Patent application number | Description | Published |
20110309358 | SEMICONDUCTOR CHIP WITH FINE PITCH LEADS FOR NORMAL TESTING OF SAME - A semiconductor chip includes a semiconductor substrate having a top surface and a bottom surface. A circuit layer having bonding pads may be formed over the top surface of the semiconductor substrate. Through electrodes may be formed to pass from a bottom surface to a top surface of the semiconductor substrate, and the through electrodes may comprise through parts connected with the bonding pads and projecting parts formed over the bottom surface of the semiconductor substrate and electrically connected with the through parts. Test pad parts may be disposed over the bottom surface of the semiconductor substrate and is connected with the through electrodes to test normal operation of the circuit layer and electrical connections of the through electrodes and the circuit layer. | 12-22-2011 |
20130099375 | SEMICONDUCTOR PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A semiconductor package substrate including a substrate body having a front surface configured for mounting a semiconductor chip on the front surface and a rear surface facing the front surface and comprising a window passing through the front and rear surfaces, the window having one or more surfaces inclined from the front surface toward the rear surface; and a conductive pattern arranged along an inclined surface of the window so as to extend from the front surface to the rear surface of the substrate body. | 04-25-2013 |
20140021602 | SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE HAVING THE SAME - A substrate for a semiconductor package includes: a first dielectric having a first surface and a second surface which faces away from the first surface and possesses waveform shaped portions, and formed with first holes penetrating the first and second surfaces; and circuit traces formed over the second surface of the first dielectric and having waveform shaped portions disposed over the waveform shaped portions of the second surface of the first dielectric. The waveform shaped portions of the second surface of the first dielectric and the waveform shaped portions of the circuit traces form a stress-resistant structure. | 01-23-2014 |
20140145343 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device comprises: a semiconductor structure formed with openings for exposing pads on an one surface thereof, a first conductive layer formed in the openings to make the one surface of the semiconductor structure more uniform, and conductive patterns formed on portions of the one surface of the semiconductor structure including the first conductive layers. | 05-29-2014 |
20140175605 | SEMICONDUCTOR CHIP AND SEMICONDUCTOR APPARATUS WITH EMBEDDED CAPACITOR - A semiconductor chip includes a semiconductor substrate having one and the other surfaces and formed with a plurality of semiconductor devices; an internal wiring layer having multi-layered internal wiring lines which are formed over the one surface and are electrically connected with the plurality of semiconductor devices, an uppermost internal wiring line among the internal wiring lines being formed with a power supply pad and a ground pad; a dielectric layer formed over the uppermost internal wiring line in such a way as to expose the power supply pad and the ground pad; an external connection reinforcing line formed over the power supply pad or the ground pad which is exposed, and extending onto the dielectric layer; and an embedded capacitor constituted by the external connection reinforcing line, and the dielectric layer and a portion of the is uppermost internal wiring line which correspond to the external connection reinforcing line. | 06-26-2014 |
20140368461 | DISPLAY APPARATUS - A display apparatus having a screen on which recording by a user's touch can be performed is provided. The display apparatus includes a display configured to provide the screen, an accommodator configured to accommodate the display and having a screen aperture formed thereon with a predetermined depth to expose the screen, a touch position sensor configured to sense the position of a touch device that is used by a user when a distance between the screen and the touch device is shorter than the predetermined depth, a vibration sensor mounted on the display and configured to sense vibration of the display due to a contact of the touch device with the screen, and a controller configured to control the display to perform recording on a point of the screen that corresponds to the sensed position of the touch device when the vibration is sensed. | 12-18-2014 |
20150061120 | STACK PACKAGES AND METHODS OF MANUFACTURING THE SAME - Embodiments of a stack package may include an upper chip on a lower chip, a backside passivation layer covering the backside surface of the lower chip and having a thickness which is substantially equal to a height of the protrusion portion of a lower through via electrode, a backside bump substantially contacting the protrusion portion, and a front side bump electrically connected to a chip contact portion of the upper chip and physically and electrically connected to the backside bump. The backside passivation layer may include a first insulation layer provided over a sidewall of the protrusion portion and the backside surface of the lower chip. Embodiments of fabrication methods are also disclosed. | 03-05-2015 |
20150270229 | SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE HAVING THE SAME - A semiconductor chip includes a semiconductor substrate having a front surface, a circuit unit formed within the semiconductor substrate and extending from the front surface into the semiconductor substrate, and a rear surface opposite the front surface, and a girder beam disposed outside of the circuit unit and within the semiconductor substrate. | 09-24-2015 |