Patent application number | Description | Published |
20120145442 | INTERCONNECT STRUCTURE - A microelectronic assembly includes a first surface and a first thin conductive element exposed at the first surface and having a face comprising first and second regions. A first conductive projection having a base connected to and covering the first region of the face extends to an end remote from the base. A first dielectric material layer covers the second region of the first thin element and contacts at least the base of the first conductive projection. The assembly further includes a second substrate having a second face and a second conductive projection extending away from the second face. A first fusible metal mass connects the first projection to the second projection and extends along an edge of the first projection towards the first dielectric material layer. | 06-14-2012 |
20130313012 | TSV FABRICATION USING A REMOVABLE HANDLING STRUCTURE - A method for forming an interconnection element having metalized structures includes forming metalized structures in an in-process unit that has a support material layer with first and second spaced-apart surfaces defining a thickness therebetween, a handling structure, and an insulating layer separating at least portions of the first surface of the support material layer from at least portions of the handling structure. The metalized structures are formed extending through the thickness of the support material layer. The method also includes etching at least a portion of the insulating layer to remove the handling structure from the in-process unit and further processing the in-process unit to form the interconnection element. | 11-28-2013 |
20140262457 | POROUS ALUMINA TEMPLATES FOR ELECTRONIC PACKAGES - Interposers and methods of making the same are disclosed herein. In one embodiment, an interposer includes a region having first and second oppositely facing surfaces and a plurality of pores, each pore extending in a first direction from the first surface towards the second surface, wherein alumina extends along a wall of each pore; a plurality of electrically conductive connection elements extending in the first direction, consisting essentially of aluminum and being electrically isolated from one another by at least the alumina; a first conductive path provided at the first surface for connection with a first component external to the interposer; and a second conductive path provided at the second surface for connection with a second component external to the interposer, wherein the first and second conductive paths are electrically connected through at least some of the connection elements. | 09-18-2014 |
20140268491 | CAPACITORS USING POROUS ALUMINA STRUCTURES - Capacitors and methods of making the same are disclosed herein. In one embodiment, a capacitor comprises a structure having first and second oppositely facing surfaces and a plurality of pores each extending in a first direction from the first surface towards the second surface, and each having pore having insulating material extending along a wall of the pore; a first conductive portion comprising an electrically conductive material extending within at least some of the pores; and a second conductive portion comprising a region of the structure consisting essentially of aluminum surrounding individual pores of the plurality of pores, the second conductive portion electrically isolated from the first conductive portion by the insulating material extending along the walls of the pores. | 09-18-2014 |
20150014850 | INTERCONNECT STRUCTURE - A microelectronic assembly includes first and second surfaces, a first thin conductive element, a first conductive projection, and a first fusible mass. The first thin conductive element includes a face that has first and second regions. The first conductive projection covers the first region of the first face. A barrier may be formed along a portion of the first region. The second face includes a second conductive projection that extends away therefrom. The first fusible metal mass connects the first conductive projection to the second conductive projection such that the first surface of the first face is oriented toward the second surface of the second substrate. The first mass extends along a portion of the first conductive projection to a location toward the first edge of the barrier. The barrier is disposed between the first thin element and the first metal mass. | 01-15-2015 |
20150097284 | Bowl-shaped solder structure - An apparatus relating generally to a substrate is disclosed. In this apparatus, a first metal layer is on the substrate. The first metal layer has an opening. The opening of the first metal layer has a bottom and one or more sides extending from the bottom. A second metal layer is on the first metal layer. The first metal layer and the second metal layer provide a bowl-shaped structure. An inner surface of the bowl-shaped structure is defined responsive to the opening of the first metal layer and the second metal layer thereon. The opening of the bowl-shaped structure is configured to receive and at least partially retain a bonding material during a reflow process. | 04-09-2015 |
20150145116 | DIE STACKS WITH ONE OR MORE BOND VIA ARRAYS - An apparatus relating generally to a die stack is disclosed. In such an apparatus, a substrate is included. A first bond via array includes first wires each of a first length extending from a first surface of the substrate. An array of bump interconnects is disposed on the first surface. A die is interconnected to the substrate via the array of bump interconnects. A second bond via array includes second wires each of a second length different than the first length extending from a second surface of the die. | 05-28-2015 |
20150145141 | Multiple Bond Via Arrays of Different Wire Heights on a Same Substrate - An apparatus relating generally to a substrate is disclosed. In such an apparatus, a first bond via array has first wires extending from a surface of the substrate. A second bond via array has second wires extending from the surface of the substrate. The first bond via array is disposed at least partially within the second bond via array. The first wires of the first bond via array are of a first height. The second wires of the second bond via array are of a second height greater than the first height for coupling of at least one die to the first bond via array at least partially disposed within the second bond via array. | 05-28-2015 |
20150206815 | FINE PITCH BVA USING RECONSTITUTED WAFER WITH AREA ARRAY ACCESSIBLE FOR TESTING - A method for simultaneously making a plurality of microelectronic packages by forming an electrically conductive redistribution structure along with a plurality of microelectronic element attachment regions on a carrier. The attachment regions being spaced apart from one another and overlying the carrier. The method also including the formation of conductive connector elements between adjacent attachment regions. Each connector element having the first or second end adjacent the carrier and the remaining end at a height of the microelectronic element. The method also includes forming an encapsulation over portions of the connector elements and subsequently singulating the assembly. into microelectronic units, each including a microelectronic element. The surface of the microelectronic unit, opposite the redistribution structure, having both the active face of the microelectronic element and the free ends of the connector elements so that both are available for connection with a component external to the microelectronic unit. | 07-23-2015 |
20150255429 | Thermal Vias Disposed in a Substrate Proximate to a Well Thereof - An apparatus relates generally to a three-dimensional stacked integrated circuit. In such an apparatus, the three-dimensional stacked integrated circuit has at least a first die and a second die interconnected to one another using die-to-die interconnects. A substrate of the first die has at least one thermal via structure extending from a lower surface of the substrate toward a well of the substrate without extending to the well and without extending through the substrate. A first end of the at least one thermal via structure is at least sufficiently proximate to the well of the substrate for conduction of heat away therefrom. The substrate has at least one through substrate via structure extending from the lower surface of the substrate to an upper surface of the substrate. A second end of the at least one thermal via structure is coupled to at least one through die via structure of the second die for thermal conductivity. | 09-10-2015 |
20150262928 | INTERPOSERS WITH CIRCUIT MODULES ENCAPSULATED BY MOLDABLE MATERIAL IN A CAVITY, AND METHODS OF FABRICATION - Stacked dies ( | 09-17-2015 |
20150262972 | INTEGRATED CIRCUIT ASSEMBLIES WITH REINFORCEMENT FRAMES, AND METHODS OF MANUFACTURE - An assembly with modules ( | 09-17-2015 |
20150270069 | CAPACITORS USING POROUS ALUMINA STRUCTURES - Capacitors and methods of making the same are disclosed herein. In one embodiment, a capacitor comprises a structure having first and second oppositely facing surfaces and a plurality of pores each extending in a first direction from the first surface towards the second surface, and each having pore having insulating material extending along a wall of the pore; a first conductive portion comprising an electrically conductive material extending within at least some of the pores; and a second conductive portion comprising a region of the structure consisting essentially of aluminum surrounding individual pores of the plurality of pores, the second conductive portion electrically isolated from the first conductive portion by the insulating material extending along the walls of the pores. | 09-24-2015 |
20150303157 | Bowl-shaped solder structure - An apparatus relating generally to a substrate is disclosed. In this apparatus, a first metal layer is on the substrate. The first metal layer has an opening. The opening of the first metal layer has a bottom and one or more sides extending from the bottom. A second metal layer is on the first metal layer. The first metal layer and the second metal layer provide a bowl-shaped structure. An inner surface of the bowl-shaped structure is defined responsive to the opening of the first metal layer and the second metal layer thereon. The opening of the bowl-shaped structure is configured to receive and at least partially retain a bonding material during a reflow process. | 10-22-2015 |
20150318344 | MAKING ELECTRICAL COMPONENTS IN HANDLE WAFERS OF INTEGRATED CIRCUIT PACKAGES - A method for making an integrated circuit package includes providing a handle wafer having a first region defining a cavity. A capacitor is formed in the first region. The capacitor has a pair of electrodes, each coupled to one of a pair of conductive pads, at least one of which is disposed on a lower surface of the handle wafer. An interposer having an upper surface with a conductive pad and at least one semiconductor die disposed thereon is also provided. The die has an integrated circuit that is electroconductively coupled to a redistribution layer (RDL) of the interposer. The lower surface of the handle wafer is bonded to the upper surface of the interposer such that the die is disposed below or within the cavity and the electroconductive pad of the handle wafer is bonded to the electroconductive pad of the interposer in a metal-to-metal bond. | 11-05-2015 |
20150325507 | CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHODS OF MANUFACTURE - A solder connection may be surrounded by a solder locking layer ( | 11-12-2015 |
20150325543 | CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHODS OF MANUFACTURE - In some embodiments, to increase the height-to-pitch ratio of a solder connection that connects different structures with one or more solder balls, only a portion of a solder ball's surface is melted when the connection is formed on one structure and/or when the connection is being attached to another structure. In some embodiments, non-solder balls are joined by an intermediate solder ball ( | 11-12-2015 |
20150333049 | HOLDING OF INTERPOSERS AND OTHER MICROELECTRONIC WORKPIECES IN POSITION DURING ASSEMBLY AND OTHER PROCESSING - A workpiece ( | 11-19-2015 |
20150348873 | LOW CTE COMPONENT WITH WIRE BOND INTERCONNECTS - A component such as an interposer or microelectronic element can be fabricated with a set of vertically extending interconnects of wire bond structure. Such method may include forming a structure having wire bonds extending in an axial direction within one of more openings in an element and each wire bond spaced at least partially apart from a wall of the opening within which it extends, the element consisting essentially of a material having a coefficient of thermal expansion (“CTE”) of less than 10 parts per million per degree Celsius (“ppm/° C.”). First contacts can then be provided at a first surface of the component and second contacts provided at a second surface of the component facing in a direction opposite from the first surface, the first contacts electrically coupled with the second contacts through the wire bonds. | 12-03-2015 |
20150348928 | WIRE BOND SUPPORT STRUCTURE AND MICROELECTRONIC PACKAGE INCLUDING WIRE BONDS THEREFROM - A microelectronic package may include a substrate having first and second regions, a first surface and a second surface remote from the first surface; at least one microelectronic element overlying the first surface within the first region; electrically conductive elements at the first surface within the second region; a support structure having a third surface and a fourth surface remote from the third surface and overlying the first surface within the second region in which the third surface faces the first surface, second and third electrically conductive elements exposed respectively at the third and fourth surfaces and electrically connected to the conductive elements at the first surface in the first region; and wire bonds defining edge surfaces and having bases electrically connected through ones of the third conductive elements to respective ones of the second conductive elements and ends remote from the support structure and the bases. | 12-03-2015 |
20150364538 | MAKING MULTILAYER 3D CAPACITORS USING ARRAYS OF UPSTANDING RODS OR RIDGES - In one embodiment, a method for making a 3D Metal-Insulator-Metal (MIM) capacitor includes providing a substrate having a surface, forming an array of upstanding rods or ridges on the surface, depositing a first layer of an electroconductor on the surface and the array of rods or ridges, coating the first electroconductive layer with a layer of a dielectric, and depositing a second layer of an electroconductor on the dielectric layer. In some embodiments, the array of rods or ridges can be made of a photoresist material, and in others, can comprise bonded wires. | 12-17-2015 |
20150371938 | BACK-END-OF-LINE STACK FOR A STACKED DEVICE - Apparatus relating generally to a back-end-of-line (“BEOL”) stack. In this apparatus, the BEOL stack is configured to electrically couple at least one first electrical component to at least one second electrical component. First contacts are provided on a first side of the BEOL stack with a first pitch for providing a bondable surface for connection to the at least one first electrical component. Second contacts are provided on a second side of the BEOL stack with a second pitch for providing another bondable surface for connection to the at least one second electrical component. The second pitch may be larger than the first pitch. | 12-24-2015 |
20150380377 | Multiple bond via arrays of different wire heights on a same substrate - Apparatuses relating generally to a substrate are disclosed. In such an apparatus, first wire bond wires (“first wires”) extend from a surface of the substrate. Second wire bond wires (“second wires”) extend from the surface of the substrate. The first wires and the second wires are external to the substrate. The first wires are disposed at least partially within the second wires. The first wires are of a first height. The second wires are of a second height greater than the first height for coupling of at least one electronic component to the first wires at least partially disposed within the second wires. | 12-31-2015 |
Patent application number | Description | Published |
20080298448 | METHOD AND APPARATUS FOR MEASURING SUBJECTIVE ASSESSMENT OF DIGITAL VIDEO IMPAIRMENT - A method and system for using key performance indicators of a transport channel to determine key quality indicators associated with information transported there through. | 12-04-2008 |
20100245534 | Method and apparatus for the efficient transmission of multimedia streams for teleconferencing - A teleconferencing system in which a teleconference controller advantageously uses information relating to the network topology layout of remote nodes which are to participate in a teleconference, and then advantageously directs the transmission of video and/or audio streams from a source node to an identified subset of the remote nodes based on the capabilities of the nodes and the network links. These nodes which initially receive the video and/or audio streams then advantageously forward the streams in turn to other nodes in their vicinity using peer-to-peer network connectivity techniques. The identification of the subset of nodes which serve as peer-to-peer forwarding nodes may be based on node activity, node service capacity, the impact on network links between the node and the requester, the distance and/or latency between the node and the requester, and the ability of the node to meet requests including video transcoding requests. | 09-30-2010 |
20100315479 | System to freely configure video conferencing camera placement - Embodiments of the present invention are directed to cordless video conferencing camera adaptors and video conferencing systems including the camera adaptors. Embodiments of the present invention overcome some of the inherent problems of known video conferencing products by being a part of a portable and configurable video conferencing system, which can be used in various meeting rooms, laboratories, training rooms, and conference halls. For example, embodiments of the invention allow use of low cost (e.g., under $100) cameras to provide any angle of video coverage in any conference room setting. | 12-16-2010 |
20100315481 | Portable video conferencing system with universal focal point - Embodiments of the present invention are directed to compact portable video conferencing systems, which eliminate the need for other meeting room appliances for a video conference. The systems provide the freedom to hold video conferences with a few participants in any setting, e.g., a manager's office, a conference room, multiple locations, etc. Embodiments provide portable video conferencing systems, which allow all the meeting participants, including local and remote users, to maintain constant eye contact throughout the meeting. An embodiment of the invention provides a portable video conferencing system including a base, a dual-sided display and a camera unit. | 12-16-2010 |
20120306997 | APPARATUS FOR THE EFFICIENT TRANSMISSION OF MULTIMEDIA STREAMS FOR TELECONFERENCING - A peer-to-peer forwarding node supports the operation of a teleconference across a telecommunications network. The telecommunications network comprises a plurality of nodes including one or more source locations and one or more remote locations. The teleconference includes teleconference participants at each of the source and remote locations. The peer-to-peer forwarding node is located at a given one of the plurality of nodes. The peer-to-peer forwarding node comprises a receiver and a transmitter. The receiver receives a request from a telecommunications controller to provide peer-to-peer forwarding of a media signal to be received from a first one of the source locations to a first one of the remote locations and which further receives the media signal from the first one of said source locations. The transmitter forwards the media signal from the first one of the source locations to the first one of the remote locations. | 12-06-2012 |