Patent application number | Description | Published |
20130025796 | DEVICE AND METHOD FOR DETACHING A PRODUCT SUBSTRATE OFF A CARRIER SUBSTRATE - Device for stripping a product substrate off a carrier substrate connected to the product substrate by an bonding layer by means of a film frame, a flexible film which is connected to the film frame and which has an adhesive layer for holding the product substrate in a contacting surface section of the film, the film being connected to the film frame in an attachment section of the film which surrounds the contacting surface section, as well as a solvent reservoir formed by the film frame and the film, especially of variable volume, for holding the solvent for detaching the bonding layer, and the product substrate and the bonding layer can be accommodated in the solvent reservoir, and by delivery means for delivering the solvent into the solvent reservoir and by stripping means for stripping the product substrate off the carrier substrate. | 01-31-2013 |
20130276990 | DEVICE AND METHOD FOR DETACHING A PRODUCT SUBSTRATE OFF A CARRIER SUBSTRATE - Device for stripping a product substrate off a carrier substrate connected to the product substrate by an bonding layer by means of a film frame, a flexible film which is connected to the film frame and which has an adhesive layer for holding the product substrate in a contacting surface section of the film, the film being connected to the film frame in an attachment section of the film which surrounds the contacting surface section, as well as a solvent reservoir formed by the film frame and the film, especially of variable volume, for holding the solvent for detaching the bonding layer, and the product substrate and the bonding layer can be accommodated in the solvent reservoir, and by delivery means for delivering the solvent into the solvent reservoir and by stripping means for stripping the product substrate off the carrier substrate. | 10-24-2013 |
20130288454 | METHOD FOR SEPARATING A PRODUCT SUBSTRATE FROM A CARRIER SUBSTRATE - The invention relates to a method for stripping a product substrate from a carrier substrate which is connected to the product substrate by an interconnect layer with the following steps, especially the following sequence:
| 10-31-2013 |
20130340947 | DEVICE AND METHOD FOR STRIPPING A PRODUCT SUBSTRATE FROM A CARRIER SUBSTRATE - Device for stripping a product substrate from a carrier substrate connected to the product substrate by an interconnect layer by means of a flexible film that is mounted on a film frame and that comprises an adhesive layer for holding the product substrate in a bonding surface section of the film, the film being mounted on the film frame in an attachment section of the film that surrounds the bonding surface section, and the film comprising a stripping section that is located between the bonding surface section and the attachment section, the device having stripping means for effecting a stripping of the product substrate from the carrier substrate from a periphery of the product substrate. | 12-26-2013 |
20140020847 | BENDABLE CARRIER MOUNT, DEVICE AND METHOD FOR RELEASING A CARRIER SUBSTRATE - A flexible carrier mount for mounting of a carrier substrate when the carrier substrate is detached from a product substrate, detachment means being provided for debonding the product substrate with bending of the carrier substrate. A device for detaching a carrier substrate from one product substrate in one detachment direction having: a carrier mount flexible in the detachment direction for mounting the carrier substrate, a substrate mount for mounting the product substrate, and detachment means for debonding the carrier substrate from the product substrate with bending of the carrier substrate. A method for detaching a carrier substrate from a product substrate in one detachment direction with the steps: mounting the product substrate with a substrate mount and mounting the carrier substrate with a carrier mount flexible in the detachment direction and debonding the carrier substrate from the product substrate with bending of the product substrate. | 01-23-2014 |
20140102221 | METHOD AND DEVICE FOR DETERMINING THE PRESSURE DISTRIBUTION FOR BONDING - A method and a device for determining the pressure distribution for bonding of a first substrate to a second substrate, with the following steps, especially with the following sequence: placing a measurement layer between a first tool for holding the first substrate and an opposite second tool which is aligned to the first tool for bonding of the substrate, deformation of the measurement layer by bringing the tools closer to one another, measurement of the deformation of the measurement layer and computation of the pressure distribution. | 04-17-2014 |
20140360666 | METHOD AND DEVICE FOR BONDING OF SUBSTRATES - A device and method for bonding first substrates to second substrates. The device includes: a receptacle for accommodating a carrier substrate, a placement device for placing multiple first substrates on a substrate side of the carrier substrate that faces away from the receptacle, and a fixing device for fixing each of the first substrates on the substrate side on at least one fixing section of each first substrate. The method includes the following steps: placement of multiple first substrates on a substrate side of a carrier substrate accommodated on a receptacle, and fixing of each first substrate on the substrate side on at least one fixing section of each first substrate. | 12-11-2014 |
20140374144 | METHOD FOR THE TEMPORARY CONNECTION OF A PRODUCT SUBSTRATE TO A CARRIER SUBSTRATE - A method for temporary connection of a product substrate to a carrier substrate comprised of the steps of:
| 12-25-2014 |
20150047783 | PRESSURE TRANSFER PLATE FOR PRESSURE TRANSFER OF A BONDING PRESSURE - A pressure transfer plate for transferring a bonding pressure, especially in thermocompression bonding, from a pressurization apparatus to a wafer, comprising a first pressure side for making contact with a pressurization apparatus, a second pressure side facing away from the first pressure side having an effective contact area for making contact with the wafer and pressurizing it, at least the effective contact area having a low adhesiveness relative to the wafer. | 02-19-2015 |
20150047784 | METHOD FOR APPLYING A TEMPORARY BONDING LAYER - A method for applying a temporary bonding layer to a carrier wafer for temporary joining to a product wafer by fusion bonding or anodic bonding, said method comprising:
| 02-19-2015 |
20150075725 | DEVICE FOR STRIPPING A PRODUCT SUBSTRATE FROM A CARRIER SUBSTRATE - Device for stripping a product substrate from a carrier substrate connected to the product substrate by an interconnect layer by means of a flexible film that is mounted on a film frame and that comprises an adhesive layer for holding the product substrate in a bonding surface section of the film, the film being mounted on the film frame in an attachment section of the film that surrounds the bonding surface section, and the film comprising a stripping section that is located between the bonding surface section and the attachment section, the device having stripping means for effecting a stripping of the product substrate from the carrier substrate from a periphery of the product substrate. | 03-19-2015 |