Patent application number | Description | Published |
20080203507 | Image sensors for zoom lenses and fabricating methods thereof - An image sensor includes a semiconductor substrate on which a plurality of photo diodes are formed. A plurality of interlayer dielectrics are formed above the semiconductor substrate, and a plurality of metal lines are formed on each of the interlayer dielectrics. A plurality of micro lenses are formed above the uppermost one of the interlayer dielectrics. The light passing through the zoom lenses is incident on the respective micro lenses. The plurality metal lines formed on at least one of the plurality of interlayer dielectrics have the same width. | 08-28-2008 |
20080224191 | Image pickup device with prevention of leakage current - An image pickup device includes an active pixel sensor (APS), a row driver, and a leakage current breaker. The active pixel sensor includes an array of a plurality of pixels. The row driver selects at least one pixel to be activated to output signals. The leakage current breaker decreases the leakage current through the unselected pixels by applying a leakage current breaker voltage at the bit lines of the APS array. | 09-18-2008 |
20090174799 | Method of driving an image sensor - For driving an image sensor having a pixel with a transfer gate formed between a photo-detector and a floating diffusion region, a noise-reducing voltage is applied on the transfer gate during a first period of an integration mode. A blooming current voltage is applied on the transfer gate during a second period of the integration mode. A read voltage is applied on the transfer gate during a read mode after the integration mode. The read voltage has a higher magnitude than the blooming current voltage. With application of the noise-reducing voltage, noise is reduced and a dynamic range is extended for the image sensor. | 07-09-2009 |
20090230444 | CMOS IMAGE SENSOR CONFIGURED TO PROVIDE REDUCED LEAKAGE CURRENT - A complementary metal-oxide-semiconductor (CMOS) image sensor (CIS) includes a semiconductor substrate including a photodiode therein as a light sensing unit. A floating diffusion region of a first conductivity type is provided in the semiconductor substrate, and is configured to receive charges generated in the photodiode. A power supply voltage region of the first conductivity type is also provided in the semiconductor substrate. A reset transistor including a reset gate electrode on a surface of the substrate between the floating diffusion region and a power supply voltage region is configured to discharge charges stored in the floating diffusion region in response to a reset control signal. The reset transistor includes a channel region in the substrate extending between the floating diffusion region and the power supply voltage region such that the floating diffusion region and the power supply voltage regions define source/drain regions for the reset transistor. An impurity region is provided in a first portion of the channel region adjacent to the floating diffusion region. The impurity region has a doping such that the first portion of the channel region adjacent to the floating diffusion region has a different built-in potential than a second portion of the channel region adjacent to the power supply voltage region. | 09-17-2009 |
20100056864 | CAPSULE-TYPE IMAGE PHOTOGRAPHING APPARATUS AND ENDOSCOPY USING THE SAME - Provided are a capsule-type image photographing apparatus and endoscopy using the same. The apparatus includes a shell unit having a globular shape and a main body unit capable of freely rotating in the shell unit. The main body unit includes an image photographing system, a wireless transmitter, a battery, a counterweight for determining the center of gravity of the main body unit, and an encapsulant for fixing the image photographing system, the wireless transmitter, the battery, and the counterweight. The apparatus may be a long-distance capsule-type image photographing apparatus or a short-distance capsule-type image photographing apparatus depending on the position of the counterweight. By use of the long- and short-distance capsule-type image photographing apparatuses, the interior of the tested person's body can be effectively photographed. | 03-04-2010 |
20100070821 | METHOD AND APPARATUS FOR DETECTING FREE PAGE AND A METHOD AND APPARATUS FOR DECODING ERROR CORRECTION CODE USING THE METHOD AND APPARATUS FOR DETECTING FREE PAGE - A method and apparatus for detecting a free page of a memory device, and a method and apparatus for decoding an error correction code by using the method and apparatus for detecting a free page are provided. Free page data read from the memory is converted into a converted codeword for inclusion as an element of an error correction code field. The converted codeword is compared to an initially set target codeword to detect an amount of non-identical bits. A page read from the memory is determined to be a free page when the amount of non-identical bits is equal to or less than an initially set threshold value. | 03-18-2010 |
20100233073 | Manufacturing Method of Highly Pure Alpha-LiAlO2 - The present invention relates to a method for preparing high-purity alpha-lithium aluminate (α-LiAlO | 09-16-2010 |
20120194512 | THREE-DIMENSIONAL IMAGE DATA DISPLAY CONTROLLER AND THREE-DIMENSIONAL IMAGE DATA DISPLAY SYSTEM - A display controller can include a blending coefficient storing unit and an image mixing unit. The blending coefficient storing unit can store blending coefficients. The image mixing unit can receive left-eye image data and right-eye image data, and generate three-dimensional image data by performing a blending operation on the left-eye image data and the right-eye image data using the blending coefficients stored in the blending coefficient storing unit. | 08-02-2012 |
20120320724 | METHOD AND APPARATUS FOR DETERMINING UNBALANCED DISC AND OPTICAL INFORMATION STORAGE MEDIUM SYSTEM USING THE SAME - An unbalanced disc determining apparatus is provided. The unbalanced disc determining apparatus includes a noise reduction unit configured to reduce noise components of a center error signal obtained from a signal configured to detect light reflected by a disc revolved by a spindle motor, and a determination unit configured to determine whether the revolving disc is unbalanced by determining whether the center error signal of which noise is reduced exceeds a reference value. | 12-20-2012 |
20130047758 | Z-AXIS STAGE DRIVING APPARATUS, STAGE DRIVING APPARATUS, AND METHOD FOR MANIPULATING STAGE DRIVING APPARATUS - Disclosed is Z-axis stage driving apparatus to move a stage on which a workpiece such as a wafer is placed along a Z-axis. The Z-axis stage driving apparatus includes a motor, a plurality of elevating devices to move a stage along a Z-axis, a power transmission device to transmit power of the motor to the plurality of elevating devices, and a clutch to control power transmission between the power transmission device and the elevating devices. | 02-28-2013 |
20130219246 | Method and Apparatus for Detecting Free Page and a Method and Apparatus for Decoding Error Correction Code Using the Method and Apparatus for Detecting Free Page - A method and apparatus for detecting a free page of a memory device, and a method and apparatus for decoding an error correction code by using the method and apparatus for detecting a free page are provided. Free page data read from the memory is converted into a converted codeword for inclusion as an element of an error correction code field. The converted codeword is compared to an initially set target codeword to detect an amount of non-identical bits. A page read from the memory is determined to be a free page when the amount of non-identical bits is equal to or less than an initially set threshold value. | 08-22-2013 |
20150045548 | METHOD FOR PREPARING FLUORINE-18 ELUENT WITH ADJUSTED PH, AND METHOD FOR LABELLING FLUORINE-18 USING SAME - The present invention relates to a method for labelling fluorine-18, which is a radioisotope, and more specifically, to a method for labelling a [ | 02-12-2015 |
Patent application number | Description | Published |
20100006821 | NANOSCALE MULTI-JUNCTION QUANTUM DOT DEVICE AND FABRICATION METHOD THEREOF - The present invention relates to a method of fabricating a nanoscale multi-junction quantum dot device wherein it can minimize constraints depending on the number or shape of patterns and a line width, and in particular, overcome shortcomings depending on the proximity effect occurring between patterns while employing the advantages of electron beam lithography to the utmost by forming a new conductive layer between the patterns and utilizing it as a new pattern. | 01-14-2010 |
20110174620 | ULTRA HIGH SPEED AND HIGH SENSITIVITY DNA SEQUENCING SYSTEM AND METHOD FOR SAME - The present system relates to a system architecture that uses a single electron transistor (SET) to analyze base sequences of deoxyribonucleic acid (DNA) at ultra high speed in real time. DNA represents the entire body of genetic information and consists of nucleotide units. There are a total of four types of nucleotides, and each nucleotide consists of an identical pentose (deoxyribose), phosphate group, and one of four types of bases (Adenine: A, Guanine: G, Cytosine: C, Thymine: T). A and G are purines having a bicyclic structure while C and T are pyrimidines having a monocyclic structure. Each has a different atomic arrangement, which signifies a different charge distribution from one another. Therefore, a system comprising a single electron transistor that is very sensitive to charges, a probe of a very small size that reacts to one nucleotide very effectively, and an extended gate that connects the SET with the probe, can be used to analyze DNA base sequences at ultra high speed in real time. | 07-21-2011 |
20130221330 | MULTIPLE QUANTUM DOT DEVICE AND A PRODUCTION METHOD FOR THE DEVICE - The present invention relates to a multi-quantum dot device and a method of manufacturing the multi-quantum dot device. Further specifically, present invention relates to a multi-quantum dot device including a channel configured by patterning the top silicon layer of an SOI wafer to have a P-type silicon region formed by connecting a transversal region and a longitudinal region and a plurality of N-type silicon regions; gates including a plurality of tunneling barrier gates, an end of each tunneling barrier gate is positioned on the top of a transversal side of an intersection of the transversal region and the longitudinal region of the P-type silicon region to locally control a potential in the channel; a plurality of coupling gates, an end of each coupling gate is positioned on the top of a point between the intersection and another intersection adjacent to the intersection to locally control the potential in the channel; and a plurality of sensor gates, an end of each sensor gate is positioned on the top of a center of the intersection to sense a state of a quantum dot formed at the intersection; and an inversion layer gate formed on the top of the P-type silicon region to control free electron density. | 08-29-2013 |
Patent application number | Description | Published |
20090027864 | Printed circuit board and manufacturing method thereof - A printed circuit board and a method of manufacturing the printed circuit board are disclosed. A printed circuit board, which includes an insulation layer, a circuit pattern formed on a surface of the insulation layer that includes at least one pad, and a solder resist which covers the circuit pattern, and in which an opening is formed that exposes a portion of a side and a surface of the pad, can ensure a sufficient amount of attachment area for the pads and the solder resist, to strengthen the adhesion of the pads. Also, the adhesion can be increased between the electronic components and the printed circuit board, and heat release characteristics can be improved. | 01-29-2009 |
20110227228 | FILLING COMPOSITION, SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND METHOD OF FABRICATING THE SEMICONDUCTOR DEVICE - Provided is a filling composition. The filling composition includes: a first particle including Cu and/or Ag; a second particle electrically connecting the first particles; and a resin containing a high molecular compound, a hardener, and a reducer, in which the first and second particles are dispersed, wherein the hardener includes amine and/or anhydride, and the reducer includes carboxyl. | 09-22-2011 |
20120168212 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a printed circuit board and a method for manufacturing the same. The printed circuit board includes: a base substrate having a metal pattern for a circuit; and a surface roughness provided on the metal pattern, wherein the surface roughness has a first surface roughness in an anchor structure and a second surface roughness having a black oxide layer in a needle structure formed on the first surface roughness. | 07-05-2012 |
20130186677 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - A printed circuit board and a method of manufacturing the printed circuit board are disclosed. In an embodiment of the present invention, the method of manufacturing a printed circuit board can include: providing a pair of conductive layers, in which roughness of one surface of one of the pair of conductive layers is different from roughness of one surface of the other of the pair of conductive layers; and stacking the pair of the conductive layers on a dielectric layer such that one surface of one of the pair of conductive layers faces one surface of the dielectric layer and one surface of the other of the pair of conductive layers faces another surface of the dielectric layer. | 07-25-2013 |
Patent application number | Description | Published |
20100012364 | METHOD OF MANUFACTURING ELECTRONIC COMPONENT EMBEDDED CIRCUIT BOARD - An electronic component embedded printed circuit board and a method for manufacturing the same are disclosed. The method includes: providing a first carrier having a first circuit pattern formed on one surface thereof; providing a second carrier having a second circuit pattern formed on one surface thereof; flip-chip bonding an electronic component to the first circuit pattern; stacking one side of an insulator on one side of the first carrier to cover the electronic component; compressing the second carrier having the second circuit pattern formed on one surface thereof on an other side of the insulator; and removing the first carrier and the second carrier. The method can improve the degree of conformation for an electrical component by embedding the electrical component using a flip-chip bonding method and can improve the yield by simplifying the production process. | 01-21-2010 |
20100059267 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - A printed circuit board and a method of manufacturing the printed circuit board are disclosed. In an embodiment of the present invention, the method of manufacturing a printed circuit board can include: providing a pair of conductive layers, in which roughness of one surface of one of the pair of conductive layers is different from roughness of one surface of the other of the pair of conductive layers; and stacking the pair of the conductive layers on a dielectric layer such that one surface of one of the pair of conductive layers faces one surface of the dielectric layer and one surface of the other of the pair of conductive layers faces another surface of the dielectric layer. | 03-11-2010 |
20100090351 | ELECTRO COMPONENT PACKAGE - An electro component package is disclosed. The electro component package in accordance with an embodiment of the present invention includes a first package substrate having a first chip mounted on an upper surface thereof, the first chip having a through-via formed therein; a second package substrate being separated from the first package substrate and having a second chip mounted on an upper surface thereof; and a connection substrate having one end connected with an upper surface of the first chip and the other end connected with an upper surface of the second chip, the connection substrate electrically connecting the first chip with the second chip. | 04-15-2010 |
20100147575 | PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The method of manufacturing a printed circuit board can include: processing a first hole, which has a tapered shape, in one side of a substrate by using a laser drill; processing a second hole, which has a tapered shape and which connects with the first hole, in the other side of the substrate by using a laser drill in a position corresponding to that of the first hole; and forming a conductive portion, which electrically connects both sides of the substrate through the first hole and the second hole, by performing plating. This method may be used for providing reliable interlayer connections. | 06-17-2010 |
20120134125 | METHOD OF MANUFACTURING ELECTRONIC COMPONENT EMBEDDED CIRCUIT BOARD - An electronic component embedded printed circuit board and a method for manufacturing the same are disclosed. The method includes: providing a first carrier having a first circuit pattern formed on one surface thereof; providing a second carrier having a second circuit pattern formed on one surface thereof; flip-chip bonding an electronic component to the first circuit pattern; stacking one side of an insulator on one side of the first carrier to cover the electronic component; compressing the second carrier having the second circuit pattern formed on one surface thereof on an other side of the insulator; and removing the first carrier and the second carrier. The method can improve the degree of conformation for an electrical component by embedding the electrical component using a flip-chip bonding method and can improve the yield by simplifying the production process. | 05-31-2012 |
Patent application number | Description | Published |
20100021108 | OPTICAL WAVEGUIDE DEVICE AND OPTICAL COMMUNICATION MODULE - An optical waveguide device and an optical communication module are provided. In the optical waveguide device which includes a core and a cladding layer formed around the core and has one end formed to be inclined so as to refract input and output signals, the core includes therein a diffraction portion for diffracting an optical signal incident through the cladding layer to propagate straight through the core. Thus, it is possible to prevent deterioration of an optical signal coupling ratio in implementing a technique of transmitting optical signals in opposite directions. | 01-28-2010 |
20100086310 | BIDIRECTIONAL OPTICAL TRANSCEIVER - A bidirectional optical transceiver is disclosed. In the bidirectional optical transceiver, by implementing, as a stacked structure, an optical bench in which an optical system and an optical-transmitting module are installed and a multi-layer substrate with good thermal, electrical and high-resistance characteristics in which an optical-receiving module and a driving circuit for driving the optical-transmitting module are installed, thermal, electrical or optical crosstalk is prevented, high-speed transmission of transmission signals is possible through high-speed modulation thereof, and miniaturization is achieved. | 04-08-2010 |
20100136783 | METHOD OF MANUFACTURING THROUGH-VIA - Disclosed is a method of manufacturing a through-via. The through-via manufacturing method includes forming a core-via hole in a wafer, forming a suction-via hole adjacent to the core-via hole in the wafer, forming a via core in the core-via hole, forming a polymer-via hole connected to the suction-via hole in the wafer, filling the polymer-via hole with polymer solution by creating a vacuum inside the polymer-via hole by drawing air out of the suction-via hole, and polishing the wafer such that the via core formed in the core-via hole is exposed. | 06-03-2010 |
Patent application number | Description | Published |
20110052125 | BIDIRECTIONAL OPTICAL TRANSCEIVER MODULE - A bidirectional optical transceiver module with a temperature control function is provided. The bidirectional optical transceiver module includes a package configured to have a flat bottom surface and include two windows used for optical transmission and reception; a ferrule configured to be coupled to one side of the package and allow an optical fiber to be inserted therein; an optical receiver module configured to be coupled to another side of the package in a direction perpendicular to that of the ferrule coupled to the package; a sub-optical transmitter module configured to be built in the package and include a light-emitting element and a collimating lens used to collimate light from the light-emitting element; an optical filter configured to be built in the package, transmit light from the light-emitting element to the optical fiber and reflect light received through the optical fiber to the optical receiver module; and a temperature regulator configured to be built in the package and control the sub-optical transmitter module to a preset temperature. Accordingly, it is possible to reduce the manufacturing cost of the package, effectively discharge heat, and be more endurable to external impact or vibration. | 03-03-2011 |
20120069574 | OPTICAL TRANSMISSION APPARATUS HAVING TEMPERATURE CONTROL FUNCTION - An optical transmission apparatus having a temperature control function includes: a package having a cavity; a cooler mounted in the cavity and controlling temperature; and a substrate mounted on the cooler and including a light source mounted thereon to generate light. In spite of the presence of the cooler, the apparatus can be implemented to be compact and have a simple structure. | 03-22-2012 |
20120128295 | MULTI-CHANNEL OPTICAL MODULE - The present inventive concept herein relates to multi-channel optical modules, and more particularly, to a multi-channel optical module capable of processing a plurality of signals having different optical wavelengths. The multi-channel optical module may include a stem including one or more cavities; at least one lead pin formed in one or more cavities; a plurality of optical devices formed in the one or more cavities; and a filter portion forming an optical path between the plurality of optical devices and an optical fiber by separating a plurality of optical signals according to a wavelength. According to the inventive concept, processing capacity of the optical module may be improved. Also, according to the inventive concept, electrical and optical cross talk of the optical module may be reduced. | 05-24-2012 |
20130027760 | OPTICAL PROBE USING SENSOR AND METHOD FOR CONTROLLING THE SAME - Disclosed are an optical probe using a sensor and a method for controlling the same. The optical probe includes: an optical converter to change a light path of light generated from a light source; a vibrator to convert an electrical signal into a mechanical motion; a transmission member to transmit the motion of the vibrator to the optical converter; a position sensor to sense the position of the optical converter; and a controller to adjust the position of the optical converter by controlling the vibrator based on the position sensed by the position sensor. | 01-31-2013 |
20130071126 | BIDIRECTIONAL OPTICAL TRANSMITTING AND RECEIVING DEVICE - Disclosed is a bidirectional light transmitting and receiving device which includes a first conductive plate; a second conductive plate; at least one first lead pin which penetrates the first conductive plate and includes a first conductor and a first dielectric surrounding the first conductor; at least one second lead pin which penetrates the second conductive plate and includes a second conductor and a second dielectric surrounding the second conductor; a light receiving unit which is connected with the at least one first lead pin; and a light transmitting unit which is connected with the at least one second lead pin, wherein the first conductive plate is electrically isolated from the second conductive plate. | 03-21-2013 |
20130089331 | OPTICAL LINE TERMINAL IN TIME DIVISION MULTIPLE ACCESS PASSIVE OPTICAL NETWORK AND METHOD FOR PROCESSING OPTICAL SIGNAL THEREOF - Proposed is an efficient method of configuration of a transmitter and a receiver for realizing an optical transmission/reception module apparatus including at least one transmission wavelength and two or more reception wavelengths over a time division multiple access passive optical network or an optical network using multiple transmission/reception wavelengths. Further, proposed is a method of configuration of an apparatus which enables optical alignment and assembly in a single package by using a single lens and three different WDM optical filters for a reception module capable of receiving four wavelengths. | 04-11-2013 |
20130195441 | BIDIRECTIONAL OPTICAL TRANSMITTING AND RECEIVING DEVICE - Disclosed is a bidirectional optical transmitting and receiving device which includes a bottom case; a sidewall case; an upper case; a thermoelectric cooler provided on a first portion of the bottom case; a temperature sensor, a light emitting element, and a first lens collecting light emitted from the light emitting element, the temperature sensor, the light emitting element, and the first lens formed over the thermoelectric cooler; a second lens contacting with the exterior via the sidewall case; a filter transmitting light propagated from the first lens to the second lens and reflecting light propagated from the second lens; a third lens coupled with a lower surface of the filter and collecting light reflected from the filter; a light receiving element provided on a second portion of the bottom case and receiving light propagated from the third lens to output an electric signal; a pre-amplifier provided on the second portion and amplifying the electric signal from the light emitting element; and a support formed on the second portion and supporting the filter. | 08-01-2013 |
20130279900 | PASSIVE OPTICAL NETWORK SYSTEM, METHOD FOR TRANSMITTING AND RECEIVING OPTICAL SIGNAL THEREOF, AND OPTICAL LINE TERMINAL - An optical line terminal (OLT) of a passive optical network (PON) detects a fault in an optical path configured as a single optical fiber core having an annular shape, divides the optical path into a right path and a left path having bi-directionality based on the fault position in which the fault has occurred, demultiplexes a plurality of downstream optical wavelength signals to be transmitted to at least one optical network terminal (ONT) of each group into an optical wavelength signal of the right path and an optical wavelength signal of the left path according to the position in which the fault has occurred, and outputs the same to at least one of the ONTs of each group. | 10-24-2013 |
20140138148 | FEED THROUGH - Provided is a feed through. The feed through comprises: an optical device; a housing surrounding the optical device and having a first hole; a solder coupled into the first hole and having a plurality of second holes, each smaller than the first hole; and lead frames leading from the inside of the housing to the outside through the second holes and having a more reduced line width at the inside of the second holes than the outside thereof. | 05-22-2014 |
20150155944 | OPTICAL TRANSMITTER MODULE - Provided is an optical transmitter module. The optical transmitter module includes a package including a lower substrate and a side substrate in which a through hole is formed, and a feed-through block coupled to the side substrate in which the through hole is formed. The feed-through block includes a feed-through substrate, at least one lead pin penetrating the feed-though substrate and coupled to the feed-though substrate, a base substrate formed to extend from the feed-through substrate in a direction in which the at least one lead pin is coupled, and a dielectric substrate formed between the at least one lead pin and the base substrate protruding from the feed-through substrate. Therefore, it is possible to improve the quality of a signal transmitted by the optical transmitter module. | 06-04-2015 |
Patent application number | Description | Published |
20080265304 | Nonvolatile semiconductor device including a floating gate, method of manufacturing the same and associated systems - A memory device includes a first floating gate electrode on a substrate between adjacent isolation layers in the substrate, at least a portion of the first floating gate protruding above a portion of the adjacent isolation layers, a second floating gate electrode, electrically connected to the first floating gate electrode, on at least one of the adjacent isolation layers, a dielectric layer over the first and second floating gate electrodes, and a control gate over the dielectric layer and the first and second floating gate electrodes. | 10-30-2008 |
20090253255 | Semiconductor device having a pair of fins and method of manufacturing the same - Example embodiments relate to a semiconductor device and a method of manufacturing the same. A semiconductor device according to example embodiments may have reduced disturbances during reading operations and a reduced short channel effect. The semiconductor device may include a semiconductor substrate having a body and a pair of fins protruding from the body. Inner spacer insulating layers may be formed on an upper portion of an inner sidewall of the pair of fins so as to reduce the entrance to the region between the pair of fins. A gate electrode may cover a portion of the external sidewalls of the pair of fins and may extend across the inner spacer insulating layers so as to define a void between the pair of fins. Gate insulating layers may be interposed between the gate electrode and the pair of fins. | 10-08-2009 |
20110156125 | NONVOLATILE SEMICONDUCTOR DEVICE INCLUDING A FLOATING GATE AND ASSOCIATED SYSTEMS - A memory device includes a first floating gate electrode on a substrate between adjacent isolation layers in the substrate, at least a portion of the first floating gate protruding above a portion of the adjacent isolation layers, a second floating gate electrode, electrically connected to the first floating gate electrode, on at least one of the adjacent isolation layers, a dielectric layer over the first and second floating gate electrodes, and a control gate over the dielectric layer and the first and second floating gate electrodes. | 06-30-2011 |