Patent application number | Description | Published |
20080277147 | Wired circuit board and producing method thereof - A wired circuit board includes a metal supporting board, an insulating layer formed on the metal supporting board, and a conductive pattern formed on the insulating layer. The conductive pattern includes an underlying layer formed on the insulating layer and a conductive layer formed on the underlying layer. The underlying layer is formed with a corroded portion corroded from a side end portion of the conductive layer toward an inner portion thereof. A semiconductive layer is formed on a surface of the insulating layer and on a surface of the conductive pattern. The semiconductive layer is formed so as to come in contact with the metal supporting board and have a cut formed in the corroded portion to interrupt conduction between the semiconductive layer formed on the surface of the insulating layer and the semiconductive layer formed on a surface of the conductive layer. | 11-13-2008 |
20080278858 | Wired circuit board - The wired circuit board includes a metal supporting board, a metal foil formed on the metal supporting board, a first insulating layer formed on the metal supporting board so as to cover the metal foil, and a conductive pattern formed on the first insulating layer and having a plurality of wires. The metal foil is arranged along a lengthwise direction of each of the wires so as not to be opposed to part of the wires in a thickness direction and so as to be opposed to a remainder of the wires in the thickness direction. | 11-13-2008 |
20090044969 | Wired circuit board and connection structure between wired circuit boards - A wired circuit board includes a first wired circuit board and a second wired circuit board disposed to be opposed to the first wired circuit board in the same plane. A first opposed surface of the first wired circuit board facing the second wired circuit board and a second opposed surface of the second wired circuit board facing the first wired circuit board include at least two types of interfitting surfaces extending in different directions so as to mutually interfit the first opposed surface with the second opposed surface. | 02-19-2009 |
20090142478 | Wired circuit board and producing method thereof - A wired circuit board and a producing method thereof are provided which can precisely form an insulating layer and reduce transmission loss with a simple layer structure and also features excellent long-term reliability by preventing the occurrence of an ion migration phenomenon between a ground layer and a positioning mark layer, and the insulating layer to improve the adhesion therebetween and the conductivity of a conductor. A metal supporting board is prepared and a first metal thin film is formed on the metal supporting board. A resist is formed in a pattern and a ground layer and a positioning mark layer are formed on the first metal thin film exposed from the resist at the same time. A second metal thin film is formed over the ground layer and the positioning mark layer, then the resist is removed. An insulating base layer is formed on the first metal thin film including the upper surface of the second metal thin film, thereafter, a conductive pattern is formed on the insulating base layer. | 06-04-2009 |
20090183907 | Wired circuit board - A wired circuit board has a metal supporting board, an insulating layer formed on the metal supporting board, a conductive pattern formed on the insulating layer and having a pair of wires arranged in spaced-apart relation, and a semiconductive layer formed on the insulating layer and electrically connected to the metal supporting board and the conductive pattern. The conductive pattern has a first region in which a distance between the pair of wires is small and a second region in which the distance between the pair of wires is larger than that in the first region. The semiconductive layer is provided in the second region. | 07-23-2009 |
20090277868 | Producing method of wired circuit board - A producing method of a wired circuit board includes a laminating step of preparing a metal supporting board, forming an insulating base layer on the metal supporting board, forming a conductive layer including a terminal portion and a plating lead continued from the terminal portion on the insulating base layer, and forming an insulating cover layer on the insulating base layer so as to cover the conductive layer, a first etching step of etching the metal supporting board, and then etching the insulating base layer to expose the plating lead from the metal supporting board and the insulating base layer, and a second etching step of etching the exposed plating lead. | 11-12-2009 |
20090283314 | Wired circuit board and producing method thereof - A method for producing a wired circuit board includes the steps of integrally forming a conductive pattern, a plating lead electrically connected with the conductive pattern, and a regulation portion provided in the plating lead to regulate penetration of an etchant into the conductive pattern; and etching the plating lead with the etchant while the regulation portion regulates the penetration of the etchant into the conductive pattern. | 11-19-2009 |
20090285524 | Suspension board with circuit - A suspension board with circuit includes a metal supporting board including a board trench portion, an insulating base layer formed on a surface of the metal supporting board, a conductive pattern formed on a surface of the insulating base layer, and an optical waveguide provided to overlap the board trench portion when projected in a thickness direction of the metal supporting board. At least a part of the optical waveguide is positioned closer to the conductive pattern than to a back surface of the metal supporting board. | 11-19-2009 |
20090310908 | Suspension board with circuit - A suspension board with circuit includes a circuit board, and an optical waveguide formed on the circuit board. The circuit board is provided with a pedestal for supporting a slider. The pedestal allows the optical waveguide to be disposed so as to overlap the slider in a thickness direction of the circuit board. | 12-17-2009 |
20090310909 | Suspension board with circuit and producing method thereof - A suspension board with circuit includes a circuit board formed with an opening, and having a mounting portion defined by the opening for mounting thereon a slider on which a magnetic head is mounted, and an optical waveguide disposed on the circuit board so as to traverse the opening. The optical waveguide is slack in the opening. | 12-17-2009 |
20100000774 | Suspension board with circuit and producing method thereof - A suspension board with circuit includes a metal supporting board; an insulating base layer formed on the metal supporting board; a conductive pattern formed on the insulating base layer; an insulating cover layer formed on the insulating base layer so as to cover the conductive pattern; and an optical waveguide. The optical waveguide is provided on the metal supporting board separately from the insulating base layer, the conductive pattern, and the insulating cover layer. | 01-07-2010 |
20100002985 | Suspension board with circuit and producing method thereof - A suspension board with circuit includes a circuit board containing a metal supporting board, an insulating pattern formed on the metal supporting board, and a conductive pattern formed on the insulating pattern; an optical waveguide disposed on the circuit board; and a positioning portion provided on the circuit board in order to position the optical waveguide with respect to the circuit board. | 01-07-2010 |
20100002986 | Suspension board with circuit and producing method thereof - A suspension board with circuit includes a metal supporting board; an insulating base layer formed on the metal supporting board; a conductive pattern formed on the insulating base layer; an insulating cover layer formed on the insulating base layer so as to cover the conductive pattern; and an optical waveguide. The optical waveguide is adhered on the metal supporting board, the insulating base layer, or the insulating cover layer. | 01-07-2010 |
20100083492 | Suspension board with circuit and producing method thereof - A suspension board with circuit includes a circuit board containing a metal supporting board, an insulating pattern formed on the metal supporting board, and a conductive pattern formed on the insulating pattern; an optical waveguide disposed on the circuit board; and a positioning portion provided on the circuit board in order to position the optical waveguide with respect to the circuit board. | 04-08-2010 |
20100116537 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - An end of a first line and an end of a second line of a first write wiring pattern are arranged on both sides of a third line of a second write wiring pattern. Circular connection portions are provided at the ends of the first line and the second line. Through holes are formed in portions of a cover insulating layer above the connection portions, respectively. First connecting layers made of copper, for example, are formed to fill the through holes of the cover insulating layer. A substantially rectangular second connecting layer made of copper, for example, is formed to integrally cover upper ends of the connecting layers. This causes the first and second lines to be electrically connected to each other through the first and second connecting layers. | 05-13-2010 |
20100116540 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - An end of a first line and an end of a second line of a first write wiring pattern are arranged on both sides of a third line of a second write wiring pattern. Circular connection portions are provided at the ends of the first line and the second line. In addition, through holes are formed in respective portions of a base insulating layer below the connection portions. Each connection portion comes in contact with a connecting region of a suspension body within the through hole. | 05-13-2010 |
20100130886 | CIRCUIT BOARD FOR BODY FLUID COLLECTION - A circuit board for body fluid collection is provided with an insulating layer, a puncture needle supported by the insulating layer and a conductor pattern that integrally has an electrode which is supported by the insulating layer and brings body fluid collected by puncture of the puncture needle into contact with the board, a terminal connected to a device measuring a component of body fluid and wiring for electrically connecting the electrode and the terminal. | 05-27-2010 |
20100186227 | Wired circuit board and production method thereof - A wired circuit board has a metal supporting board, a metal foil formed on the metal supporting board to have a thickness of less than 2.0 μm, a first insulating layer formed on the metal supporting board to cover the metal foil, and a conductive pattern formed on the first insulating layer. | 07-29-2010 |
20100292610 | CIRCUIT BOARD FOR BODY FLUID COLLECTION - A circuit board for body fluid collection includes a circuit board portion including an insulating layer and a conductor pattern which is supported by the insulating layer and in which an electrode, a terminal to be connected to a device for measuring the component of a body fluid, and a wire which electrically connects the electrode and the terminal are integrally provided. The circuit board for body fluid collection comprises a puncture needle for extracting the body fluid by performing puncturing, which is formed integrally with the circuit board portion and which is protruded from the circuit board portion, and a guard portion for guarding the tip of the puncture needle, which is arranged in opposition to the puncture needle in the lower flow side in the puncture direction of the puncture needle. | 11-18-2010 |
20110048785 | Wired circuit board and producing method thereof - A wired circuit board includes a metal supporting layer, an insulating layer formed on the metal supporting layer, and a conductive layer formed on the insulating layer. In the metal supporting layer, a reference hole for positioning is formed, and a stepped portion is formed so as to surround the reference hole. | 03-03-2011 |
20110286132 | Suspension board with circuit and producing method thereof - A suspension board with circuit includes a metal supporting board, an insulating layer formed on the metal supporting board, and a conductive pattern formed on the insulating layer and having a terminal portion connected to connecting terminals of a magnetic head mounted on a slider. A slider mounting region where the slider is disposed is defined, and a plurality of the terminal portions are spaced apart from each other in the slider mounting region, and in the metal supporting board, an opening which opens so as to expose the insulating layer where the terminal portions are disposed is formed at the slider mounting region. | 11-24-2011 |
20120030939 | Wired circuit board and producing method thereof - A wired circuit board has a metal supporting board, a metal foil formed on the metal supporting board, an insulating base layer formed on the metal supporting board to cover the metal foil, and a conductive pattern formed on the insulating base layer and a having a terminal portion. An opening is formed in the insulating base layer to expose the metal foil. | 02-09-2012 |
20120033395 | PRINTED CIRCUIT BOARD ASSEMBLY SHEET AND METHOD FOR MANUFACTURING THE SAME - A dummy trace portion is provided in a region between at least a suspension board with circuit on one end side and a support frame of a suspension board assembly sheet with circuits. A base insulating layer is formed on a support substrate in the dummy trace portion. A plurality of conductor traces are formed on the base insulating layer, and a cover insulating layer is formed on the base insulating layer to cover each conductor trace. At least one of the base insulating layer and the cover insulating layer in the dummy trace portion has a groove. | 02-09-2012 |
20120152592 | METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD, METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD ASSEMBLY SHEET, PRINTED CIRCUIT BOARD, AND PRINTED CIRCUIT BOARD ASSEMBLY SHEET - Base insulating layers are formed on a support substrate having a conductive property. The support substrate is etched, to form support substrate board and a plurality of conductive portions in a suspension board. The holding piece and the conductive portions constitute a shape determination unit. The conductive portions have first to fifth conductive portions. The third and fourth conductive portions are spaced apart from each other, and the fifth conductive portion is formed between the third and fourth conductive portions. The first and second conductive portions are respectively formed integrally with one end and the other end of the fifth conductive portion. It is determined whether the first and second conductive portions in the shape determination unit are connected electrically to each other. And it is determined whether the first and third conductive portions are connected electrically to each other. | 06-21-2012 |
20120279757 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - An insulating layer is formed on a support substrate having a conductive property. Write wiring traces, read wiring traces, and first and second electrode pad pairs are formed on the insulating layer. The first electrode pad pair is connected to the write wiring traces. The second electrode pad pair is connected to the read wiring traces. Parts of regions of the support substrate, which overlap the electrode pads, are removed. Thus, openings are formed in the regions of the support substrate, which overlap the electrode pads. | 11-08-2012 |
20130014976 | WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF - [Purpose] To provide a wired circuit board in which it is possible to inhibit a conductive adhesive from leaking to the outside, while inhibiting terminals from being increased in size, and also improve connection reliability. | 01-17-2013 |
20130133939 | WIRED CIRCUIT BOARD - A wired circuit board includes an insulating layer formed with a first opening and a second opening, a conductive layer formed on the insulating layer and including a terminal overlapping the first opening, and a wire having a part thereof overlapping the second opening and continued to the terminal, a metal pedestal portion formed under the insulating layer and disposed around the first opening so as to overlap the second opening and support an electronic element, and a conductive portion filling the second opening to provide electrical conduction between the wire and the metal pedestal portion. | 05-30-2013 |
20130215726 | SUSPENSION BOARD WITH CIRCUIT - A suspension board with circuit for mounting a slider unit including an electron device, the electron device being mounted so as to form, when projected in the thickness direction with respect to the slider provided with a magnetic head, an overlapping portion that overlaps with the slider, and a protruding portion that protrudes from the slider. The suspension board with circuit is formed with a first opening penetrating in the thickness direction and accommodates the overlapping portion, and a second opening that communicates with the first opening and accommodates the protruding portion. | 08-22-2013 |
20130299451 | METHOD OF PRODUCING A SUSPENSION BOARD WITH CIRCUIT - A suspension board with circuit includes a metal supporting board, an insulating layer formed on the metal supporting board, and a conductive pattern formed on the insulating layer and having a terminal portion connected to connecting terminals of a magnetic head mounted on a slider. A slider mounting region where the slider is disposed is defined, and a plurality of the terminal portions are spaced apart from each other in the slider mounting region, and in the metal supporting board, an opening which opens so as to expose the insulating layer where the terminal portions are disposed is formed at the slider mounting region. | 11-14-2013 |
20130319743 | WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF - A wired circuit board includes a wire, and a terminal formed continuously to the wire to be electrically connected to an electronic element at one surface thereof in a thickness direction of the wired circuit board. The terminal includes, at the one surface thereof in the thickness direction, a projecting portion projecting toward one side thereof in the thickness direction, and a covering layer covering one end portion of the projecting portion in the thickness direction. | 12-05-2013 |
20130319748 | WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF - A wired circuit board includes an insulating layer to be formed with an opening extending therethrough in a thickness direction of the wired circuit board, a conductive layer formed on one surface of the insulating layer in the thickness direction and including a one-side terminal portion, an other-side terminal portion formed on the other surface of the insulating layer in the thickness direction, disposed so as to overlap the opening and the one-side terminal portion when projected in the thickness direction, and used to be connected to an electronic element via a conductive adhesive, and a conductive portion filling the opening to provide electrical conduction between the one-side terminal portion and the other-side terminal portion. | 12-05-2013 |
20140048311 | WIRED CIRCUIT BOARD - A wired circuit board includes a first insulating layer, a conductive pattern formed on its surface at one side in a thickness direction, and a second insulating layer formed on the surface of the first insulating layer at the one side in the thickness direction so as to cover the conductive pattern. An outer end surface of the first insulating layer in a perpendicular direction to the thickness direction is formed to be inclined outwardly gradually from the one side toward the other side in the thickness direction. An outer end surface of the second insulating layer in the perpendicular direction has an end edge at the other side in the thickness direction which is located between both end edges of the outer end surface of the first insulating layer in the perpendicular direction which are located at the one side and the other side in the thickness direction. | 02-20-2014 |
20140101934 | METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD ASSEMBLY SHEET - A dummy trace portion is provided in a region between at least a suspension board with circuit on one end side and a support frame of a suspension board assembly sheet with circuits. A base insulating layer is formed on a support substrate in the dummy trace portion. A plurality of conductor traces are formed on the base insulating layer, and a cover insulating layer is formed on the base insulating layer to cover each conductor trace. At least one of the base insulating layer and the cover insulating layer in the dummy trace portion has a groove. | 04-17-2014 |
20140126169 | SUSPENSION BOARD ASSEMBLY SHEET WITH CIRCUITS AND METHOD FOR MANUFACTURING THE SAME - A plurality of suspension boards and an inspection substrate are integrally supported by a support frame. In each suspension board, a line is formed on a conductive first support substrate via a first insulating layer. The first support substrate and the line are electrically connected by a first via in the first insulating layer. In the inspection substrate, a conductor layer is formed on a conductive second support substrate with a second insulating layer sandwiched therebetween. The second support substrate and the conductor layer are electrically connected by a second via in the second insulating layer. The first via and the second via have the same configuration. | 05-08-2014 |
20140153373 | SUSPENSION BOARD WITH CIRCUIT - A suspension board with circuit is for mounting thereon a slider/light source unit provided with a slider on which a magnetic head is mounted, and a light source device including a main body, and a light source provided to protrude from the main body. The suspension board with circuit includes a receiving portion formed therein to be capable of receiving the light source, and a guide surface for guiding the light source to the receiving portion when the slider/light source unit is mounted. | 06-05-2014 |
20140353007 | WIRED CIRCUIT BOARD - A wired circuit board includes a metal supporting layer, a first insulating layer, a conductive pattern, and a second insulating layer. The first and second insulating layers include first and second openings which expose both surfaces of the conductive pattern. The conductive pattern has the surface on the other side thereof in a thickness direction which is exposed through the first opening and configured as a first terminal portion, and the surface on one side thereof in the thickness direction which is exposed through the second opening and configured as a second terminal portion. The metal supporting layer includes a third opening which exposes the first terminal portion and a covering portion of the first insulating layer which covers the conductive pattern continued to the first terminal portion, and a reinforcing portion located on a surface on the other side of the covering portion in the thickness direction. | 12-04-2014 |