Patent application number | Description | Published |
20130260562 | METHODS FOR FORMING FINE PATTERNS OF A SEMICONDUCTOR DEVICE - A method may include forming first hard mask patterns and second hard mask patterns extending in a first direction and repeatedly and alternately arranged on a lower layer, forming third mask patterns extending in a second direction perpendicular to the first direction on the first and second hard mask patterns, etching the first hard mask patterns using the third mask patterns to form first openings, forming filling patterns filling the first openings and gap regions between the third mask patterns, forming spacers on both sidewalls of each of the filling patterns, after removing the third mask patterns, and etching the second hard mask patterns using the filling patterns and the spacers to form second openings. | 10-03-2013 |
20140021566 | MAGNETIC DEVICE AND METHOD OF FABRICATING THE SAME - Provided are a magnetic memory device and a method of fabricating the same. The device may include a magnetic tunnel junction including a lower magnetic structure, an upper magnetic structure, and a tunnel barrier interposed therebetween. The tunnel barrier may have a width greater than that of the lower magnetic structure. | 01-23-2014 |
20140024138 | METHOD FOR ETCHING METAL LAYER AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME - The inventive concepts disclosed herein include, for instance, methods for etching a metal layer and methods for manufacturing a semiconductor device using the etched metal layer. A wafer including a metal layer and a mask layer on the metal layer may be loaded into a process chamber. An etching gas may be supplied into the process chamber to etch the metal layer exposed by the mask layer. After the etching process, the mask layer may be removed. The etching gas can include phosphorus (P) and fluorine (F). An RF power may be constantly or selectively supplied to the process chamber, or different levels of RF power can be selectively supplied. An etching gas can be supplied to the process chamber when the RF power is off or at a lower level. A surface activation gas can be supplied when the RF power is on or at a higher level. | 01-23-2014 |
20140117477 | MAGNETIC MEMORY DEVICES AND METHODS OF FABRICATING THE SAME - Magnetic memory devices, and methods of fabricating the same, include lower magnetic patterns arranged along first and second directions orthogonal to each other on a substrate, an upper magnetic layer covering at least two of the lower magnetic patterns arranged along the first direction and at least two of the lower magnetic patterns arranged along the second direction, and a tunnel barrier layer the lower magnetic patterns and the upper magnetic layer. | 05-01-2014 |
20140124881 | SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME - Provided are semiconductor devices and methods of fabricating the same. The semiconductor device may include lower wires, upper wires crossing the lower wires, select elements provided at intersections between the lower and upper wires, and memory elements provided between the select elements and the upper wires. Each of the memory elements may include a lower electrode having a top width greater than a bottom width, and a data storage layer including a plurality of magnetic layers stacked on a top surface of the lower electrode and having a rounded edge. | 05-08-2014 |
20140349413 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME - A method of manufacturing a semiconductor device may include forming a material layer on a substrate, performing a selective oxidation process to form a capping oxide layer on a first surface of the material layer, wherein a second surface of the material layer is not oxidized, and etching the material layer through the second surface to form a material pattern. An etch rate of the capping oxide layer is less than an etch rate of the material layer. A semiconductor device may include a lower electrode on a substrate, a data storage part on a top surface of the lower electrode, an upper electrode on the data storage part, and a capping oxide layer arranged on at least a portion of a top surface of the upper electrode. The capping oxide layer may include an oxide formed by oxidation of an upper surface of the upper electrode. | 11-27-2014 |
20150194595 | MAGNETIC MEMORY DEVICES - A magnetic memory device may include a lower electrode on a substrate, a memory element on the lower electrode, an upper electrode on the memory element, and a protection spacer enclosing a portion of a side surface of the lower electrode and protruding laterally from the side surface of the lower electrode. The protection spacer may have a bottom surface that is positioned at a level higher than that of a bottom surface of the lower electrode. | 07-09-2015 |
20150194599 | METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES USING CAVITIES TO DISTRIBUTE CONDUCTIVE PATTERNING RESIDUE - Methods of manufacturing a semiconductor device include forming a conductive layer on a substrate, forming an air gap or other cavity between the conductive layer and the substrate, and patterning the conductive layer to expose the air gap. The methods may further include forming conductive pillars between the substrate and the conductive layer. The air gap may be positioned between the conductive pillars. | 07-09-2015 |