Patent application number | Description | Published |
20110057995 | Inkjet head and inkjet head assembly having the same - There is provided an inkjet head and an inkjet head assembly having the same. The inkjet head includes an inkjet head plate having a plurality of nozzles ejecting ink provided therein; pressure chambers storing ink drawn in from both outer ends of the inkjet head plate in a width direction thereof and facing each other in a direction inwards of the width direction; piezoelectric elements supplying the pressure champers with driving force allowing ink to be ejected through the nozzles connected to the pressure chambers and disposed on the pressure chambers having membranes interposed therebetween; a pressure adjusting channel connecting the pressure chambers to adjust a pressure of ink ejected through the nozzles. | 03-10-2011 |
20110065851 | Nonaqueous ink composition for ink jet and method of manufacturing ink comprising the same - A nonaqueous ink composition for an ink jet and a method of manufacturing ink comprising the same are provided. The nonaqueous ink composition for the ink jet includes: a glycol ether acetate solvent represented by a specific chemical formula; and a polypropylene glycol binder represented by a specific chemical formula. The nonaqueous ink composition for an ink jet has dynamic viscoelasticity obtained by a chemical interaction between the solvent and the binder, exhibits excellent print quality and is capable of high-speed printing. | 03-17-2011 |
20110193913 | Inkjet head cleaning apparatus - There is provided an inkjet head cleaning apparatus including: an air blowing unit spaced apart from a nozzle ejecting ink at a predetermined distance and blowing air toward the nozzle; a blocking surface disposed to face the air blowing unit and blocking ink being removed from the nozzle due to the air released by the air blowing unit; a rebound blocking unit disposed between the blocking surface and the nozzle and blocking ink droplets being rebounded farther than a predetermined distance from the blocking surface among the ink blocked by the blocking surface; and a storage unit receiving the removed ink. | 08-11-2011 |
20120024573 | Printed circuit board and manufacturing method thereof - There are provided a printed circuit board and a manufacturing method thereof. The manufacturing method of a printed circuit board includes: preparing a substrate having active regions and non-active regions, the non-active regions being formed on edges thereof; printing resists on dummy portions corresponding to the non-active regions of the substrate by using an inkjet printing method; curing the resists; and performing plating on the active regions of the substrate. The resists are masked on the dummy portions corresponding to the non-active regions of the substrate to prevent plating from being performed on the dummy portions, thereby reducing manufacturing costs. | 02-02-2012 |
20120113181 | Resist ink printing device - There is provided a resist ink printing device according to an exemplary embodiment of the present invention including: a transfer unit transferring a substrate on which lead-in wires for electrolytic gold plating are patterned into a main body; a controller formed on the main body to measure a warpage degree of the substrate and recognizing a gerber file stored with circuit diagram information of the substrate to compensate for the warpage degree of the substrate and correct the gerber file; and at least one inkjet printing head part discharging liquid photo resist ink to the lead-in wires by the corrected gerber file. | 05-10-2012 |
20130157011 | RESIN SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a resin substrate, including: an insulating material; and a resin layer formed on the insulating material and having surface roughness. | 06-20-2013 |
20140151100 | ELECTRONIC COMPONENT EMBEDDED PRINTED CIRCUIT BOARD - An electronic component embedded printed circuit board includes a core having a cavity; an electronic component inserted in the cavity; insulating layers laminated on top and bottom of the core and mixed with a coupling agent, which has functional groups respectively acting on an organic material and an inorganic material, to be bonded to an outer peripheral surface of the electronic component; and circuit patterns provided on the insulating layers. | 06-05-2014 |
20140367149 | RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, BUILD-UP FILM, PREPREG AND PRINTED CIRCUIT BOARD - Disclosed herein are an insulating resin composition for a printed circuit board, a build-up film, a prepreg, and a printed circuit board. More specifically, disclosed herein are a build-up film prepared by using a resin composition containing a cage type silsesquioxane instead of the epoxy resin, and a multilayer printed circuit board including the build-up film or a prepreg. | 12-18-2014 |
20140370297 | CONDUCTIVE POLYMER COMPOSITION AND CONDUCTIVE FILM USING THE SAME - Disclosed herein is a conductive polymer composition capable of deteriorating water-absorption property and maintaining electrical conductivity by neutralizing polyethylenedioxythiophene/polystyrenesulfonate (PEDOT/PSS) with dicyclohexylmethylamine which is lipid-soluble tertiary amine, and a conductive film using the same. | 12-18-2014 |
20140377544 | COMPOSITE MATERIAL, METHOD FOR PREPARING THEREOF, AND SUBSTRATE USING THE SAME - Disclosed herein are a composite material including an anisotropic filler and a component having directionality, wherein the component having directionality has a length in a range of 1.5 to 20 based on a length of the anisotropic filler, a method for preparing thereof, and a substrate using the same as an insulation layer. According to the exemplary embodiment of the present invention, in the composite material using the anisotropic filler, the component having directionality is used for controlling the dispersion directionality of the anisotropic filler, whereby at the time of orientation of the component having directionality, the directionality in which the anisotropic filler is dispersed may be controlled to improve the dispersion of the anisotropic filler. | 12-25-2014 |
20150050473 | RESIN COMPOSITION, PRINTED CIRCUIT BOARD USING THE COMPOSITION, AND METHOD OF MANUFACTURING THE SAME - A resin composition, a printed circuit board using the composition, and a method of manufacturing the printed circuit board. The resin composition includes: a photopolymerizable compound, such as one having an ethylenically unsaturated bond which is polymerizable in a molecule, a photoinitiator, and a surface-modified silica by an alkyl sulfonated tetrazole compound. | 02-19-2015 |