Patent application number | Description | Published |
20150195905 | PACKAGE BOARD, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGE USING THE SAME - There are provided a package board, a method of manufacturing the same, and a semiconductor package using the same. According to an exemplary embodiment of the present disclosure, the package substrate may include: an insulating layer; a circuit layer formed on and beneath the insulating layer; a capacitor formed in the insulating layer and including an upper electrode, a lower electrode, and a dielectric layer formed between the upper electrode and the lower electrode; and a via connecting the circuit layer to the upper electrode and the lower electrode. | 07-09-2015 |
20150351228 | PACKAGE BOARD AND METHOD FOR MANUFACTURING THE SAME - There are provided a package board and a method for manufacturing the same. According to an exemplary embodiment of the present disclosure, a package board includes: a first insulating layer; a second insulating layer formed beneath the first insulating layer; a capacitor embedded in the first insulating layer and including a first electrode, a second electrode, and a dielectric layer formed between the first electrode and the second electrode; circuit layers formed on the first insulating layer and the second insulating layer; and a via formed between the capacitor and the circuit layers or between the circuit layers formed on the first insulating layer and the second insulating layer to electrically connect thererbetween, wherein an upper surface of the first electrode is formed to be exposed from the first insulating layer. | 12-03-2015 |
20150351247 | PACKAGE BOARD AND METHOD FOR MANUFACTURING THE SAME - There are provided a package board and a method for manufacturing the same. According to an exemplary embodiment of the present disclosure, the package board includes: a first insulating layer formed with a penetrating cavity; a capacitor disposed in the cavity and including a first electrode, a second electrode formed on the first electrode, and a dielectric layer formed between the first electrode and the second electrode; a second insulating layer formed on the first insulating layer and in the cavity to embed the capacitor; circuit layers formed on the first insulating layer and the second insulating layer; and a via penetrating through the second insulating layer to electrically connect the circuit layer to the capacitor. | 12-03-2015 |
Patent application number | Description | Published |
20090025195 | Method of manufacturing capacitor-embedded PCB - A method of manufacturing a capacitor-embedded PCB is disclosed. The method may include fabricating a capacitor substrate having at least one inner electrode formed on one side of a dielectric layer; aligning a semi-cured insulation layer with one side of a core layer, and aligning the capacitor substrate with the semi-cured insulation layer such that the inner electrode faces the semi-cured insulation layer; and collectively stacking the core layer, the semi-cured insulation layer, and the capacitor substrate. | 01-29-2009 |
20100236821 | Electronic Component-Embedded Printed Circuit Board - Disclosed herein is an electronic component-embedded printed circuit board including: a base plate including an insulating resin layer and circuit layers; and an electronic component embedded in the insulating resin layer, wherein the insulating resin layer has a thickness 1.3˜3 times greater than that of the electronic component. The electronic component-embedded printed circuit board has an optimum thickness ratio of its constituents in order to minimize the warpage thereof at the time of manufacturing the same. | 09-23-2010 |
20110099779 | Method of manufacturing capacitor-embedded PCB - A method of manufacturing a capacitor-embedded printed circuit board that includes fabricating a capacitor substrate having at least one inner electrode formed on one side of a dielectric layer; aligning a semi-cured insulation layer with one side of a core layer, and aligning the capacitor substrate with the semi-cured insulation layer such that the inner electrode faces the semi-cured insulation layer; and collectively stacking the core layer, the semi-cured insulation layer, and the capacitor substrate. | 05-05-2011 |
Patent application number | Description | Published |
20110025866 | COMPACT LENS OPTICAL SYSTEM AND DIGITAL CAMERA MODULE INCLUDING THE SAME - A dual lens optical system (OS) includes a photographing device, a first OS having a first reflection member and redirecting an optical axis of light representing an image of an object input from a first direction toward the photographing device, and a second OS having a second reflection member, redirecting an optical axis of light representing an image of an object input from a second direction toward the photographing device, and sharing at least one of optical elements of the first OS. The first and second OSs selectively redirect the image light from the first or second direction toward the photographing device. The photographing surface has a first region where the light representing the image of the object input through the first OS is formed, and a second region where light representing the image of the object input through the second OS is formed, have different sizes and are overlapped. | 02-03-2011 |
20110122507 | OPTICAL SYSTEM OF ZOOM LENS WITH IMAGE STABILIZATION - An optical system of a zoom lens is provided. The optical system of the zoom lens includes thirteen lenses which are divided into four lens groups, wherein: the zoom lens comprises in a following order from a subject: a first lens group which has a positive refractive index; a second lens group which has a negative refractive index, and moves along an optical axis; a third lens group which has a positive refractive index; and a fourth lens group which has a positive refractive index, wherein the first lens group comprises four lenses, and an external surface of a first lens is concave in a direction of a plane of an image; the third lens group comprises two meniscus lenses which are concave toward an image plane, and is made with capability of cross-section displacement relative to an optical axis; and the fourth lens group is convex-concave glued lens. | 05-26-2011 |
20110141339 | COMPACT LENS OPTICAL SYSTEM AND DIGITAL CAMERA MODULE INCLUDING THE SAME - A lens optical system includes a first optical system and a second optical system. The lens optical system includes at least one reflection member to selectively redirect optical paths of light representing objects from first and second directions toward a photographing device. The first optical system includes, in order from an object to the photographing device along the optical axis, a first lens group including a first reflection member, a second lens group having a negative refractive power, a third lens group having a positive refractive power, and a fourth lens group having a positive refractive power. The second optical system shares at least one optical element with the first optical system. | 06-16-2011 |
20110141576 | LENS OPTICAL SYSTEM AND DIGITAL CAMERA MODULE INCLUDING THE SAME - A lens optical system includes a first optical system which includes, in order from an object side to an image side along an optical axis, a first lens group having a positive refractive power and including a first reflection member to redirect an optical path of light representing an object from a first direction toward an image sensor, a second lens group having a negative refractive power, a third lens group having a positive refractive power, a fourth lens group having a positive refractive power, and a fifth lens group having a positive refractive power. During zooming from a wide mode to a tele mode, the first lens group and the fifth lens group are fixed, the second lens group moves toward the image side, the third lens group and the fourth lens group move toward the object side, and the fourth lens group performs focusing. | 06-16-2011 |