Patent application number | Description | Published |
20090070994 | METHOD FOR MANUFACTURING CIRCUIT BOARD ON WHICH ELECTRONIC COMPONENT IS MOUNTED - A method for manufacturing a circuit board on which an electronic component is mounted, includes at least the steps of (a) supplying a liquid photo-polymerizable adhesive containing conductive particles dispersed therein to a surface of a printed board, to form an adhesive layer on the board surface; (b) irradiating the photo-polymerizable adhesive with ultraviolet light to turn into a gel, to provide adhesiveness to the adhesive layer; and (c) pressing the electronic component against the component mounting portion of the printed board from an upper surface side of the adhesive layer, to form an electrical connection between the electronic component and the component mounting portion, and in the method, the photo-polymerizable adhesive is a delayed reactive adhesive. | 03-19-2009 |
20090133900 | ELECTRONIC CIRCUIT DEVICE AND METHOD FOR MANUFACTURING SAME - Circuit board having conductor wiring and connection terminal; anisotropic conductive resin layer provided on one surface of circuit board; and plurality of electronic components respectively provided with electrode terminals in positions facing the connection terminal are included. The anisotropic conductive resin layer includes at least one kind of conductive particles selected from coiled conductive particles, fiber fluff conductive particles and conductive particles provided with a plurality of conductive protrusions, and resin binder; electrically couples electrode terminals of plurality of electronic components to connection terminals to each other with conductive particles; mechanically fixes electronic components and circuit board to each other; and protects conductor wiring. | 05-28-2009 |
20090246356 | INK COMPOSITION FOR ORGANIC ELECTROLUMINESCENT DEVICE AND PRODUCTION METHOD THEREOF - A production method of an ink composition for organic EL devices comprises preparing a composition containing a polymer organic EL material and an organic solvent; and applying an electric field to the composition. Preferably, a composition containing a polymer organic EL material prepared by a coupling reaction between a halogenated aromatic compound and an aromatic boron compound in the presence of palladium catalyst or nickel catalyst, an organic solvent, and an aromatic carboxylic acid contained in an amount of 0.01- 1 wt % based on the total amount of the organic solvent and aromatic carboxylic acid is prepared. | 10-01-2009 |
20090322718 | DISPLAY APPARATUS - There is provided a display apparatus configured by stacking a drive circuit substrate and a light-emitting substrate. Electrodes of the substrates are accurately aligned to be electrically connected to each other. A display apparatus is configured by stacking a drive circuit substrate having a drive circuit and a light-emitting substrate having a light-emitting unit including a pixel electrode to cause the drive circuit substrate and the light-emitting substrate to face each other, wherein on a stacked plane between the drive circuit substrate and the light-emitting substrate, an intermediate electrode connected to the light-emitting unit of the light-emitting substrate and a connection electrode connected to the drive circuit and the drive circuit substrate are electrically connected to each other, and the intermediate electrode is elongated in a direction parallel to or perpendicular to a longitudinal direction of the pixel electrode on the stacked plane. | 12-31-2009 |
20100008056 | STEREOSCOPIC ELECTRONIC CIRCUIT DEVICE, AND RELAY BOARD AND RELAY FRAME USED THEREIN - A stereoscopically connected structure is made up of a first circuit board and a second circuit board which are mounted with other electronic components, and a relay board having a recess which is mounted with an electronic component and is provided with a lead-out wiring extending from the electronic component, and also having a land part to be connected with the lead-out wiring on one of the surfaces of the relay board that face the first circuit board and second circuit board. Thus the relay board can mount the electronic component thereon as well as connect the first circuit board and the second circuit board, thereby achieving high density mounting. | 01-14-2010 |
20100159257 | BONDING MATERIAL, BONDED PORTION AND CIRCUIT BOARD - Disclosed is a solder material which enables to realize a lower mounting temperature when an electronic component is mounted. Also disclosed are a solder paste and a conductive adhesive. Specifically disclosed is a solder material having a basic composition composed of Sn, Bi and In. This solder material may further contain at least one metal selected from the group consisting of Cu, Ge and Ni. A solder paste which enables to realize a low-temperature mounting can be obtained by blending a flux component into the solder material. A conductive adhesive which enables to realize a low-temperature mounting can be obtained by blending a resin component into the solder material. | 06-24-2010 |
20100167908 | DIELECTRIC PORCELAIN COMPOSITION FOR USE IN ELECTRONIC DEVICES - The invention intends to provide a dielectric porcelain composition for use in electronic devices, in which the relative dielectric constant εr is high, the Qf value is high and, the temperature coefficient τf can be controlled while maintaining the temperature coefficient τf at the resonant frequency small and the Qf value high. According to the invention, when, in an LnAlO | 07-01-2010 |
20100323877 | SEMICONDUCTOR PORCELAIN COMPOSITION - The invention intends to provide, in BaTiO | 12-23-2010 |
20120286810 | FLUID QUALITY SENSOR - An object of the present invention is to accurately detect concentrations of mixtures in a fluid. An internal electrode | 11-15-2012 |
20130037314 | BONDING MATERIAL, BONDED PORTION AND CIRCUIT BOARD - Disclosed is a solder material which enables to realize a lower mounting temperature when an electronic component is mounted. Also disclosed are a solder paste and a conductive adhesive. Specifically disclosed is a solder material having a basic composition composed of Sn, Bi and In. This solder material may further contain at least one metal selected from the group consisting of Cu, Ge and Ni. A solder paste which enables to realize a low-temperature mounting can be obtained by blending a flux component into the solder material. A conductive adhesive which enables to realize a low-temperature mounting can be obtained by blending a resin component into the solder material. | 02-14-2013 |
20130205462 | CLOTHING HAVING COOLING FUNCTION OR WARMING FUNCTION - The clothing having a frontal land and a rear land includes: a thermal storage unit provided on at least one portion of the frontal land of the clothing; and a planar thermoconductive sheet located in a planar between the frontal land and the rear land, the planar thermoconductive sheet having a thermal conduction path to the thermal storage unit, and the planar thermoconductive sheet being higher in thermoconductivity than the frontal land and the rear land. The planar thermoconductive sheet includes a resin component and graphite particles. Basal plane of each graphite particle is parallel to the direction of the plane of the planar thermoconductive sheet. | 08-15-2013 |
20130209732 | GRAPHITE STRUCTURE, AND ELECTRONIC DEVICE USING THE SAME - A graphite structure includes a graphite plate ( | 08-15-2013 |
20140374648 | ANISOTROPIC HEAT CONDUCTIVE COMPOSITION - An object of the present invention is to provide an anisotropic heat conductive composition comprising: resin; and graphite fillers dispersed into the resin, wherein the graphite fillers each have a maximum diameter A in parallel with a basal plane of each of the graphite fillers and a maximum length C perpendicular to the basal plane, an average of the maximum diameters A ranges from 1 μm to 300 μm, an average ratio of the maximum diameter A to the maximum length C represented by A/C is at least 30, a content of the graphite fillers is 20 mass % to 40 mass %, and an average of a smaller angle made by the basal plane and a sheet surface of the sheet anisotropic heat conductive composition is less than 15°. | 12-25-2014 |
20150030835 | ANISOTROPIC HEAT CONDUCTIVE COMPOSITION AND MOLDED PRODUCT THEREOF - The present invention relates to an anisotropic heat conductive composition including flake graphite particles and a resin composition for the particles to be dispersed therein. When the particles have a basal plane, a maximum diameter a in a direction of the basal plane, and a thickness c perpendicular to the basal plane, a/c is 30 or more on average, and a content of the particles is more than 40 mass % and 90 mass % or less. Since the composition includes the particles having a particular shape, when it is formed into a sheet, an anisotropic heat conductive path can be efficiently created therein. Thus, the present invention can provide a molded product in sheet form, suited to have therein a heat conductive path capable of dispersing heat from a high temperature region to a low temperature region. | 01-29-2015 |