expression MTF | 08-28-2014 |
20140284746 | SOLID STATE IMAGING DEVICE AND PORTABLE INFORMATION TERMINAL - A solid state imaging device according to an embodiment includes: an imaging element including a plurality of pixels; a bonding layer formed to be in contact with the imaging element; a first microlens array formed to be in contact with the bonding layer, and including a plurality of first microlenses with a refractive index higher than a refractive index of the bonding layer; and a main lens located above the first microlens array. | 09-25-2014 |
20140285693 | MICROLENS ARRAY UNIT AND SOLID STATE IMAGING DEVICE - A microlens array unit according to an embodiment includes: a substrate; a first group of microlenses including first microlenses having a convex shape and a first focal length, the first group of microlenses being arranged on the substrate; and a second group of microlenses including second microlenses having a convex shape and a second focal length different from the first focal length, the second group of microlenses being arranged on the substrate, a first imaging plane of the first group of microlenses and a second imaging plane of the second group of microlenses being parallel to each other, a distance between the first and second imaging planes in a direction perpendicular to the first imaging plane being 20% or less of the first focal length, and images of the first microlenses projected on the substrate not overlapping images of the second microlenses projected on the substrate. | 09-25-2014 |
20140285703 | LIQUID CRYSTAL OPTICAL DEVICE, SOLID STATE IMAGING DEVICE, PORTABLE INFORMATION TERMINAL, AND DISPLAY DEVICE - A liquid crystal optical device includes: a first electrode unit including a first substrate transparent to light, a light-transmitting layer formed on the first substrate, and a first electrode formed on the light-transmitting layer and being transparent to light, the light-transmitting layer including recesses formed on a surface facing the first electrode, arranged in a first direction, and extending in a second direction; a second electrode unit including a second substrate, the second substrate being transparent to light, and two second electrodes formed on the second substrate, the second electrodes being arranged in the second direction and extending along the first direction; a liquid crystal layer located between the first and second electrode units; a first polarizing plate located on an opposite side of the second electrode unit from the liquid crystal layer; and a drive unit that applies voltages to the first and second electrodes. | 09-25-2014 |
20140285708 | SOLID STATE IMAGING DEVICE, PORTABLE INFORMATION TERMINAL, AND DISPLAY DEVICE - A solid state imaging device according to an embodiment includes: a liquid crystal optical element including a first electrode having a first recess and a projecting portion surrounding the first recess on a first surface, a second electrode facing the first surface of the first electrode, a filling film located between the first recess of the first electrode and the second electrode, and a liquid crystal layer located between the filling film and the second electrode; an imaging lens facing the second electrode to form an image of a subject on an imaging plane; and an imaging element facing the first recess, the imaging element having a pixel block having a plurality of pixels. | 09-25-2014 |