Patent application number | Description | Published |
20090152654 | MICROMECHANICAL SYSTEM - A micromechanical system includes a substrate, a first planar electrode, a second planar electrode, and a third planar electrode. The second planar electrode is movably positioned at a distance above the first planar electrode and the third planar electrode is positioned at a distance above the second electrode. | 06-18-2009 |
20090320596 | ACCELERATION SENSOR WITH COMB-SHAPED ELECTRODES - A micromechanical capacitive acceleration sensor having at least one seismic mass that is connected to a substrate so as to be capable of deflection, at least one electrode connected fixedly to the substrate, and at least one electrode connected to the seismic mass, the at least one electrode connected fixedly to the substrate and the at least one electrode connected to the seismic mass being realized as comb-shaped electrodes having lamellae that run parallel to the direction of deflection of the seismic mass, the lamellae of the two comb-shaped electrodes overlapping partially in the resting state. | 12-31-2009 |
20100000321 | YAW RATE SENSOR - A yaw rate sensor includes a drive mass element which is situated above a surface of a substrate and is drivable to vibrate by a drive device along a first axis extending along the surface, having a detection mass element, which is deflectable under the influence of a Coriolis force along a second axis perpendicular to the surface, and having a detection device by which the deflection of the detection mass element along the second axis is detectable. Due to the arrangement of the second axis perpendicular to the surface, the yaw rate sensor may be integrated into a chip together with additional yaw rate sensors suitable for detection of rotations about axes of rotation in other directions. | 01-07-2010 |
20100024553 | MICROMECHANICAL Z-SENSOR - A micromechanical z-sensor includes a sensitivity, a torsion spring, and a seismic additional mass, the torsion spring having a spring width, and the seismic additional mass including webs having a web width. The web width is selected smaller than the spring width. | 02-04-2010 |
20100024554 | TRIAXIAL ACCELERATION SENSOR - An acceleration sensor includes a substrate and a first mass element, which is connected to the substrate in such a way that the first mass element is rotatable about an axis, the first mass element being connected to a second mass element in such a way that the second mass element is movable along a first direction parallel to the axis, and the first mass element being connected to a third mass element in such a way that the third mass element is movable along a second direction perpendicular to the axis. | 02-04-2010 |
20100043549 | TRIAXIAL ACCELERATION SENSOR - An acceleration sensor includes a substrate, a rocker mass, a z spring connected to the rocker mass, which allows the rocker mass to rotate about an axis, and at least one additional spring system connected to the substrate and the rocker mass. The additional spring system allows the rocker mass to deflect in an x or y direction oriented parallel or perpendicular to the axis. The z spring or the additional spring system allows the rocker mass to deflect in a y or x direction oriented parallel or perpendicular to the axis. | 02-25-2010 |
20100058863 | MANUFACTURING METHOD FOR A ROTATION SENSOR DEVICE AND ROTATION SENSOR DEVICE - A device and manufacturing method for a rotation sensor device includes a holding device, an oscillating mass, and a spring, via which the oscillating mass is connected to the holding device. The spring is designed so that the oscillating mass can be set into an oscillating movement around an oscillation axis with respect to the holding device with the aid of a drive. The steps include: producing a layer sequence having a first layer made of semiconductor material and/or metal and a second layer made of semiconductor material and/or a metal, a boundary surface of the first layer, at least partially being covered by an insulating layer; structuring the spring out of the first layer; and structuring at least one oscillating mass subunit of the oscillating mass, which can be set into the oscillating movement around the oscillation axis with the aid of the drive, out of the second layer. | 03-11-2010 |
20100107762 | ACCELERATION SENSOR AND METHOD FOR ITS MANUFACTURE - An acceleration sensor is described that has a base substrate, a first electrode structure situated in stationary fashion relative to the base substrate, a sensor element having a first electrode area, and a spring device having at least one spring element. Via the spring element, the sensor element is coupled to the base substrate so that the sensor element is deflected relative to the base substrate as the result of an acceleration acting on the sensor element, thus changing the distance between the first electrode structure and the first electrode area. The sensor element and the first electrode structure are situated at least partially one over the other and are formed from a common functional layer. | 05-06-2010 |
20100122576 | Rotation rate sensor - A rotation rate sensor includes: a mounting device; a first drive frame having a drive, which is designed to set the first drive frame into a first oscillatory motion along an axis of oscillation relative to the mounting device; a first stator electrode; a first actuator electrode coupled to the first drive frame in such a way that in a rotary motion of the rotation rate sensor due to a Coriolis force, the first actuator electrode being displaceable in a first deflection direction relative to the first stator electrode; and an evaluation device configured to determine a voltage applied between the first stator electrode and the first actuator electrode, and to specify information regarding the rotary motion of the rotation rate sensor while taking the determined voltage value into account. | 05-20-2010 |
20100122578 | MICROMECHANICAL COMPONENT - A micromechanical component for detecting an acceleration. The component includes a conductive layer having a first and a second electrode and a rotatable flywheel mass in the form of a rocker having a first and a second lever arm. The first lever arm is situated opposite the first electrode, and the second lever arm is situated opposite the second electrode. The first lever arm has a first hole structure having a number of first cut-outs, and the second lever arm has a second hole structure having a number of second cut-outs. The first and the second lever arm have different masses. The component is characterized by the fact that the outer dimensions of the first and second lever arms correspond, and the first hole structure of the first lever arm differs from the second hole structure of the second lever arm. Furthermore, a method for manufacturing such a micromechanical component is provided. | 05-20-2010 |
20100175473 | SENSOR SYSTEM - A sensor system having a substrate, that has a main plane of extension, and a seismic mass, the seismic mass being developed movably about a torsional axis that is parallel to the main plane of extension; and the seismic mass having an asymmetrical mass distribution with respect to the torsional axis; and furthermore an area of the seismic mass facing the substrate is developed symmetrically with respect to the torsional axis. | 07-15-2010 |
20100181944 | MICROMECHANICAL COMPONENT AND METHOD FOR OPERATING A MICROMECHANICAL COMPONENT - A micromechanical component includes a first electrode and a second electrode, the first electrode being moveable relative to the second electrode in a main direction of movement, and the first electrode and/or the second electrode being configured such that a movement of the first electrode parallel to the main direction of movement results in a modification of the average distance in a region of overlap of the projection of the first electrode with the projection of the second electrode, both perpendicular to the main direction of movement and in a main plane of extension. | 07-22-2010 |
20100192690 | MICROMECHANICAL STRUCTURES - A micromechanical structure including a substrate having a main plane of extension, and including a first seismic mass, the first seismic mass including a grid structure made of intersecting first mass lines and the first seismic mass being flexibly secured with the aid of first bending-spring elements, and moreover, a first line width of the first mass lines parallel to the main plane of extension being between 20 and 50 percent of a further first line width of the first bending-spring elements parallel to the main plane of extension. | 08-05-2010 |
20100326188 | RATE-OF-ROTATION SENSOR AND METHOD FOR OPERATING A RATE-OF-ROTATION SENSOR - A rate-of-rotation sensor having a substrate and a first Coriolis element are provided, an excitation arrangement being provided for the excitation of vibrations of the first Coriolis element in a first direction, a first detection arrangement being provided for detecting a first deflection of the first Coriolis element in a third direction running generally perpendicular to the first direction; characterized by the first Coriolis element being developed as balancing rocker. | 12-30-2010 |
20110023600 | MICROMECHANICAL YAW-RATE SENSOR - A micromechanical yaw-rate sensor comprising a first yaw-rate sensor element, which outputs a first sensor signal, which contains information about a rotation around a first rotational axis, a second yaw-rate sensor element, which outputs a second sensor signal, which contains information about a rotation around a second rotational axis, which is perpendicular to the first rotational axis, a drive, which drives the first yaw-rate sensor element, and a coupling link, which mechanically couples the first yaw-rate sensor element and the second yaw-rate sensor element to one another, so that driving of the first yaw-rate sensor element also causes driving of the second yaw-rate sensor element. | 02-03-2011 |
20110056295 | Micromechanical system - A micromechanical system includes a first movable element, which is connected to a substrate via a first spring element, and a second movable element, which is connected to the substrate via a second spring element. The first movable element and the second movable element are movable in relation to the substrate independent of one another. Furthermore, the first movable element and the second movable element are situated one above the other in at least some sections in a direction perpendicular to the substrate surface. | 03-10-2011 |
20110056297 | MICROMECHANICAL SYSTEM FOR DETECTING AN ACCELERATION - A micromechanical system for detecting an acceleration includes a substrate, a rocker-like mass structure having a first lever arm and a diametrically opposed second lever arm, the lever arms being situated tiltably at a distance to the substrate and about an axis of rotation to the substrate, and first and second electrodes being provided on the substrate. Each electrode is diametrically opposed to a lever arm and each lever arm includes a section extending from the axis of rotation which is located between the electrodes above an intermediate space. The two sections have different masses. | 03-10-2011 |
20110079079 | YAW RATE SENSOR, YAW RATE SENSOR SYSTEM, AND METHOD FOR OPERATING A YAW RATE SENSOR - A yaw rate sensor having a substrate which has a main plane of extension, and a Coriolis element is proposed. The Coriolis element is excitable to a vibration along a third direction which is perpendicular to the main plane of extension. A Coriolis deflection of the Coriolis element along a first direction which is parallel to the main plane of extension may be detected using a detection arrangement. The detection arrangement includes a Coriolis electrode which is connected to the Coriolis element, and a corresponding counterelectrode. Both the Coriolis electrode and the counterelectrode may be excited to a vibration along the third direction. | 04-07-2011 |
20110079863 | Micromechanical structure, method for manufacturing a micromechanical structure, and use of a micromechanical structure - A micromechanical structure which includes a substrate having a main plane of extension, and a seismic mass which is movable relative to the substrate. The micromechanical structure includes a fixed electrode which is connected to the substrate, and a counterelectrode which is connected to the seismic mass. The fixed electrode has a first fixed electrode region and a second fixed electrode region which is connected in an electrically conductive manner to the first fixed electrode region. The counterelectrode is partially situated between the first and the second fixed electrode region, perpendicular to the main plane of extension. | 04-07-2011 |
20110083506 | Micromechanical structure and method for manufacturing a micromechanical structure - A micromechanical structure includes: a substrate; a seismic mass movable relative to the substrate along a first direction parallel to a main plane of extension of the substrate; a first electrode structure is connected to the substrate; and a second electrode structure connected to the substrate. The seismic mass includes a counterelectrode structure having finger electrodes situated between first finger electrodes of the first electrode structure and second finger electrodes of the second electrode structure, along the first direction. The first electrode structure is fastened to the substrate by a first anchoring element in a central region of the micromechanical structure, and the second electrode structure is anchored to the substrate by a second anchoring element situated in the central region. | 04-14-2011 |
20110088469 | ROTATION-RATE SENSOR HAVING TWO SENSITIVE AXES - A method and system are provided including a rotation-rate sensor having a substrate, a bearing, a vibrating structure suspended on the bearing by springs in a rotatable manner for performing a planar driving vibration motion, and drive means for producing the planar driving vibration motion of the vibrating structure. The rotation-rate sensor has first evaluation means for detecting a rotation in a first axis of rotation and second evaluation means for detecting a rotation in a second axis of rotation. | 04-21-2011 |
20110140692 | Method for determining the sensitivity of an acceleration sensor or magnetic field sensor - A method for determining the sensitivity of a sensor provides the following steps: a) first and second deflection voltages are applied to first and second electrode systems of the sensor, respectively, and first and second electrostatic forces are exerted on an elastically suspended seismic mass of the sensor by the first and second electrode systems, respectively, and a restoring force is exerted on the mass as a result of the elasticity of the mass, and a force equilibrium is established among the first and second electrostatic forces and the restoring force, and the mass assumes a deflection position characteristic of the force equilibrium, and an output signal characteristic of the force equilibrium and of the deflection position is measured; and b) the sensitivity of the sensor is computed on the basis of the first and second deflection voltages. | 06-16-2011 |
20110153251 | METHOD FOR COMPENSATING FOR QUADRATURE - A method for compensating for the quadrature of a micromechanical structure, the micromechanical structure having a substrate having a main extension plane, a seismic mass that is attached by spring elements to the substrate, and first and second compensation electrodes anchored to the substrate; in response to application of a first quadrature voltage between the first compensation electrode and the seismic mass, a first compensation force being produced on the seismic mass and, in response to application of a second quadrature voltage between the second compensation electrode and the seismic mass, a second compensation force being produced on the seismic mass and, in addition, the second quadrature voltage being adjusted as a function of the first quadrature voltage. | 06-23-2011 |
20110154899 | MICROMECHANICAL COMPONENT AND METHOD FOR OPERATING A MICROMECHANICAL COMPONENT - A micromechanical component comprising a substrate, a seismic mass, and first and second detection means, the substrate having a main extension plane and the first detection means being provided for detection of a substantially translational first deflection of the seismic mass along a first direction substantially parallel to the main extension plane, and the second detection means further being provided for detection of a substantially rotational second deflection of the seismic mass about a first rotation axis parallel to a second direction substantially perpendicular to the main extension plane. The seismic mass can be embodied as an asymmetrical rocker, with the result that accelerations can be sensed as rotations. Detection can be accomplished via capacitive sensors. | 06-30-2011 |
20110174076 | Multiaxial micromechanical acceleration sensor - A micromechanical acceleration sensor includes a substrate, an elastic diaphragm which extends parallel to the substrate plane and which is partially connected to the substrate, and which has a surface region which may be deflected perpendicular to the substrate plane, and a seismic mass whose center of gravity is situated outside the plane of the elastic diaphragm. The seismic mass extends at a distance over substrate regions which are situated outside the region of the elastic diaphragm and which include a system composed of multiple electrodes, each of which together with oppositely situated regions of the seismic mass forms a capacitor in a circuit. In its central region the seismic mass is attached to the elastic diaphragm in the surface region of the elastic diaphragm which may be deflected perpendicular to the substrate plane. | 07-21-2011 |
20110185813 | MICROMECHANICAL YAW RATE SENSOR HAVING TWO SENSITIVE AXES AND COUPLED DETECTION MODES - In a yaw rate sensor with a substrate having a main extent plane and with a first and second partial structure disposed parallel to the main extent plane, the first partial structure includes a first driving structure and the second partial structure includes a second driving structure, the first and second partial structure being excitable by a driving device, via the first and second driving structure, into oscillation parallel to a first axis parallel to the main extent plane, the first partial structure having a first Coriolis element and the second partial structure having a second Coriolis element, the yaw rate sensor being characterized in that the first and second Coriolis elements are displaceable by a Coriolis force parallel to a second axis, which is perpendicular to the first axis, and parallel to a third axis, which is perpendicular to the first and second axis, the second axis extending parallel to the main extent plane, and the first Coriolis element being connected to the second Coriolis element via a coupling element. | 08-04-2011 |
20120006115 | YAW RATE SENSOR - A yaw rate sensor includes a substrate having a substrate surface, a first movable element, which is disposed above the substrate surface and has a drive frame and a first detection mass, a first electrode, which is disposed at a distance underneath the first detection mass and connected to the substrate surface, and a second electrode which is disposed at a distance above the first detection mass and connected to the substrate surface. The drive frame is connected to the substrate via at least one drive spring, the detection mass is connected to the drive frame via at least one detection spring, and the first movable element is excitable to a drive oscillation parallel to the substrate surface, and the first detection mass is deflectable perpendicular to the substrate surface. | 01-12-2012 |
20120024059 | Yaw rate sensor and method for manufacturing a mass element - A yaw rate sensor includes a drive device, at least one mass element which is connected to the drive device, and at least one detection electrode for detecting a motion of the mass element. The mass element has a base layer and at least one web which is situated on the base layer. Also, a method for manufacturing a mass element. | 02-02-2012 |
20120031185 | ACCELERATION SENSOR HAVING A DAMPING DEVICE - A micromechanical acceleration sensor is described which includes a substrate and a seismic mass which is movably situated with respect to the substrate in a detection direction. The micromechanical sensor includes at least one damping device for damping motions of the seismic mass perpendicular to the detection direction. | 02-09-2012 |
20120031186 | INERTIAL SENSOR AND METHOD FOR MANUFACTURING AN INERTIAL SENSOR - An inertial sensor includes a substrate, a mass element, and a detecting device for detecting a movement of the mass element relative to the substrate, the mass element being coupled to the substrate with the aid of a spring device, wherein the spring device has a T-shaped cross-sectional profile. A method for manufacturing an inertial sensor is also disclosed. | 02-09-2012 |
20120060604 | YAW-RATE SENSOR - A yaw-rate sensor having a substrate and a plurality of movable substructures that are mounted over a surface of the substrate, the movable substructures being coupled to a shared, in particular, central spring element, means being provided for exciting the movable substructures into a coupled oscillation in a plane that extends parallel to the surface of the substrate, the movable substructures having Coriolis elements, means being provided for detecting deflections of the Coriolis elements induced by a Coriolis force, a first Coriolis element being provided for detecting a yaw rate about a first axis, a second Coriolis element being provided for detecting a yaw rate about a second axis, the second axis being oriented perpendicularly to the first axis. | 03-15-2012 |
20120186345 | SELF-TEST FOR YAW RATE SENSORS - A yaw rate sensor ( | 07-26-2012 |
20130032904 | Coated Capacitive Sensor - In one embodiment, a method of forming a MEMS device includes providing a substrate, forming a sacrificial layer above the substrate layer, forming a silicon based working portion on the sacrificial layer, releasing the silicon based working portion from the sacrificial layer such that the working portion includes at least one exposed outer surface, forming a first layer of silicide forming metal on the at least one exposed outer surface of the silicon based working portion, and forming a first silicide layer with the first layer of silicide forming metal. | 02-07-2013 |
20130042681 | METHOD FOR MANUFACTURING A MICROMECHANICAL STRUCTURE, AND MICROMECHANICAL STRUCTURE - A method for manufacturing a micromechanical structure, and a micromechanical structure. The micromechanical structure encompasses a first micromechanical functional layer, made of a first material, that comprises a buried conduit having a first end and a second end; a micromechanical sensor structure having a cap in a second micromechanical functional layer that is disposed above the first micromechanical functional layer; an edge region in the second micromechanical functional layer, such that the edge region surrounds the sensor structure and defines an inner side containing the sensor structure and an outer side facing away from the sensor structure; such that the first end is located on the outer side and the second end on the inner side. | 02-21-2013 |
20130104654 | MICROMECHANICAL COMPONENT AND METHOD FOR MANUFACTURING A MICROMECHANICAL COMPONENT | 05-02-2013 |
20130186200 | MICROMECHANICAL STRUCTURE AND METHOD FOR MANUFACTURING A MICROMECHANICAL STRUCTURE - A micromechanical structure includes: a substrate which has a main plane of extension; and a mass which is movable relative to the substrate, the movable mass being elastically suspended via at least one coupling spring. A first subregion of the movable mass is situated, at least partially, between the substrate and the coupling spring along a vertical direction which is essentially perpendicular to the main plane of extension. | 07-25-2013 |
20130200473 | MICROMECHANICAL COMPONENT AND METHOD FOR THE MANUFACTURE OF SAME - A method for manufacturing a micromechanical component is described in which a trench etching process and a sacrificial layer etching process are carried out to form a mass situated movably on a substrate. The movable mass has electrically isolated and mechanically coupled subsections of a functional layer. A micromechanical component having a mass situated movably on a substrate is also described. | 08-08-2013 |
20130285165 | METHOD FOR MANUFACTURING A HYBRID INTEGRATED COMPONENT - A manufacturing method for hybrid integrated components having a very high degree of miniaturization is provided, which hybrid integrated components each have at least two MEMS elements each having at least one assigned ASIC element. Two MEMS/ASIC wafer stacks are initially created independently of one another in that two ASIC substrates are processed independently of one another; a semiconductor substrate is mounted on the processed surface of each of the two ASIC substrates, and a micromechanical structure is subsequently created in each of the two semiconductor substrates. The two MEMS/ASIC wafer stacks are mounted on top of each other, MEMS on MEMS. Only subsequently are the components separated. | 10-31-2013 |
20130285166 | HYBRID INTEGRATED COMPONENT AND METHOD FOR THE MANUFACTURE THEREOF - Hybrid integrated components including an MEMS element and an ASIC element are described, whose capacitor system allows both signal detection with comparatively high sensitivity and sensitive activation of the micromechanical structure of the MEMS element. The hybrid integrated component includes an MEMS element having a micromechanical structure which extends over the entire thickness of the MEMS substrate. At least one structural element of this micromechanical structure is deflectable and is operationally linked to at least one capacitor system, which includes at least one movable electrode and at least one stationary electrode. Furthermore, the component includes an ASIC element having at least one electrode of the capacitor system. The MEMS element is mounted on the ASIC element, so that there is a gap between the micromechanical structure and the surface of the ASIC element. According to the invention, at least one electrode of the capacitor system is separated from the layered structure of the ASIC element and instead mechanically and electrically connected to the deflectable structural element of the MEMS element, so that this electrode functions as a movable electrode of the capacitor system. | 10-31-2013 |
20130299923 | FLEXIBLE STOP FOR AN ACCELERATION SENSOR - A micromechanical acceleration sensor includes a seismic mass and a substrate that has a reference electrode. The seismic mass is deflectable in a direction perpendicular to the reference electrode, and the seismic mass has a flexible stop in the deflection direction. The flexible stop of the seismic mass includes an elastic layer. | 11-14-2013 |
20130299925 | MICROMECHANICAL INERTIAL SENSOR AND METHOD FOR MANUFACTURING SAME - A micromechanical inertial sensor includes an ASIC element having a processed front side, an MEMS element having a micromechanical sensor structure, and a cap wafer mounted above the micromechanical sensor structure, which sensor structure includes a seismic mass and extends over the entire thickness of the MEMS substrate. The MEMS element is mounted on the processed front side of the ASIC element above a standoff structure and is electrically connected to the ASIC element via through-contacts in the MEMS substrate and in adjacent supports of the standoff structure. A blind hole is formed in the MEMS substrate in the area of the seismic mass, which blind hole is filled with the same electrically conductive material as the through-contacts, the conductive material having a greater density than the MEMS substrate. | 11-14-2013 |
20130299928 | HYBRIDLY INTEGRATED COMPONENT AND METHOD FOR THE PRODUCTION THEREOF - A hybridly integrated component includes an ASIC element having a processed front side, a first MEMS element having a micromechanical structure extending over the entire thickness of the first MEMS substrate, and a first cap wafer mounted over the micromechanical structure of the first MEMS element. At least one structural element of the micromechanical structure of the first MEMS element is deflectable, and the first MEMS element is mounted on the processed front side of the ASIC element such that a gap exists between the micromechanical structure and the ASIC element. A second MEMS element is mounted on the rear side of the ASIC element. The micromechanical structure of the second MEMS element extends over the entire thickness of the second MEMS substrate and includes at least one deflectable structural element. | 11-14-2013 |
20130307096 | HYBRID INTERGRATED COMPONENT - A hybrid integrated component including an MEMS element and an ASIC element is refined to improve the capacitive signal detection or activation. The MEMS element is implemented in a layered structure on a semiconductor substrate. The layered structure of the MEMS element includes at least one printed conductor level and at least one functional layer, in which the micromechanical structure of the MEMS element having at least one deflectable structural element is implemented. The ASIC element is mounted face down on the layered structure and functions as a cap for the micromechanical structure. The deflectable structural element of the MEMS element is equipped with at least one electrode of a capacitor system. At least one stationary counter electrode of the capacitor system is implemented in the printed conductor level of the MEMS element, and the ASIC element includes at least one further counter electrode of the capacitor system. | 11-21-2013 |
20130333469 | METHOD FOR OPERATING AND/OR FOR MEASURING A MICROMECHANICAL DEVICE, AND MICROMECHANICAL DEVICE - A method for operating and/or measuring a micromechanical device. The device has a first and second seismic mass which are movable by oscillation relative to a substrate; a first drive device for deflecting the first seismic mass and a second drive device for deflecting the second seismic mass, parallel to a drive direction in a first orientation; a third drive device for deflecting the first seismic mass, and a fourth drive device for deflecting the second seismic mass in parallel to the drive direction and according to a second orientation opposite from the first orientation; a first detection device for detecting drive motion of the first seismic mass; and a second detection device for detecting drive motion of the second seismic mass. A first and a second detection signal are generated by the first and second detection devices, the first detection signal being evaluated separately from the second detection signal. | 12-19-2013 |
20130334621 | HYBRID INTEGRATED COMPONENT AND METHOD FOR THE MANUFACTURE THEREOF - An expansion of the functional scope of a hybrid integrated component including an MEMS element, a cap for the micromechanical structure of the MEMS element, and an ASIC element having circuit components is provided. In this component, the circuit components of the ASIC element interact with the micromechanical structure of the MEMS element. The MEMS element is mounted on the ASIC element in such a way that the micromechanical structure of the MEMS element is situated in a cavity between the cap and the ASIC element. The ASIC element is additionally equipped with the circuit components of a magnetic sensor system. These circuit components are produced in or on the CMOS back-end stack of the ASIC element. The magnetic sensor system may thus be implemented without enlarging the chip area. | 12-19-2013 |
20140021515 | MICROMECHANICAL STRUCTURE, IN PARTICULAR SENSOR ARRANGEMENT, AND CORRESPONDING OPERATING METHOD - A micromechanical structure, in particular a sensor arrangement, includes at least one micromechanical functional layer, a CMOS substrate region arranged below the at least one micromechanical functional layer, and an arrangement of one or more contact elements. The CMOS substrate region has at least one configurable circuit arrangement. The arrangement of one or more contact elements is arranged between the at least one micromechanical functional layer and the CMOS substrate region and is electrically connected to the micromechanical functional layer and the circuit arrangement. The configurable circuit arrangement is designed in such a way that the one or more contact elements are configured to be selectively connected to electrical connection lines in the CMOS substrate region. | 01-23-2014 |
20140110800 | Method for manufacturing a cap for a mems component, and hybrid integrated component having such a cap - A manufacturing method for a cap, for a hybrid vertically integrated component having a MEMS component a relatively large cavern volume having a low cavern internal pressure, and a reliable overload protection for the micromechanical structure of the MEMS component. A cap structure is produced in a flat cap substrate in a multistep anisotropic etching, and includes at least one mounting frame having at least one mounting surface and a stop structure, on the cap inner side, having at least one stop surface, the surface of the cap substrate being masked for the multistep anisotropic etching with at least two masking layers made of different materials, and the layouts of the masking layers and the number and duration of the etching steps being selected so that the mounting surface, the stop surface, and the cap inner side are situated at different surface levels of the cap structure. | 04-24-2014 |
20140116134 | MICROMECHANICAL STRUCTURE - Micromechanical structure, in particular a yaw rate sensor having a substrate including a main plane of extent for detecting a first yaw rate about a first direction perpendicular to the main plane, a second yaw rate about a second direction parallel to the main plane, and a third yaw rate about a third direction parallel to the main plane and perpendicular to the second direction, includes a rotational oscillating element driven to rotational oscillation about a rotational axis parallel to the first direction. The micromechanical structure includes a yaw rate sensor configuration for detecting the first yaw rate that is completely surrounded by the rotational oscillating element in a plane parallel to the main plane. The micromechanical structure includes at least one first connection of the yaw rate sensor configuration on the rotational oscillating element, and at least one second connection of the yaw rate sensor configuration on the substrate. | 05-01-2014 |
20140117475 | HYBRID INTEGRATED COMPONENT - A component has at least one MEMS element and at least one cap made of a semiconductor material. The cap, in addition to its mechanical function as a terminus of a cavity and protection of the micromechanical structure, is provided with an electrical functionality. The micromechanical structure of the MEMS element of the component is situated in a cavity between a carrier and the cap, and includes at least one structural element which is deflectable out of the component plane within the cavity. The cap includes at least one section extending over the entire thickness of the cap, which is electrically insulated from the adjoining semiconductor material in such a way that it may be electrically contacted independently from the remaining sections of the cap. | 05-01-2014 |
20140326070 | YAW-RATE SENSOR - A yaw-rate sensor having a substrate and a plurality of movable substructures that are mounted over a surface of the substrate, the movable substructures being coupled to a shared, in particular, central spring element, means being provided for exciting the movable substructures into a coupled oscillation in a plane that extends parallel to the surface of the substrate, the movable substructures having Coriolis elements, means being provided for detecting deflections of the Coriolis elements induced by a Coriolis force, a first Coriolis element being provided for detecting a yaw rate about a first axis, a second Coriolis element being provided for detecting a yaw rate about a second axis, the second axis being oriented perpendicularly to the first axis. | 11-06-2014 |
20140338450 | Acceleration sensor - An acceleration sensor having a substrate and a seismic mass; the acceleration sensor has a main extension plane and includes a spring device, via which the substrate and the seismic mass are connected, such that in an acceleration in a detection direction that runs perpendicular to the main extension plane, the seismic mass is deflectable in the sense of a tilting motion about an axis of rotation running parallel to the main extension plane, the seismic mass furthermore being connected to the substrate via at least one first spring, the stiffness of the first spring in a deflection of the seismic mass in the sense of the tilting motion being lower in the detection direction than the stiffness of the first spring in a deflection in a primary direction extending parallel to the main extension plane. | 11-20-2014 |
20140339654 | MICROPATTERNED COMPONENT AND METHOD FOR MANUFACTURING A MICROPATTERNED COMPONENT - A micropatterned component, for measuring accelerations and/or yaw rates, including a substrate having a principal plane of extension of the substrate, an electrode, and a further electrode; the electrode having a principal plane of extension of the electrode, and the further electrode having a principal plane of extension of the further electrode; the principal plane of extension of the electrode being set parallelly to a normal direction perpendicular to the principal plane of extension of the substrate; the principal plane of extension of the further electrode being set parallelly to the normal direction; the electrode having an electrode height extending in the normal direction; the electrode having a flow channel extending completely through the electrode in a direction parallel to the principal plane of extension of the substrate; the flow channel having a channel depth extending parallelly to the normal direction; the channel depth being less than the electrode height. | 11-20-2014 |
20140373628 | YAW RATE SENSOR HAVING THREE SENSITIVE AXES AND METHOD FOR MANUFACTURING A YAW RATE SENSOR - A yaw rate sensor includes: a first sensor structure having a first oscillating mass and configured to detect a first yaw rate around a first axis of rotation; a second sensor structure having a second oscillating mass and configured to detect second and third yaw rates around second and third axes of rotation, respectively; and a drive structure coupled to the first and second oscillating masses. The first oscillating mass is drivable into a first drive oscillation along a first oscillation direction, and the second oscillating mass is drivable into a second drive oscillation along a second oscillation direction different from the first oscillation direction. The first axis of rotation is perpendicular to the first oscillation direction, and the second and third axes of rotation are perpendicular to the second oscillation direction. | 12-25-2014 |
20150008542 | Micromechanical component and manufacturing method for a micromechanical component - A micromechanical component includes a substrate having a cavern structured into the same, an at least partially conductive diaphragm, which at least partially spans the cavern, and a counter electrode, which is situated on an outer side of the diaphragm oriented away from the substrate so that a clearance is present between the counter electrode and the at least partially conductive diaphragm, the at least partially conductive diaphragm being spanned onto or over at least one electrically insulating material which at least partially covers the functional top side of the substrate, and at least one pressure access being formed on the cavern so that the at least partially conductive diaphragm is bendable into the clearance when a gaseous medium flows from an outer surroundings of the micromechanical component into the cavern. Also described is a manufacturing method for a micromechanical component. | 01-08-2015 |