Patent application number | Description | Published |
20120007028 | POLYMER-SILICON COMPOSITE PARTICLES, METHOD OF MAKING THE SAME, AND ANODE AND LITHIUM SECONDARY BATTERY INCLUDING THE SAME - The present invention relates to polymer-silicon composite particles using silicon having high energy density, a method of making the same, an anode and a lithium secondary battery including the same. The silicon having high energy density is used as an anode active material to provide a lithium secondary battery having large capacity. Silicon-polymer composite particles having a metal plated on the surface thereof are provided to solve the problem that silicon has low electrical conductivity and a method of preparing the same is provided to produce an electrode having improved electrical conductivity. Furthermore, silicon-polymer composite particles having a metal coated on the surface thereof through electroless plating are prepared and an electrode is formed using the silicon-polymer composite particles. | 01-12-2012 |
20130221283 | LITHIUM SECONDARY BATTERY POSITIVE ELECTRODE MATERIAL FOR IMPROVING OUTPUT CHARACTERISTICS AND LITHIUM SECONDARY BATTERY INCLUDING THE SAME - Provided are a positive electrode active material for improving an output and a lithium secondary battery including the same. Particularly, graphite and conductive carbon which have shapes and sizes different from each other, may be simultaneously coated on a mixed positive electrode material of a 3-component system lithium-containing metal oxide having a layered structure and expressed as following Chemical Formula 1 and LiFePO | 08-29-2013 |
20140183407 | CATHODE ACTIVE MATERIAL COMPOSITION AND LITHIUM SECONDARY BATTERY INCLUDING THE SAME - Provided are a cathode active material composition including an xLi | 07-03-2014 |
20150118524 | METHOD FOR REMOVING GAS GENERATED IN LITHIUM SECONDARY BATTERY - The present disclosure provides a method for removing gases generated in a lithium secondary battery using a cathode active material of the following formula (I) | 04-30-2015 |
20150118542 | METHOD FOR PREPARING LITHIUM SECONDARY BATTERY AND LITHIUM SECONDARY BATTERY PREPARED THEREFROM - The present disclosure provides a method for preparing a lithium secondary battery by bringing a first cell using a first cathode active material of formula (I) | 04-30-2015 |
20150357671 | STACK-FOLDING TYPE ELECTRODE ASSEMBLY - The present disclosure provides a stack-folding type electrode assembly in which a plurality of full cells or bicells as unit cells is stacked on top of each other and surrounded by a second separator, each cell including a positive electrode, a negative electrode, and a first separator interposed between the positive electrode and the negative electrode, wherein a first binder is coated on at least a partial surface of the first separator, a second binder is coated on at least a partial surface of the second separator, and a content of the second binder is higher than a content of the first binder, to inhibit a loose phenomenon inside a battery, make the battery less prone to expansion, and have deformation resistance to an external impact. | 12-10-2015 |
20150364760 | POSITIVE ELECTRODE FOR LITHIUM SECONDARY BATTERY AND LITHIUM SECONDARY BATTERY COMPRISING THE SAME - The present disclosure relates to a positive electrode for a lithium secondary battery including an electrode current collector, and a positive electrode active material layer coated on at least a part of the electrode current collector, wherein the positive electrode active material layer includes a manganese-based positive electrode active material, and a porosity is from 30% to 35%, to improve high-temperature storage characteristics and high-temperature cycle characteristics. | 12-17-2015 |
20160028064 | ELECTRODE ASSEMBLY AND LITHIUM SECONDARY BATTERY COMPRISING THE SAME - An electrode assembly, comprises one or more first electrodes comprising a cathode; one or more second electrodes comprising an anode; and a separator sheet having a zigzag form interposed therebetween. The separator sheet comprises a first porous polymer substrate; a first coating layer formed on one surface of the first porous polymer substrate and comprising a polymer binder, the first coating layer being faced with the cathode; and a second coating layer formed on the other surface of the first porous polymer substrate and comprising a mixture a polymer binder and inorganic particles, the second coating layer being faced with the anode and having a composition, a thickness and a porosity different from those of the first porous coating layer. A separator has porous coating layers with a different composition, thickness or porosity formed on each surface thereof. | 01-28-2016 |
20160028065 | ELECTRODE ASSEMBLY - The present disclosure provides an electrode assembly comprising a plurality of unit cells, each unit cell having a full-cell or a bi-cell structure comprising a cathode, an anode, and a first separator interposed between the cathode and the anode, and the plurality of unit cells being stacked by surrounding each unit cell with a second separator, wherein the second separator has an average pore diameter (d | 01-28-2016 |
Patent application number | Description | Published |
20120154937 | LENS ACUATING MODULE - Disclosed herein is a lens actuating module for realizing focus adjustment and optical zooming. The lens actuating module includes a rod which is disposed on one side of a lens barrel on which at least one lens is mounted, and has an axis direction corresponding to an optical axis direction of the lens barrel, a driving force transmission member which has a conjoining recess to be conjoined with an outside surface of the rod and has magnetism so as to be conjoined with the outside surface of the rod due to a magnetic force, and a piezoelectric actuator which is disposed on one side of the driving force transmission member in the optical axis direction to provide an axis direction driving force to the rod via the driving force transmission member. | 06-21-2012 |
20120320467 | IMAGE PHOTOGRAPHING DEVICE - Disclosed herein is an image photographing device capable of being auto-focused while moving a lens barrel in an optical axis direction. The image photographing device includes: a lens barrel having at least one lens; a housing receiving the lens barrel therein so that the lens barrel moves in an optical axis direction; and an impact reducing unit elastically supporting the lens barrel in the case in which the lens barrel deviates from a set movement range, thereby primarily damping the lens barrel before the lens barrel deviates from the movement range to collide with other components positioned at an outer side of the lens barrel. | 12-20-2012 |
20150268801 | METHOD FOR PROVIDING INFORMATION TO HEAD UNIT OF VEHICLE BY USING TEMPLATE-BASED UI, AND HEAD UNIT AND COMPUTER-READABLE RECODING MEDIA USING THE SAME - The present invention relates to a method for providing information to a head unit of a vehicle by using a template-based user interface. The method includes steps of: (a) allowing the head unit to acquire information on multiple applications belonging to a specific category among built-in internal applications of the head unit and external applications stored in a mobile terminal connected with the head unit, if a template of the head unit is driven to execute them belonging thereto; (b) allowing the head unit to acquire information on available applications that support detailed functions included in the acquired multiple applications belonging to the specific category by individual detailed functions by referring to the information on the detailed functions included in the applications belonging thereto; and (c) allowing the head unit to display one or more lists of the available applications by the detailed functions through the template. | 09-24-2015 |
20160062773 | METHOD, TERMINAL AND HEAD UNIT FOR AUTOMATICALLY PROVIDING APPLICATION SERVICES USING TEMPLATES - The present invention relates to a method for automatically providing an application service by an interaction with a head unit at a terminal. The method includes steps of: (a) the terminal receiving a request for running of a specific application, if the specific application is selected by a user of the head unit from a list including information on one or more runnable applications, which are installed in the terminal, to be interacted with the head unit; and (b) the terminal running the specific application by interacting with a template application run by the head unit. | 03-03-2016 |
Patent application number | Description | Published |
20090085138 | GLASS CAP MOLDING PACKAGE, MANUFACTURING METHOD THEREOF AND CAMERA MODULE - The present invention is to reduce a manufacturing cost and improve productivity by manufacturing a small module in comparison with a conventional module and simplifying a process. | 04-02-2009 |
20090268318 | Lens driving module - Provided is a lens driving module including a housing that has a lens barrel housing portion provided in the central portion thereof, the lens barrel housing portion having a bearing coupling portion and a guide coupling portion provided therein, and a through-hole formed in one corner thereof where the guide coupling portion is formed; a lens barrel that has a bearing contact portion and a guide portion formed on the outer circumferential surface thereof and is mounted in the lens barrel housing portion of the housing such that the bearing contact portion and the guide portion correspond to the bearing coupling portion and the guide coupling portion of the lens barrel housing portion, respectively; a piezoelectric motor that is mounted in the through-hole formed in one outer corner of the housing, which corresponds to the guide portion of the lens barrel, among the outer corners of the housing; a power connection member that is attached on the outer surface of the piezoelectric motor and of which only a predetermined portion connected to a power supply exhibits conductivity; and a power connection member that surrounds the outer surface of the housing and includes a corner-bent surface having a cross-shaped pad formation portion and a pair of through-holes formed in both sides of the pad formation portion, the through-holes reducing tension. | 10-29-2009 |
20090268319 | Lens driving module - Provided is a lens driving module including a housing that has a lens barrel housing portion provided therein; a lens barrel that has a bearing contact portion and a guide portion formed on the outer circumferential surface thereof and is mounted in the lens barrel housing portion of the housing; a piezoelectric motor that is mounted in one outer corner of the housing, which corresponds to the guide portion of the lens barrel, among the outer corners of the housing, and provides a driving force to the lens barrel; and a power connection member that is bent so as to cover the piezoelectric motor and the outer circumferential surface of the housing and is coupled to the housing. | 10-29-2009 |
20090284844 | Position sensing device and lens driving module using the same - Provided is a position sensing device including a sensing unit that is mounted on one side of a lens barrel, which is inserted into a lens housing portion of a base so as to be vertically driven, and includes a light receiving section and a light emitting section which are provided to face each other; a driven grid that has a plurality of slits formed therein and is mounted on the lens barrel; and a fixed grid that has a plurality of slits formed therein and is fixed and coupled to the inside of the sensing unit. | 11-19-2009 |
20110194199 | TWO-AXIS STAGE AND CAMERA MODULE HAVING THE SAME - A camera module in accordance with an embodiment of the present invention includes a housing, a first shaft, which is disposed in a first axis direction and coupled to the housing in such a way that the other end part can be tilted against one end part, a moving guide, which is mounted on the first shaft in such a way that the moving guide can slide in the first axis direction, a second shaft, which is disposed in a second axis direction and supported by the housing in such a way that the second shaft can be tilted against the housing, a lens module, which is mounted on the second shaft in such a way that the lens module can slide in the second axis direction, and a driver, which moves the lens module in the first axis direction and the second axis direction. | 08-11-2011 |
20120106936 | Image photographing device having function for compensating hand vibration - Disclosed herein is an image photographing device having a function for compensating hand vibration. The image photographing device having a function for compensating hand vibration includes: an optical unit; a magnet combined with an outer peripheral surface of the optical unit; a housing inserted with the optical unit and the magnet and having coils disposed at a position corresponding to the magnet; suspension wires arranged at four corners of the optical unit, having the upper end portions and the lower end portions each combined with the optical unit and the housing to support the optical unit in a state floated from the bottom surface of the housing, and having a predetermined bending part formed at any point; a flexible printed circuit board surrounding the outer peripheral surface of the housing and applying current to the coils; and a substrate having the image sensor mounted on the top surface thereof and combined with the lower portion of the housing. | 05-03-2012 |
20130242422 | LENS ACTUATING MODULE - A lens actuating module for realizing focus adjustment and optical zooming. The lens actuating module includes a rod which is disposed on one side of a lens barrel on which at least one lens is mounted, and has an axis direction corresponding to an optical axis direction of the lens barrel, a driving force transmission member which has a conjoining recess to be conjoined with an outside surface of the rod and has magnetism so as to be conjoined with the outside surface of the rod due to a magnetic force, and a piezoelectric actuator which is disposed on one side of the driving force transmission member in the optical axis direction to provide an axis direction driving force to the rod via the driving force transmission member. | 09-19-2013 |
20140160584 | LENS ACTUATING MODULE - A lens actuating module for realizing focus adjustment and optical zooming. The lens actuating module includes a rod which is disposed on one side of a lens barrel on which at least one lens is mounted, and has an axis direction corresponding to an optical axis direction of the lens barrel, a driving force transmission member which has a conjoining recess to be conjoined with an outside surface of the rod and has magnetism so as to be conjoined with the outside surface of the rod due to a magnetic force, and a piezoelectric actuator which is disposed on one side of the driving force transmission member in the optical axis direction to provide an axis direction driving force to the rod via the driving force transmission member. | 06-12-2014 |
20150015954 | CAMERA MODULE - There is provided a camera module including: a lens barrel having a lens; and a housing having the lens barrel inserted thereinto, wherein an outer surface of the lens barrel facing an inner surface of the housing is provided with a first groove formed inwardly concave, and the inner surface of the housing is provided with a first foreign object collecting portion formed with a step difference and a second foreign object collecting portion formed with a step difference from the first foreign object collecting portion. | 01-15-2015 |
20150103240 | CAMERA MODULE, METHOD FOR ALIGNING OPTICAL AXIS OF CAMERA MODULE AND PORTABLE ELECTRONIC DEVICE INCLUDING CAMERA MODULE - A camera module may include a lens barrel supporting a lens, a frame in which the lens barrel is provided, and a housing accommodating the frame. The frame may be pressed toward one surface of the housing to thereby be relatively aligned in the housing so that an optical axis of the lens is positioned perpendicularly with respect to an image formation surface of an image sensor. | 04-16-2015 |
20150163386 | CAMERA MODULE - There is provided a camera module including: a housing having a lens barrel disposed therein; an infrared filter attached to an inner surface of the housing and disposed below the lens barrel; and a board coupled to a lower portion of the housing and having an image sensor mounted thereon, wherein the board has a plurality of terminals formed thereon, the image sensor has a plurality of bonding pads formed therein, and the plurality of bonding pads are electrically connected to the plurality of terminals by bonding wires, respectively, and the plurality of bonding pads have a coating material applied thereto in order to absorb external light incident thereto. | 06-11-2015 |
20150346453 | CAMERA MODULE AND DRIVING CONTROL SYSTEM FOR CAMERA MODULE - A camera module includes a lens barrel, a housing accommodating the lens barrel therein, a ball bearing contacting rolling surfaces, which are respectively provided on the lens barrel and the housing, and a semi-wet lubricant applied to a surface of the ball bearing. | 12-03-2015 |
20160054641 | CAMERA MODULE - Disclosed herein is a camera module in which a movement of a magnet is controlled by only magnetic force between the magnet and a yoke without a spring for controlling the movement of the magnet which operates up and down. The camera module includes: a lens module; and a main frame supporting the lens module and allowing the lens module to be driven in an optical axis direction, wherein the lens module includes: a lens assembly including a plurality of lenses; and a magnet fixed to one side of the lens module, and the main frame includes: a coil facing the magnet, fixed to one side within the main frame, and generating an electric field as power is applied thereto; and a yoke disposed to face the magnet with the main frame and the coil interposed therebetween and controlling driving of the lens module by attraction with the magnet. | 02-25-2016 |
Patent application number | Description | Published |
20120282735 | METHOD OF MANUFACTURING CHIP-STACKED SEMICONDUCTOR PACKAGE - A method of manufacturing a chip-stacked semiconductor package, the method including preparing a base wafer including a plurality of first chips each having a through-silicon via (TSV); bonding the base wafer including the plurality of first chips to a supporting carrier; preparing a plurality of second chips; forming stacked chips by bonding the plurality of second chips to the plurality of first chips; sealing the stacked chips with a sealing portion; and separating the stacked chips from each other. | 11-08-2012 |
20120329249 | METHODS OF PROCESSING SUBSTRATES - Methods of manufacturing a plurality of semiconductor chips are provided. The method may include providing a middle layer between a substrate and a carrier to combine the carrier with the substrate, thinning the substrate; after thinning the substrate, separating the carrier from the substrate; and after the carrier is separated from the substrate, cutting the substrate to form the plurality of semiconductor chips, wherein the middle layer is adhered to the carrier with a first bonding force, and the middle layer is adhered to the substrate with a second bonding force, and wherein the second bonding force is greater than the first bonding force. | 12-27-2012 |
20140154839 | METHOD OF MANUFACTURING CHIP-STACKED SEMICONDUCTOR PACKAGE - A method of manufacturing a chip-stacked semiconductor package, the method including preparing a base wafer including a plurality of first chips each having a through-silicon via (TSV); bonding the base wafer including the plurality of first chips to a supporting carrier; preparing a plurality of second chips; forming stacked chips by bonding the plurality of second chips to the plurality of first chips; sealing the stacked chips with a sealing portion; and separating the stacked chips from each other. | 06-05-2014 |
20140210075 | METHODS FOR PROCESSING SUBSTRATES - A method for processing substrates includes providing a bonding layer between a substrate and a carrier to bond the substrate to the carrier, processing the substrate while the substrate is supported by the carrier, and removing the bonding layer to separate the substrate from the carrier. The bonding layer may include a thermosetting release layer and thermosetting glue layers, wherein at least one of the thermosetting glue layers is provided on each side of the thermosetting release layer. | 07-31-2014 |
20150214089 | METHODS FOR PROCESSING SUBSTRATES - A method for processing substrates includes providing a bonding layer between a substrate and a carrier to bond the substrate to the carrier, processing the substrate while the substrate is supported by the carrier, and removing the bonding layer to separate the substrate from the carrier. The bonding layer may include a thermosetting release layer and thermosetting glue layers, wherein at least one of the thermosetting glue layers is provided on each side of the thermosetting release layer. | 07-30-2015 |
20150221517 | METHOD OF MANUFACTURING SEMICONDUCTOE DEVICE - A method of manufacturing a semiconductor device capable of thinning a semiconductor chip can be performed while preventing the semiconductor chip from being damaged. A method of manufacturing a semiconductor device includes: preparing a semiconductor substrate including a plurality of semiconductor chips, attaching the semiconductor substrate to a support substrate with an adhesive support film, removing an edge region of the semiconductor substrate together with a portion of the adhesive support film between the edge region of the semiconductor substrate and the support substrate and, thereafter, polishing the semiconductor substrate to thin the semiconductor substrate. | 08-06-2015 |
20150318268 | MULTI-CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME - A multi-chip package includes a first semiconductor chip and a second semiconductor chip. The first semiconductor chip has a first active surface. The second semiconductor chip has a second active surface facing the first active surface. The second active surface is electrically connected with the first active surface and the first active surface of the first semiconductor chip and the second active surface of the second semiconductor chip are bonded to each other without an adhesive. | 11-05-2015 |
20150364432 | METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE - Embodiments of the inventive aspect include a method of manufacturing a semiconductor package including a plurality of stacked semiconductor chips in which edges of a semiconductor wafer substrate may be prevented from being damaged or cracked when the semiconductor package is manufactured at a wafer level, while a diameter of a molding element is greater than a diameter of the semiconductor wafer substrate. The molding element may cover a surface of the wafer substrate and the plurality of stacked semiconductor chips. Embodiments may include a wafer level semiconductor package including a circular substrate having a first diameter, a circular passivation layer attached to the circular substrate, the passivation layer having the first diameter, and a circular molding element covering surfaces of the plurality of semiconductor chips, and covering an active area of the substrate. The circular molding element may have a second diameter that is greater than the first diameter. | 12-17-2015 |