Patent application number | Description | Published |
20130077293 | OPTICAL SEMICONDUCTOR-BASED LIGHTING APPARATUS - The present invention provides an optical semiconductor-based lighting apparatus. The lighting apparatus includes a housing, a light emitting module disposed on an open region at one side of the housing, and a heat sink unit placed within the housing to absorb and discharge heat from the light emitting module. The light emitting module includes a heat sink base on which a semiconductor optical device is mounted. The heat sink unit includes at least one main heat pipe having one side adjoining the heat sink base and a heat sink block adjoining the other side of the main heat pipe to cooperate with the main heat pipe. | 03-28-2013 |
20130088871 | OPTICAL SEMICONDUCTOR LIGHTING APPARATUS - An optical semiconductor lighting apparatus includes a heat sink including a heat dissipation base and a plurality of heat dissipation fins formed on a lower surface of the heat dissipation base; an optical semiconductor device placed on the heat dissipation base; and an optical cover coupled to an upper side of the heat sink to cover the optical semiconductor device. The heat dissipation base is formed with an air flow hole through which upper ends of the heat dissipation fins are exposed. | 04-11-2013 |
20130170209 | OPTICAL SEMICONDUCTOR LIGHTING APPARATUS - An optical semiconductor lighting apparatus having at least one or more clamping units are formed along a longitudinal direction of a race way. A first sealing unit finishes both ends of a housing attached to or detached from the clamping unit. A second sealing unit surrounds upper and lower portions of both edges of an optical member disposed on the bottom surface of the housing. A wireless communication unit receives a dimming signal through a wireless communication network, and outputs the received dimming signal to a power supply unit. The power supply unit supplies a DC voltage to the light emitting module to control the illuminance of the light emitting module according to the dimming signal input from the wireless communication unit. | 07-04-2013 |
20130200796 | HEAT SINK AND LED ILLUMINATING APPARATUS COMPRISING THE SAME - A light emitting diode (LED) illuminating apparatus including a heat sink, a light emitting module, a power connection portion, a translucent cover and a wiring path. The heat sink has a plurality of heat dissipation fins. The light emitting module is positioned on an upper portion of the heat sink. The power connection portion is positioned below a lower portion of the heat sink. The translucent cover is mounted to cover an upper portion of the light emitting module. The wiring path is formed in the heat sink so as to accommodate a wire for electrically connecting the power connection portion and the light emitting module. In the LED illuminating apparatus, the light emitting module emits light by directly receiving AC power supplied through the wire accommodated in the wiring path. | 08-08-2013 |
20130313593 | LED LIGHTING APPARATUS AND METHOD FOR FABRICATING WAVELENGTH CONVERSION MEMBER FOR USE IN THE SAME - A light-emitting diode (LED) lighting apparatus is provided. The LED lighting apparatus includes at least one LED, and a wavelength conversion member spaced apart from the LED and configured to convert a wavelength of light emitted from the LED. The wavelength conversion member includes a light-transmitting member, and a transfer molded wavelength conversion layer disposed on at least one surface of the light-transmitting member. The transfer molded wavelength conversion layer includes a resin and a phosphor. | 11-28-2013 |
20140043827 | LED LIGHTING APPARATUS - An exemplary embodiment of the present invention discloses a light emitting diode (LED) lighting apparatus with a housing, a lighting module and a diffusion cover. The lighting module includes a circuit board combined with the housing, and a plurality of light emitting diodes mounted on the circuit board to generate light, the light emitting diodes in a first region being arranged with a first distance and the light emitting diodes in a second region being arranged with a second distance that is greater than the first distance. The diffusion cover is combined with the housing such that the diffusion cover covers the lighting module. The diffusion cover has a groove portion at a region corresponding to the second region. | 02-13-2014 |
20140043833 | OPTICAL SEMICONDUCTOR LIGHTING APPARATUS - A first heat sinking path formed in a forming direction of a heat sink unit disposed radially in a housing where a light emitting module is mounted. A second heat sinking path is formed along an edge of the light emitting module. By providing a light engine concept in which a light emitting module, an optical member, and a heat sink unit are included and a bottom surface is gradually widened from one side to the other side, an optical semiconductor lighting apparatus can reduce a total weight of a product, can further improve heat dissipation efficiency by inducing natural convection, is simple in the product assembly and installation, and is easy in maintenance, and can provide products with high reliability by increasing the arrangement efficiency of semiconductor optical devices per unit area. | 02-13-2014 |
20140063811 | OPTICAL SEMICONDUCTOR LIGHTING APPARATUS - An optical semiconductor lighting apparatus includes a heat sink including a heat dissipation base and a plurality of heat dissipation fins formed on a lower surface of the heat dissipation base; an optical semiconductor device placed on the heat dissipation base; and an optical cover coupled to an upper side of the heat sink to cover the optical semiconductor device. The heat dissipation base is formed with an air flow hole through which upper ends of the heat dissipation fins are exposed. | 03-06-2014 |
20140175996 | LED LIGHTING APPARATUS WITH IMPROVED TOTAL HARMONIC DISTORTION IN SOURCE CURRENT - The LED lighting apparatus includes: a rectification block; an LED block including a first light emitting group and a second light emitting group; a charging/discharging block configured to charge electric charges in a charging period, and discharge electric charges in a discharging period; a driving control unit configured to determine a voltage level of a rectified voltage, controls a path selection switch to connect the rectification block to the LED block and controls the charging/discharging block to charge electric charges in the charging period, and controls the path selection switch to connect the rectification block to a ground and controls the charging/discharging block to discharge electric charges from the charging/discharging block to the LED block in the discharging period; and a path selection switch configured to connect the rectification block to the LED block in the charging period, and connect the rectification block to the ground in the discharging period. | 06-26-2014 |
20140247598 | HEAT SINK AND LED ILLUMINATING APPARATUS COMPRISING THE SAME - A light emitting diode (LED) illuminating apparatus including a heat sink, a light emitting module, a power connection portion, a translucent cover and a wiring path. The heat sink has a plurality of heat dissipation fins. The light emitting module is positioned on an upper portion of the heat sink. The power connection portion is positioned below a lower portion of the heat sink. The translucent cover is mounted to cover an upper portion of the light emitting module. The wiring path is formed in the heat sink so as to accommodate a wire for electrically connecting the power connection portion and the light emitting module. In the LED illuminating apparatus, the light emitting module emits light by directly receiving AC power supplied through the wire accommodated in the wiring path. | 09-04-2014 |
20140306242 | OPTICAL SEMICONDUCTOR LIGHTING APPARATUS - An optical semiconductor lighting apparatus including: a substrate in which a single LED chip or a plurality of LED chips are disposed; a first mold portion disposed on the substrate to cover the plurality of LED chips; and a second mold portion extending from an edge of the first mold portion and disposed on the substrate. The respective LED chips can improve adhesive strength with respect to the substrate through the first and second mold portions. Peeling, surface cracking and damage caused by moisture permeation can be prevented by the first and second mold portions. A fluorescent material included in the second mold portion can improve a wavelength conversion rate. | 10-16-2014 |
20140353711 | OPTICAL SEMICONDUCTOR LIGHTING APPARATUS - An optical semiconductor lighting apparatus includes a housing including a groove, a light-emitting module disposed in the housing, the light-emitting module including a semiconductor optical device, a sealing body disposed in the groove, the sealing body including a main portion and a first rib extending from the main portion, and an optical cover disposed on the housing and covering the groove and the light-emitting module, wherein a first open space is disposed between the optical cover, the first rib, the main portion of the sealing body, and a side surface of the groove. | 12-04-2014 |
20150014733 | LED LIGHTING APPARATUS AND METHOD FOR FABRICATING WAVELENGTH CONVERSION MEMBER FOR USE IN THE SAME - A light-emitting diode (LED) lighting apparatus is provided. The LED lighting apparatus includes at least one LED, and a wavelength conversion member spaced apart from the LED and configured to convert a wavelength of light emitted from the LED. The wavelength conversion member includes a light-transmitting member, and a transfer molded wavelength conversion layer disposed on at least one surface of the light-transmitting member. The transfer molded wavelength conversion layer includes a resin and a phosphor. | 01-15-2015 |
20150024525 | LED LIGHTING APPARATUS AND METHOD FOR FABRICATING WAVELENGTH CONVERSION MEMBER FOR USE IN THE SAME - A method of forming a light-emitting diode (LED) lighting apparatus, including forming an LED on a printed circuit board, and forming a wavelength conversion member on the LED, the wavelength conversion member being spaced apart from the LED. Forming the wavelength conversion member includes transfer molding a wavelength conversion layer on a light-transmitting member, and disposing the wavelength conversion member on the LED, the wavelength conversion layer being disposed between the LED and the light-transmitting member. | 01-22-2015 |
20150029733 | OPTICAL SEMICONDUCTOR LIGHTING APPARATUS - A optical semiconductor lighting apparatus includes: a board; a drive IC which is disposed in a central portion of the board; a plurality of semiconductor optical devices which is disposed adjacent to and around the drive IC in the board in a grid shape in one or more rows and columns; a non-insulating heat sink in which the board is disposed; an insulating housing which accommodates the heat sink and protects the drive IC and the plurality of semiconductor optical devices from withstand voltages; and a first optical member which faces the plurality of semiconductor optical devices, transmits or reflects light irradiated from the semiconductor optical devices, and forms a vertical vent hole corresponding to the drive IC; and a second optical member which is connected to an upper side of the housing and forms light distribution by refracting light transmitted or reflected from the first optical member. | 01-29-2015 |
20150062914 | OPTICAL SEMICONDUCTOR LIGHTING APPARATUS - A first heat sinking path formed in a forming direction of a heat sink unit disposed radially in a housing where a light emitting module is mounted. A second heat sinking path is formed along an edge of the light emitting module. By providing a light engine concept in which a light emitting module, an optical member, and a heat sink unit are included and a bottom surface is gradually widened from one side to the other side, an optical semiconductor lighting apparatus can reduce a total weight of a product, can further improve heat dissipation efficiency by inducing natural convection, is simple in the product assembly and installation, and is easy in maintenance, and can provide products with high reliability by increasing the arrangement efficiency of semiconductor optical devices per unit area. | 03-05-2015 |
20150070911 | OPTICAL SEMICONDUCTOR LIGHTING APPARATUS - A first heat sinking path formed in a forming direction of a heat sink unit disposed radially in a housing where a light emitting module is mounted. A second heat sinking path is formed along an edge of the light emitting module. By providing a light engine concept in which a light emitting module, an optical member, and a heat sink unit are included and a bottom surface is gradually widened from one side to the other side, an optical semiconductor lighting apparatus can reduce a total weight of a product, can further improve heat dissipation efficiency by inducing natural convection, is simple in the product assembly and installation, and is easy in maintenance, and can provide products with high reliability by increasing the arrangement efficiency of semiconductor optical devices per unit area. | 03-12-2015 |