Patent application number | Description | Published |
20080266829 | SHIELDING STRUCTURES FOR SIGNAL PATHS IN ELECTRONIC DEVICES - A shielding structure is provided for shielding a signal path extending between a first layer and a second layer in an electronic device at a transition region with a transition that extends in a first direction and a second direction orthogonal to the first direction. The shielding structure includes a shielding structure portion, which includes a first shielding via in proximity to a first area of the signal path at the transition; a second shielding via in proximity to a second area of the signal path at the transition; and an area metallization electrically coupled to the first shielding via. | 10-30-2008 |
20080315371 | METHODS AND APPARATUS FOR EMI SHIELDING IN MULTI-CHIP MODULES - Methods and structures provide a shielded multi-layer package for use with multi-chip modules and the like. A substrate ( | 12-25-2008 |
20080315376 | Conformal EMI shielding with enhanced reliability - An electromagnetic interference (EMI) and/or electromagnetic radiation shield is formed on a plurality of encapsulated modules by attaching a molded package panel to a process carrier ( | 12-25-2008 |
20090072357 | Integrated shielding process for precision high density module packaging - An electromagnetic interference (EMI) and/or electromagnetic radiation shield is formed on a plurality of encapsulated modules by attaching a plurality of modules ( | 03-19-2009 |
20090075428 | ELECTROMAGNETIC SHIELD FORMATION FOR INTEGRATED CIRCUIT DIE PACKAGE - Electromagnetic shielding for an integrated circuit packaged device. The method includes forming shielding structures by forming openings in an encapsulated structure. The openings are filled with conductive material that surrounds at least one die. The encapsulated structure may include a plurality of integrated circuit die. A layered redistribution structure is formed on one side of the encapsulated structure. | 03-19-2009 |
20100044840 | SHIELDED MULTI-LAYER PACKAGE STRUCTURES - Embodiments include shielded multi-layer packages for use with multi-chip modules and the like. A substrate ( | 02-25-2010 |
20110003435 | ELECTROMAGNETIC SHIELD FORMATION FOR INTEGRATED CIRCUIT DIE PACKAGE - Electromagnetic shielding for an integrated circuit packaged device. The method includes forming shielding structures by forming openings in an encapsulated structure. The openings are filled with conductive material that surrounds at least one die. The encapsulated structure may include a plurality of integrated circuit die. A layered redistribution structure is formed on one side of the encapsulated structure. | 01-06-2011 |
20110075394 | SHIELDING STRUCTURES FOR SIGNAL PATHS IN ELECTRONIC DEVICES - A shielding structure is provided for shielding a signal path extending between a first layer and a second layer in an electronic device at a transition region with a transition that extends in a first direction and a second direction orthogonal to the first direction. The shielding structure includes a shielding structure portion, which includes a first shielding via in proximity to a first area of the signal path at the transition; a second shielding via in proximity to a second area of the signal path at the transition; and an area metallization electrically coupled to the first shielding via. | 03-31-2011 |