Patent application number | Description | Published |
20090010590 | METHOD AND APPARATUS FOR COUPLING OPTICAL SIGNALS ONTO A SEMICONDUCTOR CHIP - A first optical coupler is configured to direct optical signals from an optical fiber onto one or more first optical channels located on a semiconductor chip, wherein the one or more first optical channels have dimensions that are within a specified tolerance of the dimensions of the optical fiber. One or more second optical couplers are configured to direct the optical signals from the one or more first optical channels to one or more second optical channels located on the semiconductor chip, wherein the one or more second optical channels have a specified sub-micron size. | 01-08-2009 |
20090067851 | MULTI-CHIP SYSTEMS WITH OPTICAL BYPASS - Embodiments of a system that includes an array of single-chip modules (CMs) are described. This array includes a first CM, a second CM coupled to the first CM, and a third CM coupled to the second CM. A given CM, which can be the first CM, the second CM or the third CM, includes a semiconductor die that is configured to communicate data signals with other CMs through electromagnetically coupled proximity communication. These proximity connectors are proximate to a surface of the semiconductor die. Moreover, the first CM and the third CM are configured to optically communicate optical signals with each other via the second CM through an optical signal path. | 03-12-2009 |
20090085183 | INTEGRATED-CIRCUIT PACKAGE FOR PROXIMITY COMMUNICATION - Embodiments of a multi-chip module (MCM) are described. This MCM includes a first semiconductor die and a second semiconductor die, where a given semiconductor die, which can be the first semiconductor die or the second semiconductor die, includes proximity connectors proximate to a surface of the given semiconductor die. Moreover, the given semiconductor die is configured to communicate signals with the other semiconductor die via proximity communication through one or more of the proximity connectors. Furthermore, the MCM includes an alignment plate and a top plate coupled to the alignment plate. This alignment plate includes a first negative feature configured to accommodate the first semiconductor die and a second negative feature configured to accommodate the second semiconductor die, and the top plate includes a positive feature. Note that the positive feature is coupled to the first semiconductor die, and the positive feature facilitates mechanical positioning of the first semiconductor die. | 04-02-2009 |
20090085233 | ALIGNMENT FEATURES FOR PROXIMITY COMMUNICATION - Embodiments of a semiconductor die that includes proximity connectors proximate to a first surface of the semiconductor die are described. This semiconductor die is configured to communicate signals with another semiconductor die via proximity communication through one or more of the proximity connectors. Moreover, the semiconductor die includes a positive feature coupled to a second surface of the semiconductor die that facilitates mechanical alignment of the semiconductor die with the other semiconductor die. Note that a first region around the positive feature defines a first plane, and the positive feature protrudes above the first plane. | 04-02-2009 |
20090089466 | PROXIMITY COMMUNICATION PACKAGE FOR PROCESSOR, CACHE AND MEMORY - A “sombrero” bridge transports signal communication between a processor and one or more cache memories. The bridge surrounds the processor's perimeter, and includes an aperture opposite the processor through which power and data can be provided to the processor from another device. The bridge exchanges signals with the cache memories via capacitively coupled proximity connections. The bridge communicates with the processor via conductive (e.g. wire) connections and optionally proximity connections. Spacing between opposing pads of the proximity connection(s) between the bridge and the cache memories can be provided by recesses in a surface of the cache memory, corresponding recesses in an opposing surface of the bridge, and a ball for each matching pair of corresponding cache memory and bridge recesses. The ball fits in and between the recesses of the matching pair. The recess depths and ball diameter(s) constrain a minimum distance between opposing pads of the proximity connection(s). | 04-02-2009 |
20090179334 | APPARATUS FOR FACILITATING PROXIMITY COMMUNICATION BETWEEN CHIPS - One embodiment of the present invention provides a system for facilitating proximity communication between semiconductor chips. The system includes a base chip and a bridge chip, each of which includes an active face upon which active circuitry and signal pads reside, and a back face opposite the active face. The active face of the bridge chip is bonded to the active face of the base chip. Then, an identified portion of the active face of the bridge chip is thinned via etching and is removed by planarizing the back face of the bridge chip, thereby creating an opening in the bridge chip that exposes a portion of the active face of the base chip. | 07-16-2009 |
20090280601 | METHOD AND APPARATUS FOR FACILITATING PROXIMITY COMMUNICATION AND POWER DELIVERY - The described embodiments provide a system that facilitates inter-chip alignment for proximity communication and power delivery. The system includes a first integrated circuit chip and a second integrated circuit chip, both of which whose surfaces have corresponding etch pit wells configured to align with each other. A shaped structure is placed in an etch pit well of the first integrated circuit chip such that when the corresponding etch pit well of the second integrated circuit chip is substantially aligned with the etch pit well of the first integrated circuit chip, the shaped structure mates with both the etch pit well of the first integrated circuit chip and with the corresponding etch pit well of the second integrated circuit chip, thereby aligning the first integrated circuit chip with the second integrated circuit chip. In some embodiments the etch pit wells include conductive structures for routing power through a conductive shaped structure. | 11-12-2009 |
20100014427 | ARBITRATION SCHEME FOR AN OPTICAL BUS - A method of arbitrating data transmissions to prevent data collisions in an optical data interconnect system including a transmitting node, a plurality of receiving nodes, and one or more remaining nodes connected through an optical data channel. The method involves transmitting a transmission request signal from the transmitting node over an arbitration channel corresponding to the transmitting node, monitoring, at the transmitting node, a plurality of arbitration channels corresponding to each of the plurality of receiving nodes and the one or more remaining nodes at the transmitting node for a predetermined period of time, determining a start time for a data transmission from the transmitting node based on the monitored signals to prevent a data collision, and initiating a data transmission of a data signal from the transmitting node over the optical data channel at the determined start time. | 01-21-2010 |
20100014852 | CSMA/CD OPTICAL INTERCONNECT SCHEME - A method of detecting transmission collisions in an optical data interconnect system including a transmitting node, a plurality of receiving nodes, and one or more remaining nodes connected through an optical data channel. The method includes initiating a data transmission of a data signal from the transmitting node over the optical data channel, transmitting a first collision detect signal from the transmitting node throughout a duration of the data transmission where the first collision detect signal is transmitted over an optical detection channel corresponding to the transmitting node, monitoring at the transmitting node of the optical data interconnect system for a predetermined period of time, where the optical data interconnect system further includes a plurality of optical collision detection channels corresponding to each of the plurality of receiving nodes and the one or more remaining nodes, and identifying a transmission collision when a second collision signal is received through one of the plurality of optical collision detection channels at the transmitting node during the predetermined period of time. | 01-21-2010 |
20100115349 | MISALIGNMENT COMPENSATION FOR PROXIMITY COMMUNICATION - In a proximity communication system, transmit elements on one chip are aligned with receive elements on a second chip juxtaposed with the first chip. However, if the elements are misaligned, either statically or dynamically, the coupling between chips is degraded. The misalignment may be compensated by controllably degrading performance of the system. For example, the transmit signal strength may be increased. The bit period or the time period for biasing each bit may be increased, thereby decreasing the bandwidth. Multiple coupling elements, such as capacitors, may be ganged together, thereby decreasing the number of channels. The granularity of symbols, such as images, may be increased by decreasing the number of bits per symbol. Multiple coupling elements, such as capacitors, may be ganged together, thereby decreasing the number of channels. | 05-06-2010 |
20100213606 | DIELECTRIC ENHANCEMENTS TO CHIP-TO-CHIP CAPACITIVE PROXIMITY COMMUNICATION - A method for improving signal levels between capacitively-coupled chips in proximity communication (PxC) includes depositing a high permittivity dielectric material layer over a signal pad of a first chip, and placing a second chip in close proximity to the first chip such that faces of the signal pads align to enable for capacitive signal coupling. The high permittivity dielectric material layer that fills at least a portion of a gap between the first chip and the second chip, and improves capacitive coupling between signal pads of the first chip and the second chip by providing for an increased permittivity in the gap between the first chip and the second chip. The increased permittivity ensures that electric fields are substantially confined to a space between the signal pad of the first chip and the signal pad of the second chip. | 08-26-2010 |
20100215309 | ELECTRICAL CONTACTS ON TOP OF WAVEGUIDE STRUCTURES FOR EFFICIENT OPTICAL MODULATION IN SILICON PHOTONIC DEVICES - A phase modulation waveguide structure includes one of a semiconductor and a semiconductor-on-insulator substrate, a doped semiconductor layer formed over the one of a semiconductor and a semiconductor-on-insulator substrate, the doped semiconductor portion including a waveguide rib protruding from a surface thereof not in contact with the one of a semiconductor and a semiconductor-on-insulator substrate, and an electrical contact on top of the waveguide rib. The electrical contact is formed of a material with an optical refractive index close to that of a surrounding oxide layer that surrounds the waveguide rib and the electrical contact and lower than the optical refractive index of the doped semiconductor layer. During propagation of an optical mode within the waveguide structure, the electrical contact isolates the optical mode between the doped semiconductor layer and a metal electrode contact on top of the electrical contact. | 08-26-2010 |
20100247021 | OPTICAL DEVICE WITH LARGE THERMAL IMPEDANCE - Embodiments of an optical device, an array of optical devices, and a technique for fabricating the optical device or the array are described. This optical device is implemented on a substrate (such as silicon), and includes a thermally tunable optical waveguide that has good thermal isolation from its surroundings. In particular, a portion of a semiconductor in the optical device, which includes the optical waveguide, is free standing above a gap between the semiconductor layer and the substrate. By reducing the thermal coupling between the optical waveguide and the external environment, the optical device can be thermally tuned with significantly less power consumption. | 09-30-2010 |
20100247022 | DUAL-LAYER THERMALLY TUNED OPTICAL DEVICE - Embodiments of an optical device, an array of optical devices, and a technique for fabricating the optical device or the array are described. This optical device is implemented using two semiconductor layers (such as silicon), one of which includes a heater and the other includes a thermally tunable optical waveguide. Spatially separating these two functions in the optical device results in more efficient heat transfer between the heater and the optical waveguide, reduced heat transfer to the surroundings, and reduced optical losses in the optical waveguide relative to existing silicon-based optical devices. | 09-30-2010 |
20100247029 | THERMAL TUNING OF AN OPTICAL DEVICE - Embodiments of an optical device, an array of optical devices, and a technique for fabricating the optical device or the array are described. This optical device is implemented on a substrate (such as silicon), and includes a thermally tunable optical waveguide with a high thermal resistance to the surrounding external environment and a low thermal resistance to a localized heater. In particular, the thermal resistances associated with thermal dissipation paths from a heater in the optical device to an external environment via electrodes and via the substrate are increased, while the thermal resistance between the optical waveguide and the heater is decreased. | 09-30-2010 |
20100266240 | MULTI-CHIP SYSTEM INCLUDING CAPACITIVELY COUPLED AND OPTICAL COMMUNICATION - Embodiments of a system are described. This system includes an array of chip modules (CMs) and a baseplate, where the baseplate is configured to communicate data signals via optical communication. Moreover, the array includes first CMs mechanically coupled to first alignment features on the baseplate, and adjacent second CMs mechanically coupled to second alignment features on the baseplate. In this array, a given first CM is electrically coupled to a given set of electrical proximity connectors. Additionally, the array includes bridge components, wherein a given bridge component is electrically coupled to the second SCM and another set of electrical proximity connectors, which is electrically coupled to the set of electrical proximity connectors, thereby facilitating communication of other data signals between adjacent first CMs and second CMs via electrical proximity communication. Moreover, the given bridge component is optically coupled to the baseplate, thereby facilitating optical communication of the data signals between CMs via the baseplate. | 10-21-2010 |
20100266276 | BROADBAND AND WAVELENGTH-SELECTIVE BIDIRECTIONAL 3-WAY OPTICAL SPLITTER - Embodiments of a bidirectional 3-way optical splitter are described. This bidirectional 3-way optical splitter includes an optical splitter having: a first external node, a second external node, a third external node, and a fourth external node. In one mode of operation, the optical splitter may be configured to receive an external input optical signal on the first external node and to provide external output optical signals on the other external nodes. Moreover, in another mode of operation, the optical splitter may be configured to receive the external input optical signal on the third external node and to provide the external output optical signals on the other external nodes. | 10-21-2010 |
20100266295 | OPTICAL-SIGNAL-PATH ROUTING IN A MULTI-CHIP SYSTEM - Embodiments of a system are described. This system includes an array of chip modules (CMs) that are configured to communicate data signals with each other via optical communication. In a given CM module, optical signal paths, such as waveguides, are routed in the same way as in the other CMs in the array. In this way, a common optical design in the CMs may be used in the system to prevent data conflicts during the optical communication. | 10-21-2010 |
20100290736 | OPTICAL DEVICE WITH LARGE THERMAL IMPEDANCE - Embodiments of an optical device, an array of optical devices, and a technique for fabricating the optical device or the array are described. This optical device is implemented on a substrate (such as silicon), and includes a thermally tunable optical waveguide that has good thermal isolation from its surroundings. In particular, a portion of a semiconductor in the optical device, which includes the optical waveguide, is free standing above a gap between the semiconductor layer and the substrate. By reducing the thermal coupling between the optical waveguide and the external environment, the optical device can be thermally tuned with significantly less power consumption. | 11-18-2010 |
20100327466 | TECHNIQUE FOR FABRICATING MICROSPRINGS ON NON-PLANAR SURFACES - A processing technique facilitating the fabrication of the integrated circuit with microsprings at different vertical positions relative to a surface of a substrate is described. During the fabrication technique, microsprings are lithographically defined on surfaces of a first substrate and a second substrate. Then, a hole is created through a first substrate. Moreover, the integrated circuit may be created by rigidly mechanically coupling the two substrates to each other such that the microsprings on the surface of the second substrate are within a region defined at least in part by an edge around the hole. Subsequently, photoresist that constrains the microsprings on the surfaces of the two substrates may be removed. In this way, microsprings at the different vertical positions can be fabricated. | 12-30-2010 |
20100329607 | OPTICAL CONNECTOR WITH REDUCED MECHANICAL-ALIGNMENT SENSITIVITY - An optical connector is described. This optical connector spatially segregates optical coupling between an optical fiber and an optical component, which relaxes the associated mechanical-alignment requirements. In particular, the optical connector includes an optical spreader component disposed on a substrate. This optical spreader component is optically coupled to the optical fiber at a first coupling region, and is configured to optically couple to the optical component at a second coupling region that is at a different location on the substrate than the first coupling region. Moreover, the first coupling region and the second coupling region are optically coupled by an optical waveguide. | 12-30-2010 |
20100329685 | OPTICAL DEVICE WITH REDUCED THERMAL TUNING ENERGY - An optical device that includes multiple optical modulators having actual operating wavelengths at a given temperature is described. Because of differences between the actual operating wavelengths and target operating wavelengths of the optical modulators, heating elements may be used to thermally tune the optical modulators so that the actual operating wavelengths match corresponding carrier wavelengths in a set of optical signals. Furthermore, control logic in the optical device may assign the optical modulators to the corresponding carrier wavelengths based at least on differences between the carrier wavelengths and the actual operating wavelengths, thereby reducing an average thermal tuning energy associated with the heating elements. | 12-30-2010 |
20110074011 | MECHANICAL COUPLING IN A MULTI-CHIP MODULE USING MAGNETIC COMPONENTS - A multi-chip module (MCM) is described. This MCM includes at least two substrates that are remateably mechanically coupled by positive and negative features on facing surfaces of the substrates. These positive and negative features mate with each other. In particular, a positive feature may mate with a given pair of negative features, which includes negative features on each of the substrates. Furthermore, at least one of the negative features in the given pair may include a hard magnetic material, and the positive feature and the other negative feature in the given pair may include a soft magnetic material that provide a flux-return path to the hard magnetic material. In this way, the hard magnetic material may facilitate the remateable mechanical coupling of the substrates. | 03-31-2011 |
20110091157 | THREE-DIMENSIONAL MACRO-CHIP INCLUDING OPTICAL INTERCONNECTS - A multi-chip module (MCM), which includes a three-dimensional (3D) stack of chips that are coupled using optical interconnects, is described. In this MCM, disposed on a first surface of a middle chip in the 3D stack, there are: a first optical coupler, an optical waveguide, which is coupled to the first optical coupler, and a second optical coupler, which is coupled to the optical waveguide. The first optical coupler redirects an optical signal from the optical waveguide to a first direction (which is not in the plane of the first surface), or from the first direction to the optical waveguide. Moreover, the second optical coupler redirects the optical signal from the optical waveguide to a second direction (which is not in the plane of the first surface), or from the second direction to the optical waveguide. Note that an optical path associated with the second direction passes through an opening in a substrate in the middle chip. | 04-21-2011 |
20110111559 | INTEGRATED-CIRCUIT PACKAGE FOR PROXIMITY COMMUNICATION - Embodiments of a multi-chip module (MCM) are described. This MCM includes a first semiconductor die and a second semiconductor die, where a given semiconductor die, which can be the first semiconductor die or the second semiconductor die, includes proximity connectors proximate to a surface of the given semiconductor die. Moreover, the given semiconductor die is configured to communicate signals with the other semiconductor die via proximity communication through one or more of the proximity connectors. Furthermore, the MCM includes an alignment plate and a top plate coupled to the alignment plate. This alignment plate includes a first negative feature configured to accommodate the first semiconductor die and a second negative feature configured to accommodate the second semiconductor die, and the top plate includes a positive feature. Note that the positive feature is coupled to the first semiconductor die, and the positive feature facilitates mechanical positioning of the first semiconductor die. | 05-12-2011 |
20110169522 | FAULT-TOLERANT MULTI-CHIP MODULE - A multi-chip module (MCM) is described. This MCM includes multiple sites, where a given site in the multiple sites includes multiple chips with proximity connectors that communicate information through proximity communication within the MCM via multiple components associated with the given site. Note that the MCM includes global redundancy and local redundancy at the given site. In particular, the global redundancy involves providing one or more redundant sites in the multiple sites. Furthermore, the local redundancy involves providing one or more redundant chips in the multiple chips and one or more redundant components in the multiple components. | 07-14-2011 |
20110170819 | ELECTRO-OPTIC MODULATOR WITH INVERSE TAPERED WAVEGUIDES - An integrated circuit that includes an optical waveguide to convey an optical signal via an optical mode in an on-chip optical waveguide is described. In this integrated circuit, a cross-sectional area of the optical waveguide may be tapered in proximity to an electro-optic modulator in the integrated circuit, such as a germanium electro-optic modulator or a quantum-well (QW) electro-optic modulator. In particular, the cross-sectional area may be tapered from a first diameter distal from the electro-optic modulator to a second diameter proximate to the electro-optic modulator. This so-called ‘inverse taper’ may increase the spatial extent or size of the optical mode, thereby allowing the optical signal to be optically coupled to or from the electro-optic modulator with low optical loss. | 07-14-2011 |
20110223778 | MULTI-CHIP MODULE WITH MULTI-LEVEL INTERPOSER - A multi-level interposer plate and a multi-chip module (MCM) that includes the multi-level interposer plate are described. First surfaces and second surfaces in different regions of the multi-level interposer plate have associated, different thicknesses. Moreover, first micro-spring connectors and second micro-spring connectors are respectively disposed on the first surfaces and the second surfaces. In the MCM, a given one of the first surfaces of the multi-level interposer plate faces a bridge chip in a first layer in an array of chips in the MCM so that first connectors, disposed on the bridge chip, mechanically and electrically couple to the first micro-spring connectors. Similarly, a given one of the second surfaces of the multi-level interposer plate faces an island chip in a second layer in the array of chips so that second connectors, disposed on the island chip, mechanically and electrically couple to the second micro-spring connectors. | 09-15-2011 |
20110233789 | ADHESIVE-BONDED SUBSTRATES IN A MULTI-CHIP MODULE - A multi-chip module (MCM) is described in which at least two substrates are mechanically coupled by an adhesive layer that maintains alignment and a zero (or near zero) spacing between proximity connectors on surfaces of the substrates, thereby facilitating high signal quality during proximity communication between the substrates. In order to provide sufficient shear strength, the adhesive layer has a thickness that is larger than the spacing. This may be accomplished using one or more positive and/or negative features on the substrates. For example, the adhesive may be bonded to: one of the surfaces and an inner surface of a channel that is recessed below the other surface; inner surfaces of channels that are recessed below both of the surfaces; or both of the surfaces. In this last case, the zero (or near zero) spacing may be achieved by disposing proximity connectors on a mesa that protrudes above at least one of the substrate surfaces. | 09-29-2011 |
20110235962 | OPTICAL DEVICE WITH HIGH THERMAL TUNING EFFICIENCY - An optical device with high thermal tuning efficiency is described. This optical device may be implemented using a tri-layer structure (silicon-on-insulator technology), including: a substrate, a buried-oxide layer and a semiconductor layer. In particular, a thermally tunable optical waveguide may be defined in the semiconductor layer. Furthermore, a portion of the substrate under the buried-oxide layer and substantially beneath a location of the thermally tunable optical waveguide is fabricated so that a portion of the buried-oxide layer is exposed. In this way, the thermal impedance between the thermally tunable optical waveguide and an external environment is increased, and power consumption associated with thermal tuning of the optical waveguide is reduced. | 09-29-2011 |
20110278718 | ASSEMBLY OF MULTI-CHIP MODULES USING REFLOWABLE FEATURES - A multi-chip module (MCM) that includes at least two substrates, having facing surfaces, which are mechanically coupled by a set of coupling elements having a reflow characteristic, is described. One of the two substrates includes another set of coupling elements having another reflow characteristic, which is different than the reflow characteristic. These different reflow characteristics of the sets of coupling elements allow different temperature profiles to be used when bonding the two substrates to each other than when bonding the one of the two substrates to a carrier. For example, the temperature profiles may have different peak temperatures and/or different durations from one another. These reflow characteristics may facilitate low-cost, high-yield assembly and alignment of the substrates in the MCM, and may allow temperature-sensitive components to be included in the MCM. | 11-17-2011 |
20110281395 | SELF-ASSEMBLY OF MICRO-STRUCTURES - Embodiments of a method for assembling a multi-chip module (MCM) are described. During this method, a fluid that includes coupling elements is applied to a surface of a base plate in the MCM. Then, at least some of the coupling elements are positioned into negative features on the surface of the base plate using fluidic assembly. Note that a given coupling element selects a given negative feature using chemical-based selection and/or geometry-based selection. Next, the fluid and excess coupling elements (which reside in regions outside of the negative features on the surface) are removed. | 11-17-2011 |
20110302465 | MISALIGNMENT COMPENSATION FOR PROXIMITY COMMUNICATION - In a proximity communication system, transmit elements on one chip are aligned with receive elements on a second chip juxtaposed with the first chip. However, if the elements are misaligned, either statically or dynamically, the coupling between chips is degraded. The misalignment may be compensated by controllably degrading performance of the system. For example, the transmit signal strength may be increased. The bit period or the time period for biasing each bit may be increased, thereby decreasing the bandwidth. Multiple coupling elements, such as capacitors, may be ganged together, thereby decreasing the number of channels. The granularity of symbols, such as images, may be increased by decreasing the number of bits per symbol. Multiple coupling elements, such as capacitors, may be ganged together, thereby decreasing the number of channels. | 12-08-2011 |
20120093184 | STRUCTURES AND METHODS FOR ADJUSTING THE WAVELENGTHS OF LASERS VIA TEMPERATURE CONTROL - One embodiment of the present invention provides a system that facilitates adjusting the wavelengths of lasers via temperature control. This system includes a chip with an active face upon which active circuitry and signal pads reside. A thermal-control mechanism provides localized thermal control of two lasers mounted upon the active face of the chip. By individually controlling the temperature of the lasers, the thermal-control mechanism controls the wavelengths emitted by each respective laser. By creating a temperature gradient that causes a temperature difference between two or more lasers, the system can cause the lasers to emit different wavelengths. | 04-19-2012 |
20120177318 | WAVEGUIDE ELECTRO-ABSORPTION MODULATOR - During operation of an electro-absorption modulator, an optical signal is conveyed, using an optical waveguide in the electro-absorption modulator, to a semiconductor layer that substantially fills a gap between two portions of the optical waveguide. Then, the optical signal is electro-absorption modulated by selectively applying a voltage to electrodes that produces an electric field, approximately perpendicular to the midline of the optical waveguide, in the semiconductor layer. These electrodes are coupled to the edges of the semiconductor layer at the periphery along the width of the semiconductor layer by intervening layers. Furthermore, the intervening layers include a material that has a lower index of refraction than the semiconductor layer, and a lower optical absorption than the electrodes. | 07-12-2012 |
20120189025 | MONOLITHIC LASER SOURCE USING RING-RESONATOR REFLECTORS - In a laser source, a first optical waveguide includes a gain medium, and a second optical waveguide includes a phase tuner which adjusts a phase value of the phase tuner to specify the wavelength of the laser source. Furthermore, the laser source includes a first ring resonator and a second ring resonator, which, respectively, are optically coupled to the first optical waveguide and the second optical waveguide at opposite ends of the laser source. In particular, coupling wavelengths of the first and second ring resonators may match a wavelength of the optical signal, thereby defining an optical resonance cavity in the laser source and selecting a laser mode of the laser source which is associated with the wavelength. Additionally, the laser source includes an optical amplifier that receives and amplifies the optical signal output from the optical resonance cavity. | 07-26-2012 |
20120207424 | OPTICAL MODULATOR WITH THREE-DIMENSIONAL WAVEGUIDE TAPERS - An integrated circuit that includes an optical waveguide defined in a semiconductor layer is described. In this integrated circuit, light is coupled between the optical waveguide and an optical modulator, which is disposed on the optical waveguide, using 3-dimensional (3-D) taper structures that are proximate to the ends of the optical modulator. The cross-sectional areas of these 3-D taper structures transition, over a distance, from that of the optical waveguide (distal from the optical modulator) to that of optical modulator (proximate to the ends of the optical modulator). In this way, a spatial extent of an optical mode in the optical waveguide and a spatial extent of the optical mode in the optical modulator may be approximately matched to reduce the optical loss when the light is coupled to or from the optical modulator. | 08-16-2012 |
20120207479 | OPTICAL DEVICE WITH REDUCED THERMAL TUNING ENERGY - An optical device that includes multiple optical modulators having target operating wavelengths that are distributed over a band of wavelengths and actual operating wavelengths is described. For example, the target operating wavelengths of adjacent optical modulators may be separated by a wavelength increment. Moreover, because of differences between the actual operating wavelengths and the target operating wavelengths of the optical modulators, tuning elements may be used to tune the optical modulators so that the actual operating wavelengths match corresponding carrier wavelengths in a set of optical signals. Furthermore, control logic in the optical device may assign the optical modulators to the corresponding carrier wavelengths based at least on differences between the carrier wavelengths and the actual operating wavelengths, thereby reducing an average tuning energy associated with the tuning elements. | 08-16-2012 |
20120213467 | OPTICAL DEVICE WITH ENHANCED MECHANICAL STRENGTH - An optical device implemented on a substrate (such as silicon) is described. This optical device includes a wavelength-sensitive optical component with a high thermal resistance to a surrounding external environment and a low thermal resistance to a localized thermal-tuning mechanism (such as a heater), which modifies a temperature of the wavelength-sensitive optical component, thereby specifying an operating wavelength of the wavelength-sensitive optical component. In particular, the thermal resistance associated with a thermal dissipation path from the thermal-tuning mechanism to the external environment via the substrate is increased by removing a portion of the substrate to create a gap that is proximate to the thermal-tuning mechanism and the wavelength-sensitive optical component. Furthermore, the optical device includes a binder material mechanically coupled to the substrate and proximate to the gap, thereby maintaining a mechanical strength of the optical device. | 08-23-2012 |
20120220056 | MECHANICAL COUPLING IN A MULTI-CHIP MODULE USING MAGNETIC COMPONENTS - A multi-chip module (MCM) is described. This MCM includes at least two substrates that are remateably mechanically coupled by positive and negative features on facing surfaces of the substrates. These positive and negative features mate with each other. In particular, a positive feature may mate with a given pair of negative features, which includes negative features on each of the substrates. Furthermore, at least one of the negative features in the given pair may include a hard magnetic material, and the positive feature and the other negative feature in the given pair may include a soft magnetic material that provide a flux-return path to the hard magnetic material. In this way, the hard magnetic material may facilitate the remateable mechanical coupling of the substrates. | 08-30-2012 |
20120230695 | WAVELENGTH-DIVISION MULTIPLEXING FOR USE IN MULTI-CHIP SYSTEMS - Embodiments of a system that includes an array of chip modules (CMs) is described. In this system, a given CM in the array includes a semiconductor die that is configured to communicate data signals with one or more adjacent CMs through electromagnetic proximity communication using proximity connectors. Note that the proximity connectors are proximate to a surface of the semiconductor die. Moreover, the given CM is configured to communicate optical signals with other CMs through an optical signal path using optical communication, and the optical signals are encoded using wavelength-division multiplexing (WDM). | 09-13-2012 |
20120266464 | MULTI-CHIP MODULE WITH MULTI-LEVEL INTERPOSER - A multi-level interposer plate and a multi-chip module (MCM) that includes the multi-level interposer plate are described. First surfaces and second surfaces in different regions of the multi-level interposer plate have associated, different thicknesses. Moreover, first micro-spring connectors and second micro-spring connectors are respectively disposed on the first surfaces and the second surfaces. In the MCM, a given one of the first surfaces of the multi-level interposer plate faces a bridge chip in a first layer in an array of chips in the MCM so that first connectors, disposed on the bridge chip, mechanically and electrically couple to the first micro-spring connectors. Similarly, a given one of the second surfaces of the multi-level interposer plate faces an island chip in a second layer in the array of chips so that second connectors, disposed on the island chip, mechanically and electrically couple to the second micro-spring connectors. | 10-25-2012 |
20120321251 | THREE-DIMENSIONAL MACRO-CHIP INCLUDING OPTICAL INTERCONNECTS - A multi-chip module (MCM) includes a stack of chips that are coupled using optical interconnects. On a first surface of a middle chip in the stack, there are: a first optical coupler, an optical waveguide, which is coupled to the first optical coupler, and a second optical coupler, which is coupled to the optical waveguide. The first optical coupler redirects an optical signal from the optical waveguide to a first direction (which is not in the plane of the first surface), or from the first direction to the optical waveguide. The second optical coupler redirects the optical signal from the optical waveguide to a second direction (which is not in the plane of the first surface), or from the second direction to the optical waveguide. An optical path associated with the second direction passes through an opening in a substrate in the middle chip. | 12-20-2012 |
20120326322 | CHIP PACKAGE WITH REINFORCED POSITIVE ALIGNMENT FEATURES - A chip package includes a substrate having a positive feature, which is defined on a surface of the substrate and which protrudes above a region on the surface proximate to the positive feature. Furthermore, the chip package includes a mechanical reinforcement mechanism defined on the substrate proximate to the positive feature that increases a lateral shear strength of the positive feature relative to the substrate. In this way, the chip package may facilitate increased reliability of a multi-chip module (MCM) that includes the chip package. | 12-27-2012 |
20130003310 | CHIP PACKAGE TO SUPPORT HIGH-FREQUENCY PROCESSORS - A chip package includes a processor, an interposer chip and a voltage regulator module (VRM). The interposer chip is electrically coupled to the processor by first electrical connectors proximate to a surface of the interposer chip. Moreover, the interposer chip includes second electrical connectors proximate to another surface of the interposer chip, which are electrically coupled to the first electrical connectors by through-substrate vias (TSVs) in the interposer chip. Note that the second electrical connectors can electrically couple the interposer chip to a circuit board. Furthermore, the VRM is electrically coupled to the processor by the interposer chip, and is proximate to the processor in the chip package, thereby reducing voltage droop. For example, the VRM may be electrically coupled to the surface of the interposer chip, and may be adjacent to the processor. Alternatively, the VRM may be electrically coupled to the other surface of the interposer chip. | 01-03-2013 |
20130015578 | INTERCONNECTION AND ASSEMBLY OF THREE-DIMENSIONAL CHIP PACKAGESAANM Thacker; Hiren D.AACI San DiegoAAST CAAACO USAAGP Thacker; Hiren D. San Diego CA USAANM Cunningham; John E.AACI San DiegoAAST CAAACO USAAGP Cunningham; John E. San Diego CA USAANM Shubin; IvanAACI San DiegoAAST CAAACO USAAGP Shubin; Ivan San Diego CA USAANM Krishnamoorthy; Ashok V.AACI San DiegoAAST CAAACO USAAGP Krishnamoorthy; Ashok V. San Diego CA US - In a chip package, semiconductor dies in a vertical stack of semiconductor dies or chips (which is referred to as a ‘plank stack’) are aligned by positive features that are mechanically coupled to negative features recessed below the surfaces of adjacent semiconductor dies. Moreover, the chip package includes an interposer plate at approximately a right angle to the plank stack, which is electrically coupled to the semiconductor dies along an edge of the plank stack. In particular, electrical pads proximate to a surface of the interposer plate (which are along a stacking direction of the plank stack) are electrically coupled to pads that are proximate to edges of the semiconductor dies by an intervening conductive material, such as solder balls or spring connectors. Note that the chip package may facilitate high-bandwidth communication of signals between the semiconductor dies and the interposer plate. | 01-17-2013 |
20130037905 | HYBRID SUBSTRATELESS DEVICE WITH ENHANCED TUNING EFFICIENCY - In a hybrid integrated module, a semiconductor die is mechanically coupled face-to-face to an integrated device in which the substrate has been removed. For example, the integrated circuit may include an optical device fabricated on a silicon-on-insulator (SOI) wafer in which the backside silicon handler has been completely removed, thereby facilitating improved device performance and highly efficient thermal tuning of the operating wavelength of the optical device. Moreover, the semiconductor die may be a VLSI chip that provides power, and serves as a mechanical handler and/or an electrical driver. The thermal tuning efficiency of the substrateless optical device may be enhanced by over 100× relative to an optical device with an intact substrate, and by 5× relative to an optical device in which the substrate has only been removed in proximity to the optical device. | 02-14-2013 |
20130039614 | ULTRA-COMPACT PHOTODETECTOR ON AN OPTICAL WAVEGUIDE - An integrated circuit is described. This integrated circuit includes an optical waveguide defined in a semiconductor layer, and an optical detector disposed on top of the optical waveguide. Moreover, the optical waveguide has an end with a reflecting facet. For example, the reflective facet may be defined using an anisotropic etch of the semiconductor layer. This reflecting facet reflects light propagating in a plane of the optical waveguide out of the plane into the optical detector, thereby providing a photodetector with high optical responsivity, including an extremely low dark current (and, thus, high photosensitivity) and an extremely small capacitance (and, thus, high electrical bandwidth). | 02-14-2013 |
20130071121 | WAVELENGTH-DIVISION MULTIPLEXING FOR USE IN MULTI-CHIP SYSTEMS - Embodiments of a system that includes an array of chip modules (CMs) is described. In this system, a given CM in the array includes a semiconductor die that is configured to communicate data signals with one or more adjacent CMs through electromagnetic proximity communication using proximity connectors. Note that the proximity connectors are proximate to a surface of the semiconductor die. Moreover, the given CM is configured to communicate optical signals with other CMs through an optical signal path using optical communication, and the optical signals are encoded using wavelength-division multiplexing (WDM). | 03-21-2013 |
20130121635 | DIRECT INTERLAYER OPTICAL COUPLER - In an MCM, an optical signal is conveyed by an optical waveguide disposed on a surface of a first substrate to an optical coupler having a vertical facet. This optical coupler has an optical mode that is different than the optical mode of the optical waveguide. For example, the spatial extent of the optical mode associated with the optical coupler may be larger, thereby reducing optical losses and sensitivity to alignment errors. Then, the optical signal is directly coupled from the vertical facet to a facing vertical facet of an identical optical coupler on another substrate, and the optical signal is conveyed in another optical waveguide disposed on the other substrate. | 05-16-2013 |
20130156366 | EFFICIENT INTER-CHIP OPTICAL COUPLING - In an MCM, an optical signal is conveyed by an optical waveguide disposed on a surface of a first substrate to a first optical coupler. This first optical coupler redirects the optical signal out of the plane of the optical waveguide. Then, an optical interposer guides the optical signal between the first optical coupler and a second optical coupler on a surface of a second substrate, thereby reducing spatial expansion of the optical signal between the optical couplers. Moreover, the second optical coupler redirects the optical signal into a plane of an optical waveguide disposed on a surface of the second substrate, which then conveys the optical signal. | 06-20-2013 |
20130195461 | ENERGY-EFFICIENT OPTICAL SOURCE - An optical source includes a set of N light sources that provide a corresponding set of N optical signals having N carrier wavelengths. These optical signals are combined into a seed optical signal and transported to a substrate using an optical fiber. This substrate includes a set of K optical amplifiers that amplify the seed optical signal and provide a set of M output optical signals on a corresponding set of M output optical waveguides (where M is less than K). In this way, a total power of the set of M output optical signals may be significantly larger than that of the seed optical signal, thereby ensuring that a majority of a power efficiency of the optical source is associated with power efficiencies of the set of K optical amplifiers instead of power efficiencies of the set of N light sources. | 08-01-2013 |
20130207261 | MAINTAINING ALIGNMENT IN A MULTI-CHIP MODULE USING A COMPRESSIBLE STRUCTURE - An MCM includes a two-dimensional array of facing chips, including island chips and bridge chips that communicate with each other using overlapping connectors. In order to maintain the relative vertical spacing of these connectors, compressible structures are in cavities in a substrate, which house the bridge chips, provide a compressive force on back surfaces of the bridge chips. These compressible structures include a compliant material with shape and volume compression. In this way, the MCM may ensure that facing surfaces of the island chips and the bridge chips, as well as connectors on these surfaces, are approximately coplanar without bending the bridge chips. | 08-15-2013 |
20130308903 | OPTICAL CONNECTOR WITH REDUCED MECHANICAL-ALIGNMENT SENSITIVITY - An optical connector is described. This optical connector spatially segregates optical coupling between an optical fiber and an optical component, which relaxes the associated mechanical-alignment requirements. In particular, the optical connector includes an optical spreader component disposed on a substrate. This optical spreader component is optically coupled to the optical fiber at a first coupling region, and is configured to optically couple to the optical component at a second coupling region that is at a different location on the substrate than the first coupling region. Moreover, the first coupling region and the second coupling region are optically coupled by an optical waveguide. | 11-21-2013 |
20130320567 | BATCH PROCESS FOR THREE-DIMENSIONAL INTEGRATION - A chip package is described which includes a first chip having a first surface and first sides having a first side-wall angle, and a second chip having a second surface and second sides having a second side-wall angle, which faces and is mechanically coupled to the first chip. The chip package is fabricated using a batch process, and the chips in the chip package were singulated from their respective wafers after the chip package is assembled. This is accomplished by etching the first and second side-wall angles and thinning the wafer thicknesses prior to assembling the chip package. For example, the first and/or the second side walls can be fabricated using wet etching or dry etching. Therefore, the first and/or the second side-wall angles may be other than vertical or approximately vertical. | 12-05-2013 |
20140133864 | Edge coupling of optical devices - A system includes optical modules. Each module includes a different base and one or more module waveguides on the base. Module waveguides from different modules are aligned such that the aligned module waveguides exchange light signals. At least a portion of one of the aligned module waveguides is between the base of one of the modules and the base of another module. First electronics operate a transmitter on a first one of the optical modules so as to generate one of the light signals. Second electronics operate a receiver on a second one of the modules such that the electronics generate an electrical signal in response to the receiver receiving one of the light signals. | 05-15-2014 |
20140264854 | MULTI-CHIP MODULE WITH SELF-POPULATING POSITIVE FEATURES - A multi-chip module (MCM) is described. This MCM includes at least two substrates that are mechanically coupled and aligned by positive and negative features on facing surfaces of the substrates. These positive and negative features may mate and self-lock with each other. The positive features may be self-populated into the negative features on at least one of the substrates using a hydrophilic layer in the negative feature. This hydrophilic layer may be used in conjunction with a hydrophobic layer surrounding the negative features on a top surface of at least one of the substrates. | 09-18-2014 |
20140268312 | HYBRID OPTICAL SOURCE WITH SEMICONDUCTOR REFLECTOR - A hybrid optical source that provides an optical signal having a wavelength is described. This hybrid optical source includes an edge-coupled optical amplifier (such as a III-V semiconductor optical amplifier) aligned to a semiconductor reflector (such as an etched silicon mirror). The semiconductor reflector efficiently couples (i.e., with low optical loss) light out of the optical amplifier in a direction approximately perpendicular to a plane of the optical amplifier. A corresponding optical coupler (such as a diffraction grating or a mirror) fabricated on a silicon-on-insulator chip efficiently couples the light into a sub-micron silicon-on-insulator optical waveguide. The silicon-on-insulator optical waveguide couples the light to additional photonic elements (including a reflector) to complete the hybrid optical source. | 09-18-2014 |
20140321803 | HYBRID-INTEGRATED PHOTONIC CHIP PACKAGE WITH AN INTERPOSER - A chip package includes an optical integrated circuit (such as a hybrid integrated circuit) and an integrated circuit that are adjacent to each in the chip package. The integrated circuit includes electrical circuits, such as memory or a processor, and the optical integrated circuit communicates optical signals with very high bandwidth. Moreover, a front surface of the integrated circuit is electrically coupled to a front surface of the optical integrated circuit by a top surface of the interposer, where the top surface faces the front surface of the integrated circuit and the front surface of the optical integrated circuit. Furthermore, the integrated circuit and the optical integrated circuit may be on a same side of the interposer. By integrating the optical integrated circuit and the integrated circuit in close proximity, the chip package may facilitate improved performance compared to chip packages with electrical interconnects. | 10-30-2014 |
20140321804 | HYBRID-INTEGRATED PHOTONIC CHIP PACKAGE WITH AN INTERPOSER - A chip package includes an optical integrated circuit (such as a hybrid integrated circuit) and an integrated circuit that are proximate to each other in the chip package. The integrated circuit includes electrical circuits, such as memory or a processor, and the optical integrated circuit communicates optical signals with very high bandwidth. Moreover, a front surface of the integrated circuit is electrically coupled to a top surface of an interposer, and this top surface is in turn electrically coupled to a front surface of an input/output (I/O) integrated circuit that faces the top surface. Furthermore, the front surface of the I/O integrated circuit is electrically coupled to a top surface of the optical integrated circuit, where the top surface of the optical integrated circuit faces the front surface of the I/O integrated circuit. | 10-30-2014 |
20150086149 | TUNABLE SILICON GRATING COUPLERS - A photonic integrated circuit (PIC) is described. This PIC includes a grating coupler for surface-normal coupling that has an alternating pattern of grating teeth and grating trenches, where the grating trenches are filled with an electro-optical material. By applying an electric potential to the grating teeth, the index of refraction of the electro-optical material can be modified. | 03-26-2015 |
20150086219 | ENHANCED OPTICAL MODULATION USING SLOW LIGHT - A photonic integrated circuit (PIC) is described. This PIC includes a semiconductor-barrier layer-semiconductor diode in an optical waveguide that conveys an optical signal, where the barrier layer is an oxide or a high-k material. Moreover, semiconductor layers in the semiconductor-barrier layer-semiconductor diode may include geometric features (such as a periodic pattern of holes or trenches) that create a lattice-shifted photonic crystal optical waveguide having a group velocity of light that is lower than the group velocity of light in the first semiconductor layer and the second semiconductor layer without the geometric features. The optical waveguide is included in an optical modulator, such as a Mach-Zehnder interferometer (MZI). | 03-26-2015 |