Patent application number | Description | Published |
20080231499 | LOCATION TRACKING OF MOBILE PHONE USING GPS FUNCTION - A system, method, service and mobile device are disclosed for providing a location of the mobile device. The invention utilizes a mobile phone with a global positioning system (GPS) module which is located in a wireless network. A third party device is able to submit a location query to a mobile telephone service operator (MTSO). This location query includes the mobile phone's telephone number. Using the telephone number, the MTSO determines the base station with which the mobile phone is associated. The location query is then forwarded to the mobile phone via the base station. The mobile phone collects the GPS data from the GPS module and forwards the GPS data to the base station. The base station converts the GPS data to location information and forwards the location information to the third party device via the MTSO. | 09-25-2008 |
20080253437 | MONITORING RELIABILITY OF A DIGITAL SYSTEM - Method, system and article of manufacture are provided for continually monitoring reliability, or aging, of a digital system and for issuing a warning signal if digital system operation degrades to or past a specified threshold. The technique includes periodically determining a maximum frequency of operation of the digital system, and generating a warning signal indicative of a reliability degradation of the digital system if at least one of: (i) a measured or estimated maximum frequency of operation of the digital system is below a warning threshold frequency of operation of the digital system, wherein the warning threshold frequency is greater than or equal to a manufacturer specified minimum frequency of operation for the digital system; or (ii) a rate of change in the difference between measured maximum frequencies of operation of the digital system exceeds an acceptable rate of change threshold for the digital system. | 10-16-2008 |
20080262777 | SYSTEM FOR TESTING PROCESSOR CORES - Systems, methods and program codes are provided for testing multi-core processor chip structures. Individual processor core power supply voltages are provided through controlling individual power supplies for each core, in one aspect to ensure that one or more cores operate at clock rates in compliance with one or more performance specifications. In one example, a first power supply voltage supplied to a first processing core differs from a second core power supply voltage supplied to a second processing core, both cores operating in compliance with a reference clock rate specification. Core power supply voltages may be selected from ordered discrete supply voltages derived by progressively raising or lowering a first supply voltage, optionally wherein the selected supply voltage also enables the core to operate within another performance specification. | 10-23-2008 |
20080270049 | SYSTEM AND METHOD FOR MONITORING RELIABILITY OF A DIGITAL SYSTEM - System and method are provided for continually monitoring reliability, or aging, of a digital system and for issuing a warning signal if digital system operation degrades past a specified threshold. The technique includes implementing a ring oscillator sensor in association with the digital system, wherein logic and/or device percent composition of the ring oscillator sensor mirrors percent composition thereof within the digital system. Counter logic is coupled to the ring oscillator sensor for converting outputted count signals to an oscillation frequency, and control logic is coupled to the counter logic for periodically evaluating oscillation frequency of the ring oscillator sensor and generating a warning signal indicative of reliability degradation if at least one of: (i) a measured or estimated oscillation frequency is below a warning threshold frequency; or (ii) a measured or estimated rate of change in a difference between measured oscillation frequencies exceeds an acceptable rate of change threshold. | 10-30-2008 |
20080277773 | CIRCUIT STRUCTURES AND METHODS WITH BEOL LAYER(S) CONFIGURED TO BLOCK ELECTROMAGNETIC INTERFERENCE - Back end of line (BEOL) circuit structures and methods are provided for blocking externally-originating or internally-originating electromagnetic interference. One such BEOL circuit structure includes one or more semiconductor substrates supporting one or more integrated circuits, and one or more BEOL layers disposed over the semiconductor substrate(s). At least one BEOL layer includes a conductive pattern defined at least partially by a plurality of elements arrayed in a first direction and a second direction throughout at least a portion thereof. The plurality of elements are sized and positioned in at least one of the first and second directions to block electromagnetic interference of a particular wavelength from passing therethrough. In one implementation, a first conductive pattern of a first BEOL layer polarizes electromagnetic interference, and a second conductive pattern of a second BEOL layer blocks the polarized electromagnetic interference. | 11-13-2008 |
20090108349 | HIGH-PERFORMANCE FET DEVICE LAYOUT - A fast FET, a method and system for designing the fast FET and a design structure of the fast FET. The method includes: selecting a reference design for a field effect transistor, the field effect transistor including a source, a drain, a channel between the source and drain, a gate electrode over the channel, at least one source contact to the source and at least one contact to the drain, the at least one source contact spaced a first distance from the gate electrode and the at least one drain contact spaced a second distance from the gate electrode; and adjusting the first distance and the second distance to maximize a performance parameter of the field effect transistor to create a fast design for the field effect transistor. | 04-30-2009 |
20090132082 | STRIPED ON-CHIP INDUCTOR - Sub-100 nanometer semiconductor devices and methods and program products for manufacturing devices are provided, in particular inductors comprising a plurality of spaced parallel metal lines disposed on a dielectric surface and each having width, heights, spacing and cross-sectional areas determined as a function of Design Rule Check rules. For one planarization process rule a metal density ratio of 80% metal to 20% dielectric surface is determined and produced. In one example a sum of metal line spacing gaps is less than a sum of metal line interior sidewall heights. In one aspect at least one of line height, width and line spacing dimensions is selected to optimize one or more chip yield, chip performance, chip manufacturability and inductor Q factor parameters. | 05-21-2009 |
20090134844 | APPARATUS AND METHOD FOR RECYCLING AND REUSING CHARGE IN AN ELECTRONIC CIRCUIT - An apparatus and method for recycling and reusing charge in an electronic circuit. The apparatus includes at least one capacitor coupled to a circuit block in the electronic circuit, the capacitor being configured to collect current charge consumed by the circuit block when set to a charge collection mode, and a voltage level comparator configured to detect a fully charged state when the capacitor is fully charged. Further, the apparatus includes a first electrical switch configured to allow, once the fully charged state is detected, the capacitor to switch to a discharge mode for discharging the current charge collected back into the power supply for reuse by the electrical system and a second switch configured to allow, after the capacitor has fully discharged the current charge collected, the capacitor to switch back to the charge collection mode, such that, the current charge is recycled and reused by the electrical system. | 05-28-2009 |
20090138737 | APPARATUS, METHOD AND PROGRAM PRODUCT FOR ADAPTIVE REAL-TIME POWER AND PERFOMANCE OPTIMIZATION OF MULTI-CORE PROCESSORS - An apparatus, method and program product for optimizing core performance and power in of a multi-core processor. The apparatus includes a multi-core processor coupled to a clock source providing a clock frequency to one or more cores, an independent power supply coupled to each core for providing a supply voltage to each core and a Phase-Locked Loop (PLL) circuit coupled to each core for dynamically adjusting the clock frequency provided to each core. The apparatus further includes a controller coupled to each core and being configured to collect performance data and power consumption data measured for each core and to adjust, using the PLL circuit, a supply voltage provided to a core, such that, the operational core frequency of the core is greater than a specification core frequency preset for the core and, such that, core performance and power consumption is optimized. | 05-28-2009 |
20090138748 | APPARATUS AND METHOD FOR MICRO PERFORMANCE TUNING OF A CLOCKED DIGITAL SYSTEM - An apparatus and method for micro-tuning an effective clock frequency of a core in a microprocessor. The apparatus includes a microprocessor having at least one core with logic configured to transition between states, a clock signal coupled to the microprocessor, the clock signal having a predetermined clock frequency based on a worst-case clock frequency and a predetermined clock period. The apparatus further including at least one voltage drop sensor coupled to the core, the sensor being configured to generate an output signal for detecting a voltage drop in the core and to determine whether or not the output signal is detected within the clock period and, if the output signal is not detected, the sensor dynamically adjusts the clock period of the clock signal provided to the core to allow more time to complete state transitions, such that, dynamically adjusting the clock period effectively changes an effective core clock frequency. | 05-28-2009 |
20090152612 | HIGH YIELD, HIGH DENSITY ON-CHIP CAPACITOR DESIGN - A capacitance circuit assembly mounted on a semiconductor chip, and methods for forming the same, are provided. A plurality of divergent capacitors is provided in a parallel circuit connection between first and second ports, the plurality providing at least one Metal Oxide Silicon Capacitor and at least one Vertical Native Capacitor or Metal-Insulator-Metal Capacitor. An assembly has a vertical orientation, a Metal Oxide Silicon capacitor located at the bottom and defining a footprint, with a middle Vertical Native Capacitor having a plurality of horizontal metal layers, including a plurality of parallel positive plates alternating with a plurality of parallel negative plates. In another aspect, vertically asymmetric orientations provide a reduced total parasitic capacitance. | 06-18-2009 |
20090213522 | ON-CHIP ADJUSTMENT OF MIMCAP AND VNCAP CAPACITORS - One or more on-chip VNCAP or MIMCAP capacitors utilize a variable MOS capacitor to improve the uniform capacitance value of the capacitors. This permits the production of silicon semiconductor chips on which are mounted capacitors having capacitive values that are precisely adjusted to be within a range of between about 1% and 5% of their design value. This optimization can be achieved by the use of a back-to-back connection between a pair of the variable MOS capacitors for DC decoupling. It involves the parallelization of on-chip BEOL capacitance of VNCAP and/or MIMCAP capacitors by the insertion in the FEOL of pairs of back-to-back variable MOS capacitors. | 08-27-2009 |
20100019908 | CIRCUIT STRUCTURE AND METHOD OF FABRICATION FOR FACILITATING RADIO FREQUENCY IDENTIFICATION (RFID) - A radio frequency identification (RFID) device and method of fabrication are presented. The RFID device includes an RFID antenna, a capacitor, and an RFID integrated circuit. The RFID antenna includes an elongate conductive trace disposed within an antenna area of the RFID device, and the capacitor includes an elongate capacitive structure for storing power. The elongate capacitive structure is aligned with the elongate conductive trace and embedded within the antenna area of the RFID device. The RFID integrated circuit is electrically coupled to the RFID antenna and to the capacitor, and the capacitor stores power within the antenna area of the RFID device to facilitate RFID integrated circuit functionality. | 01-28-2010 |
20100032814 | CIRCUIT STRUCTURES AND METHODS WITH BEOL LAYERS CONFIGURED TO BLOCK ELECTROMAGNETIC EDGE INTERFERENCE - Back-end-of-line (BEOL) circuit structures and methods are provided for blocking externally-originating or internally-originating electromagnetic edge interference. One such BEOL circuit structure includes a semiconductor substrate supporting one or more integrated circuits, and multiple BEOL layers disposed over the semiconductor substrate. The multiple BEOL layers extend to an edge of the circuit structure and include at least one vertically-extending conductive pattern disposed adjacent to the edge of the circuit structure. The vertically-extending conductive pattern is defined, at least partially, by a plurality of elements disposed in the multiple BEOL layers. The plurality of elements are uniformly arrayed at the edge of the circuit structure in a first direction or a second direction throughout at least a portion thereof. The plurality of elements are sized and positioned in the first direction or the second direction to block electromagnetic interference of a particular wavelength from passing therethrough. | 02-11-2010 |
20100060344 | TRANSITIONING DIGITAL INTEGRATED CIRCUIT FROM STANDBY MODE TO ACTIVE MODE VIA BACKGATE CHARGE TRANSFER - Circuits and methods are provided for facilitating transitioning of a digital circuit from backgate biased standby mode to active mode. The digital circuit includes a semiconductor substrate, multiple n-channel transistors disposed at least partially in one or more p-type wells in the semiconductor substrate, multiple p-channel transistors disposed at least partially in one or more n-type wells in the semiconductor substrate, and a backgate control circuit. The backgate control circuit is electrically coupled to the p-type well(s) and to the n-type well(s) to facilitate transitioning of the multiple n-channel transistors and the multiple p-channel transistors from backgate biased standby mode to active mode by automatically shunting charge from the n-type well(s) to the p-type well(s) until a well voltage threshold is reached indicative of a completed transition of the transistors from backgate biased standby mode to active mode. | 03-11-2010 |
20100066496 | ACOUSTIC WAVE AND RADIO FREQUENCY IDENTIFICATION DEVICE AND METHOD - An identification method and identification device are presented employing radio frequency and acoustic wave communication modes. The identification method includes: receiving at an acoustic wave and radio frequency identification device an acoustic wave signal of a first frequency and a radio frequency signal of a second frequency, where the acoustic wave signal and the radio frequency signal are received from an acoustic wave and radio frequency identification reader, and the first frequency and the second frequency are different frequencies; and responding to the receiving by transmitting at least one of an acoustic wave identification (AWID) or a radio frequency identification (RFID) from the acoustic wave and radio frequency identification device. | 03-18-2010 |
20100193905 | Techniques for Placement of Active and Passive Devices Within a Chip - A semiconductor die includes a semiconductive substrate layer with first and second sides, a metal layer adjacent the second side of the semiconductive substrate layer, one or more active devices in an active layer on the first side of the semiconductive substrate layer; and a passive device in the metal layer in electrical communication with the active layer. The passive device can electrically couple to the active layer with through silicon vias (TSVs). | 08-05-2010 |
20100285616 | TRANSITIONING DIGITAL INTEGRATED CIRCUIT FROM STANDBY MODE TO ACTIVE MODE VIA BACKGATE CHARGE TRANSFER - Circuits and methods are provided for facilitating transitioning of a digital circuit from backgate biased standby mode to active mode. The digital circuit includes a semiconductor substrate, multiple n-channel transistors disposed at least partially in one or more p-type wells in the semiconductor substrate, multiple p-channel transistors disposed at least partially in one or more n-type wells in the semiconductor substrate, and a backgate control circuit. The backgate control circuit is electrically coupled to the p-type well(s) and to the n-type well(s) to facilitate transitioning of the multiple n-channel transistors and the multiple p-channel transistors from backgate biased standby mode to active mode by automatically shunting charge from the n-type well(s) to the p-type well(s) until a well voltage threshold is reached indicative of a completed transition of the transistors from backgate biased standby mode to active mode. | 11-11-2010 |
20100295156 | STRUCTURE FOR SYMMETRICAL CAPACITOR - Capacitance circuits are provided disposing a lower vertical-native capacitor metal layer above a planar front-end-of-line semiconductor base substrate, planar metal bottom plates spaced a bottom plate distance from the base and top plates above the bottom plates spaced a top plate distance from the base defining metal-insulator-metal capacitors, top plate footprints disposed above the base substrate smaller than bottom plate footprints and exposing bottom plate remainder upper lateral connector surfaces; disposing parallel positive port and negative port upper vertical-native capacitor metal layers over and each connected to top plate and bottom plate upper remainder lateral connector surface. Moreover, electrical connecting of the first top plate and the second bottom plate to the positive port metal layer and of the second top plate and the first bottom to the negative port metal layer impart equal total negative port and positive port metal-insulator-metal capacitor extrinsic capacitance. | 11-25-2010 |
20100297825 | Passive Components in the Back End of Integrated Circuits - Passive components are formed in the back end by using the same deposition process and materials as in the rest of the back end. Resistors are formed by connecting in series individual structures on the nth, (n+1)th, etc levels of the back end. Capacitors are formed by constructing a set of vertical capacitor plates from a plurality of levels in the back end, the plates being formed by connecting electrodes on two or more levels of the back end by vertical connection members. | 11-25-2010 |
20120001297 | Techniques for Placement of Active and Passive Devices within a Chip - A semiconductor die includes a semiconductive substrate layer with first and second sides, a metal layer adjacent the second side of the semiconductive substrate layer, one or more active devices in an active layer on the first side of the semiconductive substrate layer; and a passive device in the metal layer in electrical communication with the active layer. The passive device can electrically couple to the active layer with through silicon vias (TSVs). | 01-05-2012 |
20120040509 | Techniques for Placement of Active and Passive Devices within a Chip - A method for manufacturing a semiconductor device includes fabricating an active layer on a first side of a semiconductor substrate. The method also includes fabricating a metal layer on a second side of the semiconductor substrate. The metal layer includes a passive device embedded within the metal layer. The passive device can electrically couple to the active layer with through vias. | 02-16-2012 |
20120108210 | LOCATION TRACKING OF MOBILE PHONE USING GPS FUNCTION - A system, method, service and mobile device are disclosed for providing a location of the mobile device. The invention utilizes a mobile phone with a global positioning system (GPS) module which is located in a wireless network. A third party device is able to submit a location query to a mobile telephone service operator (MTSO). This location query includes the mobile phone's telephone number. Using the telephone number, the MTSO determines the base station with which the mobile phone is associated. The location query is then forwarded to the mobile phone via the base station. The mobile phone collects the GPS data from the GPS module and forwards the GPS data to the base station. The base station converts the GPS data to location information and forwards the location information to the third party device via the MTSO. | 05-03-2012 |
20120135599 | CIRCUIT STRUCTURES AND METHODS WITH BEOL LAYERS CONFIGURED TO BLOCK ELECTROMAGNETIC EDGE INTERFERENCE - Back-end-of-line (BEOL) circuit structures and methods are provided for blocking externally-originating or internally-originating electromagnetic edge interference. One such BEOL circuit structure includes a semiconductor substrate supporting one or more integrated circuits, and multiple BEOL layers disposed over the semiconductor substrate. The multiple BEOL layers extend to an edge of the circuit structure and include at least one vertically-extending conductive pattern disposed adjacent to the edge of the circuit structure. The vertically-extending conductive pattern is defined, at least partially, by a plurality of elements disposed in the multiple BEOL layers. The plurality of elements are uniformly arrayed at the edge of the circuit structure in a first direction or a second direction throughout at least a portion thereof. The plurality of elements are sized and positioned in the first direction or the second direction to block electromagnetic interference of a particular wavelength from passing therethrough. | 05-31-2012 |
20120223411 | STRIPED ON-CHIP INDUCTOR - Sub-100 nanometer semiconductor devices and methods and program products for manufacturing devices are provided, in particular inductors comprising a plurality of spaced parallel metal lines disposed on a dielectric surface and each having width, heights, spacing and cross-sectional areas determined as a function of Design Rule Check rules. For one planarization process rule a metal density ratio of 80% metal to 20% dielectric surface is determined and produced. In one example a sum of metal line spacing gaps is less than a sum of metal line interior sidewall heights. In one aspect at least one of line height, width and line spacing dimensions is selected to optimize one or more chip yield, chip performance, chip manufacturability and inductor Q factor parameters. | 09-06-2012 |