Patent application number | Description | Published |
20110063550 | ELECTRONIC DEVICE DISPLAY STRUCTURES WITH ALIGNMENT FEATURES - Electronic devices such as handheld electronic devices may have display modules. The display modules may be covered with a layer of protective cover glass. Peripheral portions of the cover glass may be coated with an opaque masking layer to block interior portions of the device from view. An opening in the opaque masking layer can be formed over an active portion of the display module. To facilitate alignment of the display module active area with the opening in the cover glass masking layer, the display module may be provided with alignment marks. The alignment marks may be formed in opposing corners at an end of the display module. The alignment marks may be formed from metal structures on one of the glass layers in the display module. An opaque masking layer that blocks stray backlight may have openings that are formed over the metal structures. | 03-17-2011 |
20110255023 | ELECTRONIC DEVICE DISPLAY STRUCTURES WITH CONTROLLED CHASSIS REFLECTIONS - A display may be based on a display unit that is mounted within a chassis. The display unit may be a liquid crystal display unit. A backlight may be used to illuminate the display unit. The backlight may include a light guide plate. Light from a light source may be launched into an edge of the light guide plate. Scattered light from the light guide plate may travel vertically along a vertical axis that is perpendicular to the plane that contains the light guide plate. The scattered light may pass through the display unit and may serve as backlight for the display. The light guide plate may be mounted within a rectangular opening in the chassis. The edges of the rectangular opening and the edges of the light guide plate may be configured to reduce excessive reflections. These edges may have reflection-reducing coatings, non-planar surfaces, and other reflection-reducing configurations. | 10-20-2011 |
20110255250 | PRINTED CIRCUIT BOARD COMPONENTS FOR ELECTRONIC DEVICES - Electronic devices may be provided that include mechanical and electronic components. Connectors may be used to interconnect printed circuits and devices mounted to printed circuits. Printed circuits may include rigid printed circuit boards and flexible printed circuit boards. Cosmetic structures such as cowlings may be used to improve device aesthetics. Bumpers may be mounted over rough edges of printed circuit boards to protect flex circuits that are routed over the printed circuit boards. Fasteners may be soldered to solder pad structures on printed circuit boards. | 10-20-2011 |
20110285640 | ELECTRIC FIELD SHIELDING FOR IN-CELL TOUCH TYPE THIN-FILM-TRANSISTOR LIQUID CRYSTAL DISPLAYS - Displays such as liquid crystal displays may be used in electronic devices. During operation of a display, electrostatic charges on the surface of the display may give rise to electric fields. One or more electric field shielding layers may be provided in the display to prevent the electric fields from disrupting operation of the liquid crystals material in the display. The shielding layers may be formed at a location in the stack of layers that make up the display that is above the liquid crystal material of the display. Touch sensors and thin film transistors may be located below the shielding layer. | 11-24-2011 |
20120140143 | METHODS FOR ASSEMBLING DISPLAY STRUCTURES WITH ALIGNMENT FEATURES - Displays for electronic devices may be provided with display structures such as liquid crystal display module structures. Backlight structures may provide backlight. A cover glass may be mounted above a liquid crystal display module. When assembling a display, layers of components may be attached to one another using adhesive. Alignment features may be incorporated into the layers of components to ensure that components are laterally and rotationally aligned before being secured to each other. A liquid crystal display module may have a thin-film transistor layer on which alignment marks are formed. Backlight structures may include a light guide plate, a chassis that receives the light guide plate, and a reflector. The chassis may have alignment openings corresponding to the alignment marks on the thin-film transistor layer. The reflector may have portions that overlap the alignment holes or may have portions that are recessed and do not overlap the alignment holes. | 06-07-2012 |
20120188287 | Methods for Enhancing Longevity in Electronic Device Displays - An electronic device may contain components such as a processor, video circuitry, camera flash, communications circuitry, and other components that may generate heat during operation. The device may have a display with a backlight unit that contains light-emitting diodes. Control circuitry within the electronic device can apply drive powers to the light-emitting diodes in a way that is sensitive to the operating temperature of the light-emitting diodes. The control circuitry can determine whether the temperature of the light-emitting diodes is elevated by determining which components are active in the device. Activity levels can be ascertained by gathering status information on each component. Temperature sensors may be used to make real time temperature measurements. Based on factors such as component activity levels and measured temperature values, the control circuitry can adjust the maximum allowed light-emitting diode drive power level to avoid overdriving the diodes during operation at elevated temperatures. | 07-26-2012 |
20120195066 | Electronic Device Display Structures with Controlled Chassis Reflections - A display may be based on a display unit that is mounted within a chassis. The display unit may be a liquid crystal display unit. A backlight may be used to illuminate the display unit. The backlight may include a light guide plate. Light from a light source may be launched into an edge of the light guide plate. Scattered light from the light guide plate may travel vertically along a vertical axis that is perpendicular to the plane that contains the light guide plate. The scattered light may pass through the display unit and may serve as backlight for the display. The light guide plate may be mounted within a rectangular opening in the chassis. The edges of the rectangular opening and the edges of the light guide plate may be configured to reduce excessive reflections. These edges may have reflection-reducing coatings, non-planar surfaces, and other reflection-reducing configurations. | 08-02-2012 |
20120320305 | PROTECTIVE FILM PATTERNING - The patterning of objects (e.g., protective poly-films, heat-spreaders, and other components placed proximate to the backlight of an LCD) with multiple beads or raised protrusions is disclosed. The beads or protrusions can have a uniform or non-uniform size and can be arranged such that they have a uniform or non-uniform pattern density. The beads or protrusions can be patterned on a surface of the object to provide separation between a non-raised surface of the object and a surface of an adjacent item, such as a reflector film. | 12-20-2012 |
20120320327 | VARIABLE WIDTH SEAL - Forming a seal between plates (e.g., glass plates within an LCD or electrodes within an OLED display) using a non-uniform pattern of adhesive applied between the plates is disclosed. The pattern of adhesive can include more adhesive material in portions of the plate that are expected to experience higher levels of stress. The pattern of adhesive can be determined based at least in part on the width of the surface of the plates that contact each other, where wider and narrower portions of the surface can have different adhesive patterns. The amount of adhesive applied to the plates can be varied by adjusting the speed at which a dispensing nozzle traverses the contact surface of the plate, the flow rate at which adhesive is dispensed from the nozzle, or both. | 12-20-2012 |
20120326990 | FLEXIBLE CIRCUIT ROUTING - Flexible circuits for routing signals of a device, such as a touch sensor panel of a touch sensitive device, are provided. The flexible circuit can include a first set of traces for routing a first set of lines and a second set of traces for routing a second set of lines. The first set of traces can couple together the ends of at least a portion of the first set of lines. Additionally, the first set of traces can be non-intersecting or non-overlapping with the second set of traces. The flexible circuit can have a T-shape configuration and can be incorporated within a touch sensitive device, display device, printed circuit board, or the like. The flexible circuit can be placed over another flexible circuit, and can extend onto the device. | 12-27-2012 |
20120327324 | COATED CHASSIS FOR LIQUID CRYSTAL DISPLAY - A coated chassis is disclosed. The chassis can be made from a non-conductive material and can be operable to support a display. A conductive material can be applied to at least a portion of the chassis to form a continuous strip on the chassis frame. The conductive material can further form a closed-loop around the chassis frame. The chassis frame can be included within a device, such as a mobile phone, touchpad, portable computer, portable media player, and the like. The conductive material on the chassis can be coupled to the system ground of the device. Processes for making a coated chassis are also disclosed. | 12-27-2012 |
20130063978 | Chassis for Display Backlight - An electronic device may be provided with a display. Backlight structures may be used to provide backlight for the display. The backlight structures may include a light guide plate. A rectangular ring-shaped chassis may have a rectangular opening that receives the light guide plate. One or more edges of the chassis may be provided with an array of notches that receive light-emitting diodes or other light sources. The light sources may launch light into edge portions of the light guide plate. The chassis may include a first plastic structure such as a light reflecting structure formed from a material such as white plastic. The first plastic structure may surround two or more peripheral edges of the light guide plate. The chassis may also include a second plastic structure such as a light blocking structure formed from a material such as black plastic that helps prevent light leakage. | 03-14-2013 |
20130180764 | Flexible Circuitry with Heat and Pressure Spreading Layers - A flexible printed circuit may be provided with an integrated heat and pressure spreading layer. The heat and pressure spreading layer may be configured to uniformly spread heat and pressure from a bonding tool across a portion of the flexible printed circuit during bonding of the flexible printed circuit to additional circuitry. During manufacturing of the flexible printed circuit, a sheet of heat and pressure spreading material may be attached to a sheet of flexible printed circuitry and the heat and pressure spreading material and the sheet of flexible printed circuitry may be die cut to form multiple flexible printed circuits each with a heat and pressure spreading layer. An electronic device may be provided with a flexible printed circuit with a heat and pressure spreading layer coupled to a component such as a display. | 07-18-2013 |
20130201620 | Flexible Circuit Connectors with Reduced Profiles - An electronic device may contain components such as flexible printed circuits and rigid printed circuits. Electrical contact pads on a flexible printed circuit may be coupled electrical contact pads on a rigid printed circuit using a coupling member. The coupling member may be configured to electrically couple contact pads on a top surface of the flexible circuit to contact pads on a top surface of the rigid circuit. The coupling member may be configured to bear against a top surface of the flexible circuit so that pads on a bottom surface of the flexible circuit rest against pads on a top surface of the rigid circuit. The coupling member may bear against the top surface of the flexible circuit. The coupling member may include protrusions that extend into openings in the rigid printed circuit. The protrusions may be engaged with engagement members in the openings. | 08-08-2013 |
20130281113 | Apparatus and Method for Determining a Wireless Device's Location after Shutdown - A wireless data processing device is described which periodically exits an unpowered state and transmits location data. For example, one embodiment of a wireless data processing device comprises: power circuitry for maintaining the wireless data processing device in a powered or unpowered state, the power circuitry causing the wireless data processing device to enter into an unpowered state responsive to user input; a timer to periodically power up the wireless device or portion thereof in response to reaching a predetermined time; a location services module determining a current location of the wireless data processing device using one or more specified location determination techniques; a transmit thread transmitting the current location of the wireless device over one or more specified communication channels; and the power circuitry powering down the wireless data processing device a second time after the current location has been transmitted. | 10-24-2013 |
20130335999 | Displays With Rounded-Tip Turning Films - An electronic device may be provided with a display having backlight structures. The backlight structures may include a light source. Light from the light source may be coupled into an edge of a light guide plate. The backlight structures may include layers such as a diffuser layer and one or more layers of brightness enhancing film. The brightness enhancing film layers may be used to collimate light scattered from the light guide plate and thereby enhance backlight efficiency. Brightness enhancing films may be formed from transparent substrates such as layers of polyester. A patterned polymer layer such as a layer of patterned cured resin may be formed on the transparent substrate of a backlight enhancing film. A roller-based manufacturing process may be used to form the patterned polymer layer on the substrate. The patterned polymer layer may include a series of parallel ridges with rounded peaks. | 12-19-2013 |
20140159764 | SYSTEMS AND METHODS FOR FRACTURE DETECTION IN AN INTEGRATED CIRCUIT - Systems, methods, and devices are provided to identify the occurrence, location, and/or severity of a fracture within an integrated circuit, even when the integrated circuit is not accessible to external inspection. One such method includes obtaining a measurement of a property of the integrated circuit through at least one contact of the integrated circuit. The measurement may include a resistance of a resistive pattern in the integrated circuit or a measurement of current-voltage behavior of a power supply of the integrated circuit. The measurement of the property may be compared to an expected baseline property. Based at least in part on this comparison, whether a fracture of the integrated circuit has occurred and a location of the fracture in the integrated circuit may be determined. | 06-12-2014 |
20140211122 | Electronic Device With Display Backlight Unit And Display Assembly - An electronic device may be provided with electrical components mounted in an electronic device housing. A display module may be attached to a display cover layer with a layer of adhesive to form a display module assembly. The display module assembly may include a display module assembly chassis. The display module assembly chassis may include a plastic display module assembly chassis molded over a metal display module assembly chassis. The display module assembly and a backlight unit may be assembled to form a display module that is installed within the electronic device housing or display module assembly layers and backlight unit structures may be assembled into the electronic device housing. The backlight unit may include a backlight unit chassis. A metal housing midplate may serve as part of the backlight unit chassis. | 07-31-2014 |
20140262466 | Lowering the Sheet Resistance of a Conductive Layer - An electronic device can include a substrate and a conductive layer. The conductive layer can be disposed over at least a portion of the substrate and a patterned conductive material can be disposed over at least a portion of the conductive layer. Alternatively, the patterned conductive layer can be disposed over at least a portion of a surface of the substrate and the conductive layer can be disposed over a portion of the surface of the substrate and in between the patterned conductive material. The conductive layer can be disposed over at least a portion of the patterned conductive material. The patterned conductive material can have a resistivity that is lower than a resistivity of the conductive layer. | 09-18-2014 |