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| 20120105916 | PRINTING CONTROL APPARATUS AND METHOD WITH DOCUMENT SECURITY FUNCTION - A printing control apparatus includes a user interface driver to provide a security preview setup screen such that security preview options for each object are selected when a call signal is transmitted from a graphic device interface according to a print request signal input from an application program and a previewer to divide objects through the security preview setup screen and to secure a corresponding one of the objects when the security preview options are set so as to perform preview. A preview screen upon which security options for each object are set is displayed, thereby preventing malicious use and easily achieving security intended by a user. | 05-03-2012 |
| 20120236327 | COMMON DRIVER APPLICATION DEVICE AND METHOD - A common driver application device and method. A first communication unit provides a communication interface with a first printing apparatus, a common printer driver unit loads from the first printing apparatus print information including default values for print options and an emulation type that the first printing apparatus supports, and provides a print option setting menu enabling a user to adjust the default values for the print options, if the first communication unit is communicatively connected to the first printing apparatus, and a central processing unit controls the common printer driver unit to load the print information from the first printing apparatus, if the first communication unit is connected to the first printing apparatus. Thus, one common printer driver to drive plural printers connected to a computer can be provided. | 09-20-2012 |
| 20120301549 | COMPLEX FORMULATION COMPRISING ASPIRIN COATED WITH BARRIER CONTAINING HYDROPHOBIC ADDITIVE, AND HMG-COA REDUCTASE INHIBITOR - Provided is a complex formulation for the prevention or treatment of cardiovascular diseases, comprising: a) aspirin coated with a barrier containing a hydrophobic additive; and b) an HMG-CoA reductase inhibitor, which has improved storage stability by preventing the deterioration in the stability of HMG-CoA reductase which is caused by salicylic acid, thereby being used in the treatment of hypertension and hypercholesterolemia. | 11-29-2012 |
| 20120321709 | COMPLEX FORMULATION FOR ORAL ADMINISTRATION COMPRISING PROBIOTIC FORMULATION AND 5-HT4 RECEPTOR AGONIST AND METHOD FOR THE PREPARATION THEREOF - Disclosed are a complex formulation for oral administration comprising probiotic formulation and 5-HT4 receptor agonist, and a method for the preparation thereof. | 12-20-2012 |
| 20130243872 | PHARMACEUTICAL COMPOSITE FORMULATION COMPRISING HMG-COA REDUCTASE INHIBITOR AND ASPIRIN - Provided is a pharmaceutical composite formulation for preventing or treating cardiovascular diseases, which comprises (1) a first particle comprising an HMG-CoA reductase inhibitor and a basic additive; and (2) a second particle comprising a core containing aspirin and an enteric coating layer coated on said core, wherein the difference in the average diameters of said first and second particles is 100 μm to 800 μm; a method for preparing same; and a method of validating the quality of same. The pharmaceutical composite formulation according to the present invention can improve the stability of an active ingredient and prevent adverse impacts between the active ingredients to thereby enable an accurate quality validation of the pharmaceutical composite formulation. | 09-19-2013 |
| 20140126013 | PRINTING CONTROL APPARATUS AND METHOD - A printing control apparatus includes a display unit to display a preview screen of a document to print, a control unit to extract objects included in the document displayed on the preview screen and individually set a printing option corresponding to an object selected by a user from among the extracted objects, and a printing data generation unit to generate printing data corresponding to the set printing option and to spool the printing data. | 05-08-2014 |
| 20140355805 | CURVED DISPLAY APPARATUS - A display apparatus is provided. The display apparatus includes a display which is curved such that opposite lateral ends thereof protrude forward relative to a central portion thereof. A support frame having a lower end supported on a horizontal surface and allowing the display to be disposed inside thereof is provided; wherein the support frame is curved such that opposite lateral ends thereof protrude forward relative to the central portion thereof. | 12-04-2014 |
| 20150052480 | PRINTING CONTROL METHOD, AND APPARATUS AND COMPUTER-READABLE RECORDING MEDIUM THEREOF - A printing control apparatus includes a user interface configured to receive a selection of a printing option to be applied to a document, and to display, in response to a favorite printing option being the selection of the printing option, information about a method for a preselected printing option, a printer driver configured to establish the printing option to be applied to the document according to the information about the method, and to generate printing data according to the printing option, and a communication interface configured to transmit the printing data to an image forming apparatus. | 02-19-2015 |
| 20150092233 | SYSTEM AND METHOD FOR PROVIDING CLOUD PRINTING SERVICE - Provided is an image forming system operable to provide a cloud printing service, the image forming system comprising: a transmitting device operable to transmit content by designating a target phone number; a cloud printing server operable to receive the target phone number and the content from the transmitting device; a receiving device assigned with the target phone number and operable to receive an upload notification of the content with respect to the target phone number from the cloud printing server; and an image forming device operable to print the content by receiving the content from the cloud printing server, wherein the cloud printing server transmits the content to the image forming device registered in the target phone number when the cloud printing service is requested for the content to the target phone number. | 04-02-2015 |
| 20150209290 | BILAYERED COMPOSITE TABLET FORMULATION COMPRISING ATORVASTATIN, IRBESARTAN AND MAGNESIUM CARBONATE - Disclosed are a bilayered composite tablet formation comprising (a) a first layer comprising irbesartan or a pharmaceutically acceptable salt thereof; and (b) a second layer comprising atorvastatin or a pharmaceutically acceptable salt thereof and magnesium carbonate (MgCO | 07-30-2015 |
| 20150272943 | SOLID DISPERSION WITH IMPROVED SOLUBILITY COMPRISING TETRAZOLE DERIVATIVE AS AN ACTIVE INGREDIENT - The present invention relates to an amorphous solid dispersion comprising a tetrazole derivative of the formula (I) or a pharmaceutically acceptable salt thereof as an active ingredient. The solid dispersion of the present invention comprises a water-soluble polymer or an acid so as to improve the solubility of its active ingredient, i.e., the tetrazole derivative of the formula (I), thereby improving its absorption rate, and thus can be effectively used to reduce multi-drug resistance (MDR) in cancer cells | 10-01-2015 |
| 20160065751 | COMPUTING DEVICE AND SYSTEM SUPPORTING PULL PRINTING BY USING MOBILE TERMINAL, AND METHOD OF PERFORMING PULL PRINTING BY USING MOBILE TERMINAL - A computing device supports pull printing by using a mobile terminal. The computing device may include a user interface unit configured to receive an input selecting a print job and a printing method; a communication unit configured to transmit or receive data; a mobile search management unit configured to search for an available mobile terminal if pull printing by using a mobile terminal is selected as the printing method; a printer driver configured to render print data corresponding to the selected print job into a printable format file; a data transmission management unit configured to transmit the rendered print data to a found mobile terminal by using the communication unit; and a controller. | 03-03-2016 |
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| 20100160238 | TGFP-CAP Peptide and its Uses - The present invention relates to a GFP-CAP peptide having an amino acid sequence derived from TGF-β1 (transforming growth factor-β1) and a cell adhesion sequence, wherein the amino acid sequence derived from TGF-β1 consists of the amino acid sequence of SEQ ID NO:1 and the TGFP-CAP peptide is represented by the following formula I: Ile-Trp-Ser-Leu-Asp-Thr-Gln-Tyr-Cell adhesion sequence (I). The TGFP-CAP peptide of the present invention exhibits excellent anti-angiogenic activity. In addition, the TGFP-CAP peptide of the present invention prevents effectively melanin generation in skin to have skin whitening effects. The present peptide shows much higher stability and permeability to skin than natural-occurring TGF-β1. Such plausible activities and safety of the present peptide enable advantageously to application to drugs, quasi-drugs and cosmetics. | 06-24-2010 |
| 20110160131 | Growth Factor-Mimicking Peptides and Uses Thereof - The present invention relates to a growth factor-mimicking peptide having an activity of the growth factor, and a composition and a method for improving skin conditions or for treating a wound using the same. The growth factor-mimicking peptides of this invention have identical functions or actions to natural-occurring human growth factor, and much better stability and skin penetration potency than natural-occurring growth factor. In these connections, the composition comprising the peptides of this invention can exhibit excellent efficacies on the treatment, prevention and improvement of diseases or conditions demanding growth factor activities. In addition, excellent activity and stability of the peptides of this invention can be advantageously applied to pharmaceutical compositions, quasi-drugs and cosmetics. | 06-30-2011 |
| 20120114577 | Peptide Having Activity of Transforming Growth Factor and Production Method Therefor - The present invention relates to a transforming growth factor-beta (TGF-β)-mimicking peptide containing a particular amino acid sequence and a composition for preventing or treating TGF-β-effective disorders or conditions using the same. The peptide of the present invention may be much higher stability than natural-occurring TGF-β and improve drawbacks caused by high molecular weight of natural-occurring TGF-β. The peptide of this invention can be advantageously applied to treatment or improvement of TGF-β-effective disorders or conditions and have excellent efficacies on skin whitening and wrinkle improvement. | 05-10-2012 |
| 20150032281 | Method and Apparatus for Controlling Power Compensation of Wind Power Generating System - The present invention relates to the power compensation of a wind power generating system, and more particularly, to a method and an apparatus for controlling the power compensation of a wind power generating system, said method and apparatus being capable of compensating for the surplus and deficiency of the generated power by means of a battery and reducing the load on a battery to extend the life of the battery. To this end, the method of the present invention comprises: a step of detecting the output power obtained from wind power generation; a step of comparing the detected output power with a preset instructed value so as to smooth the output power; a step of performing a charging or discharging operation on a bank on the basis of the result of the comparison; and a step of updating the use priority of the bank on the basis of the time during which the charging or discharging operation is performed on the bank. | 01-29-2015 |
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| 20110061729 | Solar Cell and Method of Manufacturing the Same - Provided are a solar cell and a method of manufacturing the same. The method includes implanting impurities of a second conductivity type opposite to a first conductivity type on the entire surface of a semiconductor substrate of the first conductivity type to form an emitter layer, forming a first anti-reflective coating (ARC) layer on the emitter layer, patterning a portion of the first anti-reflective coating (ARC) layer where a front electrode will be formed, forming a second anti-reflective coating (ARC) layer on the first anti-reflective coating (ARC) layer and the emitter layer, and forming the front electrode and a rear electrode on front and rear surfaces of the semiconductor substrate. In this method, a double structure of two anti-reflective coating (ARC) layers with different thicknesses may be formed to make electrode patterns distinct, thereby facilitating alignment of electrodes. | 03-17-2011 |
| 20110277824 | Solar Cell and Method of Manufacturing the Same - Provided are a solar cell and a method of manufacturing the same. The method includes implanting impurities of a second conductivity type opposite to a first conductivity type into a front surface of a semiconductor substrate of the first conductivity type to form an emitter layer, forming a mask layer on the emitter layer, patterning the mask layer by coating etching paste on a portion of the mask layer where a front electrode will be formed, implanting high-concentration impurities into the portion of the mask layer where the front electrode will be formed to form a heavily doped region, removing the remaining mask layer, forming an anti-reflective coating (ARC) on the emitter layer, forming the front electrode on the front surface of the semiconductor substrate, and forming a rear electrode on a rear surface of the semiconductor substrate. In the method of manufacturing the solar cell, the patterning of the front surface of the semiconductor substrate includes directly coating a corrosive emulsion on the mask layer using a screen printing process instead of complicated photolithography and etching processes so that a desired pattern can be formed using a relatively simple process. | 11-17-2011 |
| 20120090682 | Solar Cell and Manufacturing Method Thereof - A solar cell and a manufacturing method thereof are provided. The method includes forming a microstructure including a texturing on the surface of a semiconductor substrate of a first conductive type, forming a plurality of nanostructures on the surface of the semiconductor substrate, forming an emitter layer by implanting impurities of a second conductive type opposite to the first conductive type in a front face of the semiconductor substrate, forming an anti-reflective coating (ARC) on the emitter layer, forming a front electrode passing through a portion of the ARC and being coupled to the emitter layer, and forming a back electrode on a rear face of the semiconductor substrate of the first conductive type, the rear face being opposite to the face on which the front electrode is formed. A dominant light-collecting characteristic can be approached by forming nanostructures on a semiconductor substrate of a solar cell. | 04-19-2012 |
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| 20080225961 | APPARATUS AND METHOD TO ESTIMATE SAMPLING OFFSET - A sampling offset estimation apparatus including a pilot sub-carrier refiner, an information sub-carrier refiner, a data sub-carrier refiner, and a sampling offset estimator. The pilot sub-carrier refiner to refine a pilot sub-carrier extracted from a differential demodulated signal, and to generate a reference pilot sub-carrier. The information sub-carrier refiner to refine an information sub-carrier extracted from the differential demodulated signal, and to generate a reference information sub-carrier. The data sub-carrier refiner to refine a data sub-carrier extracted from the differential demodulated signal, and to generate a reference data sub-carrier. The sampling offset estimator to estimate a sampling offset included in the differential demodulated signal, on a basis of the reference pilot sub-carrier, the reference information sub-carrier, and the reference data sub-carrier. | 09-18-2008 |
| 20090274223 | ORTHOGONAL FREQUENCY DIVISION MULTIPLEXING RECEIVER - In one aspect, an orthogonal frequency division multiplexing (OFDM) receiver includes an offset compensator, a fast Fourier transform (FFT) block, a control unit, a channel impulse response estimation block, and a sampling offset estimation block. The offset compensator is configured to receive a digital input signal and a sampling offset, and to convert the digital input signal into a baseband signal in accordance with the sampling offset. The fast Fourier transform (FFT) block is configured to perform an FFT operation of the base band signal output from the offset compensator and to output a corresponding FFT result. The control unit is configured to generate OFDM symbol information and a plurality of control signals based on the FFT result. The channel impulse response estimation block is configured to periodically generate receiving channel impulse response information of a receiving channel based on the FFT result. The sampling offset estimation block is configured to generate the sampling offset based on the FFT result, the receiving channel impulse response information, the OFDM symbol information, and the plurality of control signals. | 11-05-2009 |
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| 20150238382 | ROBOT FOR WALKING REHABILITATION THERAPY OF STROKE PATIENT - A robot for rehabilitation therapy includes a robot body and a walker. The robot body includes a fixing band for supporting a waist of a patient, pelvic joint shafts rotatably connected to the fixing band, first arms extending downward from the pelvic joint shafts, first connecting joint shafts connected to the first arm, second arms extending downward from the first connecting joint shafts, second connecting joint shafts rotatably connected to the second arms, extension pieces extending downward from the second connecting joint shafts, and footboards rotatably connected to the extension pieces by ankle joint shafts. The walker includes an upper frame, a connection frame, and a wheeled lower frame. The angles of the first arms and the second arms are adjusted according to the length of the lower half of the body of the patient. | 08-27-2015 |
| 20150272800 | TRANSFER ROBOT FOR CARING FOR PATIENT - Disclosed is a transfer robot for caring for a patient. The robot includes a body section against which the upper half of the body of a patient is leaned, a first clamp which is rotatably provided on one side of the body section for supporting the upper half of the body of the patient, a second clamp, which is provided at a position adjacent to the first clamp so that the position of the second clamp is able to be changed, for supporting the lower half of the body of the patient, a prop which is extendedly arranged below the body for adjusting the height of the body section, and a transfer board, which is connected to the prop, for rotating and moving positions. | 10-01-2015 |
| 20160108445 | METHODS FOR PRODUCTION OF L-METHIONINE AND RELATED PRODUCTS - A method comprising: (a) enzymatically processing an O-acetylhomoserine (OAHS) fermentation liquor to produce L-methionine and an acetate source; (b) separating at least a portion of said L-methionine from at least a fraction of said acetate source to form separated L-methionine and a residual liquor comprising an acetate-source; and (c) recovering at least a portion of said acetate source from said residual liquor as recovered acetate. | 04-21-2016 |
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| 20110057995 | Inkjet head and inkjet head assembly having the same - There is provided an inkjet head and an inkjet head assembly having the same. The inkjet head includes an inkjet head plate having a plurality of nozzles ejecting ink provided therein; pressure chambers storing ink drawn in from both outer ends of the inkjet head plate in a width direction thereof and facing each other in a direction inwards of the width direction; piezoelectric elements supplying the pressure champers with driving force allowing ink to be ejected through the nozzles connected to the pressure chambers and disposed on the pressure chambers having membranes interposed therebetween; a pressure adjusting channel connecting the pressure chambers to adjust a pressure of ink ejected through the nozzles. | 03-10-2011 |
| 20110065851 | Nonaqueous ink composition for ink jet and method of manufacturing ink comprising the same - A nonaqueous ink composition for an ink jet and a method of manufacturing ink comprising the same are provided. The nonaqueous ink composition for the ink jet includes: a glycol ether acetate solvent represented by a specific chemical formula; and a polypropylene glycol binder represented by a specific chemical formula. The nonaqueous ink composition for an ink jet has dynamic viscoelasticity obtained by a chemical interaction between the solvent and the binder, exhibits excellent print quality and is capable of high-speed printing. | 03-17-2011 |
| 20110193913 | Inkjet head cleaning apparatus - There is provided an inkjet head cleaning apparatus including: an air blowing unit spaced apart from a nozzle ejecting ink at a predetermined distance and blowing air toward the nozzle; a blocking surface disposed to face the air blowing unit and blocking ink being removed from the nozzle due to the air released by the air blowing unit; a rebound blocking unit disposed between the blocking surface and the nozzle and blocking ink droplets being rebounded farther than a predetermined distance from the blocking surface among the ink blocked by the blocking surface; and a storage unit receiving the removed ink. | 08-11-2011 |
| 20120024573 | Printed circuit board and manufacturing method thereof - There are provided a printed circuit board and a manufacturing method thereof. The manufacturing method of a printed circuit board includes: preparing a substrate having active regions and non-active regions, the non-active regions being formed on edges thereof; printing resists on dummy portions corresponding to the non-active regions of the substrate by using an inkjet printing method; curing the resists; and performing plating on the active regions of the substrate. The resists are masked on the dummy portions corresponding to the non-active regions of the substrate to prevent plating from being performed on the dummy portions, thereby reducing manufacturing costs. | 02-02-2012 |
| 20120113181 | Resist ink printing device - There is provided a resist ink printing device according to an exemplary embodiment of the present invention including: a transfer unit transferring a substrate on which lead-in wires for electrolytic gold plating are patterned into a main body; a controller formed on the main body to measure a warpage degree of the substrate and recognizing a gerber file stored with circuit diagram information of the substrate to compensate for the warpage degree of the substrate and correct the gerber file; and at least one inkjet printing head part discharging liquid photo resist ink to the lead-in wires by the corrected gerber file. | 05-10-2012 |
| 20130157011 | RESIN SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a resin substrate, including: an insulating material; and a resin layer formed on the insulating material and having surface roughness. | 06-20-2013 |
| 20140151100 | ELECTRONIC COMPONENT EMBEDDED PRINTED CIRCUIT BOARD - An electronic component embedded printed circuit board includes a core having a cavity; an electronic component inserted in the cavity; insulating layers laminated on top and bottom of the core and mixed with a coupling agent, which has functional groups respectively acting on an organic material and an inorganic material, to be bonded to an outer peripheral surface of the electronic component; and circuit patterns provided on the insulating layers. | 06-05-2014 |
| 20140367149 | RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, BUILD-UP FILM, PREPREG AND PRINTED CIRCUIT BOARD - Disclosed herein are an insulating resin composition for a printed circuit board, a build-up film, a prepreg, and a printed circuit board. More specifically, disclosed herein are a build-up film prepared by using a resin composition containing a cage type silsesquioxane instead of the epoxy resin, and a multilayer printed circuit board including the build-up film or a prepreg. | 12-18-2014 |
| 20140370297 | CONDUCTIVE POLYMER COMPOSITION AND CONDUCTIVE FILM USING THE SAME - Disclosed herein is a conductive polymer composition capable of deteriorating water-absorption property and maintaining electrical conductivity by neutralizing polyethylenedioxythiophene/polystyrenesulfonate (PEDOT/PSS) with dicyclohexylmethylamine which is lipid-soluble tertiary amine, and a conductive film using the same. | 12-18-2014 |
| 20140377544 | COMPOSITE MATERIAL, METHOD FOR PREPARING THEREOF, AND SUBSTRATE USING THE SAME - Disclosed herein are a composite material including an anisotropic filler and a component having directionality, wherein the component having directionality has a length in a range of 1.5 to 20 based on a length of the anisotropic filler, a method for preparing thereof, and a substrate using the same as an insulation layer. According to the exemplary embodiment of the present invention, in the composite material using the anisotropic filler, the component having directionality is used for controlling the dispersion directionality of the anisotropic filler, whereby at the time of orientation of the component having directionality, the directionality in which the anisotropic filler is dispersed may be controlled to improve the dispersion of the anisotropic filler. | 12-25-2014 |
| 20150050473 | RESIN COMPOSITION, PRINTED CIRCUIT BOARD USING THE COMPOSITION, AND METHOD OF MANUFACTURING THE SAME - A resin composition, a printed circuit board using the composition, and a method of manufacturing the printed circuit board. The resin composition includes: a photopolymerizable compound, such as one having an ethylenically unsaturated bond which is polymerizable in a molecule, a photoinitiator, and a surface-modified silica by an alkyl sulfonated tetrazole compound. | 02-19-2015 |
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| 20110003210 | Polyolefin Microporous Membrane Surface-Modified By Hydrophilic Polymer, Surface Modification Method Thereof And Lithium-Ion Polymer Battery Including The Same - Disclosed herein are a polyolefin microporous membrane of which surface is modified by a hydrophilic polymer, a surface modification method thereof and a lithium ion polymer battery including the surface-modified polyolefin microporous membrane as a separator. | 01-06-2011 |
| 20130069014 | CONDUCTIVE PASTE COMPOSITION FOR LOW TEMPERATURE FIRING - Disclosed is a conductive paste composition for low temperature firing, including conductive copper powder composed of flake powder, spherical powder and nano powder, a melamine-based binder, and an organic solvent, thus enabling the formation of a conductive wire having a high aspect ratio with high printability, and inexpensive formation of a metal wire, and exhibiting superior electrical properties and adhesive force even when conducting low temperature firing at 200° C. or less, so that the conductive paste composition can be usefully applied as a conductive material for forming electrodes of a variety of products such as solar cells, touch panels, printed circuit boards (PCBs), radio-frequency identification (RFID), plasma display panels (PDPs) and so on. | 03-21-2013 |
| 20130112471 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a printed circuit board and a method of manufacturing the same. The printed circuit board includes preparing a base substrate; forming a pattern layer for forming via holes on the base substrate by printing ink for forming via holes; forming an insulating layer on the base substrate including the pattern layer for forming via holes; and removing the pattern layer for forming via holes. | 05-09-2013 |
| 20130118787 | EPOXY RESIN COMPOSITION FOR FORMING PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD MANUFACTURED THEREFROM, AND METHOD FOR MANUFACTURING THE PRINTED CIRCUIT BOARD - Disclosed herein is an epoxy resin composition including a core-shell structure of microemulsion silica surrounded by surfactant. By using the epoxy resin, surface roughness of a printed circuit board can be formed in an ecofriendly and economic manner. Further, high-reliability microcircuits can be realized by enhancing interface adhesive strength between a resin substrate and a metal layer in a buildup type printed circuit board. | 05-16-2013 |
| 20130133926 | BUILD-UP PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a method of manufacturing a build-up printed circuit board (PCB), the method including: providing a first resin substrate; forming a roughness by coating an epoxy emulsion solution on a surface of the first resin substrate; and providing a core layer by forming a core circuit layer on the first resin substrate on which the roughness is formed. According to the present invention, roughness of a substrate can be formed in an environment-friendly and economical way by introducing a process of coating epoxy emulsion on a resin substrate. Further, a highly reliable fine circuit can be implemented by enhancing an adhesive bond between a build-up board material and a metal circuit layer. | 05-30-2013 |
| 20150347250 | DATABASE MANAGEMENT SYSTEM FOR PROVIDING PARTIAL RE-SYNCHRONIZATION AND PARTIAL RE-SYNCHRONIZATION METHOD OF USING THE SAME - Provided is a database management system (DBMS). The DBMS synchronizes an active node with a standby node and detects a point of time when last synchronization is performed between the active node and the standby node. Then, after the DBMS performs page synchronization from the detected point of time of the last synchronization to a point at which a failover occurs in the active node, the DBMS performs partial log synchronization by receiving a log from the standby node after the point of time of the last synchronization until the active node is recovered. | 12-03-2015 |
| 20160023978 | 6-HYDROXY-2-NAPHTHALENYL FLUORENE DERIVATIVES AND LENS AND CAMERA MODULE USING THE SAME - Disclosed herein are 6-hydroxy-2-naphthalenyl fluorene derivatives and a lens and a camera module using the same. | 01-28-2016 |
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| 20140186593 | RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, INSULATING FILM, PREPREG, AND PRINTED CIRCUIT BOARD - Disclosed herein are a resin composition for a printed circuit board, an insulating film, a prepreg, and a printed circuit board, the resin composition including: a composite epoxy resin containing a bisphenol A type epoxy resin, a cresol novolac epoxy resin, a rubber-modified epoxy resin, a phosphorus based epoxy resin, and an alkyl sulfonated tetrazole-modified epoxy resin; and a curing agent. The insulating film and the prepreg according to the present invention may have basically low coefficient of thermal expansion, excellent heat resistance, a high glass transition temperature, and excellent adhesion force with the metal. | 07-03-2014 |
| 20140187677 | SURFACE MODIFIED SILICA BY ALKYL SULFONATED TETRAZOLE COMPOUND, PREPARING METHOD THEREOF, AND RESIN COMPOSITION CONTAINING THE SAME - This invention relates to a surface modified silica by an alkyl sulfonated tetrazole compound, a preparation method thereof, and a resin composition containing the same. The silica according to this invention can exhibit superior adhesion to a metal. | 07-03-2014 |
| 20150025215 | Fluorene derivatives and lens using the same - Disclosed herein are fluorene derivatives and a lens using the same. | 01-22-2015 |
| 20150050585 | RESIN COMPOSITION, PRINTED CIRCUIT BOARD USING THE COMPOSITION, AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a resin composition, a printed circuit board using the composition, and a method of manufacturing the same. The resin composition includes an epoxy resin; a photoacid generator; and a surface-modified silica by an alkyl sulfonated tetrazole compound. | 02-19-2015 |
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| 20140312561 | APPARATUS FOR ALIGNING BILL AND METHOD FOR ALIGNING BILL USING THE SAME - Disclosed herein are an apparatus and method for aligning a bill supplied to a transfer path with a center line of the transfer path. The apparatus includes a fixed support unit which moves a bill in a transfer direction of the transfer path, a movable support unit which is disposed in succession to the fixed support unit and is provided so as to be movable in a lateral direction of the transfer path, a bill position sensor which senses the position of the bill that moves on the fixed support unit and the movable support unit, and a controller which is controls a lateral displacement of the movable support unit in response to information about the position of the bill, thus aligning the bill with the center line. | 10-23-2014 |
| 20150114794 | Circulation-Type Banknote/Check Deposit/Withdrawal Apparatus Using Lateral Deposit/Withdrawal Scheme and Method of Handling Banknotes and Checks Applied Thereto - The present invention relates to a circulation-type banknote/check deposit/withdrawal apparatus using a lateral deposit/withdrawal scheme and a method of handling banknotes and checks applied thereto, and more particularly, to a circulation-type banknote/check deposit/withdrawal apparatus using a lateral deposit/withdrawal scheme and a method of handling banknotes and checks applied thereto, wherein banknotes and checks of various sizes can be deposited and withdrawn through a single deposit/withdrawal unit; a carrying path is configured to carry the banknotes and checks deposited through the deposit/withdrawal unit in a lateral direction; and the carrying path is provided thereon with a medium alignment unit for aligning the carrying position on the carrying path of the banknotes and checks being carried thereon, so that the banknotes and checks, which have been deposited through the deposit/withdrawal unit and are being carried in the lateral direction, can be carried in a state where the banknotes and checks are aligned with a predetermined alignment position on the carrying path by the medium alignment unit, and stacked into respective corresponding cassettes, thereby optimizing the sizes of check and banknote cassettes based on the sizes of corresponding media (banknotes and checks), enhancing the carrying efficiency of the media on the carrying path by using the lateral deposit scheme, and increasing the processing speed of the media while reducing the volume of the deposit/withdrawal apparatus. | 04-30-2015 |
| 20160101958 | APPARATUS FOR AUTOMATICALLY ALIGNING BILL AND SKEW CONTROL UNIT - An apparatus for automatically aligning bills includes: a plurality of skew control units including a driving roller unit, a body, a first gear unit, and a second gear unit; a first motor unit connected with the first gear unit through a first power transmission member and providing a driving force to the driving roller unit; a second motor unit connected with the second gear unit through a second power transmission member and providing torque to the body; and ball caster units having a spherical shape and coming in contact with a second side of the bill. | 04-14-2016 |
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| 20120288238 | OPTICAL FIBRE CONNECTOR AND AN ASSEMBLY METHOD FOR THE SAME - The present invention relates to an optical fiber connector whereby an operator can easily couple optical fibers on site, and to an assembly method for the same. More specifically the invention relates to: an optical fiber connector wherein a guide ferrule bush is provided between a ferrule and a coil spring so as to be able to solve a problem whereby a ferrule optical fiber between a ferrule body and a reinforcing sleeve is bent, and a problem whereby contact between the ferrule body and the ferrule optical fiber is broken due to frequent movement, when the ferrule moves within a range of movement provided for by a resilient member due to the resilient member; and to an assembly method for the same. | 11-15-2012 |
| 20140243759 | LINEAR FLOW RATE ADJUSTING APPARATUS FOR INFUSION - The present invention relates to a linear flow regulating apparatus for intravenous infusion, and more particularly, to a flow regulating apparatus which is used in an infusion set for intravenous infusion to regulate the flow rate of a solution injected into a body. To eliminate the difficulties caused by the nonlinearity of conventional flow regulating apparatuses, which regulate flow rates by pressing a solution flow tube to adjust the flow passage area, the linear flow regulating apparatus has a control unit to be put in or taken out along the width of a flow channel unit through which the solution flows when the height and length of the flow channel unit are fixed, and is capable of linearly regulating the flow rate by varying the flow passage area of the flow channel unit by adjusting the width of a flow channel unit. | 08-28-2014 |
| 20150160417 | OPTICAL FIBER CONNECTOR - Disclosed is an optical fiber connector. The connector includes a ferrule optical fiber enclosed in a ferrule, the ferrule being elastically supported by an elastic member; and a main optical fiber. The ferrule optical fiber and the main optical fiber are fusion-spliced by a fusion splice unit. A fusion splice part is reinforced by a reinforcing sleeve and the ferrule optical fiber being integral by the reinforcing sleeve moves within a stopper. | 06-11-2015 |
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| 20130306622 | HEATER FOR VEHICLES - Provided is a heater for vehicles, and more particularly, a heater for vehicles which can be easily manufactured and have a reduced thickness to implement miniaturization, by forming a heat radiating part using a plate-shaped first support part (and second support part) vertically disposed to the flow direction of air, and can fix the support part and the heat radiating part by a simple method to increase manufacturability. | 11-21-2013 |
| 20130312453 | EVAPORATOR - Provided is an evaporator including a flow part having a refrigerant flow therein, separately from a first compartment and a second compartment to improve a refrigerant channel structure, in a double evaporator in which a refrigerant flows in a first column and a second column, respectively, thereby reducing the number of four inlets and outlets that is disposed in the first column and the second column, respectively. | 11-28-2013 |
| 20130312454 | EVAPORATOR - Provided is an evaporator including a flow part having a refrigerant flow therein, separately from a first compartment and a second compartment to improve a refrigerant channel structure, in a double evaporator in which a refrigerant flows in a first column and a second column, respectively, thereby reducing the number of four inlets and outlets that is disposed in the first column and the second column, respectively. | 11-28-2013 |
| 20130312455 | EVAPORATOR - Provided is an evaporator including a tank formed with a depressed part and a flow part having a refrigerant flow therein using a flow part forming member, separately from a first compartment and a second compartment to improve a refrigerant channel structure, in a double evaporator in which a refrigerant flows in a first column and a second column, respectively, thereby reducing the number of four inlets and outlets that is disposed in the first column and the second column, respectively, fixing a baffle at an accurate position, and reducing a defective rate to more improve productivity. | 11-28-2013 |
| 20140069136 | COLD-STORAGE HEAT EXCHANGER - Provided is a cold-storage heat exchanger. The cold-storage heat exchanger includes a pair of header tanks, and tubes which are arranged in three rows with respect to the direction of the flow of air and connected at opposite sides thereof to the header tanks. A cold-storage medium is stored in the tubes that are disposed in a middle row, and refrigerant circulates through the tubes that are disposed in front and rear rows. Therefore, the cold-storage medium can effectively store cold-energy transferred from the refrigerant. When the engine of a vehicle is stopping, the cold-storage heat exchanger can discharge the cold-energy that has been stored into the passenger compartment of the vehicle, thus preventing the temperature in the passenger compartment from rapidly increasing, thereby creating pleasant air-conditioned conditions for a user, and minimizing the energy and time required to re-cool the passenger compartment. | 03-13-2014 |
| 20150043898 | VEHICLE HEATER - Provided is a vehicle heater that is capable of being easily manufactured and being miniaturized due to a decrease in a thickness by forming a heat generating part using a first support part (and a second support part) positioned perpendicularly to an air flow direction and having a plate form and is capable of improving heating performance by improving heat exchange performance. | 02-12-2015 |
| 20150343883 | HEATER FOR MOTOR VEHICLE - Provided is a heater for a motor vehicle including: a heat source part: a heat source part rod including a rod sidewall and a rod cover in order to receive the heat source part; a first heat radiating plate including a first heat generation region in which one side of the heat source part is disposed and a first air movement region in which at least one or more first through-holes are formed; and a second heat radiating plate including a second heat generation region in which the other side of the heat source part is disposed and a second air movement region in which at least one or more second through-holes are formed. Particularly, the heat source part is disposed between the first and second heat radiating plates, and the rod sidewall is provided integrally with the first heat radiating plate. | 12-03-2015 |
| 20150345871 | HEAT EXCHANGER EQUIPPED WITH COLD RESERVING PART AND MANUFACTURING METHOD THEREOF - Provided are a heat exchanger equipped with a cold reserving part and a manufacturing method thereof, equipped with a cold reserving part, in which since a cold reserving material charging part is formed at a portion at which an inlet and outlet member is formed, an additionally protruding part to inject the cold reserving material is not required, such that the heat exchanger may be miniaturized and may more rapidly and effectively absorb cold air to increase a cold reserving effect, and a manufacturing method of a heat exchanger equipped with a cold reserving part which forms the cold reserving material charging part to charge the cold reserving material after coating the heat exchanger to block a coating solution from introducing into the heat exchanger, thereby preventing the heat exchanger from corroding due to the coating solution to increase durability and more increase manufacturing performance. | 12-03-2015 |
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| 20140166250 | COOLING MODULE FOR VEHICLE - A cooling module for a vehicle may include a radiator that is disposed at a front side of a vehicle and exchanges heat with ambient air to cool coolant that flows therein, a first condenser in which refrigerant flows through a refrigerant pipe and that is disposed in the radiator and exchanges heat with the coolant flowing in the radiator to condense the coolant, and a second condenser that is connected to the first condenser through a refrigerant pipe, the refrigerant that is condensed by the first condenser flowing therein, and is disposed at a front side of the radiator and exchanges heat with ambient air to further condense the refrigerant. | 06-19-2014 |
| 20140360703 | COOLING MODULE FOR VEHICLE - A cooling module for a vehicle may include a radiator with a first header tank receiving coolant, a second header tank at a predetermined distance from the first header tank to exhaust coolant, and a plurality of tubes that connects the first header tank with the second header tank, and a radiating fin is formed therebetween and at a front side of a vehicle, a water cooled condenser that receives refrigerant through a refrigerant pipe in the second header tank formed by laminating a plurality of plates, which condenses refrigerant by exchanging heat with cooled coolant flowing the second header tank, and an air-cooled condenser connected to the water cooled condenser through the refrigerant pipe, receives first-condensed refrigerant from the water cooled condenser, and is disposed at a front side of the radiator to further condense the refrigerant by exchanging heat with outside air. | 12-11-2014 |
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| 20100245825 | Substrate including alignment marks, methods of aligning wafers and fabricating semiconductors - Provided is a substrate having an alignment mark, methods of aligning wafers and fabricating semiconductors. An alignment method of a wafer comprises providing a wafer on a wafer stage of a photolithography apparatus, irradiating light to the alignment mark, collecting reflected light from the alignment mark, analyzing optical information of the collected light, and determining a location of the wafer based on the analyzed optical information, wherein the wafer comprises a first surface having an alignment mark, the alignment mark including a first plurality of alignment patterns in a first row, and a second plurality of alignment patterns in a second row, the second plurality of alignment patterns being adjacent to the first plurality of alignment patterns, wherein the first plurality of alignment patterns are arranged in a row direction at a first pitch, and the second plurality of alignment patterns are arranged in the row direction at a second pitch different from the first pitch. | 09-30-2010 |
| 20130234100 | NONVOLATILE MEMORY CELLS HAVING PHASE CHANGEABLE PATTERNS THEREIN FOR DATA STORAGE - Phase change memory devices can have bottom patterns on a substrate. Line-shaped or L-shaped bottom electrodes can be formed in contact with respective bottom patterns on a substrate and to have top surfaces defined by dimensions in x and y axes directions on the substrate. The dimension along the x-axis of the top surface of the bottom electrodes has less width than a resolution limit of a photolithography process used to fabricate the phase change memory device. Phase change patterns can be formed in contact with the top surface of the bottom electrodes to have a greater width than each of the dimensions in the x and y axes directions of the top surface of the bottom electrodes and top electrodes can be formed on the phase change patterns, wherein the line shape or the L shape represents a sectional line shape or a sectional L shape of the bottom electrodes in the x-axis direction. | 09-12-2013 |
| 20150041973 | SEMICONDUCTOR DEVICES INCLUDING UNITARY SUPPORTS - A semiconductor device includes a plurality of cylindrical structures located at vertices and central points of a plurality of hexagons in a honeycomb pattern, and a unitary support having a plurality of openings. Each of the openings exposes a part each of four of the cylindrical structures. Each of the openings has the shape of a parallelogram or an oval substantially. A first distance between opposite cylindrical structures of a first pair of the four cylindrical structures exposed by each opening is shorter than a second distance between opposite cylindrical structures of a second pair of the four cylindrical structures exposed by the opening. The first distance is equal to a distance between the central point and each of the vertices of the hexagon. | 02-12-2015 |
| 20150337168 | COMPOSITION FOR FORMING SILICA BASED LAYER, AND METHOD FOR MANUFACTURING SILICA BASED LAYER - A composition for forming a silica based layer and a method for manufacturing a silica based layer, the composition including a silicon-containing compound, the silicon-containing compound including a hydrogenated polysilazane moiety, a hydrogenated polysiloxazane moiety, or a combination thereof, and a solvent, wherein a number of particles of the silicon-containing compound in the composition and having a particle diameter of about 0.2 μm to about 1 μm is less than or equal to about 10/ml. | 11-26-2015 |
| 20160099145 | COMPOSITION FOR FORMING SILICA LAYER, SILICA LAYER, AND ELECTRONIC DEVICE - A composition for forming a silica layer including a silicon-containing polymer having a weight average molecular weight of about 20,000 to about 70,000 and a polydispersity index of about 5.0 to about 17.0 and a solvent; a silica layer manufactured using the same; and an electronic device including the silica layer. | 04-07-2016 |
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| 20110292312 | LIQUID CRYSTAL DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF - A liquid crystal display device (LCD) is constructed with a light blocking layer positioned on a data line region of a lower substrate defined by pixel regions and data line regions. A data line is positioned on the data line region of the lower substrate to overlap the light blocking layer with a gate insulating layer interposed therebetween. An organic insulating layer is positioned on the data line region of the lower substrate in order to cover the data line. Pixel electrodes are respectively positioned on the pixel regions to be spaced apart from the data line. Capacitors are respectively positioned on the pixel regions, and each of the capacitors has a lower electrode formed of a first transparent conductive material and an upper electrode formed of a second transparent conductive material, and the upper electrode is physically insulated from the data line with the organic insulating layer interposed therebetween. | 12-01-2011 |
| 20140159078 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - A display device and a method of manufacturing the display device are disclosed. In one aspect, the display device includes a first substrate, a light-emitting portion formed on the first substrate, and a sealing portion which is attached to the first substrate so as to shield the light-emitting portion from ambient environmental conditions. At least a portion of an edge of the first substrate is chamfered. | 06-12-2014 |
| 20140191219 | ORGANIC LIGHT EMITTING DIODE DISPLAY AND MANUFACTURING METHOD THEREOF - An organic light emitting diode (OLED) display includes: pixel electrodes formed on a substrate; a pixel definition layer between the pixel electrodes and partitioning a pixel area; organic emission layers of a plurality of colors on the pixel electrodes; and a common electrode on the organic emission layers. The pixel definition layer includes a first pattern and a second pattern having different formation materials, thicknesses, and extension directions. | 07-10-2014 |
| 20140332763 | ORGANIC LUMINESCENCE DISPLAY AND METHOD OF MANUFACTURING THE SAME - According to an aspect of the present invention, an organic luminescence display includes a substrate, a first electrode on the substrate, a pixel defining layer on the first electrode and partially exposing the first electrode, an auxiliary layer on the pixel defining layer, an organic layer on the first electrode and an edge of the auxiliary layer, and a second electrode on the organic layer. | 11-13-2014 |
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| 20130071768 | MEMBRANE ELECTRODE ASSEMBLY AND FUEL CELL STACK - A membrane electrode assembly including an electrolyte membrane; a catalyst layer on the electrolyte membrane; a gas diffusion layer attached to the catalyst layer; and an adhesive layer between the electrolyte membrane and the gas diffusion layer around an outer edge of the catalyst layer, and a fuel cell stack including a plurality of unit cells, each including one of the membrane electrode assemblies. | 03-21-2013 |
| 20130280636 | ELECTRODE FOR FUEL CELL, METHOD OF PREPARING SAME, MEMBRANE-ELECTRODE ASSEMBLY AND FUEL CELL SYSTEM INCLUDING SAME - Disclosed are an electrode for a fuel cell, a method of preparing the fuel cell electrode, a membrane-electrode assembly including the fuel cell electrode, and a fuel cell system including the fuel cell electrode. The electrode includes an electrode substrate having a conductive substrate and a layer-by-layer assembled multi-layer disposed on a side of the conductive substrate and a bilayer including a polymer electrolyte or a conductive nanoparticle, and a catalyst layer disposed on the electrode substrate. | 10-24-2013 |
| 20130288155 | SUPPORT FOR ELECTRODE CATALYST AND METHOD OF MANUFACTURING THE SAME, ELECTRODE CATALYST AND FUEL CELL - Disclosed are a support for an electrode catalyst that includes a carbon support and a crystalline carbon layer disposed on a surface of the carbon support, the crystalline carbon layer including one or more heteroatoms chemically-bound to carbon of the carbon support. A method of manufacturing the support for electrode catalyst, an electrode support, and a fuel cell including the support for an electrode catalyst are also disclosed. | 10-31-2013 |
| 20130344414 | SUPPORTER FOR FUEL CELL, AND ELECTRODE FOR FUEL CELL, MEMBRANE-ELECTRODE ASSEMBLY FOR A FUEL CELL, AND FUEL CELL SYSTEM INCLUDING SAME - Disclosed are a supporter for a fuel cell, and an electrode for a fuel cell, a membrane-electrode assembly, and a fuel cell system including the same. The supporter includes a transition metal oxide coating layer formed on a surface of a carbonaceous material, the surface of the carbonaceous material covalently bonded with the transition metal oxide. | 12-26-2013 |
| 20140030618 | ELECTRODE FOR FUEL CELL, METHOD OF FABRICATING THE SAME, AND MEMBRANE-ELECTRODE ASSEMBLY FOR FUEL CELL AND FUEL CELL SYSTEM INCLUDING THE SAME - Disclosed are an electrode for a fuel cell that includes an electrode substrate and a surface-treatment layer disposed on the electrode substrate and including a hydrophilic layer and a hydrophobic layer partially disposed on the hydrophilic layer. Also disclosed are a method of fabricating an electrode for a fuel cell, a membrane-electrode assembly, and a fuel cell system including the membrane-electrode assembly. | 01-30-2014 |
| 20140099568 | CATALYST FOR FUEL CELL, METHOD OF PREPARING SAME, MEMBRANE-ELECTRODE ASSEMBLY AND FUEL CELL SYSTEM INCLUDING SAME - Disclosed are a catalyst for a fuel cell, a method of preparing the same, and an electrode for a fuel cell, a membrane-electrode assembly for a fuel cell, and a fuel cell system including the same, and the catalyst includes a carrier; and an active metal supported on the carrier, wherein the carrier is crystalline carbon bonded with a functional group represented by the following Chemical Formula 1 at the surface thereof. | 04-10-2014 |
| 20140248552 | SUPPORT FOR FUEL CELL, METHOD OF PREPARING THE SAME, AND ELECTRODE FOR FUEL CELL, MEMBRANE-ELECTRODE ASSEMBY FOR A FUEL CELL AND FUEL CELL SYSTEM INCLUDING SAME - A support for a fuel cell includes a substrate including highly crystalline carbon, and a crystalline carbon layer on the substrate. | 09-04-2014 |
| 20140335437 | ELECTRODE CATALYST FOR FUEL CELL, ELECTRODE FOR FUEL CELL INCLUDING THE ELECTRODE CATALYST, AND MEMBRANE ELECTRODE ASSEMBLY AND FUEL CELL INCLUDING THE SAME - An electrode catalyst for a fuel cell, an electrode, a fuel cell, and a membrane electrode assembly (MEA), the electrode catalyst including a carbonaceous support, and a catalyst metal loaded on the carbonaceous support, wherein the carbonaceous support includes a functional group bound on a surface thereof, the functional group being represented by one of Formula 1 or Formula 2, below, | 11-13-2014 |
| 20150207152 | ELECTRODE CATALYST FOR FUEL CELL, METHOD OF PREPARING THE SAME, ELECTRODE FOR FUEL CELL INCLUDING THE ELECTROLYTE CATALYST, AND FUEL CELL INCLUDING THE ELECTRODE - In an aspect herein is provided an electrode catalyst for a fuel cell including a carbonaceous carrier and a metal catalyst supported in the carbonaceous carrier, wherein an amino C | 07-23-2015 |
| 20150236367 | POLYMER ELECTROLYTE MEMBRANE, MEMBRANE ELECTRODE ASSEMBLY AND FUEL CELL INCLUDING THE SAME - A polymer electrolyte membrane includes a fluorinated polymer membrane and a coating layer including a hydrocarbon-based ionomer on at least one surface of the fluorinated polymer membrane. The polymer electrolyte membrane maintains high hydrogen ion conductivity and has improved performance under high temperature and low humidity conditions. A membrane electrode assembly and a fuel cell including the polymer electrolyte membrane are also disclosed. | 08-20-2015 |
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| 20080311727 | METHOD OF CUTTING A WAFER - In a method of cutting a wafer, a supporting member is attached to an upper surface of the wafer on which semiconductor chips are formed. An opening is formed at a lower surface of the wafer along a scribe lane of the wafer. The lower surface of the wafer may be plasma-etched to reduce a thickness of the wafer. A tensile tape may be attached to the lower surface of the wafer. Here, the tensile tape includes sequentially stacked tensile films having different tensile modules. The supporting member is then removed. The tensile tape is cooled to increase the tensile modules between the tensile films. The tensile tape is tensed until the tensile films are cut using the tensile modules difference to separate the tensile tape from the semiconductor chips. Thus, the lower surface of the wafer may be plasma-etched without using an etching mask. | 12-18-2008 |
| 20080315408 | Semiconductor package, semiconductor package module including the semiconductor package, and methods of fabricating the same - Provided are a semiconductor package and a semiconductor package module including the same. The semiconductor package may include a plurality of semiconductor chips, a plurality of leads connected to pads of the semiconductor chips and externally exposed, wherein the plurality of leads may be classified into a plurality of pin groups, and the plurality of semiconductor chips may be classified into a plurality of chip groups, and the pads of the semiconductor chips of like chip groups may be connected to the leads of like pin groups. | 12-25-2008 |
| 20090278249 | Printed circuit board and method thereof and a solder ball land and method thereof - A printed circuit board and method thereof and a solder ball land and method thereof. The example printed circuit board (PCB) may include a first solder ball land having a first surface treatment portion configured for a first type of resistance and a second solder ball land having a second surface treatment portion configured for a second type of resistance. The example solder ball land may include a first surface treatment portion configured for a first type of resistance and a second surface treatment portion configured for a second type of resistance. A first example method may include first treating a first surface of a first solder ball land to increase a first type of resistance and second treating a second surface of a second solder ball land to increase a second type of resistance other than the first type of resistance. A second example method may include first treating a solder ball land to increase a first type of resistance and second treating the solder ball land to increase a second type of resistance other than the first type of resistance. | 11-12-2009 |
| 20110110062 | Stack-type semiconductor device having chips having different backside structure and electronic apparatus including the same - A stack-type semiconductor device including semiconductor chips having different backside structures and an electronic apparatus including the stack-type semiconductor device include: a base frame for a semiconductor device; a first semiconductor chip that is mounted on the base frame and has a bottom surface having a first surface roughness; and a second semiconductor chip that is mounted on the first semiconductor chip and has a bottom surface having a second surface roughness, wherein the second surface roughness is greater than the first surface roughness by 1.2 nm or more. The stack-type semiconductor device is manufactured to be thin while cracking of the first semiconductor chip is prevented. In addition, changes in data caused by charge loss resulting from diffusion of metal ions, which can occur when a stack-type semiconductor device is a memory device, is prevented. | 05-12-2011 |
| 20110318887 | METHOD OF MOLDING SEMICONDUCTOR PACKAGE - A method of molding a semiconductor package includes coating liquid molding resin or disposing solid molding resin on a top surface of a semiconductor chip arranged on a substrate. The solid molding resin may include powdered molding resin or sheet-type molding resin. In a case where liquid molding resin is coated on the top surface of the semiconductor chip, the substrate is mounted between a lower molding and an upper molding, and then melted molding resin is filled in a space between the lower molding and the upper molding. In a case where the solid molding resin is disposed on the top surface of the semiconductor chip, the substrate is mounted on a lower mold and then the solid molding resin is heated and melts into liquid molding resin having flowability. An upper mold is mounted on the lower mold, and melted molding resin is filled in a space between the lower molding and the upper molding. | 12-29-2011 |
| 20130203220 | METHOD OF MOLDING SEMICONDUCTOR PACKAGE - A method of molding a semiconductor package includes coating liquid molding resin or disposing solid molding resin on a top surface of a semiconductor chip arranged on a substrate. The solid molding resin may include powdered molding resin or sheet-type molding resin. In a case where liquid molding resin is coated on the top surface of the semiconductor chip, the substrate is mounted between a lower molding and an upper molding, and then melted molding resin is filled in a space between the lower molding and the upper molding. In a case where the solid molding resin is disposed on the top surface of the semiconductor chip, the substrate is mounted on a lower mold and then the solid molding resin is heated and melts into liquid molding resin having flowability. An upper mold is mounted on the lower mold, and melted molding resin is filled in a space between the lower molding and the upper molding. | 08-08-2013 |
| 20130223001 | PRINTED CIRCUIT BOARD AND MEMORY MODULE COMPRISING THE SAME - A printed circuit board (PCB) comprises an internal wiring layer, an insulating layer on the internal wiring layer, a via hole extending through the insulating layer, and an external wiring layer on the insulating layer. The internal wiring layer comprises at least one metal wiring layer. The via hole exposes the internal wiring layer. The external wiring layer is electrically connected to the internal wiring layer. The external wiring layer includes a mounting area on which a semiconductor chip is disposed and a non-mounting area on which a semiconductor chip is not disposed. A thickness of the mounting area is less than a thickness of the non-mounting area. | 08-29-2013 |
| 20130337616 | METHODS OF FABRICATING SEMICONDUCTOR DEVICES AND UNDERFILL EQUIPMENT FOR THE SAME - A method of fabricating a semiconductor device comprises loading a circuit board including a semiconductor chip into underfill equipment, positioning the circuit board on a depositing chuck of the underfill equipment, filling an underfill material in a space between the semiconductor chip and the circuit board placed on the depositing chuck; transferring the circuit board including the underfill material so that it is positioned on a post-treatment chuck of the underfill equipment; heating the underfill material of the circuit board placed on the post-treatment chuck in a vacuum state, and unloading the circuit board, of which the underfill material has been heated in the vacuum state, from the underfill equipment. | 12-19-2013 |
| 20140062496 | TEST APPARATUS FOR SEMICONDUCTOR PACKAGE - A test apparatus for a semiconductor package comprising an X-ray analyzer acquiring an X-ray image of the semiconductor package and detecting a thickness of the semiconductor package from the X-ray image, and a thermal reaction analyzer applying a voltage to the semiconductor package and detecting a failure position of the semiconductor package using a surface temperature of the semiconductor package and the thickness of the semiconductor package may be provided. | 03-06-2014 |
| 20140242752 | METHOD OF FABRICATING SEMICONDUCTOR PACKAGE - A method of fabricating a semiconductor package includes providing a wafer which includes an upper area having through silicon vias (TSVs) and a lower area not having the TSVs; mounting a semiconductor chip on the upper area of the wafer; forming a passivation layer to a predetermined thickness to cover the semiconductor chip; exposing the TSVs by removing the lower area of the wafer in a state where no support is attached to the wafer; and exposing a top surface of the semiconductor chip by partially removing the passivation layer. | 08-28-2014 |
| 20150118798 | METHOD OF MOLDING SEMICONDUCTOR PACKAGE - A method of molding a semiconductor package includes coating liquid molding resin or disposing solid molding resin on a top surface of a semiconductor chip arranged on a substrate. The solid molding resin may include powdered molding resin or sheet-type molding resin. In a case where liquid molding resin is coated on the top surface of the semiconductor chip, the substrate is mounted between a lower molding and an upper molding, and then melted molding resin is filled in a space between the lower molding and the upper molding. In a case where the solid molding resin is disposed on the top surface of the semiconductor chip, the substrate is mounted on a lower mold and then the solid molding resin is heated and melts into liquid molding resin having flowability. An upper mold is mounted on the lower mold, and melted molding resin is filled in a space between the lower molding and the upper molding. | 04-30-2015 |
| 20150153779 | FLEXIBLE DISPLAY DEVICE INCLUDING TOUCH SENSOR - A flexible display device including a touch sensor is disclosed. In one aspect, the display device includes a flexible substrate, a light emission layer formed over the flexible substrate, and an encapsulation layer formed over the light emission layer and comprising a plurality of encapsulating thin films and a touch detecting layer configured to detect a touch input. The encapsulating thin films include at least one inorganic film and at least one organic film and the touch detecting layer is interposed between a selected one of the at least one inorganic film and a selected one of the at least one organic film that are adjacent to each other. | 06-04-2015 |
| 20150179625 | METHOD OF FABRICATING SEMICONDUCTOR PACKAGE - A method of fabricating a semiconductor package includes providing a wafer which includes an upper area having through silicon vias (TSVs) and a lower area not having the TSVs; mounting a semiconductor chip on the upper area of the wafer; forming a passivation layer to a predetermined thickness to cover the semiconductor chip; exposing the TSVs by removing the lower area of the wafer in a state where no support is attached to the wafer; and exposing a top surface of the semiconductor chip by partially removing the passivation layer. | 06-25-2015 |
| 20160005654 | SYSTEM FOR MANUFACTURING A SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - Provided are a system and method for manufacturing a semiconductor package. The system includes: a laser marker configured to irradiate a first laser beam on a strip to make a mark on the strip; and a laser saw configured to irradiate a second laser beam on the strip to cut the strip into individual semiconductor packages. | 01-07-2016 |
| 20160007459 | PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE USING THE SAME - A printed circuit board (PCB) includes: a base substrate including a top surface including an electronic device mounting region; chip connection pads that are provided on the electronic device mounting region; a conductive pattern group that is provided on the top surface of the base substrate and includes an extended conductive pattern extending between two adjacent chip connection pads from among the chip connection pads, the extended conductive pattern being spaced apart from each of the two adjacent chip connection pads; and a solder resist layer that covers a part of the extended conductive pattern and is spaced apart from the chip connection pads. | 01-07-2016 |
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| 20110081762 | Methods of fabricating non-volatile memory devices with discrete resistive memory material regions - A semiconductor memory device includes a first conductive line on a semiconductor substrate, an interlayer insulating layer on the first conductive line, a second conductive line on the interlayer insulating layer, and a memory cell in an hole through the interlayer insulating layer wherein the first and second conductive lines cross, the memory cell including a discrete resistive memory material region disposed in the hole and electrically connected between the first and second conductive lines. The resistive memory material region may be substantially contained within the hole. In some embodiments, contact between the resistive memory material region and the interlayer insulating layer is substantially limited to sidewalls of the interlayer insulating layer in the hole. | 04-07-2011 |
| 20110128165 | KEYPAD FOR ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE KEYPAD - A keypad for an electronic device having metallic texture has rigidity and elasticity equivalent to those of stainless steel. The keypad is manufactured and includes a metal alloy board, a keypad body manufactured by primarily thermal-treating the metal alloy board to a rigidity enough to be molded and molding the primarily thermal-treated metal alloy board with a press, a button portion formed by secondarily thermal-treating the keypad body to cure the keypad body and etching the secondarily thermal-treated keypad body by means of etching processing, and urethane rubber and a silicon pad attached to a back surface of the keypad body which has undergone anodizing processing and various colorations. | 06-02-2011 |
| 20120003796 | DISPLAY SUBSTRATE, METHOD OF MANUFACTURING THE SAME AND DISPLAY PANEL HAVING THE SAME - An improved display substrate is provided to reduce surface defects on insulating layers of organic thin film transistors. Related methods of manufacture are also provided. In one example, a display substrate includes a base, a plurality of data lines, a plurality of gate lines, a pixel defined by the data lines and the gate lines, an organic thin film transistor, and a pixel electrode. The data lines are on the base and are oriented in a first direction. The gate lines are oriented in a second direction that crosses the first direction. The organic thin film transistor includes a source electrode electrically connected to one of the data lines, a gate electrode electrically connected to one of the gate lines, and an organic semiconductor layer. The pixel electrode is disposed in the pixel and electrically connected to the organic thin film transistor. The pixel electrode comprises a transparent oxynitride. | 01-05-2012 |
| 20140340039 | BATTERY CHARGING DEVICE FOR AN ELECTRIC VEHICLE - An electric vehicle battery charging device includes: a series resonance part, which receives a rectified voltage, and which includes a transformer, a resonant inductor, and a resonant capacitor; a rectifying part, of which a first input end is connected with one end of a secondary winding of the transformer, a second input end is connected with the other end of the secondary winding of the transformer, and an output end is connected with an electric vehicle battery; and a switching part, of which one end is connected with one end of the secondary winding of the transformer and the first input end of the rectifying part, and the other end is connected with the other end of the secondary winding of the transformer and the second input end of the rectifying part, where the switching part controls the current from the secondary winding of the transformer to the rectifying part. | 11-20-2014 |
| 20150224885 | DEVICE FOR COMPENSATING FOR RIPPLES OF OUTPUT VOLTAGE OF PFC CONVERTER AND BATTERY CHARGING DEVICE FOR ELECTRIC VEHICLE USING SAME - A device for compensating ripples in the output voltage of a PFC converter and a battery charging device for an electric vehicle are disclosed. The disclosed device for compensating the ripples included in the output voltage of a PFC converter includes: a first switching element having one end connected with an output terminal that is not connected with a ground from among two output terminals forming an output end of the PFC converter; a second switching element having one end connected with the other end of the first switching element and having the other end connected with a ground; a compensation inductor having one end connected with the other end of the first switching element and with one end of the second switching element; and a compensation capacitor having one end connected with the other end of the compensation inductor and having the other end connected with a ground. | 08-13-2015 |
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| 20090236951 | SWITCHED RELUCTANCE MOTOR - The present invention relates to a switched reluctance motor which includes a housing, a stator and a rotor received and installed within the housing, and a rotor position detecting unit that detects a rotational position of the rotor at an outer side of the housing. Assembling can be quickly and easily performed, a sensor can be easily repaired and checked, and a bad influence on the sensor by temperature and dust can be reduced. | 09-24-2009 |
| 20090267548 | SWITCHED RELUCTANCE MOTOR AND CONNECTION METHOD FOR SENSOR SHUTTER THEREOF - The present invention relates to a switched reluctance motor and a connection method for a sensor shutter thereof. The switched reluctance motor in accordance with the present invention includes a stator; a rotor rotating with respect to the stator centering around a rotational shaft; and a sensor shutter having a sensing part through which a light can be passed and connected to an end portion of the rotational shaft, and a stopping ring is connected to the end portion of the rotational shaft so as to prevent the sensor shutter from being separated. Accordingly, the sensor shutter can be quickly and easily connected and the length of the rotational shaft can be decreased. | 10-29-2009 |
| 20100147012 | REFRIGERATOR HAVING DISPENSER - Disclosed is a refrigerator having a dispenser, including a main body having a cooling chamber and a door for selectively shielding the cooling chamber. The refrigerator also includes a container accommodating unit and a communication chute that passes through a front surface of the door and guides content to a dispensing cavity defined by the container accommodating unit. The refrigerator further includes an obstruction unit disposed in the container accommodating unit, and movable, about a plane perpendicular to the front which content guided by the communication chute is relatively obstructed by the obstruction unit and a second position in which content guided by the communication chute is relatively unobstructed by the obstruction unit. | 06-17-2010 |
| 20100321961 | INSULATION TRANSFORMER AND KEY INPUT CIRCUIT HAVING THE SAME - An insulation transformer and a key input circuit having the same are disclosed. The insulation transformer includes: a core having a certain gap; and primary and secondary coils wound on the core. According to the insulation transformer, the operation deficiency of the insulation transformer can be reduced and thus the signal transmission efficiency can be improved. Also, the key input circuit including: an insulation transformer includes a core having a certain gap, and primary and secondary coils wound on the core; a microcomputer connected with the primary coil; and a key input unit connected with the secondary coil and including multiple resistors and switches. According to the key input circuit having the insulation transformer, the reliability of the operation of the key input circuit can be improved and user inconvenience that may be caused by an operation error can be prevented. | 12-23-2010 |
| 20110318504 | METHOD FOR FABRICATING COMPOSITE MATERIAL COMPRISING NANO CARBON AND METAL OR CERAMIC - Disclosed is a method for fabricating a composite material comprising nano carbon and metal or ceramic, in more detail, a method for fabricating a composite material in which metallic or ceramic particles are uniformly dispersed on a nano carbon surface, the method including (1) coating a metal layer on nano carbon, (2) fabricating composite nano powders by performing a thermal treatment for the nano carbon coated with the metal layer, and (3) sintering the composite nano powders, whereby the composite nano powders, in which metallic or ceramic nano powders are uniformly mixed on the surface of the nano carbon, can be easily fabricated, and such composite nano powders can be sintered so as to fabricate the composite material, in which the nano carbon and the metallic or ceramic powders are uniformly dispersed. Also, the use of the composite material can have a great contribution to implementation of high performance, lightweight and size reduction in electric, electronic and vehicle-related fields, in detail, the composite material can be applied to an electrode material with a high conductivity, a thermal interface with a high thermal conductivity, a structural material with a high strength-to-weight ratio, and the like. | 12-29-2011 |
| 20120186862 | CARRIER TAPE FOR TAB-PACKAGE AND MANUFACTURING METHOD THEREOF - The present invention relates to a method for manufacturing a TAB tap. The method includes forming a circuit pattern region having input/output terminal pattern on a base film, and forming an exposing region at a convey region having a sprocket hole for exposing the base film. Accordingly, the present invention provides a TAB tape that improves reliability of a product by fundamentally preventing the generation of metal particles by forming exposing regions that expose a base film through selectively etching and removing a metal layer of a convey region formed at both side of a TAB tape and having a sprocket hole, and that prevents short-circuit by partially removing a base film at a predetermined region not having a circuit pattern formed thereon through etching. | 07-26-2012 |
| 20130308289 | TAPE FOR ELECTRONIC DEVICES WITH REINFORCED LEAD CRACK - Provided is a tape for electronic devices with lead crack and a method of manufacturing the tape. According to the present invention, by forming a bending portion on a narrow circuit pattern to be connected from an inner lead to an outer lead and further forming the bending portion within a resin application portion, crack occurred in a narrow wiring width can be avoided. The tape may include a first lead and a second lead formed on a dielectric substrate and a bending portion formed on one of the first lead and the second lead wherein the bending portion is formed within a resin application portion. | 11-21-2013 |
| 20140151093 | CARRIER TAPE FOR TAB-PACKAGE AND MANUFACTURING METHOD THEREOF - The present invention relates to a method for manufacturing a TAB tap. The method includes forming a circuit pattern region having input/output terminal pattern on a base film, and forming an exposing region at a convey region having a sprocket hole for exposing the base film. Accordingly, the present invention provides a TAB tape that improves reliability of a product by fundamentally preventing the generation of metal particles by forming exposing regions that expose a base film through selectively etching and removing a metal layer of a convey region formed at both side of a TAB tape and having a sprocket hole, and that prevents short-circuit by partially removing a base film at a predetermined region not having a circuit pattern formed thereon through etching. | 06-05-2014 |
| 20140291004 | Carrier Tape for Tab-Package and Manufacturing Method Thereof - The present invention relates to a carrier tape for TAB-package and a manufacturing method thereof, wherein a TAB tape including a base film having a central area and edge areas at both directions of the central area, a wiring pattern formed at the central area of the base film, a transfer area formed at the edge area of the base film and exposed by the base film, a plurality of sprocket holes arranged in a row on the transfer area and a metal pattern discretely formed from the wiring pattern, and formed at the edge areas of the base film, wherein the metal pattern is formed with a paired structure formed at both sides of the plurality of sprocket holes, such that the present invention has an advantageous effect in that no Cu layer or a metal layer exists at a portion of the sprocket holes from which friction is generated by a driving roller during assembly work between a drive IC and chips/drive IC and panel to dispense with generation of foreign objects such as Cu particles, thereby enhancing reliability of the product. | 10-02-2014 |
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| 20140302184 | NATURAL ANTIMICROBIALS AND ARTICLE COMPRISING THE SAME - There is provided a natural antimicrobial including a mixture of tree essential oils, soybean oil, and a residual hydrocarbon extract extracted from a rutaceae plant, wherein the mixture is supported in a supporter, and an article including the antimicrobial are provided. The antimicrobial is comprised of only natural materials, so it is harmless to human beings and environmentally friendly. Also, in the antimicrobial, tree essential oils is supported together with soybean carrier oil in a supporter, and thus, volatility of tree essential oils is controlled by the soybean oil, whereby the tree essential oils is naturally emitted to have an effective antibiosis for a long period of time. Thus, extra power, driving device (e.g., a fan), or the like, is not required to emit the tree essential oils. In addition, the antimicrobial is actively emitted in the air, having efficacy of continuously annihilate bacteria, virus, or the like. | 10-09-2014 |
