Jong, KR
Chang Woo Jong, Jeollabuk-Do KR
| Patent application number | Description | Published |
|---|---|---|
| 20090176992 | PROCESS FOR THE PREPARATION OF HIGHLY OPTICAL PURE CARVEDILOL - The present invention relates to a process for the efficient preparation of highly optical pure chiral carvedilol. According to the present invention, a chiral oxazolidin-2-one or oxazolidin-2-thione having formula 2, produced from the reaction of N-protected 2-(2-methoxyphenoxy)ethylamine with a chiral glycidol derivative is used as a key intermediate for the preparation of the chiral carvedilol. Specifically, the process for the preparation of the chiral carvedilol comprises a) reacting a compound of formula 2 with a halogenation agent, a sulfonation agent or a mitsunobu reagent to activate a hydroxyl group of the compound of formula 2, followed by nucleophilic substitution reaction with 9H-4-hydroxy carbazole to produce a compound of formula 7, and b) subjecting the obtained compound of formula 7 to a deprotection reaction in a presence of an inorganic base to produce the targeted chiral carvedilol. The process of the present invention can be accomplished in a mild condition. The process neither requires any extraordinary purification procedure, nor involves decrease of optical purity. Therefore, the process of the present invention provides highly optical pure chiral carvedilol in simple and efficient manner. | 07-09-2009 |
Chol Ho Jong, Seoul KR
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|---|---|---|
| 20150186195 | METHOD OF ANALYSIS APPLICATION OBJECT WHICH COMPUTER-EXECUTABLE, SERVER PERFORMING THE SAME AND STORAGE MEDIA STORING THE SAME - This application relates to a method of analyzing a computer-executable application object and the method includes associating a target control object with an application object to execute the target control object, analyzing the application object through the target control object to extract a scene component defined on the application object and identifying an event for the scene component to detect an event function and monitoring an execution procedure of the application object by the detected event function. Therefore, this application may extract a service flow for a test target application. | 07-02-2015 |
Eun Ji Jong, Gyeonggi-Do KR
| Patent application number | Description | Published |
|---|---|---|
| 20120031311 | PORTABLE ASSEMBLY-TYPE FLAT BENCH - The present invention relates to a portable assembly type flat bench, and more particularly, to a portable assembly type flat bench in which a plurality of supports are spaced apart from each other by an equal spacing in the front and rear directions and left and right directions, and interconnected through a connection panel, to thereby reduce the volume of the bench and to thus enable easy carrying and storage, and easy assembly and disassembly, and to enable the size of the bench to be freely adjusted. The portable assembly type flat bench of the present invention is configured such that a plurality of supports | 02-09-2012 |
Ilyong Jong, Seongnam-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20110222631 | APPARATUS FOR RECEIVING SIGNAL AND METHOD OF COMPENSATING PHASE MISMATCH THEREOF - An apparatus for receiving a signal includes a training signal generator generating a training signal corresponding to each frequency channel; an IQ signal generator generating a first in-phase signal and a first quadrature-phase signal using the training signal in a first operation mode and generating a second in-phase signal and a second quadrature-phase signal using a receiving signal in a second operation mode; an IQ mismatch compensator which makes the first in-phase signal and the first quadrature-phase signal generated in response to each frequency channel converge for a reference time in the first operation mode to obtain a phase mismatch compensation coefficient and after obtaining a phase mismatch compensation coefficient with respect to selected frequency channels and generating a look-up table using the phase mismatch compensation coefficient, compensates the second in-phase signal and the second quadrature-phase signal using the phase mismatch compensation coefficient included in the look-up table in the second operation mode; and a memory in which the look-up table is stored. | 09-15-2011 |
Il-Yong Jong, Yongin-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20110170639 | MULTIPLIER-LESS DATA PROCESSING TECHNIQUES AND RELATED IMPLEMENTATIONS ADAPTED FOR USE IN POLAR MODULATOR - A modulator performs data processing operations such as interpolation and fractional delay adjustment on amplitude and/or phase data by performing shift operations in lieu of multiplication operations. In selected embodiments, the modulator samples input data at a first rate, processes the sampled input data using the first rate, and then interpolates the processed data to produce interpolated data. The modulator then samples the interpolated data at a second rate higher than the first rate and generates output data at the second rate. | 07-14-2011 |
Inwon Jong, Seoul KR
| Patent application number | Description | Published |
|---|---|---|
| 20150067511 | SOUND VISUALIZATION METHOD AND APPARATUS OF ELECTRONIC DEVICE - A method and an apparatus are provided for audio data playback in an electronic device. Pieces of color information, included in an image that is matched to audio data, are acquired, when the audio data is requested. At least one of the pieces of color information is mapped to at least one sound level range of predetermined audible sound according to a percentage of a respective color in the image. A predetermined object pattern is displayed using the at least one of the pieces of color information mapped to the at least one sound level range of the audio data, when the audio data is played. | 03-05-2015 |
| 20150186003 | ELECTRONIC DEVICE AND METHOD FOR DISPLAYING USER INTERFACE THEREOF - A method for displaying a user interface of an electronic device and an electronic device thereof are provided. The method includes displaying at least one object, detecting a touch gesture on the displayed at least one object, displaying a proposed object in response to the detected touch gesture, and replacing the displayed at least one object with a specific object located at a touch-released point among the proposed object when the touch gesture is released. | 07-02-2015 |
Jae Min Jong, Paju-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20090279045 | Methods of manufacturing liquid crystal display devices - An LCD device and a method for manufacturing the same is disclosed, in which it is possible to correct a problem of insufficient or excessive supply of liquid crystal in an LCD device by controlling an amount of liquid crystal. The method includes preparing a liquid crystal cell comprised of a first substrate, a second substrate, a liquid crystal layer between the first and second substrates, and a first sealant formed in the periphery of the liquid crystal layer between the first and second substrates; measuring an amount of liquid crystal provided to the inside of liquid crystal cell; forming an inlet for liquid crystal in the first sealant; and regulating the amount of liquid crystal by supplying or discharging the liquid crystal through the inlet; and sealing the inlet. | 11-12-2009 |
Kim Ho Jong, Changwon-Shi KR
| Patent application number | Description | Published |
|---|---|---|
| 20100037400 | Method of controlling motor-driven washing machine and control system for the same - A control system for a motor-driven washing machine. The control system includes an electrical motor; a driving unit that applies an input voltage to the motor to drive the motor; a voltmeter that measures a reverse voltage generated by the motor for each predetermined period; and a microprocessor reducing a speed of the motor if the measured reverse voltage is less than or equal to a predetermined voltage level. | 02-18-2010 |
Kyung-Mun Jong, Gyeongsangnam-Do KR
| Patent application number | Description | Published |
|---|---|---|
| 20090031761 | SUSPENSION APPARATUS FOR WASHING MACHINE AND WASHING MACHINE HAVING THE SAME - A suspension apparatus for a washing machine comprises: a pivot mounted to a casing; a damper cap mounted to an outer tub installed in the casing; a connection rod having the pivot and the damper cap at both ends thereof; and an elastic means formed in the damper cap, wherein a contact area decreasing portion for reducing a contact area on the surface of the pivot is formed on the pivot. Under this configuration, vibration or noise transmitted to a mounting surface for the pivot is reduced. | 02-05-2009 |
Man-Kyo Jong, Bucheon-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20090127685 | Power Device Packages and Methods of Fabricating the Same - Provided is a power device package including: a substrate including at least one first die attach region; at least one first power semiconductor chip and at least one second power semiconductor chip that are stacked in order on the first die attach region; at least one die attach paddle that is disposed between the at least one first power semiconductor chip and the at least one second power semiconductor chip, wherein the die attach paddle comprises an adhesive layer that is attached to a top surface of the first power semiconductor chip; a conductive pattern including a second die attach region, on which the second semiconductor chip is mounted, and a wire bonding region that is electrically connected to the second die attach region; and an interlayer member between the adhesive layer and the conductive pattern; and a plurality of firs leads electrically connected to at least one of the at least one first power semiconductor chip and the at least one second power semiconductor chip. | 05-21-2009 |
| 20090243079 | Semiconductor device package - Provided is a semiconductor device package including a substrate formed of a silicon (Si)-based material. The semiconductor device package includes a first substrate which comprises first and second principal planes which are opposite each other, and a substrate body layer disposed between the first and second principal planes, the substrate body layer being formed of a silicon (Si)-based material; and at least one first semiconductor device which is mounted on the first principal plane. | 10-01-2009 |
| 20110076804 | POWER DEVICE PACKAGES AND METHODS OF FABRICATING THE SAME - Provided is a power device package including: a substrate including at least one first die attach region; at least one first power semiconductor chip and at least one second power semiconductor chip that are stacked in order on the first die attach region; at least one die attach paddle that is disposed between the at least one first power semiconductor chip and the at least one second power semiconductor chip, wherein the die attach paddle comprises an adhesive layer that is attached to a top surface of the first power semiconductor chip; a conductive pattern including a second die attach region, on which the second semiconductor chip is mounted, and a wire bonding region that is electrically connected to the second die attach region; and an interlayer member between the adhesive layer and the conductive pattern; and a plurality of firs leads electrically connected to at least one of the at least one first power semiconductor chip and the at least one second power semiconductor chip. | 03-31-2011 |
Man-Kyo Jong, Gyeonggi-Do KR
| Patent application number | Description | Published |
|---|---|---|
| 20090243078 | Power Device Packages Having Thermal Electric Modules Using Peltier Effect and Methods of Fabricating the Same - Provided are power device packages, which include thermal electric modules using the Peltier effect and thus can improve operational reliability by rapidly dissipating heat generated during operation to the outside, and methods of fabricating the same. An exemplary power device package includes: a thermal electric module having a first surface and a second surface opposite each other, and a plurality of n-type impurity elements and a plurality of p-type impurity elements alternately and electrically connected to each other in series; a lead frame attached to the first surface of the thermal electric module by an adhesive member; at least one power semiconductor chip and at least one control semiconductor chip, each chip being mounted on and electrically connected to the lead frame; and a sealing member sealing the thermal electric module, the chips, and at least a portion of the lead frame, but exposing the second surface of the module. | 10-01-2009 |
| 20090244848 | Power Device Substrates and Power Device Packages Including the Same - Provided are power device substrates that comprise thermally conductive plastic materials, and power device packages including the same. An exemplary power device package includes a power device substrate that comprises a thermally conductive plastic material, and has a first principal plane that provides an electrically insulating surface and a second principal plane of which at least a portion is exposed outside a molding member. The exemplary power device package further includes one or more power devices disposed on the first principal plane of the power device substrate, and a plurality of conductive members that are electrically connected to the power device(s) in order to electrically connect the power device(s) to an external circuit. | 10-01-2009 |
| 20110204500 | POWER DEVICE PACKAGES HAVING THERMAL ELECTRIC MODULES USING PELTIER EFFECT AND METHODS OF FABRICATING THE SAME - Provided are power device packages, which include thermal electric modules using the Peltier effect and thus can improve operational reliability by rapidly dissipating heat generated during operation to the outside, and methods of fabricating the same. An exemplary power device package includes: a thermal electric module having a first surface and a second surface opposite each other, and a plurality of n-type impurity elements and a plurality of p-type impurity elements alternately and electrically connected to each other in series; a lead frame attached to the first surface of the thermal electric module by an adhesive member; at least one power semiconductor chip and at least one control semiconductor chip, each chip being mounted on and electrically connected to the lead frame; and a sealing member sealing the thermal electric module, the chips, and at least a portion of the lead frame, but exposing the second surface of the module. | 08-25-2011 |
Oh Yeong Jong, Gwangju KR
| Patent application number | Description | Published |
|---|---|---|
| 20110059201 | INJECTION MOLDING APPARATUS FOR HIGH-GLOSS PRODUCTS - An injection molding apparatus includes a first mold supported on a first fixed plate, a second mold assembled to and disassembled from the first mold and forming a cavity for injection molding, a third mold installed so as to be assembled to and disassembled from the second mold, a guide portion guiding the assembly and disassembly of the first, second, and third molds, and a heating and cooling portion heating the second molding when injecting resin for forming a product into the cavity formed as the first and second molds are assembled to each other and cooling the second mod when curing the resin injected into the cavity. | 03-10-2011 |
Se Jong, Seoul KR
| Patent application number | Description | Published |
|---|---|---|
| 20150256570 | Method for Operating Application Providing Group Call Service Using Mobile Voice over Internet Protocol - Disclosed is a method for operating an application providing a group call service using mobile voice over internet protocol (mVoIP). According to one embodiment, a request signal for a group call is received, and regardless of participation in the corresponding the group call, meta information for the group chat room corresponding to the group call can be received from a server. The meta information can comprise at least the group call connection status for each member of the group chat room. | 09-10-2015 |
Seong-Yeong Jong, Suseong-Gu KR
| Patent application number | Description | Published |
|---|---|---|
| 20150192408 | METHOD AND SYSTEM FOR ANALYZING MOTION OF SUBJECT USING EVENT-BASED SENSOR - A method is provided for analyzing motion of a subject. The method includes receiving multiple events from an event-based sensor, the events corresponding to a luminance change of the subject; calculating velocities of the events and directions of the events; generating a motion analysis table comprising an X axis classified into multiple velocity sections, a Y axis classified into multiple direction sections, and multiple cells representing frequencies of events corresponding to combinations of the velocity sections and the direction sections; and determining a motion of the subject based on the motion analysis table. | 07-09-2015 |
Suh Yeul Jong, Seocho-Gu KR
| Patent application number | Description | Published |
|---|---|---|
| 20120033041 | BROADCAST RECEIVER AND 3D VIDEO DATA PROCESSING METHOD THEREOF - A broadcast receiver and a 3D video data processing method thereof are disclosed herein, a 3D video data processing method of a broadcast receiver according to an embodiment of the present invention includes receiving, by a receiving unit, a broadcast signal including 3D video data and 3D complementary video information, wherein the 3D video data include half-resolution base video data and complementary video data for configuring a full-resolution image; parsing, by 3D video information processing unit, a 3D complementary video information; decoding, by a base video decoder, the half-resolution base video data; decoding, by a complementary video decoder, the complementary video data for configuring a full-resolution image; and combining and formatting, by an output formatter, the base video data and the complementary video data using the 3D complementary video information, thereby outputting a full-resolution 3D image. | 02-09-2012 |
Young Do Jong, Ansan-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20130026924 | LED DRIVING CIRCUIT PACKAGE - An LED driving circuit package includes a rectification unit to receive an AC power voltage and rectify the AC power voltage to generate a ripple voltage, an LED driving switching unit including a plurality of switch units and a plurality of current control units. The LED driving circuit package further includes a low voltage control unit including a circuit power supply unit to generate low voltage power, a voltage detection unit to detect a magnitude of the ripple voltage, a reference frequency generation unit to generate a reference frequency, and a reference pulse generation unit to generate a reference pulse for controlling the operation of the LED driving switch unit according to the reference frequency and a magnitude of the voltage detected by the voltage detection unit. | 01-31-2013 |
| 20130026931 | LED LUMINESCENCE APPARATUS AND METHOD OF DRIVING THE SAME - An LED luminescence apparatus includes a plurality of LED units connected in series which are configured to receive a unidirectional ripple voltage, a plurality of switch units, one end of each being connected to the cathode of one of the plurality of LED units, a plurality of constant current control circuit units, one end of each being connected to an another end of a respective switch unit to receive a current from the respective switch unit, each of the constant current control circuit units being configured to output a current control signal to the respective switch unit to control a magnitude of the received current to have a specific value, and a current comparison unit to receive currents flowing from the plurality of switching units, and generate a plurality of switching control signals for the respective switch units to sequentially drive the plurality of constant current control circuit units. | 01-31-2013 |
| 20130026935 | LED LUMINESCENCE APPARATUS - A light-emitting diode (LED) luminescence apparatus configured to receive an alternating current (AC) power includes a plurality of LED units, and a plurality of constant current control units electrically connected to the plurality of LED units. The current control units are configured to control current flowing through each of the LED units so that the current has a specific magnitude. | 01-31-2013 |
| 20140252370 | NITRIDE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - Exemplary embodiments of the present invention disclose a unidirectional heterojunction transistor including a channel layer made of a first nitride-based semiconductor having a first energy bandgap, a barrier layer made of a second nitride-based semiconductor having a second energy bandgap different from the first energy bandgap, the barrier layer including a recess, a drain electrode disposed on a first region of the barrier layer, and a recessed-drain Schottky electrode disposed in the recess of the barrier layer, the recessed-drain Schottky electrode contacting the drain electrode. | 09-11-2014 |
| 20140252371 | HETEROJUNCTION TRANSISTOR AND METHOD OF FABRICATING THE SAME - Exemplary embodiments of the present invention disclose a heterojunction transistor having a normally off characteristic using a gate recess structure and a method of fabricating the same. The heterojunction transistor may include a substrate, a channel layer disposed on the substrate and made of a first nitride-based semiconductor having a first energy bandgap, a first barrier layer disposed on the channel layer and made of a second nitride-based semiconductor having a second energy bandgap different from the first energy bandgap, a gate electrode disposed in a gate control region of the first barrier layer, and a second barrier layer disposed in gate non-control regions of the first barrier layer and separated from the first barrier layer. | 09-11-2014 |