Patent application number | Description | Published |
20110063044 | CAPACITIVE COMPENSATION OF CASCADED DIRECTIONAL COUPLERS - A cascaded directional couplers circuit having capacitive compensation such that the directivity of a resistively terminated one of the cascaded couplers is not degraded by an inductance of the other one of the cascaded directional couplers. | 03-17-2011 |
20110063045 | LUMPED CROSS-COUPLED WILKINSON CIRCUIT - The present invention relates to a lumped cross-coupled Wilkinson circuit having a pair of magnetically cross-coupled inductive elements coupled to an isolation network. By magnetically cross-coupling the inductive elements, which have a mutual inductance, the inductance of each inductive element will be significantly less than the inductance of each inductive element in an equivalent lumped traditional Wilkinson combiner. Since the inductance of each inductive element is less, the size of each inductive element may be significantly smaller and the resistive loss of the each inductive element may be significantly smaller. In one embodiment of the present invention, the lumped cross-coupled Wilkinson circuit operates as a lumped cross-coupled Wilkinson combiner. In an alternate embodiment of the present invention, the lumped cross-coupled Wilkinson circuit operates as a lumped cross-coupled Wilkinson splitter. | 03-17-2011 |
20120043956 | LOOK-UP TABLE BASED CONFIGURATION OF A DC-DC CONVERTER - RF PA circuitry and a DC-DC converter, which includes an RF PA envelope power supply and DC-DC control circuitry, are disclosed. The PA envelope power supply provides an envelope power supply signal to the RF PA circuitry. The DC-DC control circuitry has a DC-DC look-up table (LUT) structure, which has at least a first DC-DC LUT. The DC-DC control circuitry uses DC-DC LUT index information as an index to the DC-DC LUT structure to obtain DC-DC converter operational control parameters. The DC-DC control circuitry then configures the PA envelope power supply using the DC-DC converter operational control parameters. Using the DC-DC LUT structure provides flexibility in configuring the DC-DC converter for different applications, for multiple static operating conditions, for multiple dynamic operating conditions, or any combination thereof. | 02-23-2012 |
20120044022 | DYNAMIC DEVICE SWITCHING (DDS) OF AN IN-PHASE RF PA STAGE AND A QUADRATURE-PHASE RF PA STAGE - An in-phase radio frequency (RF) power amplifier (PA) stage and a quadrature-phase RF PA stage are disclosed. The in-phase RF PA stage includes a first group of arrays of amplifying transistor elements and the quadrature-phase RF PA stage includes a second group of arrays of amplifying transistor elements. A group of array bias signals is based on a selected one of a group of DDS operating modes. Each of the group of array bias signals is a current signal. The in-phase RF PA stage biases at least one of the first group of arrays of amplifying transistor elements based on the group of array bias signals. Similarly, the quadrature-phase RF PA stage biases at least one of the second group of arrays of amplifying transistor elements based on the group of array bias signals. | 02-23-2012 |
20120044606 | ESD PROTECTION OF AN RF PA SEMICONDUCTOR DIE USING A PA CONTROLLER SEMICONDUCTOR DIE - A power amplifier (PA) controller semiconductor die and a first radio frequency (RF) PA semiconductor die are disclosed. The PA controller semiconductor die includes a first electro-static discharge (ESD) protection circuit, which ESD protects and provides a first ESD protected signal. The RF PA semiconductor die receives the first ESD protected signal. In one embodiment of the PA controller semiconductor die, the first ESD protected signal is an envelope power supply signal. The PA controller semiconductor die may be a Silicon complementary metal-oxide-semiconductor (CMOS) semiconductor die and the RF PA semiconductor die may be a Gallium Arsenide semiconductor die. | 02-23-2012 |
20120056679 | SPLIT CURRENT CURRENT DIGITAL-TO-ANALOG CONVERTER (IDAC) FOR DYNAMIC DEVICE SWITCHING (DDS) OF AN RF PA STAGE - A split current current digital-to-analog converter (IDAC) and a radio frequency (RF) power amplifier (PA) stage are disclosed. The split current IDAC operates in a selected one of a group of DDS operating modes and provides a group of array bias signals based on the selected one of the group of DDS operating modes. Each of the group of array bias signals is a current signal. The RF PA stage includes a group of arrays of amplifying transistor elements. The RF PA stage biases at least one of the group of arrays of amplifying transistor elements based on the group of array bias signals. Further, the RF PA stage receives and amplifies an RF stage input signal to provide an RF stage output signal using at least one of the group of arrays of amplifying transistor elements that is biased. | 03-08-2012 |
20120062205 | VOLTAGE COMPATIBLE CHARGE PUMP BUCK AND BUCK POWER SUPPLIES - The present disclosure relates to a flexible direct current (DC)-DC converter, which includes a charge pump buck power supply and a buck power supply. The charge pump buck power supply and the buck power supply are voltage compatible with one another at respective output inductance nodes to provide flexibility. In one embodiment of the DC-DC converter, capacitances at the output inductance nodes are at least partially isolated from one another by using at least an isolating inductive element between the output inductance nodes to increase efficiency. In an alternate embodiment of the DC-DC converter, the output inductance nodes are coupled to one another, such that the charge pump buck power supply and the buck power supply share a first inductive element, thereby eliminating the isolating inductive element, which reduces size and cost but may also reduce efficiency. | 03-15-2012 |
20120117284 | CONFIGURABLE 2-WIRE/3-WIRE SERIAL COMMUNICATIONS INTERFACE - A configurable 2-wire/3-wire serial communications interface (C23SCI), which includes start-of-sequence (SOS) detection circuitry and sequence processing circuitry, is disclosed. When the SOS detection circuitry is coupled to a 2-wire serial communications bus, the SOS detection circuitry detects an SOS of a received sequence based on a serial data signal and a serial clock signal. When the SOS detection circuitry is coupled to a 3-wire serial communications bus, the SOS detection circuitry detects the SOS of the received sequence based on a chip select (CS) signal. In response to detecting the SOS, the SOS detection circuitry provides an SOS detection signal to the sequence processing circuitry, which initiates processing of the received sequence using the serial data signal and the serial clock signal. The received sequence is associated with one of multiple serial communications protocols. | 05-10-2012 |
20120161877 | PA BIAS POWER SUPPLY EFFICIENCY OPTIMIZATION - A charge pump of a PA bias power supply, PA bias circuitry, and a process to optimize efficiency of the PA bias power supply are disclosed. The charge pump operates in one of multiple bias supply pump operating modes, which include at least a bias supply pump-up operating mode and a bias supply bypass operating mode. The process prevents selection of the bias supply bypass operating mode unless a DC power supply voltage is adequate to allow the PA bias circuitry to provide minimum output regulation voltage at a specified current. Otherwise, the bias supply pump-up operating mode is selected. The charge pump operates more efficiently in the bias supply bypass operating mode than in the bias supply pump-up operating mode; therefore, selection of the bias supply bypass operating mode, when possible, increases efficiency. | 06-28-2012 |
20120184233 | COMBINED RF DETECTOR AND RF ATTENUATOR WITH CONCURRENT OUTPUTS - Radio Frequency (RF) signal conditioning circuitry, which includes RF detection circuitry and RF attenuation circuitry is disclosed. The RF detection circuitry receives and detects an RF sample signal to provide an RF detection signal. The RF attenuation circuitry has an attenuation circuitry input, and receives and attenuates the RF sample signal via the attenuation circuitry input to provide an attenuated RF signal. The RF attenuation circuitry presents an attenuation circuitry input impedance at the attenuation circuitry input. The attenuated RF signal and the RF detection signal are provided concurrently. | 07-19-2012 |
20120223773 | LINEAR MODE AND NON-LINEAR MODE QUADRATURE PA CIRCUITRY - Embodiments of the present disclosure relate to multi-mode multi-band radio frequency (RF) power amplifier (PA) circuitry, which includes a multi-mode multi-band quadrature RF PA coupled to multi-mode multi-band switching circuitry via a single output. The switching circuitry provides at least one non-linear mode output and multiple linear mode outputs. The non-linear mode output may be associated with at least one non-linear mode RF communications band and each linear mode output may be associated with a corresponding linear mode RF communications band. The outputs from the switching circuitry may be coupled to an antenna port via front-end aggregation circuitry. The quadrature nature of the quadrature PA path may provide tolerance for changes in antenna loading conditions. | 09-06-2012 |
20120223774 | LOOK-UP TABLE BASED CONFIGURATION OF MULTI-MODE MULTI-BAND RADIO FREQUENCY POWER AMPLIFIER CIRCUITRY - Circuitry, which includes multi-mode multi-band radio frequency (RF) power amplification circuitry, power amplifier (PA) control circuitry, and a PA-digital communications interface (DCI) is disclosed according to one embodiment of the circuitry. The PA control circuitry is coupled between the amplification circuitry and the PA-DCI, which is coupled to a digital communications bus, and configures the amplification circuitry. The amplification circuitry includes at least a first RF input and multiple RF outputs, such that at least some of the RF outputs are associated with multiple communications modes and at least some of the RF outputs are associated with multiple frequency bands. Configuration of the amplification circuitry associates one RF input with one RF output, and is correlated with configuration information defined by at least a first defined parameter set. The PA control circuitry stores at least a first look-up table (LUT), which provides the configuration information. | 09-06-2012 |
20120229210 | OVERLAY CLASS F CHOKE - Embodiments of the present disclosure relate to an overlay class F choke of a radio frequency (RF) power amplifier (PA) stage and an RF PA amplifying transistor of the RF PA stage. The overlay class F choke includes a pair of mutually coupled class F inductive elements, which are coupled in series between a PA envelope power supply and a collector of the RF PA amplifying transistor. In one embodiment of the RF PA stage, the RF PA stage receives and amplifies an RF stage input signal to provide an RF stage output signal using the RF PA amplifying transistor. The collector of the RF PA amplifying transistor provides the RF stage output signal. The PA envelope power supply provides an envelope power supply signal to the overlay class F choke. The envelope power supply signal provides power for amplification. | 09-13-2012 |
20120235736 | CHARGE PUMP BASED POWER AMPLIFIER ENVELOPE POWER SUPPLY AND BIAS POWER SUPPLY - The present disclosure relates to a direct current (DC)-DC converter, which includes a charge pump based radio frequency (RF) power amplifier (PA) envelope power supply and a charge pump based PA bias power supply. The DC-DC converter is coupled between RF PA circuitry and a DC power supply, such as a battery. As such, the PA envelope power supply provides an envelope power supply signal to the RF PA circuitry and the PA bias power supply provides a bias power supply signal to the RF PA circuitry. Both the PA envelope power supply and the PA bias power supply receive power via a DC power supply signal from the DC power supply. The PA envelope power supply includes a charge pump buck converter and the PA bias power supply includes a charge pump. | 09-20-2012 |
20120280746 | DC-DC CONVERTER SEMICONDUCTOR DIE STRUCTURE - A direct current (DC)-DC converter having a DC-DC converter semiconductor die and an alpha flying capacitive element is disclosed. The DC-DC converter semiconductor die includes a first series alpha switching element, a second series alpha switching element, a first alpha flying capacitor connection node, which is about over the second series alpha switching element, and a second alpha flying capacitor connection node, which is about over the first series alpha switching element. The alpha flying capacitive element is electrically coupled between the first alpha flying capacitor connection node and the second alpha flying capacitor connection node. By locating the first alpha flying capacitor connection node and the second alpha flying capacitor connection node about over the second series alpha switching element and the first series alpha switching element, respectively, lengths of transient current paths may be minimized, thereby reducing noise and potential interference. | 11-08-2012 |
20120280747 | FEEDBACK BASED BUCK TIMING OF A DIRECT CURRENT (DC)-DC CONVERTER - At least a first shunt switching element and switching control circuitry of a first switching power supply are disclosed. At least the first shunt switching element is coupled between a ground and an output inductance node of the first switching power supply. The first switching power supply provides a buck output signal from the output inductance node. The switching control circuitry selects one of an ON state and an OFF state of the first shunt switching element. When the buck output signal is above a first threshold, the switching control circuitry is inhibited from selecting the ON state. The first switching power supply provides a first switching power supply output signal based on the buck output signal. By using feedback based on the buck output signal, the switching control circuitry may refine the timing of switching between series switching elements and shunt switching elements to increase efficiency. | 11-08-2012 |
20120280752 | EMBEDDED RF PA TEMPERATURE COMPENSATING BIAS TRANSISTOR - A radio frequency (RF) power amplifier (PA) amplifying transistor of an RF PA stage and an RF PA temperature compensating bias transistor of the RF PA stage are disclosed. The RF PA amplifying transistor includes a first array of amplifying transistor elements and a second array of amplifying transistor elements. The RF PA temperature compensating bias transistor provides temperature compensation of bias of the RF PA amplifying transistor. Further, the RF PA temperature compensating bias transistor is located between the first array and the second array. As such, the RF PA temperature compensating bias transistor is thermally coupled to the first array and the second array. The RF PA stage receives and amplifies an RF stage input signal to provide an RF stage output signal using the RF PA amplifying transistor. | 11-08-2012 |
20120282869 | RF PA LINEARITY REQUIREMENTS BASED CONVERTER OPERATING MODE SELECTION - A power amplifier (PA) envelope power supply, radio frequency (RF) PA circuitry, and a process to select a converter operating mode of the PA envelope power supply based on linearity requirements of the RF PA circuitry is disclosed. The PA envelope power supply operates in one of a first converter operating mode and a second converter operating mode. The process for selecting the converter operating mode is based on a required degree of linearity of the RF PA circuitry. The PA envelope power supply provides an envelope power supply signal to the RF PA circuitry. Selection of the converter operating mode may provide efficient operation of the PA envelope power supply and the envelope power supply signal needed for proper operation of the RF PA circuitry. | 11-08-2012 |
20120299645 | TEMPERATURE CORRECTING AN ENVELOPE POWER SUPPLY SIGNAL FOR RF PA CIRCUITRY - A direct current (DC)-DC converter and radio frequency (RF) power amplifier (PA) circuitry are disclosed. The DC-DC converter provides an envelope power supply signal to the RF PA circuitry based on a first power supply output control signal. As a temperature of the RF PA circuitry changes, the envelope power supply signal may need to be adjusted to meet temperature compensation requirements of the RF PA circuitry. With adequate thermal coupling between the DC-DC converter and the RF PA circuitry, adjustments to the envelope power supply signal may be based on temperature measurements of the DC-DC converter. A desired correction of the first power supply output control signal is determined based on a measured temperature of the DC-DC converter and the temperature compensation requirements of the RF PA circuitry. The first power supply output control signal is adjusted based on the desired correction. | 11-29-2012 |
20120299646 | SELECTING A CONVERTER OPERATING MODE OF A PA ENVELOPE POWER SUPPLY - A power amplifier (PA) envelope power supply and a process to select a converter operating mode of the PA envelope power supply are disclosed. The PA envelope power supply operates in one of a first converter operating mode and a second converter operating mode. The process for selecting the converter operating mode is based on a selected communications mode of a radio frequency (RF) communications system, a target output power from RF PA circuitry of the RF communications system, and a direct current (DC) power supply voltage. | 11-29-2012 |
20120299647 | PA ENVELOPE POWER SUPPLY UNDERSHOOT COMPENSATION - A power amplifier (PA) envelope power supply, which provides an envelope power supply signal to radio frequency (RF) PA circuitry, and a process to prevent undershoot of the PA envelope power supply is disclosed. The process includes determining if an envelope control signal to the PA envelope power supply has a step change from a high magnitude to a low magnitude that exceeds a step change limit. Such a step change may cause undershoot of the PA envelope power supply. As such, if the step change exceeds the step change limit, the envelope control signal is modified to use an intermediate magnitude for period of time. Otherwise, if the step change does not exceed the step change limit, the envelope control signal is not modified. | 11-29-2012 |
20120299660 | SELECTING PA BIAS LEVELS OF RF PA CIRCUITRY DURING A MULTISLOT BURST - Power amplifier (PA) control circuitry and PA bias circuitry are disclosed. During one slot of a multislot transmit burst from radio frequency (RF) PA circuitry, the PA control circuitry selects one PA bias level of the RF PA circuitry and the RF PA circuitry has one output power level. The RF PA circuitry has a next output power level during an adjacent next slot of the multislot transmit burst. If the one output power level exceeds the next output power level by more than a power drop limit, then the PA control circuitry maintains the one PA bias level during the adjacent next slot. If the one output power level significantly exceeds the next output power level, but by less than the power drop limit, then the PA control circuitry selects a next PA bias level, which is less than the one PA bias level, during the adjacent next slot. | 11-29-2012 |
20120299661 | PA BIAS POWER SUPPLY UNDERSHOOT COMPENSATION - A charge pump of a power amplifier (PA) bias power supply and a process to prevent undershoot disruption of a bias power supply signal of the PA bias power supply are disclosed. The charge pump operates in one of multiple bias supply pump operating modes, which include at least a bias supply pump-up operating mode and a bias supply bypass operating mode. The process prevents selection of the bias supply pump-up operating mode from the bias supply bypass operating mode before charge pump circuitry in the charge pump is capable of providing adequate voltage to prevent undershoot disruption of the bias power supply signal. | 11-29-2012 |
20120302186 | INDEPENDENT PA BIASING OF A DRIVER STAGE AND A FINAL STAGE - A radio frequency (RF) communications system, which includes power amplifier (PA) control circuitry and PA bias circuitry, is disclosed. The PA control circuitry identifies a selected communications mode of the RF communications system and a target output power from RF PA circuitry. The PA control circuitry selects a PA bias level of a driver stage of the RF PA circuitry and a PA bias level of a final stage of the RF PA circuitry based on the selected communications mode and the target output power. The PA bias circuitry establishes a PA bias level for the driver stage and a PA bias level for the final stage based on the selected PA bias levels of the driver stage and the final stage, respectively. | 11-29-2012 |
20130043944 | CASCADED CONVERGED POWER AMPLIFIER - A first radio frequency (RF) power amplifier (PA) stage, a second RF PA stage, and an alpha RF switch are disclosed. The first RF PA stage provides a first RF output signal. During a first alpha mode, the alpha RF switch forwards the first RF output signal to the second RF PA stage, such that the first RF PA stage functions as a driver stage and the second RF PA stage functions as a final stage. However, during one of a group of alpha modes, the alpha RF switch forwards the first RF output signal to provide a corresponding one of a group of alpha transmit signals, such that the first RF PA stage functions as a final stage. Further, the first alpha mode is not one of the group of alpha modes. | 02-21-2013 |
20130099858 | DUAL PRIMARY SWITCHED TRANSFORMER FOR IMPEDANCE AND POWER SCALING - This application reduces the power of series combined transformers and of parallel combined transformers while maintaining efficiency. In one embodiment, a series combined transformer is provided with a switch between a first primary inductor and a second primary inductor, in order to provide at least two modes. In a high power mode, the switch is open and the series combined transformer operates normally. In a low power mode, the switch is closed, one amplifier from a first differential amplifier pair is shut down, one amplifier from a second differential pair is shut down, and the series combined transformer operates efficiently in a low power mode. | 04-25-2013 |
20130217341 | HIGH EFFICIENCY PATH BASED POWER AMPLIFIER CIRCUITRY - A first transmit path, a second transmit path, and a third transmit path are disclosed. The first transmit path includes a first radio frequency (RF) power amplifier (PA) and alpha switching circuitry, which is coupled to an output from the first RF PA. The second transmit path includes a second RF PA and beta switching circuitry, which is coupled to an output from the second RF PA. The third transmit path includes a third RF PA. | 08-22-2013 |
20130271221 | DIRECT CURRENT (DC)-DC CONVERTER HAVING A MULTI-STAGE OUTPUT FILTER - A direct current (DC)-DC converter that includes a first switching converter and a multi-stage filter is disclosed. The multi-stage filter includes at least a first inductance (L) capacitance (C) filter and a second LC filter coupled in series between the first switching converter and a DC-DC converter output. The first LC filter has a first LC time constant and the second LC filter has a second LC time constant, which is less than the first LC time constant. The first switching converter and the multi-stage filter form a feedback loop, which is used to regulate the first switching power supply output signal based on the setpoint. The first LC filter includes a first capacitive element having a first self-resonant frequency, which is about equal to a first notch frequency of the multi-stage filter. | 10-17-2013 |
20130271224 | MULTIBAND RF SWITCH GROUND ISOLATION - A radio frequency (RF) switch semiconductor die and an RF supporting structure are disclosed. The RF switch semiconductor die is attached to the RF supporting structure. The RF switch semiconductor die has a first edge and a second edge, which may be opposite from the first edge. The RF supporting structure has a group of alpha supporting structure connection nodes, which is adjacent to the first edge; a group of beta supporting structure connection nodes, which is adjacent to the second edge; and an alpha AC grounding supporting structure connection node, which is adjacent to the second edge. When the group of alpha supporting structure connection nodes and the alpha AC grounding supporting structure connection node are active, the group of beta supporting structure connection nodes are inactive. | 10-17-2013 |
20130293310 | DUAL INDUCTIVE ELEMENT CHARGE PUMP BUCK AND BUCK POWER SUPPLIES - A direct current (DC)-DC converter, which includes a charge pump buck power supply and a buck power supply is disclosed. The charge pump buck power supply includes a charge pump buck converter, a first inductive element, and an energy storage element. The charge pump buck converter and the first inductive element are coupled in series between a DC power supply, such as a battery, and the energy storage element. The buck power supply includes a buck converter, a second inductive element, and the energy storage element. The buck converter and the second inductive element are coupled in series between the DC power supply and the energy storage element. As such, the charge pump buck power supply and the buck power supply share the energy storage element. | 11-07-2013 |
20130307616 | SNUBBER FOR A DIRECT CURRENT (DC)-DC CONVERTER - Circuitry, which includes a direct current (DC)-DC converter having a first switching power supply is disclosed. The first switching power supply includes a first switching converter, an energy storage element, a first inductive element, which is coupled between the first switching converter and the energy storage element, and a first snubber circuit, which is coupled across the first inductive element. The first switching power supply receives and converts a DC power supply signal to provide a first switching power supply output signal based on a setpoint. | 11-21-2013 |
20150084715 | OUTPUT MATCH DIRECTIONAL COUPLER - A directional coupler that provides directional coupling and an impedance transformation is disclosed. In one embodiment, the directional coupler includes a low pass filter having a filter inductor that is coupled between an input port and an output port and a filter capacitor coupled between the output port and ground. The directional coupler also includes detector circuitry wherein the filter inductor is magnetically coupled to a detector inductor in the detector circuitry such that current passing through the filter inductor generates a detector current through the detector inductor. Furthermore, the low pass filter and the detector circuitry cooperate to transform a first impedance presented at the output port to a second impedance presented at the input port. Accordingly, the filter inductor is used in the low pass filter to provide an impedance transformation so as to operate with the detector circuitry to provide a detector current for directional coupling. | 03-26-2015 |