Patent application number | Description | Published |
20150131231 | ELECTRONIC COMPONENT MODULE AND MANUFACTURING METHOD THEREOF - There are provided an electronic component module allowing for a circuit wiring to be disposed outside of a molded part by a plating process, and a manufacturing method thereof, the electronic component module including a substrate; at least one electronic component mounted on the substrate; a molded part sealing the electronic component; a plurality of conductive connectors having one ends bonded to the substrate or one surface of the electronic component and formed in the molded part to penetrate through the molded part; and at least one plane pattern formed on an outer surface of the molded part and electrically connected to at least one of the conductive connectors. | 05-14-2015 |
20150181708 | SEMICONDUCTOR PACKAGE MODULE - There is provided a semiconductor package module including: a substrate having one or more connection terminals formed thereon; first electronic components mounted on a first surface of the substrate; second electronic components mounted on a second surface of the substrate; and third electronic components formed on the substrate and including connection electrodes connecting the one or more connection terminals and external terminals to each other. | 06-25-2015 |
20150223361 | ELECTRONIC COMPONENT MODULE AND MANUFACTURING METHOD THEREOF - There are provided an electronic component module capable of increasing a degree of integration by mounting electronic components on both surfaces of a substrate, and a manufacturing method thereof. The electronic component module according to an exemplary embodiment of the present disclosure includes: a substrate; a plurality of electronic components mounted on both surfaces of the substrate; connection conductors each having one end bonded to one surface of the substrate using an conductive adhesive; and a molded portion having the connection conductor embedded therein and formed on one surface of the substrate, wherein the connection conductor may have at least one blocking member preventing a spread of the conductive adhesive. | 08-06-2015 |
20150228625 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - There are provided a semiconductor package and a method of manufacturing the same. According to an exemplary embodiment of the present disclosure, a semiconductor package includes: a semiconductor device formed in a multilayer; a plurality of wires electrically connected to both sides of a plurality of semiconductor devices; a first mold via electrically connected to the plurality of wires which are formed at one side of the plurality of semiconductor devices; a second mold via electrically connected to the plurality of wires which are formed at the other side of the plurality of semiconductor device; and a first molding part enclosing the plurality of semiconductor device and formed to expose upper surface parts of the first mold via and the second mold via. | 08-13-2015 |
20150289392 | ELECTRONIC DEVICE MODULE AND MANUFACTURING METHOD THEREOF - An electronic device module includes a board including external connecting electrodes and mounting electrodes; an electronic device mounted on the mounting electrodes; a molded portion sealing the electronic device; connection conductors having an end bonded to the external connecting electrodes and penetrating through the molded portion; and external terminals bonded to another end of the connection conductors. | 10-08-2015 |
20160007463 | ELECTRONIC DEVICE MODULE AND METHOD OF MANUFACTURING THE SAME - An electronic device module includes: a board including at least one mounting electrode and at least one external connection electrode and having a protective insulation layer which is provided on an outer surface thereof; at least one electronic device mounted on the mounting electrodes; a molded part sealing the electronic device; and at least one connective conductor of which one end is bonded to the external connection electrode of the board and which penetrates through the molded part to be disposed in the molded part, wherein the protective insulation layer is disposed to be spaced apart from the connective conductor. | 01-07-2016 |
20160035678 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - The semiconductor package includes: a substrate having at least one circuit layer; at least one electronic component mounted on at least one surface of the substrate; a molded part formed on the surface of the substrate to enclose the electronic component; at least one via formed in the molded part to be electrically connected to the circuit layer of the substrate; and a semiconductive pattern connected to one end of a plated tail connected to the circuit layer connected to the via and exposed to the exterior of the substrate. | 02-04-2016 |
20160113135 | ELECTRONIC DEVICE AND METHOD OF FABRICATING EXTERIOR MEMBER FOR THE SAME - An electronic device and method of fabricating an exterior member thereof are provided. The electronic device includes a basic member disposed on an outside of the electronic device and having an outer surface that is at least partially curved, and a glass film at least partially laminated to the outer surface of the basic member. | 04-21-2016 |