Patent application number | Description | Published |
20100290696 | METHOD OF MEASURING MEASUREMENT TARGET - In order to measure a measurement target on a PCB, height information of the PCB is acquired by using a first image photographed by illuminating a grating pattern light onto the PCB. Then, a first area protruding on the PCB by greater than a reference height is determined as the measurement target by using the height information. Thereafter, color information of the PCB is acquired by using a second image photographed by illuminating light onto the PCB. Then, the first color information of the first area determined as the measurement target out of the color information of the PCB is set as reference color information. Thereafter, the reference color information is compared with color information of an area except for the first area to judge whether the measurement target is formed in the area except for the first area. Thus, the measurement target may be accurately measured. | 11-18-2010 |
20100295941 | SHAPE MEASUREMENT APPARATUS AND METHOD - A shape measurement apparatus includes a work stage supporting a target substrate, a pattern-projecting section including a light source, a grating part partially transmitting and blocking light generated by the light source to generate a grating image and a projecting lens part making the grating image on a measurement target of the target substrate, an image-capturing section capturing the grating image reflected by the measurement target of the target substrate, and a control section controlling the work stage, the pattern-projecting section and the image-capturing section, calculating a reliability index of the grating image and phases of the grating image, which is corresponding to the measurement target, and inspecting the measurement target by using the reliability index and the phases. Thus, the accuracy of measurement may be enhanced. | 11-25-2010 |
20110002527 | BOARD INSPECTION APPARATUS AND METHOD - An inspection method includes photographing a measurement target to acquire image data for each pixel of the measurement target, acquiring height data for each pixel of the measurement target, acquiring visibility data for each pixel of the measurement target, multiplying the acquired image data by at least one of the height data and the visibility data for each pixel to produce a result value, and setting a terminal area by using the produced result value. Thus, the terminal area may be accurately determined. | 01-06-2011 |
20110002529 | METHOD FOR INSPECTING MEASUREMENT OBJECT - An inspection method for inspecting a device mounted on a substrate, includes generating a shape template of the device, acquiring height information of each pixel by projecting grating pattern light onto the substrate through a projecting section, generating a contrast map corresponding to the height information of each pixel, and comparing the contrast map with the shape template. Thus, a measurement object may be exactly extracted. | 01-06-2011 |
20110191050 | METHOD OF INSPECTING A THREE DIMENSIONAL SHAPE - In order to inspect a three dimensional shape, a predetermined inspection target component formed on a board is selected as the measurement target, a shape of the inspection target component is acquired, a reference point of the inspection target component is detected, relative location information of a polarity mark formed on the inspection target component with respect to the reference point is acquired, and it is judged whether the inspection target component is good or bad by checking whether the polarity mark exists or not by using the relative location information with respect to the reference point. Thus, the location of the polarity mark may be accurately known, and polarity inspection may be more easily and accurately performed. | 08-04-2011 |
20120120414 | METHOD OF INSPECTING BOARD - A method of establishing a tip location of a terminal includes establishing a virtual tip line by measuring a height of a board, on which a component having a terminal and a body is mounted, and comparing the measured measurement height with a predetermined reference height, establishing a central line with respect to a width direction of the terminal along a longitudinal direction of the terminal, and establishing a tip location of the terminal by using the measurement height along the central line from an intersection point of the virtual tip line and the central line. Thus, a tip location of a terminal may be more correctly acquired. | 05-17-2012 |
20120127461 | METHOD OF INSPECTING A SUBSTRATE - A method of inspecting a substrate is disclosed. The method of inspecting a substrate, comprises: obtaining phase data per projecting part with regard to a substrate, by projecting pattern beam onto the substrate having a target object formed thereon through a plurality of projecting parts in sequence; obtaining height data per projecting part with regard to the substrate by using the phase data per the projecting part; setting up a projecting part with highest reliability in the a plurality of projecting parts to be a reference projecting part; modifying height data of remaining projecting part, referenced by height data of the reference projecting part; and obtaining integrated height data by using the modified height data. | 05-24-2012 |
20120128232 | METHOD FOR DETECTING A BRIDGE CONNECTING FAILURE - A method for detecting a bridge connecting failure to detect a bridge shorting terminals of a component includes acquiring a 2D image and height-based information through lights irradiated on a board, acquiring rotation information of the component using at least one of the 2D image and the height-based information, establishing an inspection region for detection of the bridge connecting failure using the rotation information, extracting a first bridge region within the inspection region using the 2D image, extracting a second bridge region within the inspection region using the height-based information, and judging whether the bridge connecting failure of the component occurs by using at least one of the first and second bridge regions. Thus, the method may inspect more precisely the bridge connecting failure through the first bridge region extracted from the 2D image and the second bridge region extracted from the height-based information. | 05-24-2012 |
20130010102 | METHOD OF MEASURING MEASUREMENT TARGET - In order to measure a measurement target on a PCB, height information of the PCB is acquired by using a first image photographed by illuminating a grating pattern light onto the PCB. Then, a first area protruding on the PCB by greater than a reference height is determined as the measurement target by using the height information. Thereafter, color information of the PCB is acquired by using a second image photographed by illuminating light onto the PCB. Then, the first color information of the first area determined as the measurement target out of the color information of the PCB is set as reference color information. Thereafter, the reference color information is compared with color information of an area except for the first area to judge whether the measurement target is formed in the area except for the first area. Thus, the measurement target may be accurately measured. | 01-10-2013 |
20130077849 | METHOD FOR INSPECTING MEASUREMENT OBJECT - An inspection method for inspecting a device mounted on a substrate, includes generating a shape template of the device, acquiring height information of each pixel by projecting grating pattern light onto the substrate through a projecting section, generating a contrast map corresponding to the height information of each pixel, and comparing the contrast map with the shape template. Thus, a measurement object may be exactly extracted. | 03-28-2013 |
20130215262 | BOARD INSPECTION APPARATUS AND METHOD - An inspection method includes photographing a measurement target to acquire image data for each pixel of the measurement target, acquiring height data for each pixel of the measurement target, acquiring visibility data for each pixel of the measurement target, multiplying the acquired image data by at least one of the height data and the visibility data for each pixel to produce a result value, and setting a terminal area by using the produced result value. Thus, the terminal area may be accurately determined. | 08-22-2013 |
20130222578 | SHAPE MEASUREMENT APPARATUS AND METHOD - A shape measurement apparatus includes a work stage supporting a target substrate, a pattern-projecting section including a light source, a grating part partially transmitting and blocking light generated by the light source to generate a grating image and a projecting lens part making the grating image on a measurement target of the target substrate, an image-capturing section capturing the grating image reflected by the measurement target of the target substrate, and a control section controlling the work stage, the pattern-projecting section and the image-capturing section, calculating a reliability index of the grating image and phases of the grating image, which is corresponding to the measurement target, and inspecting the measurement target by using the reliability index and the phases. Thus, the accuracy of measurement may be enhanced. | 08-29-2013 |
20130259359 | JOINT INSPETION APPARATUS - Disclosed herein is a joint inspection apparatus for judging whether an electronic component mounted on a board is appropriately soldered to the board capable of increasing accuracy in judging a state of a joint by combining at least two joint features with each other and capable of allowing a user to intuitively and easily change a reference for judging the state of the joint. The joint inspection apparatus includes: a three-dimensional shape measuring device measuring joint features; a classifying device judging a state of a joint by at least two joint features transmitted by the three-dimensional shape measuring device; and a user interface device displaying the state of the joint, wherein the state of the joint is displayed in a joint space graph in which a user may easily adjust a judgment reference. | 10-03-2013 |
20130263078 | METHOD FOR GENERATING TASK DATA OF A PCB AND INSPECTING A PCB - A method for generating PCB inspection task data and inspecting a PCB is disclosed. The method by which Gerber data and CAD coordinate file generated at the time of PCB designing is matched to each other facilitates to generate a task data and allows a higher inspection accuracy. The task data generating method comprises generating a Gerber data comprising information for pads on the PCB, loading a CAD coordinate file comprising a coordinate of a component mounted on the pads, inferring a shape of lead and body of the component within a pad area by matching the Gerber data and CAD coordinate file, and then setting a pad area where a tip-end of the body locates as an inspection area. | 10-03-2013 |
20130294679 | METHOD FOR INSPECTING MEASUREMENT OBJECT - An inspection method for inspecting a device mounted on a substrate, includes generating a shape template of the device, acquiring height information of each pixel by projecting grating pattern light onto the substrate through a projecting section, generating a contrast map corresponding to the height information of each pixel, and comparing the contrast map with the shape template. Thus, a measurement object may be exactly extracted. | 11-07-2013 |
20140132953 | BOARD INSPECTION METHOD - In order to inspect a board, first, an inspection area including a solder joint is provided with a first light having a first color, a second light having a second color and a third light having a third color at a first inclination angle, a second inclination angle smaller than the first inclination angle and a third inclination angle smaller than the second inclination angle with respect to the board, respectively. Then, a color image of the inspection area is acquired according to the first light, the second light and the third light provided to the inspection area. Thereafter, it is inspected whether the solder joint is good or bad by using a color distribution in the color image. Then, the inspection result is verified by using pre-measured height information of the solder joint. Thus, an inspection error may be prevented. | 05-15-2014 |
20140133735 | METHOD OF INSPECTING A LEAD OF AN ELECTRIC DEVICE - A method of inspecting leads of an electric device, which is capable of improve reliability of inspection regardless of noises induced by regions near the lead. The method uses a height or a brightness of a shoulder region of the lead to inspect existence or nonexistence or a height or a brightness of a tip region of the lead to inspect fastening or unfastening. Therefore, reliability of inspection is improved in comparison with a conventional inspection using colors of lead region. | 05-15-2014 |
20140133738 | METHOD OF INSPECTING A SOLDER JOINT - A method of inspecting a solder joint through which a lead of a semiconductor device is mounted on a printed circuit board is disclosed. The method includes setting an estimated solder joint region at an outside of an end of the lead of the semiconductor device, capturing an image of the estimated solder joint region, calculating a height of solder joint in the estimated solder joint region by using the captured image of the estimated solder joint region, and determining whether the solder joint is defective by comparing the height of the solder joint in the estimated solder joint region with a reference height of a solder joint, which is previously set. According to the method, reliability of inspection is enhanced regardless of environmental noises. | 05-15-2014 |