Patent application number | Description | Published |
20140364578 | POLISHING PAD COMPOUND - A polishing pad compound and a polishing pad, the polishing pad compound including a pre-polymer; and a hardener, wherein the pre-polymer includes about 45 wt % to about 50 wt % of a polyol, about 5 wt % to about 25 wt % of a hardness regulator, and a balance of an isocyanate. | 12-11-2014 |
20140366396 | APPARATUS FOR MANUFACTURING POLISHING PAD AND METHOD OF MANUFACTURING POLISHING PAD USING THE SAME - An apparatus for manufacturing a polishing pad includes a housing including a body, an interconnection portion, and a discharging portion, and a stirrer located in the housing, the stirrer mixing a polishing pad composition and a pore forming material with each other. A diameter of the discharging portion is in a range of about 9 mm to about 16 mm. | 12-18-2014 |
20150017807 | METHODS OF FORMING PATTERNS - Methods of forming patterns are provided. The methods may include sequentially forming an etch-target layer and a photoresist layer on a substrate, exposing two first portions of the photoresist layer to light to transform the two first portions into two first photoresist patterns and exposing a second portion of the photoresist layer to light to transform the second portion into a second photoresist pattern disposed between the two first photoresist patterns. The method may also removing portions of the photoresist layer to leave the two first photoresist patterns and the second photo resist pattern on the etch-target layer such that the etch-target layer is exposed. | 01-15-2015 |
20150079782 | LIQUID COMPOSITIONS AND METHODS OF FABRICATING A SEMICONDUCTOR DEVICE USING THE SAME - The present inventive concepts provide a liquid composition for etching a metal containing copper. The liquid composition may include hydrogen peroxide in a range of about 0.1 wt % to about 10 wt % and a buffer solution in a range of about 0.1 wt % to about 10 wt %. The buffer solution may include citrate. The liquid composition may have a pH in a range of about 4.0 to about 7.0. | 03-19-2015 |
20150227046 | METHODS OF MANUFACTURING A SEMICONDUCTOR DEVICE - The inventive concepts provide methods of forming a semiconductor device. The method includes forming a neutral layer having a photosensitive property and a reflow property on an anti-reflective coating layer, performing an exposure process and a development process on the neutral layer to form a preliminary neutral pattern at least partially exposing the anti-reflective coating layer, heating the preliminary neutral pattern to form a neutral pattern, forming a block copolymer layer on the neutral pattern, and heating the block copolymer layer to form a block copolymer pattern. The block copolymer pattern includes a first pattern disposed on the anti-reflective coating layer exposed by the neutral pattern, and a second pattern disposed on the neutral pattern and chemically bonded to the first pattern. | 08-13-2015 |
20160071762 | METHOD OF FABRICATING SEMICONDUCTOR DEVICE - Provided are a cleaning composition for removing an organic material remaining on an organic layer and a method of forming a semiconductor device using the composition. The cleaning composition includes 0.01-5 wt %. hydroxide based on a total weight of the cleaning composition and deionized water. | 03-10-2016 |
Patent application number | Description | Published |
20130004343 | RECIPROCATING COMPRESSOR - Disclosed is a reciprocating compressor. A cylinder in which a piston makes a reciprocal movement is insertedly coupled to a cylinder part of a frame which fixes a stator of a reciprocating motor, and a collision preventing portion is formed in the cylinder to allow a piston connection portion to collide therewith. Thus, although the piston connection portion overstrokes, the piston connection portion prevent collision force from being transferred to the frame having the cylinder part, whereby a laminated state of the stator can be prevented from being distorted to prevent a degradation of efficiency of the motor, and thus, reliability and performance of the compressor can be enhanced. | 01-03-2013 |
20140105761 | RECIPROCATING COMPRESSOR - A reciprocating compressor is provided that may include a cylinder having a compression space; a piston inserted into the compression space of the cylinder and making a relative reciprocating movement with respect to the cylinder; and a plurality of resonance springs that supports both sides of a member that makes a reciprocating movement, among the cylinder and the piston, in a movement direction. The plurality of resonance springs may be compression coil springs, and at least one of the plurality of resonance springs may be arranged in a direction such that a direction of a side force of the spring does not correspond to a gravitational direction. Since the side force and a force based on self-weight may become zero, sagging of a vibrator due to self-weight may be prevented. | 04-17-2014 |
20140105764 | RECIPROCATING COMPRESSOR - A reciprocating compressor is provided that may include an outer stator; an inner stator provided at an inner side of the outer stator with a predetermined gap therebetween; a mover configured to perform a reciprocating movement in the gap between the outer stator and the inner stator; a piston coupled to the mover to perform a reciprocating movement therewith; a cylinder, into which the piston may be inserted to form a compression space while performing a reciprocating movement; a frame coupled to the cylinder; a first support member coupled to the outer stator and the frame; and a second support member separated from the first support member, but coupled to the inner stator and the frame, thereby facilitating concentricity of the motor and compressor device, as well as simplifying an assembly process as the motor and compressor device are divided into several blocks for assembly. | 04-17-2014 |
20140241919 | MOTOR FOR COMPRESSOR AND RECIPROCATING COMPRESSOR HAVING THE SAME - A motor for a compressor, and a reciprocating compressor having the same, are provided. A winding coil may be formed by removing a bobbin from the winding coil, and then coating an insulating material on an outer circumferential surface of the winding coil, to allow heat and moisture generated by the winding coil to be emitted to outside and provide enhanced performance and reliability. As a bobbin is removed from the winding coil, a coil line may be wound on the removed portion of the bobbin to enhance an occupation ratio by the coil line on the same area, and thus enhance efficiency of the motor. An elastic member or an adhesive may be inserted or applied into a space between the winding coil and a coil insertion groove of an inner stator to minimize vibrations of a coil line. The insulating material, which is in the form of powder, may melt while the coil line is adhered as the self-bonding material melts, forming a coating layer. Accordingly, the winding coil may be easily fabricated, and fabrication costs of the winding coil may be reduced. | 08-28-2014 |