Patent application number | Description | Published |
20110086945 | LIGHTWEIGHT WALL REPAIR COMPOUNDS - Herein are disclosed wall repair compounds comprising at least one or more polymeric binder latex emulsions, one or more inorganic fillers, and comprising an amount of organic polymeric thickener that is less than about 0.1 percent by weight based on the total weight of the wall repair compound. In certain embodiments, the wall repair compound comprises an inorganic filler system selected such that such that synthetic inorganic fillers comprise essentially 100 percent of the inorganic filler used. In certain embodiments, the wall repair compound comprises one or more organic ether smoothing agents. | 04-14-2011 |
20130052741 | DYE COMPOSITIONS - Dye compositions comprising rhodizonate dye particles encapsulated within a shearable hydrophobic organic encapsulant composition. | 02-28-2013 |
20130052743 | FLOWABLE DRY POWDER COMPOSITION - A flowable dry powder composition comprising a mixture of diphenylcarbazide particles and glass bubbles; kits containing such compositions; methods of filling containers with such compositions; and, methods of using such compositions in the detecting of hexavalent chromium. | 02-28-2013 |
20130190430 | SELF PRIMING SPACKLING COMPOUND - A self-priming spackling compound includes between about 35% by weight and about 65% by weight acrylic latex resin, between about 20% by weight and about 50% by weight filler material, and between about 1% by weight and about 20% by weight water. In certain aspects, the latex resin may have an average latex particle size of less than about 0.18 microns, a minimum film formation temperature of less than about 15 degrees Celsius, and/or a glass transition temperature (Tg) of less than about 25 degrees Celsius. To further enhance the self-priming performance of the spackling compound, the formulation may further comprise a colorant such as titanium dioxide. | 07-25-2013 |
20130295277 | Lightweight Wall Repair Compounds - Herein are disclosed wall repair compounds comprising at least one or more polymeric binder latex emulsions, one or more inorganic fillers, and comprising an amount of organic polymeric thickener that is less than about 0.1 percent by weight based on the total weight of the wall repair compound. In certain embodiments, the wall repair compound comprises an inorganic filler system selected such that such that synthetic inorganic fillers comprise essentially 100 percent of the inorganic filler used. In certain embodiments, the wall repair compound comprises one or more glycol ether smoothing agents. | 11-07-2013 |
20130296462 | Lightweight Wall Repair Compounds - Herein are disclosed wall repair compounds comprising at least one or more polymeric binder latex emulsions, one or more inorganic fillers, and comprising an amount of organic polymeric thickener that is less than about 0.1 percent by weight based on the total weight of the wall repair compound. In certain embodiments, the wall repair compound comprises an inorganic filler system selected such that such that synthetic inorganic fillers comprise essentially 100 percent of the inorganic filler used. In certain embodiments, the wall repair compound comprises one or more glycol ether smoothing agents. | 11-07-2013 |
20140065432 | Adhesive Compositions With Reduced Levels of Volatile Organic Compounds - There are provided non-aqueous adhesive compositions comprising a) a styrene-containing polymer, b) modifying agent, and c) a solvent system comprising i) a volatile siloxane compound, and ii) a second compound selected from acetone, methyl acetate, tert-butyl acetate, para-chlorobenzotrifluoride, and combinations thereof. Bonded articles and methods of bonding articles using these compositions are also provided. | 03-06-2014 |
20150018452 | LIGHTWEIGHT WALL REPAIR COMPOUNDS - Herein are disclosed wall repair compounds comprising at least one or more polymeric binder latex emulsions, one or more inorganic fillers, and comprising an amount of organic polymeric thickener that is less than about 0.1 percent by weight based on the total weight of the wall repair compound. In certain embodiments, the wall repair compound comprises an inorganic filler system selected such that such that synthetic inorganic fillers comprise essentially 100 percent of the inorganic filler used. In certain embodiments, the wall repair compound comprises one or more glycol ether smoothing agents. | 01-15-2015 |
20150018454 | SELF PRIMING SPACKLING COMPOUND - A self-priming spackling compound includes between about 35% by weight and about 65% by weight acrylic latex resin, between about 20% by weight and about 50% by weight filler material, and between about 1% by weight and about 20% by weight water. In certain aspects, the latex resin may have an average latex particle size of less than about 0.18 microns, a minimum film formation temperature of less than about 15 degrees Celsius, and/or a glass transition temperature (Tg) of less than about 25 degrees Celsius. To further enhance the self-priming performance of the spackling compound, the formulation may further comprise a colorant such as titanium dioxide. | 01-15-2015 |