Patent application number | Description | Published |
20100001415 | LIQUID EPOXY RESIN COMPOSITION - A liquid epoxy resin composition comprising
| 01-07-2010 |
20100016474 | LIQUID EPOXY RESIN COMPOSITION - A liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) an amine curing agent, and (C) an inorganic filler in an amount of from 50 to 900 parts by weight per 100 parts by weight of the component (A), wherein the component (B) is contained in such an amount that a molar ratio of epoxy groups of the component (A) to amino groups of the component (B), ranges from 0.6 to less than 1.0, provided that, if the component (B) includes an amine curing agent which is solid in the composition at a temperature of from room temperature to 150° C., a content of such an amine is 30 mol % or less, based on the component (B). | 01-21-2010 |
20100304536 | DAM COMPOSITION FOR USE WITH MULTILAYER SEMICONDUCTOR PACKAGE UNDERFILL MATERIAL, AND FABRICATION OF MULTILAYER SEMICONDUCTOR PACKAGE USING THE SAME - A composition comprising (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler having an average particle size of 0.1-10 μm and a maximum particle size of up to 75 μm, and (D) a surface-silylated silica having an average particle size of 0.005 μm to less than 0.1 μm is suited as a dam composition for use with a underfill material in the fabrication of multilayer semiconductor packages. | 12-02-2010 |
20120074596 | SET OF RESIN COMPOSITIONS FOR PREPARING SYSTEM-IN-PACKAGE TYPE SEMICONDUCTOR DEVICE - Set of compositions for preparing system-in-package type semiconductor device. The composition set consists of underfill composition for preparing underfill part and encapsulation resin composition for preparing resin encapsulation part. 1) A cured product of the underfill composition has a glass transition temperature, Tg, ≧100° C. and is the same with or differs from a Tg of a cured product of the encapsulation resin composition by ≦20° C. 2) Total linear expansion coefficient of the cured product of the underfill composition at a temperature not higher than (Tg−30)° C. and a linear expansion coefficient of the cured product of the encapsulation resin composition at a temperature not higher than (Tg−30)° C. is ≦42 ppm/° C. 3) A ratio of the linear expansion coefficient of the cured product of the encapsulation resin composition to the linear expansion coefficient of the cured product of the underfill composition ranges from 0.3 to 1.0. | 03-29-2012 |
20120184646 | SEMICONDUCTOR-ENCAPSULATING LIQUID EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE - A semiconductor-encapsulating liquid epoxy resin composition comprises (A) a liquid epoxy resin, (B) an aromatic amine curing agent, and (C) an inorganic filler comprising an inorganic filler A which is a silica having an average particle size of 0.1 to 3 μm, and an inorganic filler B which is an amorphous nanosilica having an average particle size of 5 to 70 nm and having its surface treated with a coupling agent represented by the following formula (1) and/or (2): | 07-19-2012 |
20130181361 | THERMOSETTING RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND ENCAPSULATED SEMICONDUCTOR DEVICE - A thermosetting resin composition for semiconductor encapsulation contains a both end allyl isocyanurate ring-terminated organopolysiloxane polymer as a sole base polymer and an isocyanurate ring-containing organohydrogenpolysiloxane polymer as a sole curing agent or crosslinker. When a semiconductor element array having semiconductor elements mounted on a substrate with an adhesive is encapsulated with the thermosetting resin composition, warp-free semiconductor devices having improved heat resistance and moisture resistance are obtainable. | 07-18-2013 |
20130197129 | LIQUID EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE - Disclosed is a liquid epoxy resin composition containing: (A) a liquid epoxy resin comprising at least one liquid epoxy resin represented by the following general formula (1) or (2): | 08-01-2013 |
20150353731 | HEAT-CURABLE RESIN COMPOSITION - The present invention can provide a heat-curable resin composition which is excellent in insulation property, heat resistance, and preservation stability. The heat-curable resin composition includes (A) cyanate ester compound having at least two cyanate groups in a molecule, (B) phenol curing agent including a resorcinol type phenol resin represented by the formula (1), | 12-10-2015 |