Junichi Sawada
Junichi Sawada, Annaka-Shi JP
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20090304961 | WHITE HEAT-CURABLE SILICONE RESIN COMPOSITION AND OPTOELECTRONIC PART CASE - A white heat-curable silicone resin composition comprising (A) a heat-curable organopolysiloxane, (B) a white pigment, (C) an inorganic filler, and (D) a condensation catalyst cures into a white uniform product having heat resistance, light resistance and minimal yellowing. The cured composition has a reflectance of at least 80% at wavelength 350-400 nm. The composition is useful for forming cases on optoelectronic parts, typically LED. | 12-10-2009 |
20090306263 | WHITE HEAT-CURABLE SILICONE RESIN COMPOSITION AND OPTOELECTRONIC PART CASE - A white heat-curable silicone resin composition comprising (A) a heat-curable organopolysiloxane, (B) a white pigment, (C) an inorganic filler, and (D) a condensation catalyst cures into a white uniform product having heat resistance, light resistance and minimal yellowing. The cured composition has a thermal conductivity of 1-10 W/mK. The composition is useful for forming cases on optoelectronic parts, typically LED. | 12-10-2009 |
20100081748 | SILICONE RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR DEVICES - The present invention provides a silicone resin composition for an optical semiconductor device, comprising | 04-01-2010 |
20100273927 | SILICONE RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR DEVICES AND AN OPTICAL SEMICONDUCTOR DEVICE - Silicone resin composition for optical semiconductor devices, providing cured product wherein warpage in the devices is reduced and whiteness, heat-resistance, and light resistance are improved. The composition comprises: (A) an organopolysiloxane of the formula | 10-28-2010 |
20110054072 | WHITE HEAT-CURABLE SILICONE/EPOXY HYBRID RESIN COMPOSITION FOR OPTOELECTRONIC USE, MAKING METHOD, PREMOLDED PACKAGE, AND LED DEVICE - A white heat-curable silicone/epoxy hybrid resin composition is provided comprising (A) a heat-curable silicone resin, (B) a triazine derived epoxy resin composition, (C) a white pigment, (D) an inorganic filler, and (E) an antioxidant. Antioxidant (E) is a phosphite compound having formula: P(OR | 03-03-2011 |
20110065872 | UNDERFILL COMPOSITION AND AN OPTICAL SEMICONDUCTOR DEVICE - A purpose of the present invention is to provide an underfill composition for optical semiconductor devices which can provide a cured product whose moldability, adhesiveness to a gold bump, heat-resistance, and light resistance are better. The present invention is an underfill composition, comprising (A) 60 to 99 parts by weight of a branched organopolysiloxane having a weight average molecular weight of from 500 to 20000, reduced to polystyrene, and represented by the average compositional formula (1); (B) 250 to 1000 parts by weight of an inorganic filler; (C) 0.01 to 10 parts by weight of a condensation catalyst; (D) 1 to 40 parts by weight of an organopolysiloxane having a linear diorganopolysiloxane moiety, represented by the formula (2), provided that a total amount of component (A) and component (D) is 100 parts by weight; and (E) 0.2 to 2.0 parts by weight of silane coupling agent. | 03-17-2011 |
Junichi Sawada, Shizuoka JP
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20100194937 | SOLID STATE IMAGING DEVICE - A solid state imaging device | 08-05-2010 |
20100208113 | SOLID STATE IMAGING DEVICE - A solid state imaging device | 08-19-2010 |
20100295976 | SOLID-STATE IMAGING DEVICE AND FRAME DATA CORRECTING METHOD - The present invention relates to a solid-state imaging device, etc., which makes it possible to obtain an image with higher resolution by properly correcting pixel data even when any one of row selecting wirings is disconnected. A solid-state imaging device ( | 11-25-2010 |
20100295982 | SOLID-STATE IMAGING DEVICE AND FRAME DATA CORRECTING METHOD - The present invention relates to a solid-state imaging device, etc., having a structure which enables to obtain an image with higher resolution by correcting pixel data even when any one of row selecting wirings is disconnected. A solid-state imaging device ( | 11-25-2010 |
20110176656 | SOLID-STATE IMAGE PICKUP DEVICE - A solid-state image pickup device | 07-21-2011 |
Junichi Sawada, Kawasaki-Shi JP
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20100251319 | VIDEO TRANSMISSION SYSTEM AND VIDEO RELAYER DEVICE - A video relayer device includes a processing unit and a memory. The processing unit includes: a key information transfer section to transfer first key information to a video content sink upon receiving the first key information from a video content source having a timer, and a timer pausing section to control the timer of the sink to pause upon receiving the first key information from the source. The processing unit is operable to receive second key information and a calculation result from the sink and store the same, respectively in the memory. The processing unit further includes a timer resuming section to control the timer of the source to resume when the second key information and the calculation result have been stored, respectively, in the memory. | 09-30-2010 |
Junichi Sawada, Tokyo JP
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20090032603 | IC CARD AND MANUFACTURING METHOD OF THE SAME - An IC card formed by sandwiching a circuit board formed with an antenna pattern and an IC chip mounted on the circuit board with a plurality of card constituent sheets. Ferrite beads to absorb and remove noises (unnecessary radiation energy) input to and output from the IC chip are mounted on wiring sections interconnecting the antenna pattern and IC chip. | 02-05-2009 |
20130113437 | CONTROL APPARATUS, CONTROL METHOD AND CONTROL SYSTEM - Disclosed herein is a control apparatus, including: a discrimination section configured to discriminate a plurality of battery units which are to share and output electric power required by a load; and a control section configured to carry out discharge control for the battery units in response to a situation of each of batteries which the battery units individually have. | 05-09-2013 |
20140285147 | CONTROL SYSTEM, CONTROL DEVICE, AND CONTROL METHOD - A control system includes a first device configured to receive a first voltage, and convert the first voltage to a second voltage that varies according to a variation of the received first voltage. The control system also includes a second device configured to receive the second voltage and to change a charging rate of an energy storage device according to a variation of the received second voltage. | 09-25-2014 |
Junichi Sawada, Annaka JP
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20120136086 | SILICONE-MODIFIED ADAMANTANE DERIVATIVE, PHOTO-RADICALLY CURABLE RESIN COMPOSITION, AND METHOD FOR PREPARING PHOTO-RADICALLY CURABLE RESIN COMPOSITION - There is disclosed a silicone-modified adamantane derivative represented by the following general formula (1), | 05-31-2012 |
20130109776 | SILICONE RUBBER COMPOSITION CURABLE BY RADIAL RAY | 05-02-2013 |
Junichi Sawada, Kawasaki JP
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20120224589 | RELAY STATION AND RELAY METHOD - A relay station for relaying data between first and second ring networks, each of the first and the second ring networks including a plurality of stations includes a first transmission and receiving circuit transmitting and receiving data to and from the first ring network; a second transmission and receiving circuit transmitting and receiving the data to and from the second ring network; and a switch that, when a destination of the data received by the first transmission and receiving circuit is one of the stations included in the second ring network, inputs the data to the second transmission and receiving circuit, and, when a destination of the data received by the second transmission and receiving circuit is another of the stations included in the first ring network, inputs the data to the first transmission and receiving circuit. | 09-06-2012 |
Junichi Sawada, Kanagawa-Ken JP
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20130106188 | CONTROL SYSTEM, CONTROL APPARATUS AND CONTROL METHOD | 05-02-2013 |
Junichi Sawada, Hamamatsu-Shi JP
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20140353515 | SENSOR UNIT AND SOLID-STATE IMAGING DEVICE - A sensor unit includes a metallic base member, a solid-state imaging element, and amplifier chips. The base member has a first placement surface and a second placement surface. The solid-state imaging element has a photodetecting surface, and is disposed on the first placement surface such that a rear surface and the first placement surface face each other. The amplifier chips are mounted on a substrate disposed on the second placement surface. The base member further has side wall portions facing side surfaces of the solid-state imaging element. The chips and the solid-state imaging element are electrically connected to one another via a bonding wire. The chips are thermally coupled to the base member via a thermal via of the substrate. | 12-04-2014 |
Junichi Sawada, Kanagawa JP
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20150069950 | CONTROL SYSTEM - The control system includes, for example, a plurality of first devices and at least one second device connected to each of the plurality of first devices. The first device includes a plurality of conversion units configured to convert first voltage supplied from a power generator to second voltage in accordance with a level of the first voltage, and the second device includes a power storage unit and a charging control unit configured to control charging the power storage unit. The second voltage output from at least one conversion unit out of the plurality of conversion units is supplied to the second device, and the charging control unit controls charging the power storage unit in accordance with fluctuation of the second voltage. | 03-12-2015 |