Patent application number | Description | Published |
20120298996 | Thin Film Transistor and Method for Manufacturing the Same - A thin film transistor and a method for manufacturing the same are provided. A photoresist layer is patterned to cover a part of an ohmic contact layer by shifting a photomask. Then, the exposed ohmic contact layer is removed to shorten the channel length of the thin film transistor for increasing on-state current. | 11-29-2012 |
20130112977 | PIXEL STRUCTURE, ARRAY SUBSTRATE AND METHOD OF FABRICATING THE SAME - The present invention provides a pixel structure including a substrate, a first metal pattern layer, an insulating layer, a second metal pattern layer, a passivation layer, and a conductive protection layer. The substrate has at least one pixel region. The first patterned metal layer is disposed on the substrate, and has a top surface. The insulating layer is disposed on the first patterned metal layer and the substrate, and is in contact with the top surface of the first patterned metal layer. The second patterned metal layer is disposed on the insulating layer in the pixel region, and includes a source and a drain. The passivation layer is disposed on the second patterned metal layer and the insulating layer. A top surface of the source is in contact with the passivation layer, and the conductive protection layer is disposed on the drain. | 05-09-2013 |
20130119385 | PIXEL STRUCTURE AND METHOD OF FABRICATING THE SAME - A pixel structure includes a substrate; a scan line; a gate electrode; an insulating layer disposed on the scan line, the gate electrode and the substrate; a channel and a data line disposed on the insulating layer; a source electrode and a drain electrode disposed on the channel; a passivation layer; a pixel electrode and a connecting electrode. The data line does not overlap the scan line. The passivation layer disposed on the source electrode and the drain electrode includes a first contact hole partially exposing the drain electrode, and a plurality of second contact holes partially exposing the data line or the scan line. The pixel electrode disposed on the passivation layer is electrically connected to the drain electrode through the first contact hole. Furthermore, the connecting electrode disposed on the passivation layer is electrically connected to the data line or the scan line through the second contact holes. | 05-16-2013 |
20130175531 | PIXEL STRUCTURE AND MANUFACTURING METHOD THEREOF - A pixel structure includes a substrate, a gate line, a data line, a semiconductor pattern, a non-metal source electrode pattern, a non-metal drain electrode pattern, and a pixel electrode. The gate line and the data line are disposed on the substrate. The semiconductor pattern is disposed on the gate line, and the semiconductor pattern overlaps two corresponding edges of the gate line along a vertical projective direction. The non-metal source electrode pattern and the non-metal drain electrode pattern are disposed on the semiconductor pattern. The non-metal source electrode pattern and the non-metal drain electrode pattern are respectively disposed on two corresponding edges of the gate line. The non-metal source electrode pattern is partially disposed between the data line and the gate line. The pixel electrode is electrically connected to the non-metal drain electrode pattern. | 07-11-2013 |
20130175532 | PIXEL STRUCTURE AND MANUFACTURING METHOD THEREOF - A method for manufacturing a pixel structure is provided. A thin film transistor is formed on a substrate and an insulating layer is formed to cover the substrate and the thin film transistor. The insulating layer is patterned by a half-tone mask to form a protruding pattern, a sunken pattern connecting the protruding pattern, and a contact window inside the sunken pattern. A transparent conductive layer is formed to cover the protruding pattern and the sunken pattern, and filled in the contact window. A passivation layer is formed to cover the transparent conductive layer. A pixel electrode pattern is formed from the transparent conductive layer by removing a part of the passivation layer located on the protruding pattern, a part of the transparent conductive layer on the protruding pattern, and a part of the passivation layer located within the contact window. A pixel structure manufactured by the method is provided. | 07-11-2013 |
Patent application number | Description | Published |
20120119211 | THIN FILM TRANSISTORS AND METHODS FOR MANUFACTURING THE SAME - Disclosed is a thin film transistor including a gate electrode on a substrate. A gate dielectric layer is disposed on the gate electrode and the substrate, and source/drain electrodes are disposed on the gate dielectric layer overlying two edge parts of the gate electrode. A channel layer is disposed on the gate dielectric layer overlying a center part of the gate electrode, and the channel region contacts the source/drain electrodes. An insulating capping layer overlies the channel layer, wherein the channel layer includes an oxide semiconductor. | 05-17-2012 |
20130083307 | Photo-Alingment Apparatus, and Method for Fabricating Liquid Crystal Display - A photo-alignment apparatus is provided, which includes an exposure machine, at least one mask and a photo-alignment area. The exposure machine includes a light source, a polarization plate, and a multilayer splitter. The light source emits an unpolarized light. The polarization plate receives the unpolarized light and converts the unpolarized light into a polarized light. The multilayer splitter split the polarized light into a first light beam and a second light beam. The mask includes at least two transmission portions which allow the first and second light beams to be transmitted therethrough and be projected onto the photo-alignment area for exposure thereto. | 04-04-2013 |
20140160457 | DISPLAY MANUFACTURING METHOD AND PHOTO ALIGNMENT PROCESS - A display manufacturing method comprises steps of: moving a first substrate and a second substrate by a conveying apparatus; and implementing a first exposure and a second exposure of the first substrate and a first exposure and a second exposure of the second substrate by at least one light emitting element when the conveying apparatus drives the first and second substrates to pass through the light source module. When the first exposures of the first and second substrates are implemented, the moving directions of the first and second substrates are opposite, or when the second exposures of the first and second substrates are implemented, the moving directions of the first and second substrates are opposite. A photo alignment process is also disclosed. | 06-12-2014 |
20140374750 | THIN FILM TRANSISTOR AND DISPLAY PANEL INCLUDING THE SAME - Disclosed is a thin film transistor including a gate electrode on a substrate. A gate dielectric layer is disposed on the gate electrode and the substrate, and source/drain electrodes are disposed on the gate dielectric layer overlying two edge parts of the gate electrode. A channel layer is disposed on the gate dielectric layer overlying a center part of the gate electrode, and the channel region contacts the source/drain electrodes. An insulating capping layer overlies the channel layer, wherein the channel layer includes an oxide semiconductor. | 12-25-2014 |
20140374751 | THIN FILM TRANSISTOR AND DISPLAY PANEL INCLUDING THE SAME - Disclosed is a thin film transistor including a gate electrode on a substrate. A gate dielectric layer is disposed on the gate electrode and the substrate, and source/drain electrodes are disposed on the gate dielectric layer overlying two edge parts of the gate electrode. A channel layer is disposed on the gate dielectric layer overlying a center part of the gate electrode, and the channel region contacts the source/drain electrodes. An insulating capping layer overlies the channel layer, wherein the channel layer includes an oxide semiconductor. | 12-25-2014 |
20140377906 | METHODS FOR MANUFACTURING THIN FILM TRANSISTORS - Disclosed is a thin film transistor including a gate electrode on a substrate. A gate dielectric layer is disposed on the gate electrode and the substrate, and source/drain electrodes are disposed on the gate dielectric layer overlying two edge parts of the gate electrode. A channel layer is disposed on the gate dielectric layer overlying a center part of the gate electrode, and the channel region contacts the source/drain electrodes. An insulating capping layer overlies the channel layer, wherein the channel layer includes an oxide semiconductor. | 12-25-2014 |
20150076474 | METHOD FOR PACKAGING DISPLAY PANEL AND PACKAGING STRUCTURE OF DISPLAY PANEL - A method for packaging display panel is provided. The method comprises following steps: providing a first substrate; pasting a frit on the first substrate; pre-sintering the frit in a specific temperature; forming a color filter unit on the first substrate; providing a second substrate oppositely disposed on the first substrate; and assembling the first substrate and the second substrate with the frit by way of laser sealing. | 03-19-2015 |
Patent application number | Description | Published |
20120140521 | FLAT PANEL DISPLAY - In a flat panel display, a reflector and a light guide plate are enlarged and a support section is formed on the light guide plate. A support component made of Methylsilanol Mannuronate with high stiffness is configured onto the support section and utilized for supporting a cell. After optical films are configured on the light guide plate, and between the support component, the cell is then placed on the support component. Finally, a top frame and two covers are assembled to complete the assembly of the flat panel display. | 06-07-2012 |
20120242926 | LIQUID CRYSTAL DISPLAY DEVICE AND ELECTRONIC EQUIPMENT HAVING THE SAME - A liquid crystal display device includes a support frame having a bottom wall, and a main surrounding wall extending upwardly from and formed integrally as one piece with the bottom wall. The bottom wall and the surrounding wall cooperatively define a receiving space. The bottom wall includes a first support disposed in the receiving space. The main surrounding wall includes a second support disposed in the receiving space and spacedly above the first support. A backlight module is supported on the first support. A liquid crystal display panel is supported on the second support so that the liquid crystal display panel is positioned above the backlight module. | 09-27-2012 |
20120250289 | FLAT PANEL DISPLAY - In a flat panel display having integral frame structure, features of a metal frame and a plastic support, which support, position, and fix each component, are incorporated as an integral frame structure, such that no additional structure component is needed for the flat panel display to assemble the backlight module and the panel module. The frame structure is assembled to the bottom cover via screw that can reduce defectiveness of repetitive processing. A concave section at the bottom of the frame structure can contain a control circuit board for the panel cell such that the control circuit board can be rerouted downward to the bottom of the frame structure. The space required at the light source side of the flat panel display can be reduced, hence leading to the flat panel display with thin frame at the light source side. | 10-04-2012 |
20140126238 | LIGHT SOURCE MODULE AND MANUFACTURING METHOD THEREOF - A light source module including a light emitting unit for emitting a light beam, a light guiding plate, and a light coupling unit is provided. The light guiding plate has a first light emitting surface, a first bottom surface, and a first light incident surface, wherein the first light emitting surface is opposite to the first bottom surface, and the first light incident surface connects the first light emitting surface and the first bottom surface. The light coupling unit has a second light incident surface and a second light emitting surface in contact with the first light incident surface. The light emitting unit is disposed beside the second light incident surface. The light beam enters the light coupling unit through the second light incident surface, exits the light coupling unit through the second light emitting surface, and then enters the light guiding plate through the first light incident surface. | 05-08-2014 |
20140327856 | LIQUID CRYSTAL DISPLAY DEVICE AND ELECTRONIC EQUIPMENT HAVING THE SAME - A liquid crystal display device includes a support frame having a bottom wall, and a main surrounding will extending upwardly from and formed integrally as one piece with the bottom wall. The bottom wall and the surrounding wall cooperatively define a receiving space. The bottom wall includes a first support disposed in the receiving space. The main surrounding wall includes a second support disposed in the receiving space and spacedly above the first support. A backlight module is supported on the first support. A liquid crystal display panel is supported on the second support so that the liquid crystal display panel is positioned above the backlight module. | 11-06-2014 |
Patent application number | Description | Published |
20120280348 | BACK SIDE ILLUMINATED IMAGE SENSOR WITH IMPROVED STRESS IMMUNITY - Provided is an image sensor device. The image sensor device includes a substrate having a front side and a back side opposite the first side. The substrate has a pixel region and a periphery region. The image sensor device includes a plurality of radiation-sensing regions disposed in the pixel region of the substrate. Each of the radiation-sensing regions is operable to sense radiation projected toward the radiation-sensing region through the back side. The image sensor device includes a reference pixel disposed in the periphery region. The image sensor device includes an interconnect structure that is coupled to the front side of the substrate. The interconnect structure includes a plurality of interconnect layers. The image sensor device includes a film formed over the back side of the substrate. The film causes the substrate to experience a tensile stress. The image sensor device includes a radiation-blocking device disposed over the film. | 11-08-2012 |
20130020662 | NOVEL CMOS IMAGE SENSOR STRUCTURE - Provided is a method of fabricating an image sensor device. The method includes providing a first substrate having a radiation-sensing region disposed therein. The method includes providing a second substrate having a hydrogen implant layer, the hydrogen implant layer dividing the second substrate into a first portion and a second portion. The method includes bonding the first portion of the second substrate to the first substrate. The method includes after the bonding, removing the second portion of the second substrate. The method includes after the removing, forming one or more microelectronic devices in the first portion of the second substrate. The method includes forming an interconnect structure over the first portion of the second substrate, the interconnect structure containing interconnect features that are electrically coupled to the microelectronic devices. | 01-24-2013 |
20130037890 | MULTIPLE GATE DIELECTRIC STRUCTURES AND METHODS OF FORMING THE SAME - The present disclosure provides for multiple gate dielectric semiconductor structures and methods of forming such structures. In one embodiment, a method of forming a semiconductor structure includes providing a substrate including a pixel array region, an input/output (I/O) region, and a core region. The method further includes forming a first gate dielectric layer over the pixel array region, forming a second gate dielectric layer over the I/O region, and forming a third gate dielectric layer over the core region, wherein the first gate dielectric layer, the second gate dielectric layer, and the third gate dielectric layer are each formed to be comprised of a different material and to have a different thickness. | 02-14-2013 |
20130277719 | Gate Electrodes with Notches and Methods for Forming the Same - A device includes a semiconductor substrate, and a Device Isolation (DI) region extending from a top surface of the semiconductor substrate into the semiconductor substrate. A gate dielectric is disposed over an active region of the semiconductor substrate, wherein the gate dielectric extends over the DI region. A gate electrode is disposed over the gate dielectric, wherein a notch of the gate electrode overlaps a portion of the DI region. | 10-24-2013 |
20130285181 | Apparatus and Method for Reducing Cross Talk in Image Sensors - A method for reducing cross talk in image sensors comprises providing a backside illuminated image sensor wafer, forming an isolation region in the backside illuminated image sensor wafer, wherein the isolation region encloses a photo active region, forming an opening in the isolation region from a backside of the backside illuminated image sensor wafer and covering an upper terminal of the opening with a dielectric material to form an air gap embedded in the isolation region of the backside illuminated image sensor wafer. | 10-31-2013 |
20130292750 | IMAGE DEVICE AND METHODS OF FORMING THE SAME - A method of forming of an image sensor device includes an isolation well formed in a pixel region of a substrate. The isolation well has a first conductivity type. A gate stack is formed over the isolation well on the substrate. A mask layer is formed over the isolation well and covering at least a majority portion of the gate stack. A plurality of dopants is implanted in the pixel region, using the gate stack and the mask layer as masks, to form doped isolation features. The plurality of dopants has the first conductivity type. A source region and a drain region are formed on opposite sides of the gate stack in the substrate. The source region and the drain region have a second conductivity type opposite to the A conductivity. | 11-07-2013 |
20130299886 | Backside Structure and Methods for BSI Image Sensors - BSI image sensors and methods. In an embodiment, a substrate is provided having a sensor array and a periphery region and having a front side and a back side surface; a bottom anti-reflective coating (BARC) is formed over the back side to a first thickness, over the sensor array region and the periphery region; forming a first dielectric layer over the BARC; a metal shield is formed; selectively removing the metal shield from over the sensor array region; selectively removing the first dielectric layer from over the sensor array region, wherein a portion of the first thickness of the BARC is also removed and a remainder of the first thickness of the BARC remains during the process of selectively removing the first dielectric layer; forming a second dielectric layer over the remainder of the BARC and over the metal shield; and forming a passivation layer over the second dielectric layer. | 11-14-2013 |
20130299931 | Backside Structure for BSI Image Sensor - An embodiment method for forming an image sensor includes forming an anti-reflective coating over a surface of a semiconductor supporting a photodiode, forming an etching stop layer over the anti-reflective coating, forming a buffer oxide over the etching stop layer, and selectively removing a portion of the buffer oxide through etching, the etching stop layer protecting the anti-reflective coating during the etching. An embodiment image sensor includes a semiconductor disposed in an array region and in a periphery region, the semiconductor supporting a photodiode in the array region, an anti-reflective coating disposed over a surface of the semiconductor, an etching stop layer disposed over the anti-reflective coating, a thickness of the etching stop layer over the photodiode in the array region less than a thickness of the etching stop layer in the periphery region, and a buffer oxide disposed over the etching stop layer in the periphery region. | 11-14-2013 |
20130320420 | CMOS Image Sensors and Methods for Forming the Same - A device includes a diode, which includes a first, a second, and a third doped region in a semiconductor substrate. The first doped region is of a first conductivity type, and has a first impurity concentration. The second doped region is of the first conductivity type, and has a second impurity concentration lower than the first impurity concentration. The second doped region encircles the first doped region. The third doped region is of a second conductivity type opposite the first conductivity type, wherein the third doped region overlaps a portion of the first doped region and a portion of the second doped region. | 12-05-2013 |
20140035013 | Novel CMOS Image Sensor Structure - Provided is a method of fabricating an image sensor device. The method includes providing a first substrate having a radiation-sensing region disposed therein. The method includes providing a second substrate having a hydrogen implant layer, the hydrogen implant layer dividing the second substrate into a first portion and a second portion. The method includes bonding the first portion of the second substrate to the first substrate. The method includes after the bonding, removing the second portion of the second substrate. The method includes after the removing, forming one or more microelectronic devices in the first portion of the second substrate. The method includes forming an interconnect structure over the first portion of the second substrate, the interconnect structure containing interconnect features that are electrically coupled to the microelectronic devices. | 02-06-2014 |
20140042445 | System and Method for Fabricating a 3D Image Sensor Structure - A system and method for fabricating a 3D image sensor structure is disclosed. The method comprises providing an image sensor with a backside illuminated photosensitive region on a substrate, applying a first dielectric layer to the first side of the substrate opposite the substrate side where image data is gathered, and applying a semiconductor layer that is optionally polysilicon, to the first dielectric layer. A least one control transistor may be created on the first dielectric layer, within the semiconductor layer and may optionally be a row select, reset or source follower transistor. An intermetal dielectric may be applied over the first dielectric layer; and may have at least one metal interconnect disposed therein. A second interlevel dielectric layer may be disposed on the control transistors. The dielectric layers and semiconductor layer may be applied by bonding a wafer to the substrate or via deposition. | 02-13-2014 |
20140061737 | Isolation for Semiconductor Devices - A system and method for isolating semiconductor devices is provided. An embodiment comprises an isolation region that is laterally removed from source/drain regions of semiconductor devices and has a dielectric material extending over the isolation implant between the source/drain regions. The isolation region may be formed by forming an opening through a layer over the substrate, depositing a dielectric material along the sidewalls of the opening, implanting ions into the substrate after the deposition, and filling the opening with another dielectric material. | 03-06-2014 |
20140091375 | Implant Isolated Devices and Method for Forming the Same - A device includes a semiconductor substrate and implant isolation region extending from a top surface of the semiconductor substrate into the semiconductor substrate surrounding an active region. A gate dielectric is disposed over an active region of the semiconductor substrate and extends over the implant isolation region. A gate electrode is disposed over the gate dielectric and two end cap hardmasks are between the gate dielectric and the gate electrode over the implant isolation region. The two end cap hardmasks include same dopants as those implanted into the active region. | 04-03-2014 |
20140091377 | Implant Isolated Devices and Method for Forming the Same - A device includes a semiconductor substrate and implant isolation region extending from a top surface of the semiconductor substrate into the semiconductor substrate surrounding an active region. A gate dielectric is disposed over an active region of the semiconductor substrate, wherein the gate dielectric extends over the implant isolation region. A gate electrode is disposed over the gate dielectric and an end cap dielectric layer is between the gate dielectric and the gate electrode over the implant isolation region. | 04-03-2014 |
20140138752 | System and Method for Fabricating a 3D Image Sensor Structure - A system and method for fabricating a 3D image sensor structure is disclosed. The method comprises providing an image sensor with a backside illuminated photosensitive region on a substrate, applying a first dielectric layer to the first side of the substrate opposite the substrate side where image data is gathered, and applying a semiconductor layer that is optionally polysilicon, to the first dielectric layer. A least one control transistor may be created on the first dielectric layer, within the semiconductor layer and may optionally be a row select, reset or source follower transistor. An intermetal dielectric may be applied over the first dielectric layer; and may have at least one metal interconnect disposed therein. A second interlevel dielectric layer may be disposed on the control transistors. The dielectric layers and semiconductor layer may be applied by bonding a wafer to the substrate or via deposition. | 05-22-2014 |
20140159190 | Backside Structure and Methods for BSI Image Sensors - BSI image sensors and methods. In an embodiment, a substrate is provided having a sensor array and a periphery region and having a front side and a back side surface; a bottom anti-reflective coating (BARC) is formed over the back side to a first thickness, over the sensor array region and the periphery region; forming a first dielectric layer over the BARC; a metal shield is formed; selectively removing the metal shield from over the sensor array region; selectively removing the first dielectric layer from over the sensor array region, wherein a portion of the first thickness of the BARC is also removed and a remainder of the first thickness of the BARC remains during the process of selectively removing the first dielectric layer; forming a second dielectric layer over the remainder of the BARC and over the metal shield; and forming a passivation layer over the second dielectric layer. | 06-12-2014 |
20140248734 | CMOS Image Sensors and Methods for Forming the Same - A method includes forming a first implantation mask comprising a first opening, implanting a first portion of a semiconductor substrate through the first opening to form a first doped region, forming a second implantation mask comprising a second opening, and implanting a second portion of the semiconductor substrate to form a second doped region. The first portion of the semiconductor substrate is encircled by the second portion of the semiconductor substrate. A surface layer of the semiconductor substrate is implanted to form a third doped region of an opposite conductivity type than the first and the second doped regions. The third doped region forms a diode with the first and the second doped regions. | 09-04-2014 |
20140252521 | Image Sensor with Improved Dark Current Performance - Provided is a semiconductor image sensor device. The image sensor device includes a semiconductor substrate having a first side and a second side opposite the first side. The semiconductor substrate contains a radiation-sensing region configured to sense radiation projected toward the substrate from the second side. A first layer is disposed over the second side of the semiconductor substrate. The first layer has a first energy band gap. A second layer is disposed over the first layer. The second layer has a second energy band gap. A third layer is disposed over the second layer. The third layer has a third energy band gap. The second energy band gap is smaller than the first energy band gap and the third energy band gap. | 09-11-2014 |
20140252523 | Backside Structure and Methods for BSI Image Sensors - A back side image sensor and method of manufacture are provided. In an embodiment a bottom anti-reflective coating is formed over a substrate, and a metal shield layer is formed over the bottom anti-reflective coating. The metal shield layer is patterned to form a grid pattern over a sensor array region of the substrate, and a first dielectric layer and a second dielectric layer are formed to at least partially fill in openings within the grid pattern. | 09-11-2014 |
20140264504 | Method and Apparatus for Low Resistance Image Sensor Contact - A method and apparatus for a low resistance image sensor contact, the apparatus comprising a photosensor disposed in a substrate, a first ground well disposed in a first region of the substrate, the first ground well having a resistance lower than the substrate, and a ground line disposed in a region adjacent to the first ground well. The first ground well is configured to provide a low resistance path to the ground line from the substrate for excess free carriers in the first region of the substrate. The apparatus may optionally comprise a second ground well having a lower resistance than the first ground well and disposed between the first ground well and the ground line, and may further optionally comprise a third ground well having a lower resistance than the second ground well and disposed between the second ground well and the ground line. | 09-18-2014 |
20140264508 | Structure and Method for 3D Image Sensor - The present disclosure provides an embodiment of an image sensor structure that includes a first semiconductor substrate having a plurality of imaging sensors; a first interconnect structure formed on the first semiconductor substrate; a second semiconductor substrate having a logic circuit; a second interconnect structure formed on the second semiconductor substrate, wherein the first and the second semiconductor substrates are bonded together in a configuration that the first and second interconnect structures are sandwiched between the first and second semiconductor substrates; and a backside deep contact (BDCT) feature extended from the first interconnect structure to the second interconnect structure, thereby electrically coupling the logic circuit to the image sensors. | 09-18-2014 |
20140264682 | Interconnect Sructure for Stacked Device and Method - A stacked integrated circuit (IC) device and a method are disclosed. The stacked IC device includes a first semiconductor element and a second semiconductor element bonded on the first semiconductor element. The first semiconductor element includes a first substrate, a common conductive feature in the first substrate, a first inter-level dielectric (ILD) layer, a first interconnection feature and a conductive plug connecting the first interconnection feature to the common conductive feature. The second semiconductor element includes a second substrate, a second ILD layers over the second substrate and a second interconnection feature in second ILD layers. The device also includes a conductive deep plug connecting to the common conductive feature in the first semiconductor element and the second interconnection feature. The conductive deep plug is separated with the conductive plug by the first ILD layer. | 09-18-2014 |
20140264683 | Imaging Sensor Structure and Method - The present disclosure provides an embodiment of a method for fabricating a three dimensional (3D) image sensor structure. The method includes providing to an image sensor substrate having image sensors formed therein and a first interconnect structure formed thereon, and a logic substrate having a logic circuit formed therein and a first interconnect structure formed thereon; bonding the logic substrate to the image sensor substrate in a configuration that the first and second interconnect structures are sandwiched between the logic substrate and the image sensor substrate; and forming a conductive feature extending from the logic substrate to the first interconnect structure, thereby electrically coupling the logic circuit to the image sensors. | 09-18-2014 |
20140264947 | Interconnect Apparatus and Method - A method comprises bonding a first chip on a second chip, depositing a first hard mask layer over a non-bonding side of the first chip, depositing a second hard mask layer over the first hard mask layer, etching a first substrate of the first semiconductor chip using the second hard mask layer as a first etching mask and etching the IMD layers of the first chip and the second chip using the first hard mask layer as a second etching mask. | 09-18-2014 |
20150028403 | Semiconductor Switching Device Separated by Device Isolation - A device including a gate structure formed over a semiconductor substrate, the gate structure having extensions, a device isolation structure formed into the semiconductor substrate adjacent the gate structure, wherein the extensions are over a portion of the device isolation structure, and source/drain regions on both sides of the gate structure, the source/drain regions being formed in a gap in the device isolation structure and being partially enclosed by the extensions of the gate structure. | 01-29-2015 |
20150041945 | PICKUP DEVICE STRUCTURE WITHIN A DEVICE ISOLATION REGION - A device includes a device isolation region formed into a semiconductor substrate, a doped pickup region formed into the device isolation region, a dummy gate structure that includes at least one structure that partially surrounds the doped pickup region, and a via connected to the doped pickup region. | 02-12-2015 |
20150060963 | IMAGE SENSOR DEVICE - An image sensor device comprises an isolation well region within a substrate. A gate stack is over the isolation well region on the first surface of the substrate. The gate stack has an edge. A doped isolation feature is within the substrate between the isolation well region and the gate stack. The doped isolation feature surrounds an active area. The gate stack is over the active area. The doped isolation feature extends from the edge of the gate stack under the gate stack. | 03-05-2015 |
Patent application number | Description | Published |
20120127077 | METHOD AND APPARATUS FOR DETECTING DISPLACEMENT WITH SUB-PIXEL ACCURACY - A method of detecting displacement with sub-pixel accuracy includes the steps of: capturing a first array image and a second array image; interpolating the first array image to form a reference image; interpolating the second array image to form a comparison image; comparing the reference image with the comparison image so as to obtain a displacement. The present invention also provides an apparatus for detecting displacement with sub-pixel accuracy. | 05-24-2012 |
20130127714 | USER INTERFACE SYSTEM AND OPTICAL FINGER MOUSE SYSTEM - There is provided a user interface system including a slave device and a master device. The slave device provides light of two different wavelengths to illuminate a finger surface, receives reflected light from the finger surface to generate a plurality of image frames, calculates and outputs an image data associated with a predetermined number of the image frames. The master device calculates a contact status and a displacement of the finger surface and a physiological characteristic of a user according to the image data. | 05-23-2013 |
20130162601 | OPTICAL TOUCH SYSTEM - There is provided an optical touch system including at least one lighting unit, at least one image sensing module and a processing unit. The image sensing module is configured to capture light of a pointer and the lighting unit to generate a two-dimensional image and to convert entire of the two-dimensional image to a one-dimensional feature. The processing unit positions the pointer according to the one-dimensional feature. | 06-27-2013 |
20130215257 | OPTICAL NAVIGATION DEVICE - There is provided an optical navigation device including at least one light source, an image sensor and a processing unit. The light source illuminates a work surface in a first brightness value and a second brightness value. The image sensor receives reflected light from the work surface and outputs a first image frame corresponding to the first brightness value and a second image frame corresponding to the second brightness value. The processing unit calculates a differential image of the first image frame and the second image frame and identifies an operating state according to the differential image. | 08-22-2013 |
20130265230 | IMAGE POSITIONING METHOD AND INTERACTIVE IMAGING SYSTEM USING THE SAME - There is provided an image positioning method including the steps of: capturing an image frame with an image sensor; identifying at least on object image in the image frame; comparing an object image size of the object image with a size threshold and identifying the object image having the object image size larger than the size threshold as a reference point image; and positioning the reference point image. There is further provided an interactive imaging system. | 10-10-2013 |
20140145947 | PORTABLE COMPUTER HAVING POINTING FUNCTIONS AND POINTING SYSTEM - There is provided a pointing system including a first image sensor, a second image sensor and a processing unit. The first image sensor is configured to capture a first image. The processing unit is configured to recognize a predetermined hand posture according to the first image and to identify a click event according to a second image captured by the second image sensor when the predetermined hand posture is recognized. | 05-29-2014 |
20140168065 | MOTION DETECTION SYSTEM - The present invention provides a motion detecting system, which includes a light source module, a plurality of image sensors and a control unit. The light source module illuminates at least one object. The image sensors respectively detect the object under the light emitted by the light source module to generate a plurality of detection results. The control unit is coupled to the image sensors, and generates a control command according to the detection results. | 06-19-2014 |
20140191959 | POINTING SYSTEM AND DISPLAY HAVING IMPROVED OPERABLE RANGE - There is provided a pointing system including an image sensor, a plurality of reference marks and a processing unit. The image sensor is configured to capture image frames containing at least one reference mark image of the reference marks. The processing unit is configured to recognize an image number of the reference mark image and calculate an aiming point coordinate according to a positioning algorithm associated with the image number. | 07-10-2014 |
20140210715 | GESTURE DETECTION DEVICE FOR DETECTING HOVERING AND CLICK - There is provided a gesture detection device including two linear image sensor arrays and a processing unit. The processing unit is configured to compare sizes of pointer images in the image frames captured by the two linear image sensor arrays in the same period or different periods so as to identify a click event. | 07-31-2014 |
20140210716 | GESTURE DETECTION DEVICE FOR DETECTING HOVERING AND CLICK - There is provided a gesture detection device including two linear image sensor arrays and a processing unit. The processing unit is configured to compare sizes of pointer images in the image frames captured by the two linear image sensor arrays in the same period or different periods so as to identify a click event. | 07-31-2014 |
20140253497 | CAPACITIVE TOUCH DEVICE - There is provided a capacitive touch device including a controlling and processing circuit and a touch panel. The touch panel has a plurality of detection cells arranged in matrix. The controlling and processing circuit is configured to input a drive signal to the detection cells of the touch panel and read measurement data from the detection cells for post-processing, wherein the controlling and processing circuit reads a first sampling number of the measurement data of the detection cells in a normal mode and a second sampling number of the measurement data of the detection cells in a sleep mode, and the second sampling number is lower than the first sampling number. | 09-11-2014 |
Patent application number | Description | Published |
20120194417 | INPUT DEVICE WITH SWING OPERATION - An input device with swing operation includes a supporting frame, a flexible printed circuit installed on the supporting frame for outputting a signal, a supporting base fixed on the supporting frame, a cap pivoted to the supporting base, and a hook respectively pivoted to the supporting base and the cap. An inclined angle is formed between the hook and the supporting frame when the cap is not pressed down. The hook and the cap pivots relative to the supporting base when the cap is pressed down. The input device further includes a resilient component disposed between the flexible printed circuit and the cap for being pressed by the cap to actuate the flexible printed circuit when the cap is pressed down. | 08-02-2012 |
20120211343 | INPUT DEVICE WITH SWING OPERATION - An input device includes a printed circuit board for outputting a signal, a supporting base fixed on the printed circuit board, a metal dome switch installed on the printed circuit board, and a cap pivoted to the supporting base. A protrusion is formed on an end of the cap for contacting against the printed circuit board when the cap is not pressed down. The cap pivots relative to the supporting base when the cap is pressed down. An actuator is further formed on the cap and disposed on a side of the metal dome switch. The actuator of the cap presses down the metal dome switch to actuate the metal dome switch when the cap is pressed down. | 08-23-2012 |
20120211344 | INPUT DEVICE WITH SWING OPERATION - An input device includes a printed circuit board for outputting a signal, a supporting base fixed on the printed circuit board, and a cap pivoted to the supporting base. A protrusion is formed on an end of the cap for contacting against the printed circuit board when the cap is not pressed down. The cap pivots relative to the supporting base when the cap is pressed down. The input device further includes a resilient conductive component disposed between the printed circuit board and the cap for being pressed by the cap to conduct the printed circuit board when the cap is pressed down. | 08-23-2012 |
20120242094 | FIXING MECHANISM WITH SWING OPERATION - A fixing mechanism for fixing a component is disclosed. The fixing mechanism includes a base, a lateral wall disposed on the base, and a top plate connected to the lateral wall. A containing space is formed between the base, the lateral wall, and the top plate. The top plate presses against the component in a first direction and the lateral wall abuts against the component laterally when the component is contained inside the containing space. The fixing mechanism includes at least one hook. The hook includes a cantilever portion and a hooking portion. The cantilever portion is disposed on a side of the base, and a distance between the cantilever portion and the base is greater than a distance between the top plate and the base. The hooking portion engages with a lateral surface of the component in a second direction when the component is contained inside the containing space. | 09-27-2012 |
20120250234 | PRESS BUTTON AND PORTABLE COMPUTER USING THE SAME - A thin press button is provided. The press button includes a base plate, a link member, a cap, and at least one stopper. The link member, having a sliding recess, is disposed on the base plate. The cap pivots on the link member. The stopper has a first end and a second end, wherein the first end pivots on the cap and the second end is slidably disposed in the sliding recess. | 10-04-2012 |
20120250251 | PRESS BUTTON AND PORTABLE COMPUTER USING THE SAME - A flat press button is provided. The press button includes a base plate, a link member, and a cap. The link member is disposed on the base plate. The cap, having an embossed strip and a flange, pivots at the link member, wherein the embossed strip and the flange are formed at the opposing sites of the cap, and the embossed strip and the flange are operated in a pivotal swinging manner around a pivot axis to abut the base plate alternatively. | 10-04-2012 |
20120255845 | Keyswitch Structure - A keyswitch structure includes a bottom board, a circuit board disposed on the bottom board, a resilient member, a key cap and two supporting members. The bottom board is formed with two first holes spaced apart from each other. The key cap is located over the bottom board, and includes two pivoting portions that are spaced apart from each other. Each supporting member has an end pivoted to a respective one of the pivoting portions of the key cap, and an opposite end pivoted to the bottom board. When the key cap is moved toward the bottom board and presses the resilient member, each of the supporting members engages at least partly a corresponding one of the first holes, and the resilient member triggers the circuit board so as to generate a corresponding signal. | 10-11-2012 |
20120268902 | Fixing Mechanism and Electronic Device Having the Same - A fixing mechanism for fixing a magnetic element on a base wall includes a frame, a retaining member, and a blocker. The frame is adapted to be connected to and is adapted to cooperate with the base wall to define a receiving space for receiving the magnetic element, and an opening communicating with the receiving space for entry of the magnetic element into the receiving space along a first assembly direction. The retaining member is adapted to be connected to the base wall in proximity to the frame. The blocker is engaged to the retaining member, and blocks the opening. | 10-25-2012 |
20120285813 | KEYSWITCH DEVICE AND ASSEMBLY OF SUPPORTING SEAT AND KEY CAP THEREOF - A keyswitch device includes a supporting seat, a key cap, a circuit board disposed on the supporting seat, and an elastic member located between the key cap and the circuit board. The supporting seat includes a base board and two first confining members that are formed on the base board and that are spaced apart from each other. The key cap includes a cap body and two first hooks that engage respectively the first confining members, thereby inhibiting the key cap to move in horizontal directions with respect to the supporting seat, and allowing the key cap to move vertically in a range equal to the height of the first blocking parts of the first confining members. When the key cap is moved downward, the elastic member deforms to press the circuit board so as to generate a corresponding signal. | 11-15-2012 |
20120286908 | ELECTRONIC DEVICE AND RETAINING MECHANISM FOR RETAINING A MAGNETIC ELEMENT OF THE ELECTRONIC DEVICE - An electronic device includes a magnetic switch, a magnetic element for actuating the magnetic switch to send a control signal to an electronic element module, and a retaining mechanism for retaining the magnetic element at a housing. The retaining mechanism includes a retaining casing, a connecting member, and a blocking member. The retaining casing is disposed on and cooperates with the housing to define a receiving space to receive the magnetic element, and has an opening in spatial communication with the receiving space. The blocking member is connected to the housing by the connecting member and is adjacent to the opening to prevent removal of the magnetic element from the receiving space through the opening. | 11-15-2012 |
20120287561 | LOCKING MECHANISM AND ELECTRONIC DEVICE HAVING THE SAME - A locking mechanism is adapted for locking an object, and includes a housing and a locking member. The housing includes a base wall and a cover extending from the base wall to form amounting space therebetween, and amounting port in spatial communication with the mounting space and adapted for permitting the object to be moved into the mounting space therethrough in amounting direction. The locking member is snapped onto the cover so as to prevent removal of the object from the mounting space through the mounting port in a direction opposite to the mounting direction, in such a manner that a portion of the locking member is disposed in proximity to the mounting port and abuts against one of the sides of the object facing the mounting port. | 11-15-2012 |
20120287595 | Electronic Device and Fixing Structure Therefor - An electronic device includes a first body, a magnetic switch disposed in the first body, and a second body connected pivotally to and covering openably the first body. The second body includes a housing, and an electronic component module disposed in the housing and coupled electrically to the magnetic switch. A fixing structure is disposed in the housing and includes a casing and a blocker. The casing defines a receiving space and an opening that communicates with the receiving space. A magnetic element is disposed in the receiving space through the opening. The blocker is rotatable to block the opening and prevent the magnetic element from moving out of the receiving space through the opening. | 11-15-2012 |
20120297689 | DOOR STRUCTURE - A door structure includes a cover for covering an accommodating space formed on a housing, a lodging part connected to an end of the cover for lodging in a slot on the housing, and a first inverse hook part connected to the housing and disposed adjacent to a hole on the housing. A first inclined surface is formed on a side of the first inverse hook part. The door structure further includes a second inverse hook part connected to a side of the cover. A second inclined surface is formed on a side of the second bard part. The second inverse hook part is inserted into the hole on the housing so that the second inclined surface of the second inverse hook part wedges with the first inclined surface of the first inverse hook part. | 11-29-2012 |
20120307428 | ELECTRONIC DEVICE, AND ASSEMBLY OF AN ELECTRONIC DEVICE AND A BATTERY - In an assembly of an electronic device and a battery, the battery includes a protrusion that is formed with an engaging hole, and the electronic device includes a housing and an engaging unit. The housing defines a receiving space and is formed with a first opening that is adapted for extension of the protrusion. The engaging unit includes a main body pivotable relative to the housing, an actuating member accessible from outside of the receiving space, and an engaging hook disposed on the main body adjacent to the first opening. The engaging hook is engageable with the engaging hole in the protrusion. The actuating member is actuable to pivot the main body so as to disengage the engaging hook from the engaging hole. | 12-06-2012 |
20130064537 | CAMERA ROTATION MECHANISM AND PORTABLE ELECTRONIC APPARATUS THEREWITH - The invention discloses a camera rotation mechanism and a portable electronic apparatus therewith. The camera rotation mechanism includes a rotatable carrier, a bearing structure, and a rotating mechanism, which are disposed in a casing. The rotatable carrier includes a carrier body and a rotatable shaft connected to the carrier body and bore by the bearing structure. A camera module is disposed on the carrier body such that a lens of the camera module is exposed through a lens hole of the casing. The rotating mechanism is connected to the rotatable shaft and includes a rotation operation part partially exposed through a slot hole of the casing and capable of being rotated to rotate the carrier body through the rotatable shaft. Therefore, a user can use the camera rotation mechanism to adjust the disposition angle of the lens, which solves the impossibility of adjusting a fixed camera in the prior art. | 03-14-2013 |
20130093305 | ELECTRONIC DEVICE WITH A BATTERY FASTENING MECHANISM - An electronic device includes a battery module, a housing having first and second panels, and a fastening mechanism. The fastening mechanism has a fixing portion extending from the battery module and engaging an opening in the first panel, a first fastening portion formed in the fixing portion, a cantilever formed in the second panel, and a second fastening portion formed on the cantilever and engaging the first fastening portion. The cantilever can be bent away from the fixing portion, such that the second fastening portion is disengaged from the first fastening portion, and that the fixing portion is urged by a protrusion on the cantilever to be disengaged from the opening. | 04-18-2013 |
20130314345 | INFORMATION INPUT UNIT AND ELECTRONIC DEVICE - An information input unit includes a carrying module disposed on a base and movable between a first position and a second position, and an input module disposed on and moveable along with the carrying module. The input module includes a touch-pad mechanism including a touch pad configured to be pressed to a pressed position and to generate a touch signal upon being touched, a resilient supporting mechanism resiliently supporting the touch pad to enable the touch pad to return to its original position from the pressed position, and a pressing mechanism disposed below the touch pad and configured to generate a pressing signal upon being pressed by the touch pad. | 11-28-2013 |
20140118901 | LIFTING MECHANISM AND ELECTRONIC DEVICE THEREWITH - A lifting mechanism includes a lifting member, a first magnetic member, a rotating arm, a second magnetic member and a resilient member. The lifting member is pivoted to a first casing. The first magnetic member is fixed on the lifting member. The rotating arm is pivoted to a second casing. The second magnetic member is fixed on the rotating arm for attracting the first magnetic member as being rotated with the rotating arm to where the second magnetic member is aligned with the first magnetic member, so as to retract the lifting member inside the first casing. The resilient member resiliently abuts against the second casing and the lifting member for pushing the lifting member as being rotated with the rotating arm to where the second magnetic member is not aligned with the first magnetic member, so as to expand the lifting member out of the first casing. | 05-01-2014 |
20140126134 | PORTABLE ELECTRONIC DEVICE WITH HINGE STRUCTURE - portable electronic device includes a host module, a display module and a hinge structure. The hinge structure is pivotally connected to the host module and the display module. The hinge structure includes a support frame, a rotating component and two pivotal components. An end of the rotating component is installed inside the support frame and another end of the rotating component is installed inside the display module, so that the display module is capable of rotating in a first rotating direction relative to the support frame. The two pivotal components are disposed at opposite sides of the support frame and separated from the rotating component. An end of each pivotal component is installed inside the support frame and another end of each pivotal component is installed inside the host module, so that the display module is capable of rotating in a second rotating direction relative to the host module. | 05-08-2014 |
Patent application number | Description | Published |
20120068279 | DOMAIN WALL ASSISTED SPIN TORQUE TRANSFER MAGNETRESISTIVE RANDOM ACCESS MEMORY STRUCTURE - A semiconductor memory device includes a first ferromagnetic layer magnetically pinned and positioned within a first region of a substrate; a second ferromagnetic layer approximate the first ferromagnetic layer; and a barrier layer interposed between the first ferromagnetic layer and the first portion of the second ferromagnetic layer. The second ferromagnetic layer includes a first portion being magnetically free and positioned within the first region; a second portion magnetically pinned to a first direction and positioned within a second region of the substrate, the second region contacting the first region from a first side; and a third portion magnetically pinned to a second direction and positioned within a third region of the substrate, the third region contacting the first region from a second side. | 03-22-2012 |
20130015538 | MAGNETORESISTIVE RANDOM ACCESS MEMORY AND METHOD OF MAKING THE SAMEAANM LIU; Ming-TeAACI TaipeiAACO TWAAGP LIU; Ming-Te Taipei TWAANM CHIANG; Tien-WeiAACI HsinchuAACO TWAAGP CHIANG; Tien-Wei Hsinchu TWAANM KAO; Ya-ChenAACI Fuxing TownshipAACO TWAAGP KAO; Ya-Chen Fuxing Township TWAANM CHEN; Wen-ChengAACI HsinchuAACO TWAAGP CHEN; Wen-Cheng Hsinchu TW - A magnetoresistive random access memory (MRAM) cell includes a magnetic tunnel junction (MTJ), a top electrode disposed over the MTJ, a bottom electrode disposed below the MTJ, and an induction line disposed to one side of the MTJ. The induction line is configured to induce a perpendicular magnetic field at the MIJ. | 01-17-2013 |
20130038418 | CONTACTLESS COMMUNICATIONS USING FERROMAGNETIC MATERIAL - A communications structure comprises a first semiconductor substrate having a first coil, and a second semiconductor substrate having a second coil above the first semiconductor substrate. Inner edges of the first and second coils define a boundary of a volume that extends below the first coil and above the second coil. A ferromagnetic core is positioned at least partially within the boundary, such that a mutual inductance is provided between the first and second coils for wireless transmission of signals or power between the first and second coils. | 02-14-2013 |
20130155759 | Test Structures, Methods of Manufacturing Thereof, Test Methods, and MRAM Arrays - Test structures, methods of manufacturing thereof, test methods, and magnetic random access memory (MRAM) arrays are disclosed. In one embodiment, a test structure is disclosed. The test structure includes an MRAM cell having a magnetic tunnel junction (MTJ) and a transistor coupled to the MTJ. The test structure includes a test node coupled between the MTJ and the transistor, and a contact pad coupled to the test node. | 06-20-2013 |
20130188418 | MAGNETORESISTIVE RANDOM ACCESS MEMORY - A magnetoresistive random access memory (MRAM) cell includes a magnetic tunnel junction (MTJ), a top electrode disposed over the MTJ, a bottom electrode disposed below the MTJ, and an induction line disposed above or below the MTJ. The induction line is configured to induce a magnetic field at the MTJ. | 07-25-2013 |
20130200475 | MRAM Device and Fabrication Method Thereof - A magnetoresistive random access memory (MRAM) device and a method of manufacture are provided. The MRAM device comprises a magnetic pinned layer, a compound GMR structure acting as a free layer, and a non-magnetic barrier layer separating the pinned and GMR layers. The barrier layer is provided to reduce the magnetic coupling of the free layer and GMR structure, as well as provide a resistive state (high or low) for retaining binary data (0 or 1) in the device. The GMR structure provides physical electrode connectivity for set/clear memory functionality which is separated from the physical electrode connectivity for the read functionality for the memory device. | 08-08-2013 |
20140256063 | CONTACTLESS COMMUNICATIONS USING FERROMAGNETIC MATERIAL - A communications structure comprises a first semiconductor substrate having a first coil, and a second semiconductor substrate having a second coil above the first semiconductor substrate. Inner edges of the first and second coils define a boundary of a volume that extends below the first coil and above the second coil. A ferromagnetic core is positioned at least partially within the boundary, such that a mutual inductance is provided between the first and second coils for wireless transmission of signals or power between the first and second coils. | 09-11-2014 |
20140264463 | Integration of Magneto-Resistive Random Access Memory and Capacitor - The present disclosure provides one embodiment of a semiconductor structure that includes a first metal layer formed on a semiconductor substrate, wherein the first metal layer includes a first metal feature in a first region and a second metal feature in a second region; a second metal layer disposed on the first metal layer, wherein the second metal layer includes a third metal feature in the first region and a fourth metal feature in a second region; a magneto-resistive memory device sandwiched between the first metal feature and the third metal feature; and a capacitor sandwiched between the second metal feature and the fourth metal feature. | 09-18-2014 |
20150048433 | Contact Formation for Split Gate Flash Memory - An integrated circuit structure includes a plurality of flash memory cells forming a memory array, wherein each of the plurality of flash memory cells includes a select gate and a memory gate. A select gate electrode includes a first portion including polysilicon, wherein the first portion forms select gates of a column of the memory array, and a second portion electrically connected to the first portion, wherein the second portion includes a metal. A memory gate electrode has a portion forming memory gates of the column of the memory array. | 02-19-2015 |
Patent application number | Description | Published |
20120026072 | ACTIVE DEVICE ARRAY SUBSTRATE, DISPLAY PANEL AND REPAIR METHOD - A display panel, a repair method, and an active device array substrate including a substrate, first and second signal lines, active devices, pixel electrodes, a bus line, and a switch device are provided. The bus line and the switch device are disposed outside a display region of the active device array substrate. The switch device has a gate coupled to the bus line, a first electrode coupled to a signal source, and a second electrode coupled to one of the first signal lines. The first and second electrodes are comb-shaped. The first electrode includes first fingers parallel to one another and a first connection portion connected to the first fingers. The second electrode includes second fingers parallel to one another and a second connection portion connected to the second fingers. The first and second fingers are arranged alternately. A portion of the first electrode is located outside the gate. | 02-02-2012 |
20120097955 | THIN FILM TRANSISTOR AND PIXEL STRUCTURE HAVING THE THIN FILM TRANSISTOR - A thin film transistor (TFT) and a pixel structure having the TFT are provided. The TFT is configured on a substrate. Besides, the TFT includes a gate, a gate insulation layer, a source, a channel layer, and a drain. The gate insulation layer covers the gate and the substrate. The source is configured on a portion of the gate insulation layer. The channel layer is configured on the gate insulation layer and covers a portion of the source located above the gate. The drain is configured on and electrically connected to the channel layer. | 04-26-2012 |
20120133607 | TOUCH-SENSING DISPLAY PANEL, TOUCH PANEL, TOUCH-SENSING DEVICE AND TOUCH-SENSING CIRCUIT - The present application provides a touch-sensing display panel comprising a display panel and a touch-sensing device disposed above the display panel. The touch-sensing device comprises a plurality of select lines, a plurality of readout lines and a plurality of capacitive touch-sensing units arranged in array. Each of the capacitive touch-sensing units comprises a transistor and a touch-sensing pad, each of the transistors comprises a gate electrode electrically connected to one of the select lines, a source electrode electrically connected to a reference voltage, a drain electrode electrically connected to one of the readout lines, and a channel layer electrically coupled to the touch-sensing pad. | 05-31-2012 |
20130134489 | PIXEL STRUCTURE AND FABRICATING METHOD THEREOF - A fabrication method of a pixel structure and a pixel structure are provided. A first patterned metal layer including scan lines and a gate is formed on a substrate. A first insulation layer, a semiconductor layer, an etching stop pattern and a metal layer are formed sequentially on the first patterned metal layer. The metal layer and the semiconductor layer are patterned to form a second patterned metal layer and a patterned semiconductor layer. The second patterned metal layer includes data lines, a source and a drain. The patterned semiconductor layer includes a first semiconductor pattern completely overlapping the second patterned metal layer and a second semiconductor pattern without overlapping the second patterned metal layer, wherein the second semiconductor pattern includes a channel pattern and a marginal pattern. The channel pattern is between the source and the drain and the marginal pattern surrounds the first semiconductor pattern. | 05-30-2013 |
20130168682 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device and a manufacturing method thereof are provided. The semiconductor device includes a gate, a channel layer, a gate insulation layer, a source, a drain and a silicon-aluminum-oxide layer. The gate is disposed on a substrate. The channel layer is disposed on the substrate. The channel layer overlaps the gate. The gate insulation layer is disposed between the gate and the channel layer. The source and the drain are disposed on two sides of the channel layer. The silicon-aluminum-oxide layer is disposed on the substrate and covers the source, the drain and the channel layer. | 07-04-2013 |
20140291742 | PIXEL STRUCTURE AND FABRICATING METHOD THEREOF - A fabrication method of a pixel structure and a pixel structure are provided. A first patterned metal layer including scan lines and a gate is formed on a substrate. A first insulation layer, a semiconductor layer, an etching stop pattern and a metal layer are formed sequentially on the first patterned metal layer. The metal layer and the semiconductor layer are patterned to form a second patterned metal layer and a patterned semiconductor layer. The second patterned metal layer includes data lines, a source and a drain. The patterned semiconductor layer includes a first semiconductor pattern completely overlapping the second patterned metal layer and a second semiconductor pattern without overlapping the second patterned metal layer, wherein the second semiconductor pattern includes a channel pattern and a marginal pattern. The channel pattern is between the source and the drain and the marginal pattern surrounds the first semiconductor pattern. | 10-02-2014 |
Patent application number | Description | Published |
20120287562 | Expandable Keyboard Device - An expandable keyboard device includes a keyboard, and a supporting assembly having interconnected first and second panels. The second panel is adapted to connect with an electronic device. The supporting assembly is movable relative to the keyboard between an unfolded state, where the first panel extends upwardly relative to the keyboard for supporting the electronic device above the keyboard, and a folded state, where the second panel along with the electronic device cover the keyboard. An electrical connector is disposed in the housing for electrical connection with the electronic device. A connecting unit interconnects the supporting assembly and the keyboard. | 11-15-2012 |
20130127407 | Wireless Charging System and Related Method for Transmitting Data - The invention discloses a wireless charging system for transmitting data. The wireless charging system includes a charging device for wirelessly transmitting a source signal and adjusting a current corresponding to the source signal according to a transmitted datum, and a receiving device which includes a first coil for receiving the source signal according to the electromagnetic effect and generating a corresponding AC current signal, and an output module for obtaining the transmitted datum according to the AC current signal. | 05-23-2013 |
20130241477 | Wireless Charging System and Method for Controlling the Same - A wireless charging system and a method for controlling the wireless charging system are disclosed. The wireless charging system is used for charging a rechargeable device. The wireless charging system includes a charging circuit, a power supply module, a power switching module, a power sensing terminal, and a comparison module. The power supply module is used for providing a DC power signal. The power switching module converts the DC power signal to an AC power signal based on a switching frequency. The power sensing terminal is used for sensing a coupling voltage according to the AC power signal to charge the rechargeable device. The comparison module compares the coupling voltage with a default value, wherein the default value is set according to the switching frequency. When the coupling voltage is less than the default value, the comparison module controls the power switching module to increase the switching frequency. | 09-19-2013 |
20130241846 | METHOD FOR SYNCING DIFFERENT TOUCHING SYSTEMS - A method for syncing different touching systems is disclosed. A computer is electrically connected with a first input device and a second input device respectively, wherein an input of the first input device is controlled by the second input device. The method uses the computer to make the first input device and the second device synchronous, and the method comprises: defining at least one correction point on the first input device; receiving time tags of signal inputs at the correction points of the first input device and the second input device respectively; calculating time differences for each time tag at each correction point with respect to other correction points; averaging all time differences for all correction points to determine a deviation value; and delaying a signal transmission of the second input device according to the deviation value. | 09-19-2013 |
20130257812 | TOUCH STYLUS CAPABLE OF DETECTING PRESSURE ON A TIP AND RELATED OPTICAL-MECHANICAL SYSTEM - A touch stylus capable of detecting pressure on its tip is disclosed in the present disclosure. The touch stylus includes a body, a tip, and a pressure sensing module disposed between the body and the tip for detecting a pressure on the tip. The pressure sensing module includes a lighting unit, a pressure sensing unit connected to the tip, and a controller electrically connected to the lighting unit and the pressure sensing unit. The pressure sensing unit detects a movement of the tip relative to the body, and generates a corresponding electrical signal. The controller receives the electrical signal to drive the lighting unit for generating a corresponding optical signal. A scintillating frequency of the optical signal and a value of the electrical signal are in direct proportion, and an optical detector can transform the optical signal into the pressure on the tip. | 10-03-2013 |
20130257824 | STYLUS CAPABLE OF DETECTING PRESSURE ON A TIP - A stylus capable of detecting pressure on its tip is disclosed in the present disclosure. The stylus includes a holder, a tip and a pressure sensing module. The pressure sensing module can detect the pressure on the tip. The pressure sensing module includes a retractable body disposed inside the holder and connected to the tip. The retractable body includes a base, a reference component disposed on an end of the base and fixed inside the holder, and a movable component disposed on the other end of the base and connected to the tip. The movable component can move relative to the reference component with the tip. The pressure sensing module further includes a sensor disposed by the retractable body for detecting a movement of the movable component relative to the reference component, so that value of the movement can be analyzed for calculating value of the pressure. | 10-03-2013 |
20140179138 | PROTECTION DEVICE FOR PROTECTING A POWER CABLE CONNECTOR AND RELATED POWER SUPPLY AND ELECTRONIC SYSTEM - A protection device for protecting a power cable connector includes one sensor, a separation mechanism and a processing unit. The sensor is for sensing a relative distance and a moving speed of an external object. The separation mechanism is connected to the power cable connector in a separable manner. The processing unit is electrically connected to the sensor for controlling the separation mechanism to separate from the power cable connector as the sensor senses that the relative distance is less than a separation distance and the moving speed is not zero. | 06-26-2014 |
20140278204 | IDENTIFICATION SYSTEM AND METHOD FOR IDENTIFYING AN OBJECT - An identification system includes a plurality of sensing units, a storage module, a computing unit and an identification unit. The plurality of sensing units is for sensing a plurality of pressure values of a plurality of pressure points of a first object disposed on the plurality of sensing units. The storage module is for storing a set of characteristic information of a second object. The computing unit is electrically connected to the plurality of sensing units and for computing at least three distance characteristic values and at least three angle characteristic values after receiving the plurality of pressure values. The identification unit is electrically connected to the storage module and the computing unit for comparing the set of characteristic information with the at least three distance characteristic values and the at least three angle characteristic values, so as to indentify whether the first object corresponds to the second object. | 09-18-2014 |
20150035760 | CONTROL SYSTEM AND METHOD FOR DEFINING FUNCTION THEREOF - A control system and a method for defining function thereof are provided. The control system includes a touchpad and a key sheet, wherein the touchpad includes a touch sensing surface and the key sheet includes a first surface and a second surface opposite to the first surface. The key sheet is detachably disposed on the touch sensing surface with the second surface facing toward the touch sensing surface. The second surface comprises at least one identification pattern for generating an attribute recognition signal when the at least one identification pattern contacts or approaches the touch sensing surface. The attribute recognition signal reflects features of the identification patterns and is used to determine a type of a controllable device. The features include one or a combination of a number of the identification patterns, a touch position of each identification pattern, and a shape of each identification pattern. | 02-05-2015 |
20150061994 | GESTURE RECOGNITION METHOD AND WEARABLE APPARATUS - A wearable apparatus includes a user interface, a motion sensor, a microprocessor and a central processing unit (CPU). In an operation mode, the motion sensor senses a current hand movement trajectory (HMT). The microprocessor generates a velocity curve along a coordinate axis according to the current HMT, and samples the velocity curve according to a first predetermined velocity and a second predetermined velocity to output velocity sampling points. The microprocessor further determines whether a matching number between the velocity sampling points and velocity feature points is greater than a threshold. The current HMT matches a predetermined HMT when the matching number is greater than the threshold. The CPU performs a system operation corresponding to the default HMT when the current HMT matches the predetermined HMT. | 03-05-2015 |
Patent application number | Description | Published |
20110212975 | ANTIVIRAL COMPOUNDS AND METHODS OF MAKING AND USING THEREOF - Compounds which exhibit antiviral activity, particularly against influenza virus, and methods of making and using thereof are described herein. In one embodiment, the compounds are heterocyclic amides containing piperazine and isozazole rings and optionally substituted with one or more substituents. The compounds can be formulated with one or more pharmaceutically acceptable excipients to form compositions suitable for enteral or parenteral administration. The compounds are preferably used to treat or prevent Influenza A infections, such as H1N1, H2N2, H3N2, H5N1, H7N7, H1N2, H9N2, H7N2, H7N3, and H10N7. | 09-01-2011 |
20120142701 | COMPOUNDS AND METHODS FOR THE TREATMENT OF PROLIFERATIVE DISEASES - Cell-based and cell-free assays are disclosed that detect compounds that promote aggregation of proteins, glycoproteins, and protein-nucleic acid complexes. Also disclosed are pharmaceutical formulations useful for treating or preventing viral infections, bacterial infections, cancer, and diseases involving hyper-proliferative cells. | 06-07-2012 |
20120149715 | COMPOUNDS AND METHODS FOR THE TREATMENT OF VIRAL INFECTIONS - High throughput and virtual screening methods are disclosed that can identify potential anti-viral agents. The virtual screening methods identify agents that interact with a viral nucleoprotein binding site. The high throughput methods identify compounds that inhibit viral infection by binding to viral nucleoprotein. Also disclosed are pharmaceutical formulations useful for treating or preventing viral infections, especially influenza A. | 06-14-2012 |
20130325429 | Compounds and Methods for the Treatment of Viral Infections - High throughput and virtual screening methods are disclosed that can identify potential anti-viral agents. The virtual screening methods identify agents that interact with a viral nucleoprotein binding site. The high throughput methods identify compounds that inhibit viral infection by binding to viral nucleoprotein. Also disclosed are pharmaceutical formulations useful for treating or preventing viral infections, especially influenza A. | 12-05-2013 |
20140155478 | ANTIFUNGAL COMPOUND AND USES THEREOF - Disclosed herein is a novel antifungal compound, derivatives that are used to treat fungal infections. In a specific embodiment, the compound is a small molecule. In a specific embodiment, the compound described herein inhibits yeast to hypha transition under robust hyphal inducing conditions at lower concentration of the molecule. Also disclosed is a composition comprising the antifungal compound. In a specific embodiment, the composition is a pharmaceutical composition. Also disclosed is a method of treating and/or preventing fungal infection using the disclosed compound. The disclosed compound exhibits antifungal activity against wide range of fungal species at slightly higher concentrations. Antifungal compound disclosed herein is used as anti-biofilm agent against fungal infections. | 06-05-2014 |