Patent application number | Description | Published |
20140151101 | EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME, AND PRINTED CIRCUIT BOARD HAVING EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT THEREIN - There is provided an embedded multilayer ceramic electronic component, including: a ceramic body including dielectric layers; first and second internal electrodes facing each other with the dielectric layers interposed therebetween; a first external electrode and a second external electrode formed on external surfaces of the ceramic body, the first external electrode being electrically connected to the first internal electrodes and the second external electrode being electrically connected to the second internal electrodes; and a plating layer formed on the first external electrode and the second external electrode, wherein a surface roughness of the ceramic body is 500 nm or greater and not greater than a thickness of a ceramic cover sheet and a surface roughness of the plating layer is 300 nm or greater and not greater than a thickness of the plating layer. | 06-05-2014 |
20140209364 | MULTILAYER CERAMIC CAPACITOR, MANUFACTURING METHOD THEREFOR, CIRCUIT BOARD HAVING MULTILAYER CERAMIC CAPACITOR EMBEDDED THEREIN, AND POLISHING DEVICE FOR MULTILAYER CERAMIC CAPACITOR - There are provided multilayer ceramic capacitor, a manufacturing method therefor, a circuit board having a multilayer ceramic capacitor embedded therein, and a polishing device for a multilayer ceramic capacitor. | 07-31-2014 |
20140262463 | EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT AND PRINTED CIRCUIT BOARD HAVING THE SAME - There is provided an embedded multilayer ceramic electronic component including a ceramic body including dielectric layers, having first and second main surfaces, first and second side surfaces, and first and second end surfaces, and having a thickness of 250 μm or less, first and second internal electrodes alternately exposed to the first or second side surface, and first and second external electrodes formed on the first and second side surfaces, wherein the first external electrode includes a first electrode layer and a first metal layer, the second external electrode includes a second electrode layer and a second metal layer, the first and second external electrodes are extended onto the first and second main surfaces, and widths of the first and second external electrodes formed on the first and second main surfaces are different from each other. | 09-18-2014 |
20150021079 | MULTILAYER CERAMIC ELECTRONIC COMPONENT TO BE EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC COMPONENT EMBEDDED THEREIN - There is provided a multilayer ceramic electronic component to be embedded in a board, including a ceramic body including dielectric layers and having first and second main surfaces facing each other, first and second side surfaces facing each other, and first and second end surfaces facing each other, an active layer including a plurality of first and second internal electrodes alternately exposed through both end surfaces of the ceramic body with the dielectric layers interposed therebetween, to form capacitance therein, upper and lower cover layers formed on upper and lower portions of the active layer, and first and second external electrodes formed on both end surfaces of the ceramic body, wherein when a thickness of the upper or lower cover layer is defined as tc, 4 μm≦tc≦20 μm may be satisfied. | 01-22-2015 |
20150021080 | MULTILAYER CERAMIC ELECTRONIC PART TO BE EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC PART EMBEDDED THEREIN - There is provided a multilayer ceramic electronic part to be embedded in a board including: a ceramic body including dielectric layers; an active layer including a plurality of first and second internal electrodes; upper and lower cover layers disposed on and below the active layer, respectively; and first and second external electrodes formed on both end portions of the ceramic body, wherein a first internal electrode positioned at an outermost position among the first electrodes is connected to the first external electrode by at least one first via extended to at least one of first and second main surfaces of the ceramic body, and a second internal electrode positioned at an outermost position among the second internal electrodes is connected to the second external electrode by at least one second via extended to at least one of first and second main surfaces of the ceramic body. | 01-22-2015 |
20150022943 | MULTILAYER CERAMIC CAPACITOR TO BE EMBEDDED IN BOARD, METHOD OF MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING BOARD HAVING MULTILAYER CERAMIC CAPACITOR EMBEDDED THEREIN - There is provided a multilayer ceramic capacitor to be embedded in a board, including: a ceramic body; first and second internal electrodes alternately exposed through end surfaces of the ceramic body; first and second external electrodes formed on end surfaces of the ceramic body; and first and second plating layers enclosing the first and second external electrodes, wherein when distance from one end of bands of the first or second external electrode to the other end thereof is ‘A’ and distance between points at which a virtual line drawn from a point vertically spaced apart from a surface of the first or second plating layer at a point ½×A from one end of the bands inwardly of the ceramic body by 3 μm in length direction of the ceramic body intersects points on the surface of the first or second plating layer is ‘B,’ B/A≧0.6. | 01-22-2015 |
20150041197 | EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT AND PRINTED CIRCUIT BOARD HAVING THE SAME - There is provided an embedded multilayer ceramic electronic component including: a ceramic body including dielectric layers; first internal electrodes and second internal electrodes having first and second leads; first dummy electrodes and second dummy electrodes; and first and second external electrodes, wherein when a length from ends of the first and second external electrodes formed on first and second lateral surfaces of the ceramic body to the first and second external electrodes corresponding to the first and second leads is G, a length of the first and second external electrodes formed on the first and second lateral surfaces of the ceramic body up to end surfaces of the ceramic body is BW, and a length from the end surfaces of the ceramic body to the first and second external electrodes corresponding to the first and second leads is M, 30 μm≦G02-12-2015 | |
20150041198 | MULTILAYER CERAMIC ELECTRONIC PART TO BE EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC PART EMBEDDED THEREIN - There is provided a multilayer ceramic electronic part to be embedded in a board, the multilayer ceramic electronic part including: a ceramic body including dielectric layers; first and second internal electrodes disposed in the ceramic body; first and second external electrodes formed on the respective end portions of the ceramic body, and a third external electrode formed on first and second main surfaces of the ceramic body, wherein an outermost first internal electrode among the first internal electrodes is connected to the first and second external electrodes through at least one first via, and the second internal electrodes are connected to the third external electrode through at least one second via. | 02-12-2015 |
20150049412 | MULTILAYER CERAMIC CAPACITOR, METHOD OF MANUFACTURING THE SAME, AND PRESSING PLATE FOR MULTILAYER CERAMIC CAPACITOR - There is provided a multilayer ceramic capacitor, including: a ceramic body including a plurality of dielectric layers stacked therein; first and second internal electrodes alternately exposed to both end surfaces of the ceramic body, having each of the dielectric layers disposed therebetween; and first and second external electrodes formed on the end surfaces of the ceramic body and electrically connected to the first and second internal electrodes, respectively, wherein a difference in rigidity between upper and lower portions of the ceramic body is 4% or less. | 02-19-2015 |
20150053472 | EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT AND PRINTED CIRCUIT BOARD HAVING THE SAME - There is provided an embedded multilayer ceramic electronic component including: a ceramic body including a dielectric layer; a plurality of first and second internal electrodes; and first and second external electrodes formed on both end portions of the ceramic body, wherein the first and second external electrodes are extended to first and second main surfaces of the ceramic body, and when a thickness of the ceramic body is defined as ts, a maximum thickness of the first and second external electrodes formed on the first and second main surfaces of the ceramic body is defined as tb, a minimum distance of the first and second external electrodes formed on first and second end surfaces of the ceramic body in a length direction of the ceramic body is defined as ta, tb/ts and ta/tb satisfy the following Equations, respectively: 0.1≦tb/ts≦1.0 and 0.5≦ta/tb≦2.0. | 02-26-2015 |
20150060122 | MULTILAYER CERAMIC ELECTRONIC COMPONENT TO BE EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC COMPONENT EMBEDDED THEREIN - There is provided a multilayer ceramic electronic component embedded in a board including: a ceramic body including dielectric layers; first and second internal electrodes; and first and second external electrodes formed on first and second side surfaces of the ceramic body, respectively, wherein the first external electrode includes a first electrode layer and a first metal layer formed on the first electrode layer, the second external electrode includes a second electrode layer and a second metal layer formed on the second electrode layer, the first and second external electrodes are formed to be extended to first main surface of the ceramic body, and when a maximum width and a minimum width of at least one of the first and second external electrodes formed on the first main surface are defined as BWmax and BWmin, respectively, 0≦BWmax−BWmin≦100 μm is satisfied. | 03-05-2015 |
20150075853 | MULTILAYER CERAMIC ELECTRONIC COMPONENT EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING THE SAME - There is provided a multilayer ceramic electronic component embedded in a board including: a ceramic body including dielectric layers; an active layer including a plurality of first and second internal electrodes, having the dielectric layer therebetween, to thereby form capacitance; upper and lower cover layers formed in upper and lower portions of the active layer; and first and second external electrodes formed in both ends of the ceramic body, wherein the first external electrode includes a first base electrode and a first terminal electrode formed on the first base electrode, the second external electrode includes a second base electrode and a second terminal electrode formed on the second base electrode, and in the case that a thickness of the upper cover layer is tc1 and a thickness of the lower cover layer is tc2, 0.10≦tc1/tc2≦1.00 is satisfied. | 03-19-2015 |