Kamphuis
Aaron M. Kamphuis, Rockford, MI US
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20140214554 | ELECTRONIC COMMERCE TRANSACTIONS WITHIN A MARKETING SYSTEM THAT MAY CONTAIN A MEMBERSHIP BUYING OPPORTUNITY - The present invention is directed to a system and method for providing complete electronic commerce (“E-Commerce”) transactions and solutions for a marketing company's products via the World Wide Web, including facilities for signing up new customers and recruiting, training and supporting new Independent Business Owners through an interactive online process. In another aspect, the present invention relates to the combination of a marketing business with a membership buying opportunity using both electronic commerce and face-to-face transactions. The present invention is also directed to a system and method for combining a marketing business with a membership buying opportunity, so that Independent Business Owners participating in the marketing plan can introduce customers to a membership buying opportunity and earn bonuses or commissions based on the purchases by those members, while Members in the buying opportunity can consume products or, at their option, qualify to become Independent Business Owners. | 07-31-2014 |
Bert-Jan Kamphuis, Vosselaar BE
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20110206879 | Cobalt Bearing Polymeric Compositions - The invention relates to polymeric cobalt bearing compounds, in particular for use as metal-rubber adhesion promoters (RAPs) in tires, belts and hoses. Known active substances are a.o. cobalt stearates, naphthenates, resinates, decanoates, boro-decanoates and many other forms of acylates. While these substances appear to enhance the metal-rubber adhesion, all of them also come with significant drawbacks, a.o. linked to the relatively high bioavailability of cobalt in these substances. The invention concerns more particularly a polymer comprising Co-carboxylate sequences, with a Co content of at least 3% by weight, and with a mean molecular weight of more than 2000. Several synthesis methods, allowing to reach relatively high Co concentrations in the polymer, illustrate the invention. The invented polymers show a strongly reduced bioavailability of Co compared to currently available products, as demonstrated by aqueous leaching tests. As RAPs, they perform similarly to commercial products, as shown by pullout tests. | 08-25-2011 |
Dwain Kamphuis, West Olive, MI US
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20110146721 | FILTER CLEANING TOOL AND METHOD - A tool for removing particulate matter from a diesel particulate filter (DPF) includes a container defining a chamber that has an open end, and a support associated with the open end that supports a first axial end of the DPF and forms a seal around an outside surface of the can of the DPF and the container. An air nozzle mounted proximate to a second axial end of the DPF directs a narrow flow of air through the DPF that passes through a portion of the DPF element bundle and exits through the first axial end into the container. | 06-23-2011 |
20140360453 | VALVE GUIDE INSERT WITH FRICTIONAL PRE-BROACH RETENTION FEATURE - A valve guide insert for lining and relining a valve guide bore in an internal combustion engine includes a one-piece, thin-walled, cylindrically-shaped metallic tube made from reformable bearing material having first and second ends and an intermediate portion. An inwardly tapered portion is disposed at the first end, wherein an end diameter of the inwardly tapered portion is less than an outer diameter of a valve guide bore, and wherein the outer diameter of the intermediate section is greater than an inner diameter of a valve guide bore. A longitudinal slit is included having a stepped portion along a length of the longitudinal slit. An interference portion is disposed proximate the second end, wherein the interference portion is configured to substantially secure the valve guide insert within a valve guide bore. | 12-11-2014 |
Dwain L. Kamphuis, West Olive, MI US
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20090297286 | CUTTER FOR MACHINING COUNTERBORE IN ENGINE BLOCK - A tool for resurfacing a counterbore of a cylinder bore in an engine block includes a holder fixedly attached to the engine block using existing threaded holes, and a cutter rotatably supported by the holder and axially movable while being rotated. The cutter is positioned to cut and resurface a counterbore in the top of the cylinder bore. A plurality of springs bias the cutter head axially toward the engine block while rotating the cutter, thus providing a uniform force while cutting and resurfacing the counterbore. A ratchet wrench matably engages the upper end of the shaft to rotate the cutter, with the ratchet wrench extending in a single lateral direction from the shaft. A related method is also discussed. | 12-03-2009 |
20110005309 | Tire Runout Gauge - A runout gauge includes a stand (such as a tripod), and a gauge bar pivotally mounted on the stand. The gauge bar includes a wheel on its upper end positioned above the pivot for rollingly engaging an outer surface of a vehicle tire, and further includes a pointer located a greater second distance below the pivot. By this arrangement, movement of the wheel on the tire due to runout causes the pointer to move along an amplified path having a length greater than the movement of the wheel, thus making it easier to read. The illustrated stand includes indicia for measuring movement of the pointer, and also includes gauge slides on a frame component that abut the pointer in a manner showing an extent of the pointer's movement, which relates to the runout on the tire. | 01-13-2011 |
Frank Kamphuis, Neustadt A. Rbge DE
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20150353755 | Microstructured Paint - The present invention relates to a waterborne paint composition, comprising a non-film-forming poly(styrene acrylate) having a glass transition temperature (T | 12-10-2015 |
Kevin L. Kamphuis, Round Rock, TX US
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20150309539 | Information Handling System Housing Synchronization with Differential Torque Hinge - An information handling system hinge assembly simulates synchronous and other types of motions by applying friction varied based upon dual-axis hinge rotational position to generate differential torque at an information handling system chassis and lid portion. A connecting device maintains first and second hinges in position relative to each other during rotation of the chassis and lid portions, such as through 360 degrees of rotation between closed and tablet positions. | 10-29-2015 |
Martijn Hendrik Kamphuis, Veldhoven NL
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20100157260 | LITHOGRAPHIC APPARATUS AND DEVICE MANUFACTURING METHOD - A lithographic apparatus having a table including a target and/or a sensor and a liquid displacing device to displace liquid from the target and/or sensor using a localized gas flow is disclosed. The liquid displacement device may be positioned at various positions, e.g. mounted to a liquid handling device at an exposure station, adjacent or in a transfer path between the exposure station and a measurement station, at a load/unload station or adjacent a sensor. | 06-24-2010 |
20110273679 | LITHOGRAPHIC APPARATUS AND DEVICE MANUFACTURING METHOD - A lithographic apparatus having a table including a target and/or a sensor and a liquid displacing device to displace liquid from the target and/or sensor using a localized gas flow is disclosed. The liquid displacement device may be positioned at various positions, e.g. mounted to a liquid handling device at an exposure station, adjacent or in a transfer path between the exposure station and a measurement station, at a load/unload station or adjacent a sensor. | 11-10-2011 |
Patrick Joseph Gerardus Hendrikus Kamphuis, De Bilt NL
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20140066397 | METHOD FOR TREATING NEUROTRAUMA - The invention relates to a composition comprising: i) one or more of uridine and cytidine, or salts, phosphates, acyl derivatives or esters thereof; ii) a lipid fraction comprising at least one of docosahexaenoic acid (22:6; DHA), eicosapentaenoic acid (20:5; EPA) and docosapentaenoic acid (22:5; DPA), or esters thereof, in which the lipid fraction comprises less than 2 weight % of □-linolenic acid (ALA), calculated on the weight of all fatty acids; iii) choline, or salts or esters thereof; for use in the prevention or treatment of neurotrauma, traumatic brain injury, cerebral palsy and spinal cord injury. | 03-06-2014 |
Robert Engelbert Hubert Kamphuis, Ojakkala FI
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20100298014 | PROVISION OF VALUE ADDED SHORT MESSAGE SERVICES - A network node of a communications system that routes short messages in a home network of a mobile station provides a service where one or more functions are invoked in response to receiving a request to forward a short message addressed to the mobile station. When the network node receives a request to forward a short message it determines a type of transmission of the received short message, where the type of transmission indicates whether or not a request for forwarding the same short message has been previously received in the network node. The network node then invokes functions of the service according to the determined type of transmission. | 11-25-2010 |
20110098066 | CHARGING FOR SHORT MESSAGE DELIVERY - A short message service (SMS) node detects that at least one request to deliver a plurality of short messages (SM) originates from a single user. Information (MSISDN, ISMI) related to recipients of the plurality of short messages is combined in a signaling message, and the signaling message is transmitted to a charging function (OFCS, OCS). | 04-28-2011 |
20130340092 | SOFTWARE LICENCE CONTROL - A system for software license control is described that is particular useful for use in a virtualized system, such as a cloud computing system. A module can be made available for use within the virtualized network, wherein a license fee is payable for use of the module. The module includes a license file that can be located wherever it is required. In addition, a central license file is provided at an administration node. The central license file is configured such that it can only be operated from that administration node, thereby preventing the copying of that file. The license file operating in the virtual network communicates with the central license file. The central license file controls the use of the licensed module. | 12-19-2013 |
Tonny Kamphuis, Lent NL
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20100181568 | INTEGRATED CIRCUITS ON A WAFER AND METHODS FOR MANUFACTURING INTEGRATED CIRCUITS - Integrated circuits ( | 07-22-2010 |
20110156237 | FAN-OUT CHIP SCALE PACKAGE - A chip scale package has a semiconductor die having an array of die bond pads arranged with a bond pad density per unit area, embedded in a molded die support body having a surface supporting an array of conducting contacts, each of the contacts connected by an electrical lead to a corresponding one of the die bond pads. | 06-30-2011 |
20130264691 | INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING THE SAME - Presented is an integrated circuit packaged at the wafer level wafer (also referred to as a wafer level chip scale package, WLCSP), and a method of manufacturing the same. The WLCSP comprises a die having an electrically conductive redistribution layer, RDL, formed above the upper surface of the die, the RDL defining a signal routing circuit. The method comprises the steps of: depositing the electrically conductive RDL so as to form an electrically conductive ring surrounding the signal routing circuit; and coating the side and lower surfaces of the die with an electrically conductive shielding material. | 10-10-2013 |
20130273731 | FAN-OUT CHIP SCALE PACKAGE - A chip scale package has a semiconductor die having an array of die bond pads arranged with a bond pad density per unit area, embedded in a molded die support body having a surface supporting an array of conducting contacts, each of the contacts connected by an electrical lead to a corresponding one of the die bond pads. | 10-17-2013 |
20140091458 | ENCAPSULATED WAFER-LEVEL CHIP SCALE (WLSCP) PEDESTAL PACKAGING - Consistent with an example embodiment, there is semiconductor device assembled to resist mechanical damage. The semiconductor device comprises an active circuit defined on a top surface, contact areas providing electrical connection to the active circuit. There is a pedestal structure upon which the active circuit is mounted on an opposite bottom surface; the pedestal structure has an area smaller than the area of the active device. An encapsulation, consisting of a molding compound, surrounds the sides and the underside of the active device and it surrounds the contact areas. The encapsulation provides a resilient surface protecting the active device from mechanical damage. A feature of the embodiment is that the contact areas may have solder bumps defined thereon. | 04-03-2014 |
20140110842 | USING A DOUBLE-CUT FOR MECHANICAL PROTECTION OF A WAFER-LEVEL CHIP SCALE PACKAGE (WLCSP) - Consistent with an example embodiment, there is a semiconductor device, with an active device having a front-side surface and a backside surface; the semiconductor device of an overall thickness, comprises an active device with circuitry defined on the front-side surface, the front-side surface having an area. The back-side of the active device has recesses f a partial depth of the active device thickness and a width of about the partial depth, the recesses surrounding the active device at vertical edges. There is a protective layer of a thickness on to the backside surface of the active device, the protective material having an area greater than the first area and having a stand-off distance. The vertical edges have the protective layer filling the recesses flush with the vertical edges. A stand-off distance of the protective material is a function of the semiconductor device thickness and the tangent of an angle (θ) of tooling impact upon a vertical face the semiconductor device. | 04-24-2014 |
20140138855 | PROTECTION OF A WAFER-LEVEL CHIP SCALE PACKAGE (WLCSP) - Consistent with an example embodiment, there is a method for assembling a wafer level chip scale processed (WLCSP) wafer; The wafer has a topside surface and an back-side surface, and a plurality of device die having electrical contacts on the topside surface. The method comprises back-grinding, to a thickness, the back-side surface the wafer. A protective layer of a thickness is molded onto the backside of the wafer. The wafer is mounted onto a sawing foil; along saw lanes of the plurality of device die, the wafer is sawed, the sawing occurring with a blade of a first kerf and to a depth of the thickness of the back-ground wafer. Again, the wafer is sawed along the saw lanes of the plurality of device die, the sawing occurring with a blade of a second kerf, the second kerf narrower than the first kerf, and sawing to a depth of the thickness of the protective layer. The plurality of device die are separated into individual device die. Each individual device die has a protective layer on the back-side, the protective layer having a stand-off distance from a vertical edge of the individual device die. | 05-22-2014 |
20150069587 | INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING THE SAME - Presented is an integrated circuit packaged at the wafer level wafer (also referred to as a wafer level chip scale package, WLCSP), and a method of manufacturing the same. The WLCSP comprises a die having an electrically conductive redistribution layer, RDL, formed above the upper surface of the die, the RDL defining a signal routing circuit. The method comprises the steps of: depositing the electrically conductive RDL so as to form an electrically conductive ring surrounding the signal routing circuit; and coating the side and lower surfaces of the die with an electrically conductive shielding material. | 03-12-2015 |
20150162306 | ENCAPSULATED WAFER-LEVEL CHIP SCALE (WLSCP) PEDESTAL PACKAGING - Consistent with an example embodiment, there is semiconductor device assembled to resist mechanical damage. The semiconductor device comprises an active circuit defined on a top surface, contact areas providing electrical connection to the active circuit. There is a pedestal structure upon which the active circuit is mounted on an opposite bottom surface; the pedestal structure has an area smaller than the area of the active device. An encapsulation, consisting of a molding compound, surrounds the sides and the underside of the active device and it surrounds the contact areas. The encapsulation provides a resilient surface protecting the active device from mechanical damage. A feature of the embodiment is that the contact areas may have solder bumps defined thereon. | 06-11-2015 |
20150278673 | DUAL INTERFACE IC CARD COMPONENTS AND METHOD FOR MANUFACTURING THE DUAL-INTERFACE IC CARD COMPONENTS - Dual-interface Integrated Circuit (IC) card components and methods for manufacturing the dual-interface IC card components are described. In an embodiment, a dual-interface IC card component includes a single-sided contact base structure, which includes a substrate with an electrical contact layer. On the single-sided contact base structure, one or more antenna contact leads are attached to the single-sided contact base structure to form a dual-interface contact structure, which is a component of a dual-interface IC card. Other embodiments are also described. | 10-01-2015 |
20150303156 | SINGLE INLINE NO-LEAD SEMICONDUCTOR PACKAGE - Embodiments of a packaged semiconductor device with no leads are disclosed. One embodiment includes a semiconductor chip and a no leads package structure defining a boundary and having a bottom surface and includes three or more pads exposed at the bottom surface of the package structure. Each of the pads is located in a single inline row. | 10-22-2015 |
Tonny Kamphuis, Niijmegen NL
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20160005653 | FLEXIBLE WAFER-LEVEL CHIP-SCALE PACKAGES WITH IMPROVED BOARD-LEVEL RELIABILITY - Consistent with an example embodiment, there is a method for manufacturing integrated circuit (IC) devices from a wafer substrate, the wafer substrate having a front-side surface with active devices and a back-side surface. A temporary covering to the front-side of the wafer substrate is applied. The back-side of the wafer substrate having a pre-grind thickness is ground to a post-grind thickness. To a predetermined thickness, the back-side of the wafer substrate is coated with a resilient coating. The wafer is mounted onto a second carrier tape on its back-side surface. After removing the temporary carrier tape from the front-side of the wafer substrate, the wafer is sawed along active device boundaries and active devices are singulated. | 01-07-2016 |
Tonny Kamphuis, Nlijmegen NL
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20160005680 | Exposed-Heatsink Quad Flat No-Leads (QFN) Package - Consistent with an example embodiment, there is a method for preparing an integrated circuit (IC) device having enhanced heat dissipation. The method comprises providing a heat sink array having a top-side surface and an under-side surface; the heat sink array has die placement areas on the top-side surface. A plurality of active device die are die bonded onto the die placement areas on the heat sink array. The plurality of active device die are singulated into an individual heat sink device die having a heat sink portion attached to its underside. | 01-07-2016 |