Patent application number | Description | Published |
20110042042 | RADIATING PACKAGE MODULE FOR EXOTHERMIC ELEMENT - Disclosed herein is a radiating package module for an exothermic element. The radiating package module includes a heat conducting plate which has a groove of an internal thread shape, with the exothermic element being mounted on a surface of the heat conducting plate. A heat pipe is inserted into the groove in a screw-type coupling manner and has a coupling part of an external thread shape. An adhesive is applied between the groove and the coupling part. A cooling unit is coupled to an end of the heat pipe. The radiating package module maintains the reliability with which the radiating package radiates heat and improves structural reliability. | 02-24-2011 |
20110126409 | METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD - Disclosed herein is a method of manufacturing a printed circuit board, including: mounting a strip substrate on a fixing member; separating the strip substrate into unit substrates by performing a singulation process; attaching solder balls onto the unit substrates using a jig; and fixing the solder balls on the unit substrates by performing a reflow process. The method of manufacturing a printed circuit board is advantageous in that the solder balls can be accurately formed at the predetermined positions of the strip substrate because they are attached to the unit substrates after the warpage of the strip substrate was reduced by a singulation process. | 06-02-2011 |
20110127070 | EMBEDDED PRINTED CIRCUIT BOARD, MULTI-LAYER PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - An embedded PCB, a multi-layer PCB using the embedded PCB, and a method of manufacturing the same are provided. The method of manufacturing an embedded PCB includes a first step of patterning an insulating layer on which a photoresist layer is formed using a laser such that parts of the insulating layer are selectively etched to form a circuit pattern region and a second step of filling the circuit pattern region with a plating material to form a circuit pattern. Accordingly, the method of manufacturing an embedded PCB can simultaneously or sequentially etch a photoresist layer and an insulating layer using a laser to form a circuit pattern so as to obtain a micro pattern and simplify a manufacturing process and achieve alignment accuracy in construction of a multi-layer PCB using the embedded PCB to thereby improve product reliability and yield. | 06-02-2011 |
20120075830 | WIRE GRID POLARIZER AND BACKLIGHT UNIT USING THE SAME - Provided is a wire grid polarizer and a backlight unit using the wire grid polarizer. The wire grid polarizer comprises a first grid layer thrilled on a substrate and provided with at least one of a first grid pattern, and a second grid layer formed on the first grid pattern and provided with at least one of a second grid pattern made of metal material wherein the first grid layer is made of high molecular substance having a lower refraction index than that of the substrate. | 03-29-2012 |
20120086887 | Wire Grid Polarizer, Liquid Crystal Device Including The Wire Grid Polarizer, 3-D Stereoscopic Image Display Device Including The Wire Grid Polarizer, and Method of Manufacturing The Wire Grid Polarizer - The present invention relates to a wire grid polarizer capable of securing a high brightness and reducing the number of processes, a liquid crystal device including the wire grid polarizer, and a method of manufacturing the wire grid polarizer. According to the present invention, the wire grid polarizer, including first grids arranged in parallel at certain intervals over a substrate and second grids formed on the first grids, can be formed using only an imprint process, a deposition process, and a wet etch process. Accordingly, the number of processes and the process costs and time can be reduced, and high reliability can be guaranteed. | 04-12-2012 |
20120127681 | SOLDERING CONNECTING PIN, SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD OF MOUNTING SEMICONDUCTOR CHIP USING THE SAME - Disclosed herein are a soldering connecting pin, a semiconductor package substrate and a method of mounting a semiconductor chip using the same. A semiconductor chip is mounted on the printed circuit board using the soldering connecting pin inserted into a through-hole of the printed circuit board, thereby preventing deformation of the semiconductor package substrate and fatigue failure due to external shocks. | 05-24-2012 |
20120156882 | METHOD FOR FABRICATING LARGE-AREA NANOSCALE PATTERN - A method for fabricating a large-area nanoscale pattern includes: forming multilayer main thin films isolated by passivation layers; patterning a first main thin film to form a first main pattern; forming a first spacer pattern with respect to the first main pattern; and forming a second main pattern by transferring the first spacer pattern onto a second main thin film. By using multilayer main thin films isolated by different passivation films, spacer lithography capable of reducing a pattern pitch can be repetitively performed, and the pattern pitch is repetitively reduced without shape distortion after formation of micrometer-scale patterns, thereby forming nanometer-scale fine patterns uniformly over a wide area. | 06-21-2012 |
20120160802 | Method For Manufacturing A Wire Grid Polarizer - Provided is a method of manufacturing a wire grid polarizer in which a stable color coordinate can be implemented. According to the present invention, in a process where a second grid pattern of metal pattern is formed over a first grid pattern made of resin material, metal layer is deposited in a concave portion formed between adjacent first grid patterns to form void portion and a width and a height of the second grid pattern are adjusted depending on adjustment of a width of the voids, and thereby improving a process efficiency. | 06-28-2012 |
20130062106 | Printed Circuit Board and Method of Manufacturing the Same - A structure of a printed circuit board and a method of manufacturing the same are provided. The manufacturing method includes a first step of forming at least one connecting bump on first circuit patterns and forming a first insulating layer to form an inner circuit board, a second step of processing a second insulating layer with a metal seed layer formed thereon using a mold to form second circuit patterns so as to construct an outer circuit board, and a third step of aligning the inner circuit board and the outer circuit board with each other and laminating the inner circuit board and the outer circuit board. Accordingly, a structure of a high-density high-reliability printed circuit board having a circuit embedded in an insulating layer can be provided. A seed layer forming process for forming an outmost circuit can be removed by using an insulating layer combined with a seed layer. In addition, a conductive structure in the form of a connecting bump is formed, and thus a complicated process of forming a via-hole and filling the via-hole with a conductive material is not required. Furthermore, a process of grinding the surface of the filled conductive material is removed so as to remarkably decrease a circuit error rate. | 03-14-2013 |
20130105955 | SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME AND SEMICONDUCTOR PACKAGE MODULE HAVING THE SAME | 05-02-2013 |
20130112463 | Printed Circuit Board and Manufacturing Method Thereof - The present invention provides a structure of a printed circuit board and a manufacturing method thereof. The method includes: (a) forming a circuit pattern on an insulating layer in which a seed layer is formed; (b) embedding the circuit pattern into the insulating layer by a press method; and (c) removing the seed layer. According to the present invention, a fine pattern may be formed without occurring alignment problem by forming a circuit pattern directly on an insulating layer and reliability of the formed fine pattern may be increased by performing a process of embedding protruded circuits into the insulating layer. In addition, possibility of inferior circuit occurring due to ion migration between adjacent circuits may be reduced by performing over-etching a circuit layer to be lower than a surface of the insulating layer during the etching process of removing a seed layer. | 05-09-2013 |
20130192881 | PRINTED CIRCUIT BOARD AND THE METHOD FOR MANUFACTURING THE SAME - Provided is a method for manufacturing a printed circuit board. The method for manufacturing a printed circuit board includes preparing an insulation board, irradiating a laser onto a graytone mask to each a surface of the insulation board, thereby forming a circuit pattern groove and a via hole at the same time, and filling the circuit pattern groove and the via hole to form a buried circuit pattern and the via. Thus, the circuit pattern groove and the via hole may be formed using the graytone mask at the same time without performing a separate process for forming the via hole. Therefore, the manufacturing process may be simplified to reduce the manufacturing costs. | 08-01-2013 |
20130271834 | WIRE GRID POLARIZER - Provided is a wire grid polarizer including: a first grid patterns on a substrate; a second grid pattern on the first grid patterns; and a passivation layer filling between the first grid patterns and the second grid patterns. | 10-17-2013 |
20130328869 | METHOD AND SYSTEM FOR PROVIDING A FACE ADJUSTMENT IMAGE - The present invention relates to a method and system for providing a face adjustment image, the method comprising the steps of: (a) generating a matched image by superimposing a cephalometric image having a cranium image of a patient whose face is to be corrected with a three-dimensional facial image of the patient; and (b) displaying a predicted facial image on a screen by transforming soft skin tissues of the face according to the skeletal change in the cephalometric image. According to the present invention, the change in the soft skin tissues and the predicted facial image are displayed on a screen of a computer, a terminal or the like based on the skeletal change in cranium, teeth, prosthesis or the like supporting the soft skin tissues. Therefore, the change in the soft skin tissues can be predicted, thereby increasing the accuracy of a face correction operation, making it more accurate and convenient to plan the operation, and enhancing communication between the patient and medical staff. | 12-12-2013 |
20140000938 | ELECTRODE SUBSTRATE AND TOUCH PANEL | 01-02-2014 |
20140144881 | NANOWIRE MANUFACTURING METHOD - Provided is a nanowire manufacturing method, comprising forming a plurality of grid patterns on a substrate, forming a nanowire on the grid patterns, and separating the grid pattern and the nanowire. According to the present invention, the width and height of the nanowire can be adjusted by controlling the wet-etching process time period, and the nanowire can be manufactured at a room temperature at low cost, the nanowire can be mass-manufactured and the nanowire with regularity can be manufactured even in case of mass production. | 05-29-2014 |
20140272316 | TRANSPARENT SUBSTRATE HAVING NANO PATTERN AND METHOD OF MANUFACTURING THE SAME - Provided are a transparent substrate having a nano pattern, and a method of manufacturing the same, which enables the nano pattern to be easily formed on the transparent substrate and has the nano pattern applicable to a large sized substrate by forming a resin layer made of transparent material on a transparent substrate; forming at least one or more unit pattern parts composed of a first pattern area and a second pattern area in which a plurality of grid patterns are formed, and a protrusion pattern formed between the first pattern area and the second pattern area, on the resin layer; and forming a nanoscale metal layer on the protrusion pattern. | 09-18-2014 |
20140334599 | X-RAY IMAGING APPARATUS - The present invention relates to an X-ray imaging apparatus, comprising: an X-ray imager including an X-ray beam generator for emitting an X-ray beam, an X-ray beam detector for detecting the X-ray beam to obtain an X-ray image of an object, and a main body unit in which the X-ray beam generator and the X-ray beam detector are installed; and a three-dimensional scanner arranged in the X-ray imager in order to obtain an image of the outer appearance of the object. According to the present invention, an X-ray image and an image of the outer appearance of an object, for example, an image of the skull and an image of the face, can be obtained at the same time, thereby minimizing image correction procedures for matching two images. | 11-13-2014 |
20140335328 | NANOWIRE MANUFACTURING DEVICE HAVING NANOWIRE MANUFACTURING SUBSTRATE AND NANOWIRE ADHESIVE FILM AND NANOWIRE MANUFACTURED USING THE SAME - Provided is a nanowire manufacturing substrate, comprising a grid base layer on a substrate and a grid pattern formed by patterning the grid base layer, the grid pattern being disposed to produce a nanowire on a surface thereof. According to the present invention, the width and height of the nanowire can be adjusted by controlling the wet-etching process time period, and the nanowire can be manufactured at a room temperature at low cost, the nanowire can be mass-manufactured and the nanowire with regularity can be manufactured even in case of mass production. | 11-13-2014 |
20150022742 | PATTERN SUBSTRATE AND TOUCH PANEL USING THE SAME - A touchscreen display device includes a display module and an electrically conductive and light transmissive layer provided over the display module to allow detection of touch input. The electrically conductive and light transmissive layer includes a transparent substrate and a transparent layer provided over the transparent substrate. The transparent layer has first and second surfaces, which are opposing surfaces, and the first surface faces the transparent substrate. The second surface includes a plurality of protrusions extending in different directions such that the plurality of first protrusions intersect to form recess regions on the second surface. The recess regions include a plurality of second protrusions, and the second protrusions have a height and a width less than the first protrusions. At least one metallic wiring layer is formed on the plurality of first protrusions including at locations where the first protrusions intersect. | 01-22-2015 |